[go: up one dir, main page]

DE102005053767A1 - MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau - Google Patents

MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau Download PDF

Info

Publication number
DE102005053767A1
DE102005053767A1 DE102005053767A DE102005053767A DE102005053767A1 DE 102005053767 A1 DE102005053767 A1 DE 102005053767A1 DE 102005053767 A DE102005053767 A DE 102005053767A DE 102005053767 A DE102005053767 A DE 102005053767A DE 102005053767 A1 DE102005053767 A1 DE 102005053767A1
Authority
DE
Germany
Prior art keywords
carrier substrate
manufacture
installation
mems microphone
microphone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE102005053767A
Other languages
English (en)
Other versions
DE102005053767B4 (de
Inventor
Wolfgang Pahl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Priority to DE102005053767.7A priority Critical patent/DE102005053767B4/de
Priority to PCT/DE2006/001946 priority patent/WO2007054071A1/de
Priority to JP2008539239A priority patent/JP5054703B2/ja
Priority to US12/092,423 priority patent/US8229139B2/en
Publication of DE102005053767A1 publication Critical patent/DE102005053767A1/de
Application granted granted Critical
Publication of DE102005053767B4 publication Critical patent/DE102005053767B4/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0064—Packages or encapsulation for protecting against electromagnetic or electrostatic interferences
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2225/00—Details of deaf aids covered by H04R25/00, not provided for in any of its subgroups
    • H04R2225/49—Reducing the effects of electromagnetic noise on the functioning of hearing aids, by, e.g. shielding, signal processing adaptation, selective (de)activation of electronic parts in hearing aid

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Computer Hardware Design (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)

Abstract

Es wird ein Mikrofon in miniaturisierter Bauweise vorgeschlagen, welches auf einer ersten Oberfläche eines flachen Trägersubstrats einen elektroakustischen Wandler trägt, der über einer Ausnehmung des Trägersubstrats angeordnet ist. Auf der zweiten Oberfläche des Trägersubstrats wird die Ausnehmung von einer auf dem Trägersubstrat aufsitzenden und mit dessen Oberfläche dicht abschließenden Kappe überspannt, die zumindest eine metallische Schicht zur elektromagnetischen Abschirmung aufweist. Unter der Kappe können Halbleiterbauelemente angeordnet sein, die die Funktion des Mikrofons unterstützen oder gewährleisten.
DE102005053767.7A 2005-11-10 2005-11-10 MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau Expired - Lifetime DE102005053767B4 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE102005053767.7A DE102005053767B4 (de) 2005-11-10 2005-11-10 MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
PCT/DE2006/001946 WO2007054071A1 (de) 2005-11-10 2006-11-06 Mems-mikrofon, verfahren zur herstellung und verfahren zum einbau
JP2008539239A JP5054703B2 (ja) 2005-11-10 2006-11-06 Ｍｅｍｓマイクロフォン、ｍｅｍｓマイクロフォンの製造方法およびｍｅｍｓマイクロフォンの組み込み方法
US12/092,423 US8229139B2 (en) 2005-11-10 2006-11-06 MEMS microphone, production method and method for installing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005053767.7A DE102005053767B4 (de) 2005-11-10 2005-11-10 MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau

Publications (2)

Publication Number Publication Date
DE102005053767A1 true DE102005053767A1 (de) 2007-05-16
DE102005053767B4 DE102005053767B4 (de) 2014-10-30

Family

ID=37700795

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102005053767.7A Expired - Lifetime DE102005053767B4 (de) 2005-11-10 2005-11-10 MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau

Country Status (4)

Country Link
US (1) US8229139B2 (de)
JP (1) JP5054703B2 (de)
DE (1) DE102005053767B4 (de)
WO (1) WO2007054071A1 (de)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007038396B3 (de) * 2007-08-14 2008-12-11 Robert Bosch Gmbh Mikromechanisches Bauteil mit abgestumpfter Kante
US8218794B2 (en) 2006-09-29 2012-07-10 Epcos Ag Component comprising a MEMS microphone and method for the production of said component
US8737674B2 (en) 2011-02-11 2014-05-27 Infineon Technologies Ag Housed loudspeaker array
WO2016180841A1 (de) * 2015-05-13 2016-11-17 USound GmbH Leiterplattenmodul mit durchgehender aussparung sowie diesbezügliche schallwandleranordnung sowie herstellungsverfahren
CN108622845A (zh) * 2017-03-16 2018-10-09 日月光半导体制造股份有限公司 半导体装置封装及其制造方法
CN112697262A (zh) * 2020-12-08 2021-04-23 联合微电子中心有限责任公司 水听器及其制造方法
DE102014214153B4 (de) 2013-07-22 2021-12-23 Infineon Technologies Ag Oberflächenmontierbares Mikrofonpackage

