DE19616402C2 - Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter - Google Patents
Vorrichtung zum Behandeln von Substraten in einem Fluid-BehälterInfo
- Publication number
- DE19616402C2 DE19616402C2 DE1996116402 DE19616402A DE19616402C2 DE 19616402 C2 DE19616402 C2 DE 19616402C2 DE 1996116402 DE1996116402 DE 1996116402 DE 19616402 A DE19616402 A DE 19616402A DE 19616402 C2 DE19616402 C2 DE 19616402C2
- Authority
- DE
- Germany
- Prior art keywords
- fluid
- fluid container
- nozzles
- container
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012530 fluid Substances 0.000 title claims description 150
- 239000000758 substrate Substances 0.000 title claims description 41
- 230000005855 radiation Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 10
- 239000000126 substance Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 230000008901 benefit Effects 0.000 description 5
- 238000011010 flushing procedure Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000011068 loading method Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012958 reprocessing Methods 0.000 description 2
- 101100346656 Drosophila melanogaster strat gene Proteins 0.000 description 1
- 241000047428 Halter Species 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- 239000003518 caustics Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 210000003608 fece Anatomy 0.000 description 1
- 210000004072 lung Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 210000004197 pelvis Anatomy 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/26—Nozzle-type reactors, i.e. the distribution of the initial reactants within the reactor is effected by their introduction or injection through nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/102—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration with means for agitating the liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00049—Controlling or regulating processes
- B01J2219/00051—Controlling the temperature
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
Claims (18)
Priority Applications (14)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19655219A DE19655219C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
| DE19654903A DE19654903C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
| US08/762,199 US5921257A (en) | 1996-04-24 | 1996-12-06 | Device for treating substrates in a fluid container |
| JP53765197A JP3493030B2 (ja) | 1996-04-24 | 1997-03-27 | 流体容器内で基板を処理する装置 |
| PCT/EP1997/001580 WO1997040524A1 (de) | 1996-04-24 | 1997-03-27 | Vorrichtung zum behandeln von substraten in einem fluid-behälter |
| EP02005774A EP1239512A3 (de) | 1996-04-24 | 1997-03-27 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
| AT97915453T ATE259989T1 (de) | 1996-04-24 | 1997-03-27 | Vorrichtung zum behandeln von substraten in einem fluid-behälter |
| KR1019980708443A KR100316823B1 (ko) | 1996-04-24 | 1997-03-27 | 유체용기내의기판처리장치 |
| DE59711318T DE59711318D1 (de) | 1996-04-24 | 1997-03-27 | Vorrichtung zum behandeln von substraten in einem fluid-behälter |
| EP97915453A EP0895655B1 (de) | 1996-04-24 | 1997-03-27 | Vorrichtung zum behandeln von substraten in einem fluid-behälter |
| MYPI97001552A MY132460A (en) | 1996-04-24 | 1997-04-09 | Device for treating substrates in a fluid container |
| TW086104566A TW446575B (en) | 1996-04-24 | 1997-04-10 | Device for treating substrates in a fluid container |
| IDP971344A ID16694A (id) | 1996-04-24 | 1997-04-22 | Alat untuk mengolah lapisan dasar konyeiner fluida |
| US09/056,586 US5992431A (en) | 1996-04-24 | 1998-04-07 | Device for treating substrates in a fluid container |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19655219A DE19655219C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
| DE19654903A DE19654903C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE19616402A1 DE19616402A1 (de) | 1997-11-06 |
| DE19616402C2 true DE19616402C2 (de) | 2001-11-29 |
Family
