DE10361537A1 - Thermoplastic blends for implanting electrical modules into a card body - Google Patents

Abstract

Adhesive film consisting of two thermoplastics T1 and T2, wherein T1 NOTEQUAL T2 and DOLLAR A a) the adhesive system has a softening temperature of greater than 65 ° C. and less than 125 ° C. DOLLAR A b) a G 'measured according to test method A at 23 ° C. greater than 10 · 7 · Pas has DOLLAR A c) a G '' measured according to test method A of greater than 10 · 6 · Pas has DOLLAR A d) and a crossover of less than 125 ° C. measured according to test method A has DOLLAR A for bonding chip modules in card bodies.

Description

The The invention relates to a thermoplastic blend, with a Implanting puncture at 150 ° C activated and used for bonding electrical modules with card bodies become.

For the implantation of electrical modules in card bodies, a large number of adhesive films or joining methods are already known in the prior art. The aim of these implants is the production of telephone cards, credit cards, parking cards, insurance cards, etc .. Examples of the corresponding bonding methods can be found for example in the patents EP 0 842 995 . EP 1 078 965 and DE 199 48 560 ,

In However, in this area of bonding, the requirements are constantly increasing to the adhesive system. So the glue needs a good adhesion to polycarbonate, on ABS, PVC and PET, but also good adhesion to electrical module. This is usually on epoxy materials, Poyestern or polyimides glued. Previously, cyan-acrylates were used as liquid adhesives used, which have the advantage that optimum wetting of the card body and the electrical chip was achieved. This technology is but dying out because the processes are very slow. The solvent evaporated only slowly from the cavity of the card body, the Syringes for dosing clogged by dehydration at standstill and were also difficult to dose and the liquid adhesive needed as well a certain amount of time to cure. As a result, the quality was the bonding is pretty bad.

Here the hot melt pressure sensitive adhesives are clearly superior to liquid adhesives. Nevertheless, the selection of suitable connections is very good here as well limited, because very high demands are placed on this joining technology. A restriction are the very different materials that need to be glued. By the very different polarities of PC, PVC, PET, ABS, Epoxy and polyimide are impossible to find a single polymer which is the same on all materials good adhesion. A possibility to increase the adhesion on different substrates is the mixture of different Adhesives. But again, the problem is a stable mix to achieve that does not phase-separated after several weeks and thus the adhesion in turn worsened. This is especially true for longer storage at elevated Temperatures.

Farther the requirements of the end customers continue to rise. So is e.g. the flatness of the electrical module with the card body important criterion, otherwise the cards are no longer read could become. This implies that the implantation temperatures are limited to the top are, since e.g. especially PVC at implant temperatures above 170 ° C too Deformations tends.

One Another criterion is the requirement from the banking sector that The electrical modules can not be removed non-destructively. Accordingly, the internal cohesion of the adhesive must be very high, so he does not split in the middle and liability to both Pages (card body + electrical module) is extremely high. At the same time, the glue needs also a very high flexibility show, as the cards after implanting torsion tests and Go through bending test. The map material should be preferred first break before the adhesion to the card body and the electric module exposes. As a rule, not even withdrawals are made at the edge tolerated.

One Another criterion is temperature fluctuations and the influence of moisture, as these cards in the later Use both high and low temperatures to withstand and sometimes even have to survive a wash passage. Accordingly, should the adhesive does not embrittle at low temperatures, at high temperatures do not liquefy and have a low tendency to absorb water.

One Another requirement criterion is due to the growing number of Card requirements the processing speed. The glue should very quickly soften or melt, thus the implantation process can be completed within one second.

Of the Invention is the object in view of this prior art basically, an adhesive film for implanting electrical Modules in a card body which meets the above criteria and especially at implant temperatures of 150 ° C in the stamp to the different card bodies and electrical modules forms a very high adhesion.