Families Citing this family (122)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7608789B2 (en) * 2004-08-12 2009-10-27 Epcos Ag Component arrangement provided with a carrier substrate
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008511B4 (de) 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
DE102005053765B4 (de) 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
US8295528B2 (en) * 2006-11-23 2012-10-23 Epcos Ag Board mounting of microphone transducer
JP5243746B2 (ja) * 2007-08-07 2013-07-24 ルネサスエレクトロニクス株式会社 磁気記憶装置の製造方法および磁気記憶装置
JP5024671B2 (ja) * 2007-12-11 2012-09-12 ソニーモバイルコミュニケーションズ株式会社 コンデンサマイクロホン及び電子機器
US8604566B2 (en) 2008-06-17 2013-12-10 Infineon Technologies Ag Sensor module and semiconductor chip
DE102008053327A1 (de) 2008-10-27 2010-04-29 Epcos Ag Anordnung mit einem Mikrofon
JP2010183312A (ja) * 2009-02-05 2010-08-19 Funai Electric Co Ltd マイクロホンユニット
JP5375311B2 (ja) 2009-04-28 2013-12-25 オムロン株式会社 電子部品実装装置及びその製造方法
US9344805B2 (en) * 2009-11-24 2016-05-17 Nxp B.V. Micro-electromechanical system microphone
US8387464B2 (en) * 2009-11-30 2013-03-05 Freescale Semiconductor, Inc. Laterally integrated MEMS sensor device with multi-stimulus sensing
IT1397976B1 (it) * 2009-12-23 2013-02-04 St Microelectronics Rousset Trasduttore di tipo microelettromeccanico e relativo procedimento di assemblaggio.
CN102125760B (zh) * 2010-01-14 2014-04-30 鸿富锦精密工业（深圳）有限公司 游戏鼓
DE102010022204B4 (de) * 2010-05-20 2016-03-31 Epcos Ag Elektrisches Bauelement mit flacher Bauform und Herstellungsverfahren
EP2432249A1 (de) 2010-07-02 2012-03-21 Knowles Electronics Asia PTE. Ltd. Mikrofon
JP2012039272A (ja) * 2010-08-05 2012-02-23 Funai Electric Co Ltd マイクロホンユニット
US20120288130A1 (en) * 2011-05-11 2012-11-15 Infineon Technologies Ag Microphone Arrangement
CN110944269A (zh) 2011-08-18 2020-03-31 美商楼氏电子有限公司 用于mems装置的灵敏度调整装置和方法
DE102011086722A1 (de) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren
US9485560B2 (en) 2012-02-01 2016-11-01 Knowles Electronics, Llc Embedded circuit in a MEMS device
US20130320465A1 (en) * 2012-05-30 2013-12-05 Merry Electronics Co., Ltd. Thin mems microphone module
US9402118B2 (en) 2012-07-27 2016-07-26 Knowles Electronics, Llc Housing and method to control solder creep on housing
US9491539B2 (en) 2012-08-01 2016-11-08 Knowles Electronics, Llc MEMS apparatus disposed on assembly lid
US9078063B2 (en) 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US9804003B2 (en) * 2012-10-23 2017-10-31 Apple Inc. Electronic devices with environmental sensors
KR101303954B1 (ko) 2012-12-14 2013-09-05 주식회사 비에스이 광대역 및 방수 특성을 위한 보텀 포트형 마이크로폰 조립체
US10097918B2 (en) * 2013-01-23 2018-10-09 Infineon Technologies Ag Chip arrangement and a method for manufacturing the same
US9082883B2 (en) 2013-03-04 2015-07-14 Unisem (M) Berhad Top port MEMS cavity package and method of manufacture thereof
US8999757B2 (en) 2013-03-04 2015-04-07 Unisem (M) Berhad Top port MEMS cavity package and method of manufacture thereof
US9467785B2 (en) 2013-03-28 2016-10-11 Knowles Electronics, Llc MEMS apparatus with increased back volume
US9503814B2 (en) 2013-04-10 2016-11-22 Knowles Electronics, Llc Differential outputs in multiple motor MEMS devices
US9301075B2 (en) 2013-04-24 2016-03-29 Knowles Electronics, Llc MEMS microphone with out-gassing openings and method of manufacturing the same
US9711166B2 (en) 2013-05-23 2017-07-18 Knowles Electronics, Llc Decimation synchronization in a microphone
KR20160010606A (ko) 2013-05-23 2016-01-27 노우레스 일렉트로닉스, 엘엘시 Vad 탐지 마이크로폰 및 그 마이크로폰을 동작시키는 방법
US20180317019A1 (en) 2013-05-23 2018-11-01 Knowles Electronics, Llc Acoustic activity detecting microphone
US10028054B2 (en) 2013-10-21 2018-07-17 Knowles Electronics, Llc Apparatus and method for frequency detection
US10020008B2 (en) 2013-05-23 2018-07-10 Knowles Electronics, Llc Microphone and corresponding digital interface
DE102013106353B4 (de) * 2013-06-18 2018-06-28 Tdk Corporation Verfahren zum Aufbringen einer strukturierten Beschichtung auf ein Bauelement
US9386370B2 (en) 2013-09-04 2016-07-05 Knowles Electronics, Llc Slew rate control apparatus for digital microphones
JP6103068B2 (ja) 2013-09-20 2017-03-29 株式会社村田製作所 圧電センサ
WO2015056443A1 (ja) * 2013-10-15 2015-04-23 パナソニックＩｐマネジメント株式会社 マイクロホン
US9502028B2 (en) 2013-10-18 2016-11-22 Knowles Electronics, Llc Acoustic activity detection apparatus and method
US9147397B2 (en) 2013-10-29 2015-09-29 Knowles Electronics, Llc VAD detection apparatus and method of operating the same
US9831844B2 (en) 2014-09-19 2017-11-28 Knowles Electronics, Llc Digital microphone with adjustable gain control
US9554214B2 (en) 2014-10-02 2017-01-24 Knowles Electronics, Llc Signal processing platform in an acoustic capture device
US9743191B2 (en) 2014-10-13 2017-08-22 Knowles Electronics, Llc Acoustic apparatus with diaphragm supported at a discrete number of locations
US9743167B2 (en) 2014-12-17 2017-08-22 Knowles Electronics, Llc Microphone with soft clipping circuit
US10045140B2 (en) 2015-01-07 2018-08-07 Knowles Electronics, Llc Utilizing digital microphones for low power keyword detection and noise suppression
US9830080B2 (en) 2015-01-21 2017-11-28 Knowles Electronics, Llc Low power voice trigger for acoustic apparatus and method
US10121472B2 (en) 2015-02-13 2018-11-06 Knowles Electronics, Llc Audio buffer catch-up apparatus and method with two microphones
US9866938B2 (en) 2015-02-19 2018-01-09 Knowles Electronics, Llc Interface for microphone-to-microphone communications
US9800971B2 (en) 2015-03-17 2017-10-24 Knowles Electronics, Llc Acoustic apparatus with side port
DE102015206863B3 (de) * 2015-04-16 2016-05-25 Robert Bosch Gmbh Verfahren zur Herstellung einer Mikrofonstruktur und einer Drucksensorstruktur im Schichtaufbau eines MEMS-Bauelements
DE112016002183T5 (de) 2015-05-14 2018-01-25 Knowles Electronics, Llc Mikrophon mit eingesenktem Bereich
US10291973B2 (en) 2015-05-14 2019-05-14 Knowles Electronics, Llc Sensor device with ingress protection
CN104921751A (zh) * 2015-06-23 2015-09-23 杨松 接触式拾音麦克风和听诊器
US9478234B1 (en) 2015-07-13 2016-10-25 Knowles Electronics, Llc Microphone apparatus and method with catch-up buffer
US9794661B2 (en) 2015-08-07 2017-10-17 Knowles Electronics, Llc Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
DE112016005317T5 (de) 2015-11-19 2018-08-16 Knowles Electronics, Llc Differentielles MEMS-Mikrofon
WO2017105851A1 (en) 2015-12-18 2017-06-22 Knowles Electronics, Llc Microphone with hydrophobic ingress protection
US9516421B1 (en) 2015-12-18 2016-12-06 Knowles Electronics, Llc Acoustic sensing apparatus and method of manufacturing the same
