CN2603431Y - The bearing structure of the central processing unit cooling device - Google Patents
The bearing structure of the central processing unit cooling device Download PDFInfo
- Publication number
- CN2603431Y CN2603431Y CN 03236419 CN03236419U CN2603431Y CN 2603431 Y CN2603431 Y CN 2603431Y CN 03236419 CN03236419 CN 03236419 CN 03236419 U CN03236419 U CN 03236419U CN 2603431 Y CN2603431 Y CN 2603431Y
- Authority
- CN
- China
- Prior art keywords
- processing unit
- central processing
- bearing structure
- sleeve
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title description 27
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims 6
- 238000010168 coupling process Methods 0.000 claims 6
- 238000005859 coupling reaction Methods 0.000 claims 6
- 238000012856 packing Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 11
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 230000007547 defect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
技术领域technical field
本实用新型涉及一种中央处理器散热装置的承载结构,尤指一种适用于笔记本型计算机,可将中央处理器与散热装置适当连接的承载结构。The utility model relates to a bearing structure of a cooling device for a central processing unit, in particular to a bearing structure suitable for a notebook computer and capable of properly connecting the central processing unit and the cooling device.
背景技术Background technique
现有笔记本型计算机(notebook computer)中央处理器(CPU)散热装置的承载结构,是将中央处理器以螺丝锁固方式压紧于一金属材料制成的散热板上,以便借助散热板协助散热,此种以螺丝锁固的方式,完全依靠螺丝的力量来决定散热板施加于中央处理器上的压力,若螺丝锁附力量过大,则会有造成中央处理器受损的可能,若螺丝锁附力量过小,又会造成锁固不牢,故组装时需费时的调整螺丝的锁紧力量,使得组装操作较为麻烦,相对的成本也会增加。The load-bearing structure of the existing notebook computer (notebook computer) central processing unit (CPU) cooling device is to press the central processing unit on a cooling plate made of a metal material in a screw locking manner, so as to assist heat dissipation by means of the cooling plate. , this kind of screw locking method completely depends on the force of the screw to determine the pressure exerted by the heat sink on the CPU. If the screw locking force is too large, it may cause damage to the CPU. If the screw If the locking force is too small, the locking will not be firm. Therefore, it is time-consuming to adjust the locking force of the screw during assembly, which makes the assembly operation more troublesome and the relative cost will also increase.
另外,上述现有的用以连接中央处理器与散热装置的方式,同时也有不利于螺丝锁固时对位的缺陷。In addition, the above-mentioned existing method for connecting the CPU and the cooling device also has the disadvantage of being unfavorable for alignment during screw locking.
由上可知,现有用以连接中央处理器与散热装置的方式,在实际使用上,显然具有不便与缺陷存在,而可待加以改善。It can be known from the above that the existing method for connecting the CPU and the cooling device obviously has inconvenience and defects in actual use, and needs to be improved.
本实用新型设计人有感上述缺陷可进一步改善,特潜心研究并配合理论的运用,终于提出一种设计合理且有效改善上述缺陷的本实用新型。The designer of this utility model feels that the above-mentioned defects can be further improved, so he devotes himself to research and cooperates with the application of the theory, and finally proposes a utility model with reasonable design and effective improvement of the above-mentioned defects.
实用新型内容Utility model content
本实用新型的主要目的,在于提供一种中央处理器散热装置的承载结构,能使螺接组件可具有辅助的导引行程以提供其在锁固上的对位效果,同时,能够解决螺接组件锁附力量过大或过小的问题。The main purpose of this utility model is to provide a load-bearing structure of a central processing unit cooling device, so that the screw joint assembly can have an auxiliary guide stroke to provide its alignment effect on locking, and at the same time, it can solve the problem of screw joint assembly. Component locking force is too large or too small.
为了实现上述目的,本实用新型是提供了一种中央处理器散热装置的承载结构,包括:一散热板,设有多个穿孔;一固定座,设于该散热板下方,该固定座上设有多个螺接槽,该多个螺接槽与该散热板的穿孔相对应,且该螺接槽底缘均设有导孔;及多个连接组件,分别设于该固定座的螺接槽内;其中,该连接组件包含一弹性组件、一套筒及一螺接组件,该弹性组件容置于该螺接槽内,而该套筒顶缘则形成一环边,该套筒套置于该弹性组件中并由该环边抵止于该弹性组件顶端,该螺接组件穿设于该套筒上,且该螺接组件的长度比该套筒的长度长。In order to achieve the above object, the utility model provides a load-bearing structure of a central processing unit cooling device, comprising: a cooling plate provided with a plurality of perforations; There are a plurality of screw connection grooves, the plurality of screw connection grooves correspond to the through holes of the heat dissipation plate, and the bottom edges of the screw connection grooves are provided with guide holes; and a plurality of connection components are respectively arranged on the screw connection In the groove; wherein, the connection component includes an elastic component, a sleeve and a screw connection component, the elastic component is accommodated in the screw connection groove, and the top edge of the sleeve forms a ring edge, and the sleeve covers Placed in the elastic component and abutted against the top end of the elastic component by the ring edge, the screw connection component is passed through the sleeve, and the length of the screw connection component is longer than the length of the sleeve.
如上所述的中央处理器散热装置的承载结构,其中,所述的固定座底面设有一导热部。In the bearing structure of the heat sink of the central processing unit as described above, a heat conduction portion is provided on the bottom surface of the fixing base.
如上所述的中央处理器散热装置的承载结构,其中,所述的导热部顶面处与一热管直接接触,该热管设于该散热板底面,并于该固定座上开设有一与该热管相对应的凹槽,该热管容置于该凹槽中并与导热部顶面处直接接触。The bearing structure of the central processing unit cooling device as described above, wherein, the top surface of the heat conduction part is in direct contact with a heat pipe, the heat pipe is arranged on the bottom surface of the heat dissipation plate, and a heat pipe corresponding to the heat pipe is provided on the fixing seat. Corresponding to the groove, the heat pipe is accommodated in the groove and directly contacts with the top surface of the heat conducting part.