• a) das Klebesystem eine Erweichungstemperatur von größer 65°C und kleiner 125°C aufweist
• b) einen nach Testmethode A gemessenen G' bei 23°C von größer 10⁷ Pas besitzt
• c) einen nach Testmethode A gemessenen G'' bei 23°C von größer 10⁶ Pas besitzt
• d) und einen nach Testmethode A gemessenen crossover von kleiner 125°C aufweist.

According to the invention the object is achieved by an adhesive film consisting of a blend of thermoplastics T1 and T2, wherein T1 ≠ T2 and

• a) the adhesive system has a softening temperature of greater than 65 ° C and less than 125 ° C.
• b) has a measured by test method A G 'at 23 ° C greater than 10 ⁷ Pas
• c) has a measured by test method A G '' at 23 ° C greater than 10 ⁶ Pas
• d) and a measured by test method A crossover of less than 125 ° C.

Farther the crossover temperature must be below 125 ° C, otherwise the adhesive do not become fluid would and thus not the map surface and wet the electrical module optimally.

Furthermore, the elastic portion G 'must be greater than 10 ⁷ Pas and the viscous portion G "greater than 10 ⁶ Pas, since otherwise no optimal flexibility of the adhesive is guaranteed. The adhesive must ensure the occurring loads between card body and electrical module even under strong bends. Therefore, a rheologically optimized viscoelastic behavior is required.

By the mixture according to the invention The thermoplastic blend becomes an adhesion improvement card body reached, which can not be reached with the singular thermoplastics is.

The bonding of the electrical module with a card body is in 1 ) shown schematically. The inventive temperature-activatable adhesive in a preferred embodiment has a layer thickness between 10 and 100 microns, in a particularly preferred embodiment, a layer thickness of 30 to 80 microns.

Heat-activatable thermoplastic blends

Of the Heat-activatable glue consists of a blend of at least two thermoplastic materials T1 and T2.

In a preferred embodiment are two different thermoplastic Polymers mixed with each other. The mixing ratio of the two thermoplastics T1 and T2 is between 5:95 (T1: T2) and 95: 5 (T1: T2). In a more preferred Interpretation amounts the mixing ratio between 10:90 (T1: T2) and 90:10 (T1: T2).

In a very preferred design are the thermoplastic materials T1 and T2 are selected from the group of the following polymers: polyurethanes, Polyesters, polyamides, ethylene vinyl acetates, synthetic rubbers, such as e.g. Styrene isoprene di and triblock copolymers (SIS), styrene butadiene Di- and triblock copolymers (SBS), styrene-ethylene butadiene di- and Triblock copolymer (SEBS), polyvinyl acetate, polyimides, polyethers, Copolyamides, copolyesters, polyolefins, e.g. Polyethylene, polypropylene, or poly (meth) crylates, where T1 ≠ T2 is. The list is not exhaustive.

In another embodiment the invention thermoplastic blends are selected from a polymer group, wherein then the polymers differ in their chemical composition.

to Achievement of the activation temperature below 125 ° C should at least T1 or T2 have an activation temperature below 125 ° C.

The thermoplastic blend has a softening range between 65 and 125 °.

• a) einen nach Testmethode A gemessenen G' bei 23°C von größer 10⁷ Pas
• b) einen nach Testmethode A gemessenen G'' bei 23°C von größer 10⁶ Pas
• c) und einen nach Testmethode A gemessenen crossover von kleiner 125°C

Furthermore, at least one of the thermoplastics has T1 or T2

• a) measured by test method A G 'at 23 ° C greater than 10 ⁷ Pas
• b) a measured by test method A G '' at 23 ° C greater than 10 ⁶ Pas
• c) and a measured according to test method A crossover of less than 125 ° C.

to Optimization of the adhesive properties and the activation range optionally include adhesion-enhancing resins or reactive resins added sat. The proportion of resins is between 2 and 50 wt .-% based on the thermoplastic blend.