WO2017136364A1 (en) 2016-02-01 2017-08-10 Knowles Electronics, Llc Apparatus to bias mems motors
WO2017136744A1 (en) 2016-02-04 2017-08-10 Knowles Electronics, Llc Microphone and pressure sensor
US10362408B2 (en) 2016-02-04 2019-07-23 Knowles Electronics, Llc Differential MEMS microphone
US20170240418A1 (en) * 2016-02-18 2017-08-24 Knowles Electronics, Llc Low-cost miniature mems vibration sensor
ITUA20162959A1 (it) * 2016-04-28 2017-10-28 St Microelectronics Srl Modulo di trasduzione multi-camera, apparecchiatura includente il modulo di trasduzione multi-camera e metodo di fabbricazione del modulo di trasduzione multi-camera
CN109314828B (zh) 2016-05-26 2021-05-11 美商楼氏电子有限公司 具有集成压力传感器的麦克风装置
US11104571B2 (en) 2016-06-24 2021-08-31 Knowles Electronics, Llc Microphone with integrated gas sensor
US10499150B2 (en) 2016-07-05 2019-12-03 Knowles Electronics, Llc Microphone assembly with digital feedback loop
US10206023B2 (en) 2016-07-06 2019-02-12 Knowles Electronics, Llc Transducer package with through-vias
US10153740B2 (en) 2016-07-11 2018-12-11 Knowles Electronics, Llc Split signal differential MEMS microphone
US9860623B1 (en) 2016-07-13 2018-01-02 Knowles Electronics, Llc Stacked chip microphone
US10257616B2 (en) 2016-07-22 2019-04-09 Knowles Electronics, Llc Digital microphone assembly with improved frequency response and noise characteristics
WO2018022773A1 (en) 2016-07-27 2018-02-01 Knowles Electronics, Llc Microelectromechanical system (mems) device packaging
JP6914540B2 (ja) * 2016-07-29 2021-08-04 国立大学法人東北大学 マイクロフォン、電子機器及びパッケージング方法
WO2018081278A1 (en) 2016-10-28 2018-05-03 Knowles Electronics, Llc Transducer assemblies and methods
CN110191859B (zh) 2016-12-05 2023-03-28 美商楼氏电子有限公司 微机电系统装置中的传感器功率斜变
CN110115048B (zh) 2016-12-28 2020-11-24 美商楼氏电子有限公司 微机电系统和微机电系统麦克风封装物
US11218804B2 (en) 2017-02-14 2022-01-04 Knowles Electronics, Llc System and method for calibrating microphone cut-off frequency
EP3855129B1 (de) 2017-03-22 2023-10-25 Knowles Electronics, LLC Interface schaltkreis für einen kapazitiven sensor
WO2018218073A1 (en) 2017-05-25 2018-11-29 Knowles Electronics, Llc Microphone package for fully encapsulated asic and wires
WO2019005885A1 (en) 2017-06-27 2019-01-03 Knowles Electronics, Llc POST-LINEARIZATION SYSTEM AND METHOD USING A TRACKING SIGNAL
CN110800317B (zh) 2017-07-26 2021-11-30 美商楼氏电子有限公司 微机电系统电机和麦克风
WO2019051211A1 (en) 2017-09-08 2019-03-14 Knowles Electronics, Llc NOISE MITIGATION FOR A DIGITAL MICROPHONE
US11228845B2 (en) 2017-09-18 2022-01-18 Knowles Electronics, Llc Systems and methods for acoustic hole optimization
WO2019060599A1 (en) 2017-09-21 2019-03-28 Knowles Electronics, Llc MEMS DEVICE RAISED IN A MICROPHONE WITH INPUT PROTECTION
US10591326B2 (en) 2017-11-14 2020-03-17 Knowles Electronics, Llc Sensor package with ingress protection
DE102018203098B3 (de) * 2018-03-01 2019-06-19 Infineon Technologies Ag MEMS-Sensor
DE112019001416T5 (de) 2018-03-21 2021-02-04 Knowles Electronics, Llc Dielektrischer kamm für mems-vorrichtung
CN112020865B (zh) 2018-04-26 2022-06-17 美商楼氏电子有限公司 具有透声隔膜的声学组件
CN112189347B (zh) 2018-05-18 2022-10-04 美商楼氏电子有限公司 麦克风组件和形成麦克风组件的方法
CN112335262B (zh) 2018-06-19 2021-12-28 美商楼氏电子有限公司 麦克风组件、半导体管芯和降低麦克风的噪声的方法
WO2019246151A1 (en) 2018-06-19 2019-12-26 Knowles Electronics, Llc Transconductance amplifier
WO2020072920A1 (en) 2018-10-05 2020-04-09 Knowles Electronics, Llc Microphone device with ingress protection
US10870577B2 (en) 2018-10-05 2020-12-22 Knowles Electronics, Llc Methods of forming MEMS diaphragms including corrugations
WO2020072904A1 (en) 2018-10-05 2020-04-09 Knowles Electronics, Llc Acoustic transducers with a low pressure zone and diaphragms having enhanced compliance
WO2020076846A1 (en) 2018-10-09 2020-04-16 Knowles Electronics, Llc Digital transducer interface scrambling
WO2020123550A2 (en) 2018-12-11 2020-06-18 Knowles Electronics, Llc Multi-rate integrated circuit connectable to a sensor
WO2020154066A1 (en) 2019-01-22 2020-07-30 Knowles Electronics, Llc Leakage current detection from bias voltage supply of mems microphone assembly
US11197104B2 (en) 2019-01-25 2021-12-07 Knowles Electronics, Llc MEMS transducer including free plate diaphragm with spring members
US11122360B2 (en) 2019-02-01 2021-09-14 Knowles Electronics, Llc Microphone assembly with back volume vent
EP3694222B1 (de) 2019-02-06 2024-05-15 Knowles Electronics, LLC Sensoranordnung und -verfahren
US11109727B2 (en) 2019-02-28 2021-09-07 Irobot Corporation Cleaning rollers for cleaning robots
US11778390B2 (en) 2019-11-07 2023-10-03 Knowles Electronics, Llc. Microphone assembly having a direct current bias circuit
DE102020133179A1 (de) 2019-12-23 2021-06-24 Knowles Electronics, Llc Mikrofonanordnung, die eine gleichstromvorspannungsschaltung mit tiefer grabenisolation aufweist
US11228846B2 (en) * 2020-02-14 2022-01-18 Apple Inc. Sensor assembly for electronic device
US11787690B1 (en) 2020-04-03 2023-10-17 Knowles Electronics, Llc. MEMS assembly substrates including a bond layer
US11240600B1 (en) 2020-11-12 2022-02-01 Knowles Electronics, Llc Sensor assembly and electrical circuit therefor
US11671775B2 (en) 2020-12-30 2023-06-06 Knowles Electronics, Llc Microphone assembly with transducer sensitivity drift compensation and electrical circuit therefor
US11743666B2 (en) 2020-12-30 2023-08-29 Knowles Electronics, Llc. Microphone assembly with transducer sensitivity drift compensation and electrical circuit therefor
US11916575B2 (en) 2020-12-31 2024-02-27 Knowleselectronics, Llc. Digital microphone assembly with improved mismatch shaping
US11909387B2 (en) 2021-03-17 2024-02-20 Knowles Electronics, Llc. Microphone with slew rate controlled buffer
US12240748B2 (en) 2021-03-21 2025-03-04 Knowles Electronics, Llc MEMS die and MEMS-based sensor
US11897762B2 (en) 2021-03-27 2024-02-13 Knowles Electronics, Llc. Digital microphone with over-voltage protection
US11528546B2 (en) 2021-04-05 2022-12-13 Knowles Electronics, Llc Sealed vacuum MEMS die
US11540048B2 (en) 2021-04-16 2022-12-27 Knowles Electronics, Llc Reduced noise MEMS device with force feedback
US11649161B2 (en) 2021-07-26 2023-05-16 Knowles Electronics, Llc Diaphragm assembly with non-uniform pillar distribution
US11772961B2 (en) 2021-08-26 2023-10-03 Knowles Electronics, Llc MEMS device with perimeter barometric relief pierce
US11780726B2 (en) 2021-11-03 2023-10-10 Knowles Electronics, Llc Dual-diaphragm assembly having center constraint
CN115278479A (zh) * 2022-05-31 2022-11-01 青岛歌尔智能传感器有限公司 一种骨声纹传感器和电子设备

