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DE1808161B2 - - Google Patents

Info

Publication number
DE1808161B2
DE1808161B2 DE19681808161 DE1808161A DE1808161B2 DE 1808161 B2 DE1808161 B2 DE 1808161B2 DE 19681808161 DE19681808161 DE 19681808161 DE 1808161 A DE1808161 A DE 1808161A DE 1808161 B2 DE1808161 B2 DE 1808161B2
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19681808161
Other versions
DE1808161A1 (de
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of DE1808161A1 publication Critical patent/DE1808161A1/de
Publication of DE1808161B2 publication Critical patent/DE1808161B2/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1407—Applying catalyst before applying plating resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19681808161 1967-11-13 1968-11-09 Verfahren zum Aufbringen eines gedruckten Leitungsmusters auf ein elektrisch isolierendes Substrat Withdrawn DE1808161A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US68237367A 1967-11-13 1967-11-13

Publications (2)

Publication Number Publication Date
DE1808161A1 DE1808161A1 (de) 1969-06-12
DE1808161B2 true DE1808161B2 (de) 1970-11-05

Family

ID=24739411

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19681808161 Withdrawn DE1808161A1 (de) 1967-11-13 1968-11-09 Verfahren zum Aufbringen eines gedruckten Leitungsmusters auf ein elektrisch isolierendes Substrat

Country Status (4)

Country Link
US (1) US3573973A (de)
DE (1) DE1808161A1 (de)
FR (1) FR1594723A (de)
GB (1) GB1247706A (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3642476A (en) * 1970-05-21 1972-02-15 Ibm Method of preparing glass masters
US3666527A (en) * 1970-07-31 1972-05-30 Rca Corp Method of electroless deposition of metals with improved sensitizer
US3808028A (en) * 1971-08-11 1974-04-30 Western Electric Co Method of improving adhesive properties of a surface comprising a cured epoxy
US3982054A (en) * 1972-02-14 1976-09-21 Rca Corporation Method for electrolessly depositing metals using improved sensitizer composition
US3950569A (en) * 1972-05-05 1976-04-13 W. R. Grace & Co. Method for preparing coatings with solid curable compositions containing styrene-allyl alcohol copolymer based polythiols
US3865623A (en) * 1973-02-02 1975-02-11 Litton Systems Inc Fully additive process for manufacturing printed circuit boards
CA1053994A (en) * 1974-07-03 1979-05-08 Amp Incorporated Sensitization of polyimide polymer for electroless metal deposition
US4150177A (en) * 1976-03-31 1979-04-17 Massachusetts Institute Of Technology Method for selectively nickeling a layer of polymerized polyester resin
US4082899A (en) * 1976-09-07 1978-04-04 Nathan Feldstein Method of applying catalysts for electroless deposition and article
US4388351A (en) * 1979-08-20 1983-06-14 Western Electric Company, Inc. Methods of forming a patterned metal film on a support
DE3149919A1 (de) * 1981-12-11 1983-06-23 Schering Ag, 1000 Berlin Und 4619 Bergkamen Verfahren zum haftfesten metallisieren von polyimid
US4478883A (en) * 1982-07-14 1984-10-23 International Business Machines Corporation Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
US4593016A (en) * 1985-02-14 1986-06-03 International Business Machines Corporation Process for manufacturing a concentrate of a palladium-tin colloidal catalyst
US4902610A (en) * 1985-08-02 1990-02-20 Shipley Company Inc. Method for manufacture of multilayer circuit board
US4806395A (en) * 1987-02-24 1989-02-21 Polyonics Corporation Textured polyimide film
US4725504A (en) * 1987-02-24 1988-02-16 Polyonics Corporation Metal coated laminate products made from textured polyimide film
US4832799A (en) * 1987-02-24 1989-05-23 Polyonics Corporation Process for coating at least one surface of a polyimide sheet with copper
DE4438799A1 (de) * 1994-10-18 1996-04-25 Atotech Deutschland Gmbh Verfahren zum Beschichten elektrisch nichtleitender Oberflächen mit Metallstrukturen
JP2003309346A (ja) * 2002-04-15 2003-10-31 National Institute Of Advanced Industrial & Technology プリント基板高速作成方法
US6852152B2 (en) * 2002-09-24 2005-02-08 International Business Machines Corporation Colloidal seed formulation for printed circuit board metallization
JP4198514B2 (ja) * 2003-04-23 2008-12-17 新光電気工業株式会社 無電解めっき方法
US20070080067A1 (en) * 2005-10-07 2007-04-12 Applied Materials, Inc. Pre-treatment to eliminate the defects formed during electrochemical plating
US7633073B2 (en) * 2005-11-23 2009-12-15 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN101437984A (zh) * 2006-05-17 2009-05-20 株式会社Pi技术研究所 金属复合膜及其制造方法
RU2341048C1 (ru) * 2007-06-28 2008-12-10 Федеральное государственное унитарное предприятие "Ордена Трудового Красного Знамени федеральный научно-производственный центр по радиоэлектронным системам и информационным технологиям имени В.И. Шимко" (ФГУП "Федеральный НПЦ "Радиоэлектроника" им. В.И. Шимко") Способ изготовления микрополосковых свч-интегральных схем
KR100904251B1 (ko) * 2008-01-28 2009-06-25 한국생산기술연구원 폴리머 표면에 귀금속촉매의 선택적 흡착방법
CA2917967A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Plated polymer compressor
CA2917916A1 (en) 2013-07-09 2015-02-05 United Technologies Corporation Plated polymer nosecone
WO2015006406A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Plated tubular lattice structure
CA2917643A1 (en) * 2013-07-09 2015-01-15 United Technologies Corporation Industrial products formed from plated polymers
CA2917884A1 (en) 2013-07-09 2015-01-15 United Technologies Corporation Plated polymer fan

Also Published As

Publication number Publication date
DE1808161A1 (de) 1969-06-12
GB1247706A (en) 1971-09-29
FR1594723A (de) 1970-06-08
US3573973A (en) 1971-04-06

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Legal Events

Date Code Title Description
SH Request for examination between 03.10.1968 and 22.04.1971
E77 Valid patent as to the heymanns-index 1977
8339 Ceased/non-payment of the annual fee