As tackifying resins to be added, all previously known adhesive resins described in the literature can be used without exception. Mention may be made representative of the pinene, indene and Kolaphoniumharze, their disproportionated, hydrogenated, polymerized, esterified derivatives and salts, the aliphatic and aromatic hydrocarbon resins, terpene resins and terpene phenolic resins and C5, C9 and other hydrocarbon resins. Any combination of these and other resins can be used to adjust the properties of the resulting adhesive as desired. In general, everyone can be with The invention makes use of compatible (soluble) resins for the corresponding thermoplastic, in particular reference is made to all aliphatic, aromatic, alkylaromatic hydrocarbon resins, hydrocarbon resins based on pure monomers, hydrogenated hydrocarbon resins, functional hydrocarbon resins and natural resins. The presentation of the state of knowledge in the "Handbook of Pressure Sensitive Adhesive Technology" by Donatas Satas (van Nostrand, 1989) is expressly pointed out.

In another embodiment Reactive resins are added to the thermoplastic blends.

A very preferred group includes epoxy resins. The molecular weight of the epoxy resins varies from 100 g / mol to a maximum of 10,000 g / mol for polymers Epoxy resins.

The Epoxy resins include, for example, the reaction product of bisphenol A and epichlorohydrin, the reaction product of phenol and formaldehyde (Novolak resins) and epichlorohydrin, glycidyl ester, the reaction product from epichlorohydrin and p-amino phenol.

Preferred commercial examples include Araldite ^™ 6010, CY-281 ^™ , ECN ^™ 1273, ECN ^™ 1280, MY 720, RD-2 from Ciba Geigy, DER ^™ 331, DER ^™ 732, DER ^™ 736, DEN ^™ 432, DEN ^™ 438, ^TM 485 from Dow Chemical, Epon ^™ 812, 825, 826, 828, 830, 834, 836, 871, 872,1001, 1004, 1031 etc. from Shell Chemical and HPT ^™ 1071, HP ^™ 1079 also from Shell Chemical.

Examples for commercial Aliphatic epoxy resins are e.g. Vinylcyclohexane dioxides, such as ERL-4206, ERL-4221, ERL 4201, ERL-4289 or ERL-0400 from Union Carbide Corp.

As the novolak resins, for example, Epi-Rez ^™ 5132 from Celanese, ESCN-001 from Sumitomo Chemical, CY-281 from Ciba Geigy, DEN ^™ 431, DEN ^™ 438, Quatrex 5010 from Dow Chemical, RE 305S from Nippon Kayaku can be used , Epiclon ^™ N673 from DaiNipon Ink Chemistry or Epicote ^™ 152 from Shell Chemical.

Furthermore, can be used as reactive resins and melamine resins, such as Cymel ^TM 327 and 323 from Cytec.

Furthermore, can be used as reactive resins and terpene phenolic resins such as NIREZ ^TM 2019 from Arizona Chemical.

Farther can be used as reactive resins and phenolic resins, such. YP 50 of Toto Kasei, PKHC of Union Carbide Corp. And BKR 2620 from Showa Union Gosei Corp. deploy.

It is also possible to use as reactive resins also polyisocyanates such as Coronate ^™ L from Nippon Polyurethane Ind., Desmodur ^™ N3300 or Mondur ^™ 489 from Bayer.

Around to accelerate the reaction between the two components Also optional crosslinker and accelerator in the mix too additize.

When Accelerators are useful e.g. Imidazoles, commercially available at 2M7, 2E4MN, 2PZ-CN, 2PZ-CNS, P0505, L07N from Shikoku Chem. Corp. or Curezol 2MZ from Air Products.

Farther It is also possible to use amines, in particular tertiary amines for acceleration deploy.

Next Reactive resins can also use plasticizers. Here you can in a preferred embodiment plasticizers based on polyglycol ethers, polyethylene oxides, Phosphate esters, aliphatic carboxylic acid esters and benzoic acid esters be used. Furthermore, it is also possible to use aromatic carboxylic esters, high molecular weight Diols, sulfonamides and adipic acid esters deploy.