ID=26032905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1996116402 Expired - Fee Related DE19616402C2 (de) | 1996-04-24 | 1996-04-24 | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE19616402C2 (de) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6240938B1 (en) * | 1996-05-29 | 2001-06-05 | Steag Microtech Gmbh | Device for treating substrates in a fluid container |
| DE19644779C2 (de) * | 1996-10-28 | 2001-06-28 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten, insbesondere auch von Halbleiterwafern |
| DE19644255C1 (de) | 1996-10-24 | 1998-04-30 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten und Verwendung der Vorrichtung |
| DE19644253A1 (de) | 1996-10-24 | 1998-05-07 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten |
| DE19645425C2 (de) * | 1996-11-04 | 2001-02-08 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten |
| DE19648498C1 (de) * | 1996-11-22 | 1998-06-10 | Steag Micro Tech Gmbh | Vorrichtung zum Behandeln von Substraten, insbesondere von Halbleiter-Wafern |
| DE19752942A1 (de) * | 1997-11-28 | 1999-06-10 | Steag Micro Tech Gmbh | Vorrichtung zum Anreichern eines Gases mit einer Flüssigkeit |
| DE19926462C1 (de) * | 1999-02-18 | 2000-11-30 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zum Behandeln von Substraten |
| DE19960573C2 (de) * | 1999-12-15 | 2002-10-10 | Promos Technologies Inc | Verfahren zum Entfernen von festen Rückständen auf Oberflächen von Halbleiterscheiben |
| DE10155548A1 (de) * | 2001-11-12 | 2003-05-28 | Mattson Wet Products Gmbh | Vorrichtung zum Behandeln von Substraten |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5000795A (en) * | 1989-06-16 | 1991-03-19 | At&T Bell Laboratories | Semiconductor wafer cleaning method and apparatus |
| JPH05267263A (ja) * | 1992-03-17 | 1993-10-15 | Sony Corp | 半導体ウェーハ洗浄装置 |
| US5261431A (en) * | 1991-04-02 | 1993-11-16 | Tokyo Electron Limited | Washing apparatus |
| US5275184A (en) * | 1990-10-19 | 1994-01-04 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system |
| US5286657A (en) * | 1990-10-16 | 1994-02-15 | Verteq, Inc. | Single wafer megasonic semiconductor wafer processing system |
| WO1995002473A1 (en) * | 1993-07-16 | 1995-01-26 | Cfmt, Inc. | Static megasonic cleaning system for cleaning objects |
| US5443540A (en) * | 1992-12-25 | 1995-08-22 | Tokyo Electron Limited | Apparatus and method for drying substrates |
| DE4413077A1 (de) * | 1994-04-15 | 1995-10-19 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zur chemischen Behandlung von Substraten |
| US5488964A (en) * | 1991-05-08 | 1996-02-06 | Tokyo Electron Limited | Washing apparatus, and washing method |
| DE19546990A1 (de) * | 1995-01-05 | 1996-07-11 | Steag Micro Tech Gmbh | Anlage zur chemischen Naßbehandlung |
-
1996
- 1996-04-24 DE DE1996116402 patent/DE19616402C2/de not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5000795A (en) * | 1989-06-16 | 1991-03-19 | At&T Bell Laboratories | Semiconductor wafer cleaning method and apparatus |
| US5286657A (en) * | 1990-10-16 | 1994-02-15 | Verteq, Inc. | Single wafer megasonic semiconductor wafer processing system |
| US5275184A (en) * | 1990-10-19 | 1994-01-04 | Dainippon Screen Mfg. Co., Ltd. | Apparatus and system for treating surface of a wafer by dipping the same in a treatment solution and a gate device for chemical agent used in the apparatus and the system |
| US5261431A (en) * | 1991-04-02 | 1993-11-16 | Tokyo Electron Limited | Washing apparatus |
| US5488964A (en) * | 1991-05-08 | 1996-02-06 | Tokyo Electron Limited | Washing apparatus, and washing method |
| JPH05267263A (ja) * | 1992-03-17 | 1993-10-15 | Sony Corp | 半導体ウェーハ洗浄装置 |
| US5443540A (en) * | 1992-12-25 | 1995-08-22 | Tokyo Electron Limited | Apparatus and method for drying substrates |
| WO1995002473A1 (en) * | 1993-07-16 | 1995-01-26 | Cfmt, Inc. | Static megasonic cleaning system for cleaning objects |
| DE4413077A1 (de) * | 1994-04-15 | 1995-10-19 | Steag Micro Tech Gmbh | Verfahren und Vorrichtung zur chemischen Behandlung von Substraten |
| DE19546990A1 (de) * | 1995-01-05 | 1996-07-11 | Steag Micro Tech Gmbh | Anlage zur chemischen Naßbehandlung |
Non-Patent Citations (8)
