CN2743974Y - Heat dissipation structure - Google Patents
Heat dissipation structure Download PDFInfo
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- CN2743974Y CN2743974Y CN 200320127929 CN200320127929U CN2743974Y CN 2743974 Y CN2743974 Y CN 2743974Y CN 200320127929 CN200320127929 CN 200320127929 CN 200320127929 U CN200320127929 U CN 200320127929U CN 2743974 Y CN2743974 Y CN 2743974Y
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 44
- 239000004020 conductor Substances 0.000 claims abstract description 60
- 239000000463 material Substances 0.000 claims abstract description 36
- 239000006260 foam Substances 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000002023 wood Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 description 15
- 239000006261 foam material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 1
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Abstract
本实用新型公开了一种散热结构,其具有一外壳,该外壳置于一导热率低的材质上,及一导热器,该导热器置于所述外壳内且与外壳间形成至少一空气隙,藉由空气隙降低导热器至外壳间的传导率,进而增加导热器至外壳的热阻,使外壳底部表面温度降低且平均,有效提升产品的寿命、安全性及可靠度。
The utility model discloses a heat dissipation structure, which has a shell, which is placed on a material with low thermal conductivity, and a heat conductor, which is placed in the shell and forms at least an air gap with the shell , through the air gap to reduce the conductivity between the heat spreader and the shell, and then increase the thermal resistance from the heat spreader to the shell, so that the temperature of the bottom surface of the shell is reduced and averaged, effectively improving the life, safety and reliability of the product.
Description
技术领域technical field
本实用新型涉及一种散热结构,更具体地说,涉及一种由不同材质组成的导热器与电子装置的外壳间形成一空气隙的散热结构。The utility model relates to a heat dissipation structure, in particular to a heat dissipation structure in which an air gap is formed between a heat conductor composed of different materials and an electronic device shell.
背景技术Background technique
一般电子装置内部发热元件的散热方式,是以一散热片与发热元件的结合,使发热元件温度降低,且当此电子装置放置于一低导热系数材质上时,此电子装置的底部中央部分由于无法散热,而使其底部中央部分的表面温度较其余部分高。The heat dissipation method of the heating element inside the general electronic device is to combine a heat sink with the heating element to reduce the temperature of the heating element, and when the electronic device is placed on a material with low thermal conductivity, the central part of the bottom of the electronic device is due to Unable to dissipate heat, the surface temperature of the central part of the bottom is higher than that of the rest.
为了改善上述缺点,台湾专利第447693号公告中揭示了一种平均热能散逸装置,其主要包含有一第一导热器,该第一导热器具有一第一部分,用于吸收来自发热元件的热能,并具有不与该发热元件相接触的一第二部分,以及一第二导热器,其具有相对低热传导率的第一部分,用于触接第一导热器的第一部分,并且具有相对高热传导率的第二部分,用于触接第一导热器的第二部分,自第一导热器转移热能至机壳。In order to improve the above-mentioned shortcomings, Taiwan Patent No. 447693 discloses an average heat dissipating device, which mainly includes a first heat conductor, which has a first part for absorbing heat energy from the heating element, and has a second portion not in contact with the heating element, and a second heat conductor having a first portion of relatively low thermal conductivity for contacting the first portion of the first heat conductor and having a first portion of relatively high thermal conductivity The second part is used to contact the second part of the first heat conductor to transfer heat energy from the first heat conductor to the casing.
该第447693号专利中公告的发热元件先触接一高热传导率的第一导热器的第一部分,而第一导热器的第一部分再与一低热传导率的第二导热器的第一部分触接,而将第一导热器中的热能转移至机壳,故上述结构与发热元件的位置有关,当不同的电子装置,其发热元件的位置不同,则第二导热器需随着发热元件的不同位置而搭配置换低热传导率的第一部分的位置,而造成制作上的不便,且需因根据不同的电子装置而设计不同的导热器,造成成本增加。The heating element announced in the No. 447693 patent first contacts the first part of a first heat conductor with high thermal conductivity, and the first part of the first heat conductor contacts with the first part of a second heat conductor with low thermal conductivity , and transfer the heat energy in the first heat conductor to the casing, so the above structure is related to the position of the heating element. When different electronic devices have different positions of the heating element, the second heat conductor needs to follow the difference The location of the first part with low thermal conductivity is matched with the location of the first part, which causes inconvenience in production, and needs to design different heat conductors according to different electronic devices, resulting in increased cost.