Family Cites Families (189)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2105010A (en) * 1933-02-25 1938-01-11 Brush Dev Co Piezoelectric device
US2315417A (en) * 1941-04-14 1943-03-30 Charles B Greenberg Expansion link
US3447217A (en) * 1964-02-05 1969-06-03 Hitachi Ltd Method of producing ceramic piezoelectric vibrator
US3587322A (en) * 1969-06-17 1971-06-28 Simmonds Precision Products Pressure transducer mounting
US3735211A (en) * 1971-06-21 1973-05-22 Fairchild Camera Instr Co Semiconductor package containing a dual epoxy and metal seal between a cover and a substrate, and method for forming said seal
US3726002A (en) * 1971-08-27 1973-04-10 Ibm Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate
JPS562346Y2 (de) 1974-05-23 1981-01-20
US4127840A (en) 1977-02-22 1978-11-28 Conrac Corporation Solid state force transducer
US4454440A (en) * 1978-12-22 1984-06-12 United Technologies Corporation Surface acoustic wave (SAW) pressure sensor structure
JPS55112864U (de) * 1979-02-02 1980-08-08
US4222277A (en) 1979-08-13 1980-09-16 Kulite Semiconductor Products, Inc. Media compatible pressure transducer
US4277814A (en) 1979-09-04 1981-07-07 Ford Motor Company Semiconductor variable capacitance pressure transducer assembly
JPS622879Y2 (de) * 1981-03-25 1987-01-22
CH642504A5 (en) * 1981-06-01 1984-04-13 Asulab Sa Hybrid electroacoustic transducer
US4424419A (en) * 1981-10-19 1984-01-03 Northern Telecom Limited Electret microphone shield
CA1165859A (en) 1981-10-19 1984-04-17 Guy J. Chaput Electret microphone shield
US4558184A (en) 1983-02-24 1985-12-10 At&T Bell Laboratories Integrated capacitive transducer
US4545440A (en) 1983-04-07 1985-10-08 Treadway John E Attachment for pneumatic hammers for punching holes of varying size
US4533795A (en) 1983-07-07 1985-08-06 American Telephone And Telegraph Integrated electroacoustic transducer
JPS60111129A (ja) 1983-11-21 1985-06-17 Yokogawa Hokushin Electric Corp 圧力センサ
US4641054A (en) * 1984-08-09 1987-02-03 Nippon Ceramic Company, Limited Piezoelectric electro-acoustic transducer
US4691363A (en) 1985-12-11 1987-09-01 American Telephone & Telegraph Company, At&T Information Systems Inc. Transducer device
JPS62173814A (ja) * 1986-01-28 1987-07-30 Alps Electric Co Ltd 弾性表面波素子搭載ユニツト
ATA74486A (de) * 1986-03-20 1987-04-15 Akg Akustische Kino Geraete Richtmikrophon nach dem elektrostatischen oder elektrodynamischen wandlerprinzip
JPH0726887B2 (ja) 1986-05-31 1995-03-29 株式会社堀場製作所 コンデンサマイクロフオン型検出器用ダイアフラム
US5091051A (en) * 1986-12-22 1992-02-25 Raytheon Company Saw device method
NL8702589A (nl) * 1987-10-30 1989-05-16 Microtel Bv Elektro-akoestische transducent van de als elektreet aangeduide soort, en een werkwijze voor het vervaardigen van een dergelijke transducent.
US5293781A (en) 1987-11-09 1994-03-15 California Institute Of Technology Tunnel effect measuring systems and particle detectors
US4816125A (en) * 1987-11-25 1989-03-28 The Regents Of The University Of California IC processed piezoelectric microphone
US5216490A (en) * 1988-01-13 1993-06-01 Charles Stark Draper Laboratory, Inc. Bridge electrodes for microelectromechanical devices
US4825335A (en) * 1988-03-14 1989-04-25 Endevco Corporation Differential capacitive transducer and method of making
US4866683A (en) 1988-05-24 1989-09-12 Honeywell, Inc. Integrated acoustic receiver or projector
US4984268A (en) * 1988-11-21 1991-01-08 At&T Bell Laboratories Telephone handset construction
JPH03116899A (ja) * 1989-09-29 1991-05-17 Toshiba Lighting & Technol Corp 多層回路基板
US5146435A (en) * 1989-12-04 1992-09-08 The Charles Stark Draper Laboratory, Inc. Acoustic transducer
DE4000903C1 (de) 1990-01-15 1990-08-09 Robert Bosch Gmbh, 7000 Stuttgart, De
US5101543A (en) * 1990-07-02 1992-04-07 Gentex Corporation Method of making a variable capacitor microphone
US5179015A (en) * 1990-07-23 1993-01-12 New England Biolabs, Inc. Heterospecific modification as a means to clone restriction genes
US5059848A (en) 1990-08-20 1991-10-22 The United States Of America As Represented By The Secretary Of The Army Low-cost saw packaging technique
US5153379A (en) 1990-10-09 1992-10-06 Motorola, Inc. Shielded low-profile electronic component assembly
US5189777A (en) 1990-12-07 1993-03-02 Wisconsin Alumni Research Foundation Method of producing micromachined differential pressure transducers
JP2772739B2 (ja) * 1991-06-20 1998-07-09 いわき電子株式会社 リードレスパッケージの外部電極構造及びその製造方法
US5184107A (en) * 1991-01-28 1993-02-02 Honeywell, Inc. Piezoresistive pressure transducer with a conductive elastomeric seal
US5257547A (en) 1991-11-26 1993-11-02 Honeywell Inc. Amplified pressure transducer
US5650685A (en) 1992-01-30 1997-07-22 The United States Of America As Represented By The Secretary Of The Army Microcircuit package with integrated acoustic isolator
US5490220A (en) * 1992-03-18 1996-02-06 Knowles Electronics, Inc. Solid state condenser and microphone devices
FR2697675B1 (fr) * 1992-11-05 1995-01-06 Suisse Electronique Microtech Procédé de fabrication de transducteurs capacitifs intégrés.
US5531787A (en) 1993-01-25 1996-07-02 Lesinski; S. George Implantable auditory system with micromachined microsensor and microactuator
US5475606A (en) * 1993-03-05 1995-12-12 International Business Machines Corporation Faraday cage for a printed circuit card
US5477008A (en) 1993-03-19 1995-12-19 Olin Corporation Polymer plug for electronic packages
JPH06334298A (ja) * 1993-05-27 1994-12-02 Fujitsu Ltd 表面実装部品の搭載構造
US5459368A (en) 1993-08-06 1995-10-17 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device mounted module
US5465008A (en) 1993-10-08 1995-11-07 Stratedge Corporation Ceramic microelectronics package
JPH07111254A (ja) * 1993-10-12 1995-04-25 Sumitomo Electric Ind Ltd 半導体装置の製造方法
US6191928B1 (en) * 1994-05-27 2001-02-20 Littelfuse, Inc. Surface-mountable device for protection against electrostatic damage to electronic components
US5452268A (en) 1994-08-12 1995-09-19 The Charles Stark Draper Laboratory, Inc. Acoustic transducer with improved low frequency response
US5545912A (en) 1994-10-27 1996-08-13 Motorola, Inc. Electronic device enclosure including a conductive cap and substrate
JP3171043B2 (ja) * 1995-01-11 2001-05-28 株式会社村田製作所 弾性表面波装置
US5506919A (en) * 1995-03-27 1996-04-09 Eastman Kodak Company Conductive membrane optical modulator
JP3328102B2 (ja) 1995-05-08 2002-09-24 松下電器産業株式会社 弾性表面波装置及びその製造方法
US5659195A (en) 1995-06-08 1997-08-19 The Regents Of The University Of California CMOS integrated microsensor with a precision measurement circuit
DK172085B1 (da) * 1995-06-23 1997-10-13 Microtronic As Mikromekanisk mikrofon
US5573435A (en) 1995-08-31 1996-11-12 The Whitaker Corporation Tandem loop contact for an electrical connector
TW332166B (en) * 1995-10-06 1998-05-21 Laurance Lewellin Richard Method for making articles with rice hulls
EP0774888B1 (de) 1995-11-16 2003-03-19 Matsushita Electric Industrial Co., Ltd Gedruckte Leiterplatte und ihre Anordnung