Farther can optional fillers (e.g., fibers, carbon black, Zinc oxide, titanium dioxide, chalk, solid or hollow glass spheres, microspheres other materials, silica, Silicates), nucleating agents, blowing agents, Compounding agents and / or anti-aging agents, e.g. in shape from primary and secondary Antioxidants or be added in the form of sunscreens.

In a further preferred embodiment of the pressure-sensitive adhesive tape according to the invention, polyolefins, in particular poly-α-olefins, are used for the thermoplastics T1 or T2, at least one thermoplastic T1 or T2 having a softening temperature of greater than 65 ° C. and less than 125 ° C. and also solidify again after bonding during cooling. Different heat-activatable poly-α-olefins are commercially available from Degussa under the trade name Vestoplast ^™ .

In a preferred embodiment, the thermoplastic blends have static softening temperatures T _{E, A} or melting points T _{S, A} of +65 ° C to 125 ° C. The adhesive power of these polymers can be increased by targeted additive. Thus, for example, polyimine or polyvinyl acetate copolymers can be used as adhesion-promoting additives.

Process for the preparation

The thermolastic blends can out of solution or produced in the melt. For the production of the blend in solution are preferred solvents used, in which at least one of the thermoplastics T1 or T2 a good solubility having. To prepare the mixture are the known stirring units used. Therefor can also be the entry of heat to be required. Subsequently the blends are out of solution or more preferably melt-coated. For the coating From the melt, the thermoplastic blend is previously the solvent withdrawn. In a preferred embodiment, the solvent becomes withdrawn under reduced pressure in a concentrating extruder, For example, single or twin screw extruder used can be which prefers the solvent Distill off in different or equal vacuum stages and over a feed preheater feature. Then it will over a melt nozzle or an extrusion die coated, where appropriate, the adhesive film is stretched to to achieve the optimum coating thickness.

In another embodiment According to the invention, the thermoplastic blend is produced in the melt. For the Mixing of the resins can be a kneader or a twin-screw extruder, or a planetary roller extruder can be used.

The Coating then takes place again from the melt. It is about one melt die or an extrusion die coated, where appropriate, the adhesive film is stretched to to achieve the optimum coating thickness.

When support materials for the thermoplastic blend are the familiar and common to those skilled Materials, such as films (polyester, PET, PE, PP, BOPP, PVC, polyimide), Nonwovens, foams, Fabrics and fabric films and release paper (glassine, HDPE, LDPE) uses. The carrier materials should be equipped with a separating layer. The separation layer consists in a very preferred embodiment of the invention of a Silicone release varnish or a fluorinated release varnish.

Examples

Test Methods:

Rheology A)

The Measurement was carried out with a rheometer from Rheometrics Dynamic Systems (RDA II). The sample diameter was 8 mm, the sample thickness was between 1 and 2 mm. It was measured with the plate on plate configuration. It became the temperature sweep from 0-150 ° C with a Frequency of 10 rad / s recorded.

Iso-bending B)

Of the Iso-bending test is analogous to Iso / IEC standard 10373: 1993 (E) - section 6.1 performed. The test is passed when a total of more than 4000 bends be achieved.

Extreme bending test C)

in the Extreme stress test is a 3 cm wide cutout with the electric Module lying in the middle cut out of the chip card and then 10 × of 3 cm wide compressed to 2.5 cm width. The test is passed, when the electrical module does not dissolve.

Hand test D)

in the Hand the chip card with your hand over one of the two corners, the closer lie to the electrical module, so far bent until that the card breaks or the module breaks. Then the test is passed. If the electric module comes loose or falls out, the rule applies the test failed.

Reference 1)

• Polyamide film XAF 34.408 from Collano-Xiro

Reference 2)

• PU film XAF 36.304 from the company Collano Xiro

Reference 3)

• Copolymer Grilltex 1519 from EMS-Grilltex

Reference 4)

• Copolyamide Grilltex 1500 from EMS-Grilltex

example 1

30 % By weight of Griltex 1616 E (copolyester) from EMS-Griltech and 70 Wt .-% platamide 2395 (copolyamide) from. Atofina were in a Recording Extruder The company Haake at about 130 ° C. and 15 minutes at 25 rpm. mixed. The heat-activatable Adhesive was subsequently pressed between two layers of siliconized Glassine release paper to 60 microns at 140 ° C.