发明内容Contents of the invention
本实用新型的目的在于提供一种散热结构,即借导热器与外壳间形成的空气隙来增加内部发热元件到外壳的热阻,使置于一低导热率材质上的电子装置的外壳底部表面温度平均。The purpose of this utility model is to provide a heat dissipation structure, that is, to increase the thermal resistance from the internal heating element to the shell by means of the air gap formed between the heat conductor and the shell, so that the bottom surface of the shell of the electronic device placed on a low thermal conductivity material average temperature.
为了达到上述目的,本实用新型中散热结构包含一外壳,该外壳置于一导热率低的材质上,及一导热器,该导热器置于外壳内,且与外壳间形成至少一空气隙。In order to achieve the above purpose, the heat dissipation structure of the present invention includes a shell, the shell is placed on a material with low thermal conductivity, and a heat conductor, the heat spreader is placed in the shell, and at least an air gap is formed between the shell and the shell.
所述外壳置于一导热率低的材质上。The shell is placed on a material with low thermal conductivity.
所述导热率低的材质可为木板、地毯或衣料等材质。The material with low thermal conductivity can be wood board, carpet or clothing.
所述导热器可搭配一平坦底部的外壳而设有一凸部,使导热器与外壳间形成一空气隙。The heat spreader can be matched with a shell with a flat bottom and provided with a protrusion, so that an air gap is formed between the heat spreader and the shell.
所述导热器可搭配一具有一体成型的肩部的外壳,使导热器与外壳间形成一空气隙。The heat spreader can be matched with a shell with integrally formed shoulders, so that an air gap is formed between the heat spreader and the shell.
所述导热器可搭配一具有一体成型的凸部的外壳,使导热器与外壳间形成一空气隙。The heat conductor can be matched with a casing with integrally formed convex parts, so that an air gap is formed between the heat conductor and the casing.
所述导热器的材质可为热传导率良好的材质,例如铜或铝。The material of the heat conductor can be a material with good thermal conductivity, such as copper or aluminum.
所述空气隙可为一低导热材质,例如泡绵、发泡材料。The air gap can be a material with low thermal conductivity, such as foam or foam material.
所述外壳肩部的材质可为塑料或金属材质。The material of the shell shoulder can be plastic or metal.
本实用新型中的散热结构是藉由空气隙来降低导热器至外壳间的传导率,进而增加导热器至外壳的热阻,使外壳底部表面温度降低且平均,有效提升产品的寿命、安全性及可靠度。The heat dissipation structure in the utility model uses the air gap to reduce the conductivity between the heat conductor and the shell, and then increases the thermal resistance from the heat conductor to the shell, so that the temperature of the bottom surface of the shell is reduced and averaged, effectively improving the life and safety of the product and reliability.
附图说明Description of drawings
下面将结合附图对本实用新型中的具体实施例作进一步详细说明。The specific embodiments of the present utility model will be described in further detail below in conjunction with the accompanying drawings.
图1是本实用新型实施例一中散热结构的立体分解图;Fig. 1 is a three-dimensional exploded view of the heat dissipation structure in
图2是本实用新型实施例一中散热结构的组合立体图;Fig. 2 is a combined perspective view of the heat dissipation structure in
图3是图2中所示散热结构沿X-X线的剖面图;Fig. 3 is a cross-sectional view of the heat dissipation structure shown in Fig. 2 along line X-X;
图4是本实用新型实施例二中散热结构的立体分解图;Fig. 4 is a three-dimensional exploded view of the heat dissipation structure in the second embodiment of the utility model;
图5是本实用新型实施例三中散热结构的立体分解图;Fig. 5 is a three-dimensional exploded view of the heat dissipation structure in
图6是图5中所示散热结构的组合立体图;Fig. 6 is a combined perspective view of the heat dissipation structure shown in Fig. 5;
图7是图6中所示散热结构沿Y-Y线的剖面图;Fig. 7 is a cross-sectional view of the heat dissipation structure shown in Fig. 6 along the Y-Y line;
图8是本实用新型实施例四中散热结构的剖面图;Fig. 8 is a cross-sectional view of the heat dissipation structure in
图9是本实用新型实施例五中散热结构的剖面图。Fig. 9 is a cross-sectional view of the heat dissipation structure in Embodiment 5 of the present utility model.