US5674785A (en) * 1995-11-27 1997-10-07 Micron Technology, Inc. Method of producing a single piece package for semiconductor die
JP3294490B2 (ja) 1995-11-29 2002-06-24 株式会社日立製作所 Ｂｇａ型半導体装置
JP3432982B2 (ja) * 1995-12-13 2003-08-04 沖電気工業株式会社 表面実装型半導体装置の製造方法
US6242842B1 (en) 1996-12-16 2001-06-05 Siemens Matsushita Components Gmbh & Co. Kg Electrical component, in particular saw component operating with surface acoustic waves, and a method for its production
DE19548051A1 (de) 1995-12-21 1997-06-26 Siemens Matsushita Components Elektronisches Bauelement insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement -
DE19548046C2 (de) * 1995-12-21 1998-01-15 Siemens Matsushita Components Verfahren zur Herstellung von für eine Flip-Chip-Montage geeigneten Kontakten von elektrischen Bauelementen
DE19548048C2 (de) 1995-12-21 1998-01-15 Siemens Matsushita Components Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement (OFW-Bauelement)
US5748758A (en) * 1996-01-25 1998-05-05 Menasco, Jr.; Lawrence C. Acoustic audio transducer with aerogel diaphragm
JPH09222372A (ja) 1996-02-19 1997-08-26 Mitsubishi Electric Corp 半導体式センサ
US5888845A (en) * 1996-05-02 1999-03-30 National Semiconductor Corporation Method of making high sensitivity micro-machined pressure sensors and acoustic transducers
DE59704079D1 (de) * 1996-05-24 2001-08-23 Epcos Ag Elektronisches bauelement, insbesondere mit akustischen oberflächenwellen arbeitendes bauelement - ofw-bauelement
US5939968A (en) 1996-06-19 1999-08-17 Littelfuse, Inc. Electrical apparatus for overcurrent protection of electrical circuits
AU6541996A (en) * 1996-06-24 1998-01-14 International Business Machines Corporation Stacked semiconductor device package
US5889872A (en) * 1996-07-02 1999-03-30 Motorola, Inc. Capacitive microphone and method therefor
US5838551A (en) 1996-08-01 1998-11-17 Northern Telecom Limited Electronic package carrying an electronic component and assembly of mother board and electronic package
US5740261A (en) * 1996-11-21 1998-04-14 Knowles Electronics, Inc. Miniature silicon condenser microphone
JP3576727B2 (ja) * 1996-12-10 2004-10-13 株式会社デンソー 表面実装型パッケージ
DE19653097A1 (de) * 1996-12-20 1998-07-02 Forschungszentrum Juelich Gmbh Schicht mit porösem Schichtbereich, eine solche Schicht enthaltendes Interferenzfilter sowie Verfahren zu ihrer Herstellung
US5999821A (en) 1997-01-29 1999-12-07 Motorola, Inc. Radiotelephone having a user interface module
US5870482A (en) * 1997-02-25 1999-02-09 Knowles Electronics, Inc. Miniature silicon condenser microphone
US5923995A (en) 1997-04-18 1999-07-13 National Semiconductor Corporation Methods and apparatuses for singulation of microelectromechanical systems
US6118881A (en) 1997-05-13 2000-09-12 Lucent Technologies Inc. Reduction of flow-induced microphone noise
US5831262A (en) 1997-06-27 1998-11-03 Lucent Technologies Inc. Article comprising an optical fiber attached to a micromechanical device
WO1999000844A2 (en) * 1997-06-30 1999-01-07 Formfactor, Inc. Sockets for semiconductor devices with spring contact elements
US5990418A (en) 1997-07-29 1999-11-23 International Business Machines Corporation Hermetic CBGA/CCGA structure with thermal paste cooling
TW387198B (en) * 1997-09-03 2000-04-11 Hosiden Corp Audio sensor and its manufacturing method, and semiconductor electret capacitance microphone using the same
US6150753A (en) 1997-12-15 2000-11-21 Cae Blackstone Ultrasonic transducer assembly having a cobalt-base alloy housing
DE19757560A1 (de) * 1997-12-23 1999-07-01 Forschungszentrum Juelich Gmbh Verfahren zur Herstellung einer porösen Schicht mit Hilfe eines elektrochemischen Ätzprozesses
DE19806550B4 (de) * 1998-02-17 2004-07-22 Epcos Ag Elektronisches Bauelement, insbesondere mit akustischen Oberflächenwellen arbeitendes Bauelement - OFW-Bauelement
DE19806818C1 (de) * 1998-02-18 1999-11-04 Siemens Matsushita Components Verfahren zur Herstellung eines elektronischen Bauelements, insbesondere eines mit akustischen Oberflächenwllen arbeitenden OFW-Bauelements
US6282072B1 (en) 1998-02-24 2001-08-28 Littelfuse, Inc. Electrical devices having a polymer PTC array
US6400065B1 (en) * 1998-03-31 2002-06-04 Measurement Specialties, Inc. Omni-directional ultrasonic transducer apparatus and staking method
DE19818824B4 (de) * 1998-04-27 2008-07-31 Epcos Ag Elektronisches Bauelement und Verfahren zu dessen Herstellung
DE19822794C1 (de) * 1998-05-20 2000-03-09 Siemens Matsushita Components Mehrfachnutzen für elektronische Bauelemente, insbesondere akustische Oberflächenwellen-Bauelemente
US6052464A (en) * 1998-05-29 2000-04-18 Motorola, Inc. Telephone set having a microphone for receiving or an earpiece for generating an acoustic signal via a keypad
FI105880B (fi) * 1998-06-18 2000-10-13 Nokia Mobile Phones Ltd Mikromekaanisen mikrofonin kiinnitys
US6108184A (en) 1998-11-13 2000-08-22 Littlefuse, Inc. Surface mountable electrical device comprising a voltage variable material
US6078245A (en) * 1998-12-17 2000-06-20 Littelfuse, Inc. Containment of tin diffusion bar
US7003127B1 (en) * 1999-01-07 2006-02-21 Sarnoff Corporation Hearing aid with large diaphragm microphone element including a printed circuit board
US6157546A (en) 1999-03-26 2000-12-05 Ericsson Inc. Shielding apparatus for electronic devices
US6182342B1 (en) * 1999-04-02 2001-02-06 Andersen Laboratories, Inc. Method of encapsulating a saw device
US6136419A (en) 1999-05-26 2000-10-24 International Business Machines Corporation Ceramic substrate having a sealed layer
CA2315417A1 (en) 1999-08-11 2001-02-11 Hiroshi Une Electret capacitor microphone
US6522762B1 (en) * 1999-09-07 2003-02-18 Microtronic A/S Silicon-based sensor system
PL209935B1 (pl) 1999-09-06 2011-11-30 Sonionmems As Układ czujnika na bazie krzemu do mikrofonu
US6732588B1 (en) * 1999-09-07 2004-05-11 Sonionmems A/S Pressure transducer
US6829131B1 (en) 1999-09-13 2004-12-07 Carnegie Mellon University MEMS digital-to-acoustic transducer with error cancellation
FR2799883B1 (fr) 1999-10-15 2003-05-30 Thomson Csf Procede d'encapsulation de composants electroniques
EP1230739B1 (de) 1999-11-19 2016-05-25 Gentex Corporation Fahrzeugzubehörmikrofon
JP2001157298A (ja) 1999-11-26 2001-06-08 Koji Ono 光学式マイクロホンおよびその製造方法
US6324907B1 (en) 1999-11-29 2001-12-04 Microtronic A/S Flexible substrate transducer assembly
US6613605B2 (en) 1999-12-15 2003-09-02 Benedict G Pace Interconnection method entailing protuberances formed by melting metal over contact areas
US20020076910A1 (en) * 1999-12-15 2002-06-20 Pace Benedict G. High density electronic interconnection
DE19961842B4 (de) 1999-12-21 2008-01-31 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Mehrschichtleiterplatte
JP2001267473A (ja) 2000-03-17 2001-09-28 Hitachi Ltd 半導体装置およびその製造方法
DE10016867A1 (de) * 2000-04-05 2001-10-18 Epcos Ag Bauelement mit Beschriftung
US6384473B1 (en) * 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
US6809413B1 (en) 2000-05-16 2004-10-26 Sandia Corporation Microelectronic device package with an integral window mounted in a recessed lip