| Title |
|---|
| JP 4-80924 A2. In: Patent Abstracts of Japan, E-1227, 2.7.1992, Vol. 16, No. 300 * |
| JP 5-267262 A2. In: Patent Abstracts of Japan, E-1493, 18.1.1994, Vol. 18, No. 33 * |
| JP 5-304131 A2. In: Patent Abstracts of Japan, E-1511, 18.2.1994, Vol. 18, No. 102 * |
| JP 6-196466 A2. In: Patent Abstracts of Japan, E-1617, 18.10.1994, Vol. 18, No. 545 * |
| JP 6-208984 A2. In: Patent Abstracts of Japan, E-1623, 31.10.1994, Vol. 18, No. 570 * |
| KANEKO, T. et.al.: Low Temperature Silicon Surface Cleaning by HF Etching/Ultraviolet Ozone Cleaning (HF/UVOC) Method (II)-insitu UVOC. In: Jap. Journal of Applied Physics, Vol. 28, No. 12, Dec. 1989, pp. 2425-29 * |
| Method of Cleaning Silicon Wafers. In: IBM TDB, Vol. 34, No. 5, Oct. 1991, p. 331 * |
| Spray Nozzle Configuration... In: IBM TDB, Vol. 38, No. 4, April 1995, pp. 403-405 * |
Also Published As
| Publication number | Publication date |
|---|---|
| DE19616402A1 (de) | 1997-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE19655219C2 (de) | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter | |
| DE19549488C2 (de) | Anlage zur chemischen Naßbehandlung | |
| DE3852883T2 (de) | Wasserkläranlage für die beseitigung von teilchen, die grösser als ein vorbestimmter durchmesser sind. | |
| DE19616402C2 (de) | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter | |
| DE72264T1 (de) | Filter mit angeordnetem koernigem material. | |
| EP0953205B1 (de) | Vorrichtung zum behandeln von substraten | |
| DE69408490T2 (de) | Vorrichtung zur Behandlung von Gegenständen mit Flüssigkeiten | |
| DE19546990A1 (de) | Anlage zur chemischen Naßbehandlung | |
| DE19644254A1 (de) | Vorrichtung zum Behandeln von Substraten | |
| DE19934300C2 (de) | Vorrichtung zum Behandeln von Substraten | |
| EP2063206B1 (de) | Vorrichtung zum Behandeln einer Substratbahn | |
| DE69419942T2 (de) | Verfahren und vorrichtung zur behandlung einer halbleiterscheibe in einer flüssigkeit | |
| WO1997002724A1 (de) | Verfahren und vorrichtung zum chemischen und elektrolytischen behandeln von leiterplatten und leiterfolien | |
| EP0904164B1 (de) | Vorrichtung zum behandeln von substraten in einem fluid-behälter | |
| DE4014938A1 (de) | Ueberlauftank fuer halbleiter-wafer-waschvorrichtungen | |
| DE3631344A1 (de) | Schlammbelebungsanlage | |
| EP1239512A2 (de) | Vorrichtung zum Behandeln von Substraten in einem Fluid-Behälter | |
| DE1907278A1 (de) | Verfahren und Vorrichtung zur Behandlung von Fluessigkeiten | |
| DE19537879C2 (de) | Verfahren und Vorrichtung zum Behandeln von Substraten | |
| DE19644255C1 (de) | Vorrichtung zum Behandeln von Substraten und Verwendung der Vorrichtung | |
| DE19962169C2 (de) | Vorrichtung zum Behandeln von Substraten | |
| DE2801751A1 (de) | Vorrichtung zur aufbereitung einer fluessigkeit, insbesondere zur saettigung mit sauerstoff | |
| DE2204814C3 (de) | Belebungsbecken für Kläranlagen mit biologischer Abwasserreinigung | |
| DE2304986C3 (de) | Vorrichtung zur biologischen Abwasserreinigung | |
| WO1998018153A1 (de) | Vorrichtung zum behandeln von substraten |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| AH | Division in |
Ref country code: DE Ref document number: 19654903 Format of ref document f/p: P |
|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| AH | Division in |
Ref country code: DE Ref document number: 19654903 Format of ref document f/p: P |
|
| AH | Division in |
Ref country code: DE Ref document number: 19654903 Format of ref document f/p: P |
|
| 8172 | Supplementary division/partition in: |
Ref country code: DE Ref document number: 19655219 Format of ref document f/p: P |
|
| Q171 | Divided out to: |
Ref document number: 19655219 Ref country code: DE |
|
| AH | Division in |
Ref country code: DE Ref document number: 19654903 Format of ref document f/p: P Ref country code: DE Ref document number: 19655219 Format of ref document f/p: P |
|
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: SCP U.S.,INC., WILMINGTON, DEL., US |
|
| R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20131101 |