具体实施方式Detailed ways
如图1所示,本实用新型实施例一中的散热结构100包含有一外壳2,该外壳2具有一底部20;及一导热器1,该导热器1具有一底部10及由底部10向上垂直延伸的垂直部11,且于底部10中央处设有一凸部12。As shown in Figure 1, the
如图1和图2所示,本实施例一中外壳2的底部20为一平坦的底面,且该外壳2置于一导热率低的材质上,该导热率低的材质可为木板、地毯或衣料等材质,而导热器1置于外壳2内,藉由导热器1的凸部12与外壳2的底部20叠置形成一空气隙13,如图3所示,导热器1的材质为热传导率良好的材质,例如铜或铝等材质,且导热器1的上方再置放一发热元件(图中未示出),该发热元件所产生的热能藉由导热器1均匀吸收,再籍由导热器1与外壳2所形成的空气隙13,让导热器1至外壳2间的传导率降低,而使外壳2底部中央部分表面的温度降低,形成本实用新型中的散热结构100。As shown in Figures 1 and 2, the
如图4所示,本实用新型实施例二中的散热结构100是由图1中所示散热结构变换而来的,其包含有一外壳2,该外壳2具有一底部20;及一导热器1,该导热器1具有一底部10及由底部10向上垂直延伸的垂直部11,且于底部10一体成型设有一凸部12,使导热器1的底端形成一凹槽14,该凹槽14与外壳2的底部20叠置以形成一空气隙13(参考图3所示),使导热器1至外壳2的热阻增加,而让外壳2底部中央部分表面的温度降低,即形成本实用新型中的散热结构100。As shown in FIG. 4 , the
如图5所示,本实用新型实施例三中的散热结构100包含有一外壳2,该外壳2具有一底部20;一第一导热器3,该第一导热器3具有一底部10及由底部10向上垂直延伸的垂直部11;及一第二导热器4,该第二导热器4为一中空体,且该第二导热器4设置于外壳2底部的边缘四周。As shown in Figure 5, the
如图5和图6所示,本实施例三中的散热结构100是将外壳2置于一导热率低的材质上,该导热率低的材质可为木板、地毯或衣料等等,而第一导热器3叠置于第二导热器4上,且第一导热器3的底部10为一平坦底面,藉由第一导热器3的平坦底部10与第二导热器4叠置形成一空气隙13,如图7所示,而外壳2的底板的材质可为塑胶或金属等材质,而第一导热器3与第二导热器4的材质为热传导率良好的材质,例如铜或铝等材质,且第一导热器3的上方再置放一发热元件(图中未示出),该发热元件所产生的热能藉由第一导热器3均匀吸收,再籍由第一导热器3与第二导热器4所形成的空气隙13,让第一导热器3至外壳2间的传导率降低,而使外壳2底部中央部分表面的温度降低,形成本实用新型中的散热结构100。As shown in Fig. 5 and Fig. 6, the
如图7所示,当第一导热器3吸收发热元件所产生的热能时,因第一导热器3为具有良好热传导率的材质,故能均匀吸收发热元件所产生的热能,且藉由第一导热器3的平坦底部10与第二导热器4形成的空气隙13,使第一导热器3至外壳2的热阻增加,而让外壳2底部中央部分表面的温度降低。As shown in Figure 7, when the
如图8所示,本实用新型实施例四中的散热结构包含一外壳2,该外壳2一体成型于底部边缘设有一肩部22;一导热器1,该导热器1具有一底部10及由底部10向上垂直延伸的垂直部11,其中肩部22与平坦底面的导热器1形成一空气隙13,使导热器1至外壳2的热阻增加,而让外壳2底部中央部分表面的温度降低。As shown in Figure 8, the heat dissipation structure in
如图9所示,本实用新型实施例五中的散热结构包含一外壳2,该外壳2一体成型于底部中央位置处设有一凸部23;一第一导热器3,该第一导热器3具有一底部10及由底部10向上垂直延伸的垂直部11及一第二导热器4,该第二导热器4为较高导热率材质,且置于凸部23的两侧,而外壳2为一较低导热率材质,此结构的中央部分到外壳底部20的热阻较周围部分高,而让外壳底部20中央部分表面温度降低。As shown in Figure 9, the heat dissipation structure in Embodiment 5 of the present utility model includes a
另外,上述虽然对本实用新型中的多个具体实施例作了详细说明,但熟悉该项技术的人士可清楚的了解,在不脱离本实用新型中的设计精神下可进行各种变化与改变,而并不受限于说明书所举的实施方式,例如第二施实施例中导热器与外壳形成的空气隙可置换为低导热的材质,如泡绵、发泡材料等等的低导热材质。In addition, although the above-mentioned multiple specific embodiments in the utility model have been described in detail, those familiar with the technology can clearly understand that various changes and changes can be made without departing from the design spirit of the utility model. It is not limited to the embodiments mentioned in the specification, for example, the air gap formed by the heat spreader and the casing in the second embodiment can be replaced with a material with low thermal conductivity, such as foam, foam material and the like.