JP2001339796A (ja) * 2000-05-29 2001-12-07 Nippon Hoso Kyokai <Nhk> コンデンサ型マイクロフォン
US7153717B2 (en) * 2000-05-30 2006-12-26 Ic Mechanics Inc. Encapsulation of MEMS devices using pillar-supported caps
JP2002001857A (ja) * 2000-06-21 2002-01-08 Nitto Denko Corp 樹脂基板及び液晶表示装置
US6535460B2 (en) * 2000-08-11 2003-03-18 Knowles Electronics, Llc Miniature broadband acoustic transducer
US6439869B1 (en) 2000-08-16 2002-08-27 Micron Technology, Inc. Apparatus for molding semiconductor components
US6530515B1 (en) * 2000-09-26 2003-03-11 Amkor Technology, Inc. Micromachine stacked flip chip package fabrication method
US6566672B1 (en) 2000-09-29 2003-05-20 Heidelberger Druckmaschinen Ag Light sensor for sheet products
JP2002134875A (ja) * 2000-10-26 2002-05-10 Murata Mfg Co Ltd モジュール部品、モジュール部品の実装構造、および電子装置
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
US7439616B2 (en) 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
US7434305B2 (en) 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US7092539B2 (en) 2000-11-28 2006-08-15 University Of Florida Research Foundation, Inc. MEMS based acoustic array
GB2386030B (en) * 2000-12-22 2004-08-18 Bruel & Kjaer Sound & Vibratio A micromachined capacitive transducer
DE10104574A1 (de) * 2001-02-01 2002-08-08 Epcos Ag Substrat für ein elektrisches Bauelement und Verfahren zur Herstellung
MXPA03007128A (es) 2001-02-14 2003-11-18 Gentex Corp Microfono para accesorio de vehiculo.
US6437449B1 (en) 2001-04-06 2002-08-20 Amkor Technology, Inc. Making semiconductor devices having stacked dies with biased back surfaces
DE10136743B4 (de) 2001-07-27 2013-02-14 Epcos Ag Verfahren zur hermetischen Verkapselung eines Bauelementes
JPWO2003017364A1 (ja) * 2001-08-17 2004-12-09 シチズン時計株式会社 電子装置及びその製造方法
US7298856B2 (en) 2001-09-05 2007-11-20 Nippon Hoso Kyokai Chip microphone and method of making same
JP2003078981A (ja) 2001-09-05 2003-03-14 Nippon Hoso Kyokai <Nhk> マイクロホン実装回路基板および該基板を搭載する音声処理装置
US6930364B2 (en) 2001-09-13 2005-08-16 Silicon Light Machines Corporation Microelectronic mechanical system and methods
WO2003032484A1 (de) 2001-09-28 2003-04-17 Epcos Ag Verfahren zur verkapselung eines elektrischen bauelementes und damit verkapseltes oberflächenwellenbauelement
WO2003047307A2 (en) * 2001-11-27 2003-06-05 Corporation For National Research Initiatives A miniature condenser microphone and fabrication method therefor
US6649446B1 (en) 2001-11-29 2003-11-18 Clarisay, Inc. Hermetic package for multiple contact-sensitive electronic devices and methods of manufacturing thereof
DE10164494B9 (de) * 2001-12-28 2014-08-21 Epcos Ag Verkapseltes Bauelement mit geringer Bauhöhe sowie Verfahren zur Herstellung
DE10164502B4 (de) * 2001-12-28 2013-07-04 Epcos Ag Verfahren zur hermetischen Verkapselung eines Bauelements
US6800987B2 (en) 2002-01-22 2004-10-05 Measurement Specialties, Inc. Protective housing for ultrasonic transducer apparatus
US6891266B2 (en) 2002-02-14 2005-05-10 Mia-Com RF transition for an area array package
JP3908059B2 (ja) * 2002-02-27 2007-04-25 スター精密株式会社 エレクトレットコンデンサマイクロホン
US6627814B1 (en) 2002-03-22 2003-09-30 David H. Stark Hermetically sealed micro-device package with window
JP3945292B2 (ja) 2002-04-10 2007-07-18 松下電器産業株式会社 ダイヤフラム型トランスデューサ
US7217588B2 (en) * 2005-01-05 2007-05-15 Sharp Laboratories Of America, Inc. Integrated MEMS packaging
US6621392B1 (en) 2002-04-25 2003-09-16 International Business Machines Corporation Micro electromechanical switch having self-aligned spacers
US6850133B2 (en) * 2002-08-14 2005-02-01 Intel Corporation Electrode configuration in a MEMS switch
JP2004079776A (ja) * 2002-08-19 2004-03-11 Yutaka Denki Seisakusho:Kk プリント配線板の実装方法
DE10238523B4 (de) 2002-08-22 2014-10-02 Epcos Ag Verkapseltes elektronisches Bauelement und Verfahren zur Herstellung
US7072482B2 (en) 2002-09-06 2006-07-04 Sonion Nederland B.V. Microphone with improved sound inlet port
US6781231B2 (en) * 2002-09-10 2004-08-24 Knowles Electronics Llc Microelectromechanical system package with environmental and interference shield
US6909589B2 (en) 2002-11-20 2005-06-21 Corporation For National Research Initiatives MEMS-based variable capacitor
US7371970B2 (en) * 2002-12-06 2008-05-13 Flammer Jeffrey D Rigid-flex circuit board system
JP2004229200A (ja) * 2003-01-27 2004-08-12 Sanyo Electric Co Ltd 音響センサー
DE10303263B4 (de) 2003-01-28 2012-01-05 Infineon Technologies Ag Mikrophonanordnung
EP1602124B1 (de) 2003-02-25 2013-09-04 IC Mechanics, Inc. Mikrobearbeitete baugruppe mit einer mehrschichtkappendefinitionskavität
US7492019B2 (en) 2003-03-07 2009-02-17 Ic Mechanics, Inc. Micromachined assembly with a multi-layer cap defining a cavity
WO2004093506A2 (en) 2003-04-15 2004-10-28 Wavezero, Inc. Electomagnetic interference shielding for a printed circuit board
US7233679B2 (en) * 2003-09-30 2007-06-19 Motorola, Inc. Microphone system for a communication device
JP2005198051A (ja) * 2004-01-08 2005-07-21 Hitachi Ltd 高周波モジュール
US20050189635A1 (en) * 2004-03-01 2005-09-01 Tessera, Inc. Packaged acoustic and electromagnetic transducer chips
JP4264103B2 (ja) 2004-03-03 2009-05-13 パナソニック株式会社 エレクトレットコンデンサーマイクロホン
EP1722596A4 (de) * 2004-03-09 2009-11-11 Panasonic Corp Elektretkondensatormikrofon
JP3875240B2 (ja) * 2004-03-31 2007-01-31 株式会社東芝 電子部品の製造方法
DE102004020204A1 (de) 2004-04-22 2005-11-10 Epcos Ag Verkapseltes elektrisches Bauelement und Verfahren zur Herstellung
JP3998658B2 (ja) 2004-04-28 2007-10-31 富士通メディアデバイス株式会社 弾性波デバイスおよびパッケージ基板
DE102004037817B4 (de) * 2004-08-04 2014-08-07 Epcos Ag Elektrisches Bauelement in Flip-Chip-Bauweise
US7608789B2 (en) * 2004-08-12 2009-10-27 Epcos Ag Component arrangement provided with a carrier substrate
DE202005001559U1 (de) 2005-01-31 2005-05-19 Microelectronic Packaging Dresden Gmbh Chipaufbau für stressempfindliche Chips
DE102005008512B4 (de) 2005-02-24 2016-06-23 Epcos Ag Elektrisches Modul mit einem MEMS-Mikrofon
DE102005008511B4 (de) 2005-02-24 2019-09-12 Tdk Corporation MEMS-Mikrofon
US7202552B2 (en) * 2005-07-15 2007-04-10 Silicon Matrix Pte. Ltd. MEMS package using flexible substrates, and method thereof
SG130158A1 (en) * 2005-08-20 2007-03-20 Bse Co Ltd Silicon based condenser microphone and packaging method for the same
DE102005046008B4 (de) * 2005-09-26 2007-05-24 Infineon Technologies Ag Halbleitersensorbauteil mit Sensorchip und Verfahren zur Herstellung desselben
DE102005050398A1 (de) * 2005-10-20 2007-04-26 Epcos Ag Gehäuse mit Hohlraum für ein mechanisch empfindliches elektronisches Bauelement und Verfahren zur Herstellung
DE102005053765B4 (de) 2005-11-10 2016-04-14 Epcos Ag MEMS-Package und Verfahren zur Herstellung
DE102005054461B4 (de) 2005-11-15 2010-10-14 Daimler Ag Vorrichtung zum schwenkbeweglichen Verbinden von mindestens zwei Bauteilen und Verfahren zur Montage der Vorrichtung
DE102006019118B4 (de) * 2006-04-25 2011-08-18 Epcos Ag, 81669 Bauelement mit optischer Markierung und Verfahren zur Herstellung
DE102006025162B3 (de) * 2006-05-30 2008-01-31 Epcos Ag Flip-Chip-Bauelement und Verfahren zur Herstellung