Example 2

50 % By weight of Griltex 1365 E (copolyester) from EMS-Griltech and 50 % By weight of Griltex 1442 (copolyester) from EMS-Griltech were used in a measuring mixer The company Haake at about 130 ° C. and 15 minutes at 25 rpm. mixed. The heat-activatable Adhesive was subsequently pressed between two layers of siliconized Glassine release paper to 60 microns at 140 ° C.

Example 3

80 % By weight of Griltex 9 E (copolyester) from EMS-Grilltech and 20% by weight Irostic 8304 HV (thermoplastic polyurethane) from Huntsman were in a measuring mixer The company Haake at about 130 ° C. and 15 minutes at 25 rpm. mixed. The heat-activatable Adhesive was subsequently pressed between two layers of siliconized Glassine release paper to 60 microns at 140 ° C.

Implantation of electrical modules

The Implantation of the electrical modules took place in the card body with a Implanter of the company Ruhlamat Testplatz Modul insert.

The following materials were used.
Electrical Modules: Nedcard Dummy N4C-25C, Tape Type: 0232-10
PVC cards: Fa. CCD
ABS card: Fa.ORGA

In a first step will be over a Zweiwalzenkaschieranlage Fa. Storck GmbH the examples 1 to 3 with 2 bar on the module belt of Fa. Nedcard laminated.

Then The electrical modules are implanted in the appropriate cavity of the card body. There were the following parameters for all examples applied:

Heating steps: 1

• Stamping temperature: 150 ° C
• Time: 1 × 2 s
• Cooling step: 1 × 800 ms, 25 ° C
• Pressure: 70 N per module

Results:

The With the inventive adhesives manufactured chip cards were tested according to the test methods B, C and D. The results are shown in Table 1.

table 1 it can be seen that all the inventive examples the most important criteria for have passed a chip card and thus very good for bonding of electric modules on card bodies are suitable.

Tab. 2

The Reference patterns in Table 2, on the other hand, are significantly worse and In particular, on ABS card materials do not pass the test methods.

The rheological properties are listed in Table 3 below.

Tab. 3

Claims (9)

Adhesive film consisting of two thermoplastics T1 and T2, wherein T1 ≠ T2 and a) the adhesive system has a softening temperature of greater than 65 ° C and less than 125 ° C b) measured by test method A G 'at 23 ° C greater than 10 ⁷ Pas has c) has a measured by test method A G '' at 23 ° C greater than 10 ⁶ Pas d) and measured by test method A crossover of less than 125 ° C for bonding of chip modules in card bodies. Adhesive film for bonding electrical chip modules in card bodies, wherein the respective adhesive layer has a very good adhesion to the card body and forms to the electrical chip module after the temperature activation, Adhesive film according to claim 1, characterized in that that the layer thickness between 10 and 100 microns, more preferably between 30 and 80 μm is. Adhesive film after at least one of the preceding Claims, characterized in that as thermoplastics T1 and T2 particularly preferably from the groups of copolyamides, polyethylvinylacetates, Polyvinyl acetates, polyolefins, polyurethanes and copolyesters are chosen Adhesive film after at least one of the preceding Claims, characterized in that additionally as reactive resins epoxy, and / or phenolic and / or novolac resins are used. Process for producing a heat-sensitive Adhesive tape, characterized in that the adhesive film after the claims 1 to 5 coated on a release paper or a release film becomes. Use of the heat-activatable prepared by method 6 Adhesive tape Adhesive film for bonding to polyimide, polyester or epoxy-based chip modules and on PVC, ABS, PET, PC, PP or PE card bodies. Method according to claim 7, characterized in that that the heat-activatable adhesive tape is punched. Method according to at least one of the preceding Claims, characterized in that the heat-activatable adhesive tape with an implantation stamping temperature of 150 ° C is processed.