Claims (18)
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200320127929 CN2743974Y (en) | 2003-12-15 | 2003-12-15 | Heat dissipation structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200320127929 CN2743974Y (en) | 2003-12-15 | 2003-12-15 | Heat dissipation structure |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102484957A (en) * | 2011-06-14 | 2012-05-30 | 华为终端有限公司 | Devices with thermal insulation |
| CN103025122A (en) * | 2011-09-23 | 2013-04-03 | 联想(北京)有限公司 | Electronic device |
| CN103687438A (en) * | 2012-09-14 | 2014-03-26 | 仁宝电脑工业股份有限公司 | Heat dissipation structure |
| CN103828499A (en) * | 2011-08-30 | 2014-05-28 | 苹果公司 | Electronics enclosure and heat sink structures with thermal management features |
| CN106004606A (en) * | 2016-08-10 | 2016-10-12 | 广德天运新技术股份有限公司 | Car foot mat with insect-damage-proof function |
| WO2018086165A1 (en) * | 2016-11-11 | 2018-05-17 | 浙江鼎业机械设备有限公司 | Vacuum machine |
| CN109392282A (en) * | 2017-08-02 | 2019-02-26 | 启碁科技股份有限公司 | Electronic device |
-
2003
- 2003-12-15 CN CN 200320127929 patent/CN2743974Y/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102484957A (en) * | 2011-06-14 | 2012-05-30 | 华为终端有限公司 | Devices with thermal insulation |
| CN103828499A (en) * | 2011-08-30 | 2014-05-28 | 苹果公司 | Electronics enclosure and heat sink structures with thermal management features |
| CN103828499B (en) * | 2011-08-30 | 2016-03-16 | 苹果公司 | Electronics enclosure and heat sink structures with thermal management features |
| CN103025122A (en) * | 2011-09-23 | 2013-04-03 | 联想(北京)有限公司 | Electronic device |
| US9502324B2 (en) | 2011-09-23 | 2016-11-22 | Lenovo (Beijing) Limited | Electronic device |
| CN103687438A (en) * | 2012-09-14 | 2014-03-26 | 仁宝电脑工业股份有限公司 | Heat dissipation structure |
| CN106004606A (en) * | 2016-08-10 | 2016-10-12 | 广德天运新技术股份有限公司 | Car foot mat with insect-damage-proof function |
| CN106004606B (en) * | 2016-08-10 | 2019-04-30 | 广德天运新技术股份有限公司 | A kind of band automatic foot-mat with insect-proof function |
| WO2018086165A1 (en) * | 2016-11-11 | 2018-05-17 | 浙江鼎业机械设备有限公司 | Vacuum machine |
| CN109392282A (en) * | 2017-08-02 | 2019-02-26 | 启碁科技股份有限公司 | Electronic device |
| CN109392282B (en) * | 2017-08-02 | 2020-06-02 | 启碁科技股份有限公司 | electronic device |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: CHICONY POWER TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: HIPRO ELECTRONICS CO.,LTD. Effective date: 20100603 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20100603 Address after: Taiwan County, Taipei, China Patentee after: Chicony Power Technology Co., Ltd. Address before: Taiwan County, Taipei, China Patentee before: Gaoxiao Electronic Co., Ltd. |
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20051130 Termination date: 20121215 |