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8218794B2 (en) 2006-09-29 2012-07-10 Epcos Ag Component comprising a MEMS microphone and method for the production of said component
DE102007038396B3 (de) * 2007-08-14 2008-12-11 Robert Bosch Gmbh Mikromechanisches Bauteil mit abgestumpfter Kante
US8737674B2 (en) 2011-02-11 2014-05-27 Infineon Technologies Ag Housed loudspeaker array
DE102014214153B4 (de) 2013-07-22 2021-12-23 Infineon Technologies Ag Oberflächenmontierbares Mikrofonpackage
WO2016180841A1 (de) * 2015-05-13 2016-11-17 USound GmbH Leiterplattenmodul mit durchgehender aussparung sowie diesbezügliche schallwandleranordnung sowie herstellungsverfahren
US10206046B2 (en) 2015-05-13 2019-02-12 USound GmbH Circuit board module comprising a continuous cavity, associated sonic transducer assembly, and production method
CN108622845A (zh) * 2017-03-16 2018-10-09 日月光半导体制造股份有限公司 半导体装置封装及其制造方法
CN108622845B (zh) * 2017-03-16 2023-12-01 日月光半导体制造股份有限公司 半导体装置封装及其制造方法
CN112697262A (zh) * 2020-12-08 2021-04-23 联合微电子中心有限责任公司 水听器及其制造方法

Also Published As

Publication number Publication date
WO2007054071A1 (de) 2007-05-18
JP2009515443A (ja) 2009-04-09
JP5054703B2 (ja) 2012-10-24
DE102005053767B4 (de) 2014-10-30
US20080279407A1 (en) 2008-11-13
US8229139B2 (en) 2012-07-24

Similar Documents

Publication Publication Date Title
DE102005053767A1 (de) MEMS-Mikrofon, Verfahren zur Herstellung und Verfahren zum Einbau
ATE490037T1 (de) Verfahren zur herstellung einer mikronadel oder eines mikroimplantats
EP4344794A3 (de) Verfahren zur herstellung von platten und dadurch erhaltene platte
EP1588989A3 (de) Verfahren zur Herstellung eines Masters, Master und Verfahren zur Herstellung von optischen Elementen sowie optisches Element
EP4303021A3 (de) Verfahren zur erzeugung einer strukturierten oberfläche
WO2008110883A3 (en) Methods for manufacturing laminate, device applied herewith, laminate obtained herewith, method for encasing substrates and encased substrate obtained herewith
ATE491052T1 (de) Verfahren zum behandeln der schaufelspitze einer turbinenschaufel sowie mit einem solchen verfahren behandelte turbinenschaufel
EP2408012A3 (de) Solarzelle, Solarzellenherstellungsverfahren und Prüfverfahren
TW200745057A (en) Diaminopyrimidines as P2X3 and P3X2/3 modulators
WO2009115192A3 (en) Ni-p layer system and process for its preparation
EP4382309A3 (de) Verfahren zur herstellung von paneelen
EP3211657A3 (de) Verfahren zur herstellung eines diamantsubstrats, diamantsubstrat und freistehendes diamantsubstrat
SG166794A1 (en) Layer arrangement for the formation of a coating on a surface of a substrate,coating method,and substrate with a layer arrangement
EP4223889A3 (de) Verfahren zur herstellung eines mit einem metallischen, vor korrosion schützenden überzug versehenen stahlbauteils
EP4275883A3 (de) Verfahren zur herstellung eines mit einem metallischen, vor korrosion schützenden überzug versehenen stahlbauteils
TWI265204B (en) Method for coating substrates in inline installations
MY151037A (en) Method of treating a surface to protect the same
WO2011003498A3 (en) Method and system for the manipulation of cells
AT517050A3 (de) Heizkanaleinheit, Verfahren zum Herstellen einer Heizkanaleinheit und Umbuganlage
WO2007003826A3 (fr) Procede de realisation de nanostructures
TW200632564A (en) Surface patterning and via manufacturing employing controlled precipitative growth
EP2455229A3 (de) Herstellungsverfahren für ein Oberflächenelement
EP4497794A3 (de) Verfahren zur herstellung eines fäulnisfreisetzungsbeschichtungssystems
WO2019175817A3 (en) Methods for manufacturing decorative panels and panels obtainable thereby
ATE382441T1 (de) Verfahren zur herstellung eines flansches an einer blechronde

Legal Events

Date Code Title Description
R012 Request for examination validly filed

Effective date: 20120530

R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final
R081 Change of applicant/patentee

Owner name: TDK CORPORATION, JP

Free format text: FORMER OWNER: EPCOS AG, 81669 MUENCHEN, DE

R082 Change of representative

Representative=s name: EPPING HERMANN FISCHER, PATENTANWALTSGESELLSCH, DE

Representative=s name: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHA, DE

R071 Expiry of right