如上所述的中央处理器散热装置的承载结构,其中,所述的热管由该散热板的一侧延伸至另一侧,贯穿该散热板的斜向对角。The above-mentioned supporting structure of the cooling device of the central processing unit, wherein, the heat pipe extends from one side of the cooling plate to the other side, and runs through diagonally diagonal corners of the cooling plate.
如上所述的中央处理器散热装置的承载结构,其中,所述的热管延伸至该散热板外侧,其中,延伸至该散热板外侧的管体部位则贯穿一以多片散热鳍片所堆栈排列而成的散热器。The above-mentioned supporting structure of the central processing unit cooling device, wherein the heat pipe extends to the outside of the cooling plate, wherein the tube body extending to the outside of the cooling plate runs through a stacked array of multiple cooling fins made radiator.
如上所述的中央处理器散热装置的承载结构,其中,所述的连接组件的弹性组件是压缩弹簧。In the bearing structure of the central processing unit cooling device described above, the elastic component of the connecting component is a compression spring.
如上所述的中央处理器散热装置的承载结构,其中,所述的连接组件的套筒的底缘形成有一导角。In the bearing structure of the central processing unit heat sink as described above, a chamfer is formed on the bottom edge of the sleeve of the connection assembly.
如上所述的中央处理器散热装置的承载结构,其中,所述的连接组件的螺接组件是螺丝。The bearing structure of the heat sink of the central processing unit as described above, wherein, the screwed components of the connecting components are screws.
如上所述的中央处理器散热装置的承载结构,其中,所述的连接组件的螺接组件外缘形成一垫圈,该垫圈的直径大于该散热板上的穿孔的直径。The bearing structure of the central processing unit cooling device above, wherein, the outer edge of the screwed component of the connecting component forms a washer, and the diameter of the washer is larger than the diameter of the perforated hole on the cooling plate.
本实用新型的承载结构,当欲连接于主机板上时,先由螺设工具对该螺接组件施以向下的压力,以使该套筒穿过螺接槽底缘的导孔,并穿入位于该主机板上的定位孔,从而提供了该螺接组件在对位上的引导作用,使该螺接组件在整个锁固的动作中皆保持直立的状态,故可顺利地锁固于定位孔下方的螺孔,而达到便于螺接组件在锁固上的对位效果。When the load-bearing structure of the present invention is to be connected to the main board, the screw assembly is first pressed downward by the screw tool, so that the sleeve passes through the guide hole at the bottom edge of the screw groove, and It penetrates into the positioning hole on the main board, thereby providing a guiding function for the alignment of the threaded assembly, so that the threaded assembly remains upright during the entire locking action, so it can be locked smoothly The screw hole below the positioning hole achieves the alignment effect of the screwed component on the lock.
在该螺接组件锁固于螺孔的同时,该弹性组件将受到套筒顶缘的环边的压迫,而处于弹力储存的状态,故可以通过该弹力适当调整该螺接组件的锁紧压力,进而使组装操作上较为快速容易,能有效地降低成本产生。When the screwed component is locked in the screw hole, the elastic component will be pressed by the ring edge of the top edge of the sleeve, and will be in a state of elastic storage, so the locking pressure of the screwed component can be properly adjusted through the elastic force , so that the assembly operation is relatively fast and easy, and the cost can be effectively reduced.
由于该套筒的底缘上形成有一导角,故对于穿入主机板的定位孔时还有提高引导作用的功效。Since a chamfer is formed on the bottom edge of the sleeve, it also has the effect of improving the guiding effect when passing through the positioning hole of the main board.
下面结合附图和具体实施方式对本实用新型作进一步说明。Below in conjunction with accompanying drawing and specific embodiment, the utility model is further described.
附图说明Description of drawings
图1是本实用新型的立体分解图;Fig. 1 is a three-dimensional exploded view of the utility model;
图2是本实用新型的立体组合图;Fig. 2 is the three-dimensional assembly diagram of the present utility model;
图3是本实用新型的平面剖视图;Fig. 3 is a plane sectional view of the utility model;
图3A是图3的A部份放大详图;FIG. 3A is an enlarged detailed view of part A of FIG. 3;
图4是本实用新型与中央处理器的立体分解图;Fig. 4 is a three-dimensional exploded view of the utility model and the central processing unit;
图5是本实用新型与中央处理器的平面剖视图。Fig. 5 is a plane sectional view of the utility model and the central processing unit.
具体实施方式Detailed ways
如图1、图2及图3,分别是本实用新型的立体分解图、立体组合图及平面剖视图。本实用新型提供了一种中央处理器散热装置的承载结构,是一种适用于笔记本型计算机中央处理器的承载结构,用以连接于一主机板4上(如图4所示),并提供位于该主机板4上的中央处理器40进行散热,包括一散热板1、一固定座2及多个连接组件3;其中:Fig. 1, Fig. 2 and Fig. 3 are three-dimensional exploded view, three-dimensional combined view and plane sectional view of the present utility model respectively. The utility model provides a bearing structure of a central processor cooling device, which is a bearing structure suitable for the central processor of a notebook computer, and is used to connect to a mainboard 4 (as shown in Figure 4), and provides The
该散热板1是以金属等热传导性良好的材料制成,其是设置于一笔记本型计算机的主机(图略)内部,该散热板1底面设有一热管10,该热管10是由散热板1的一侧延伸至另一侧,以大致贯穿该散热板1的斜向对角,而该热管10持续延伸至散热板1外侧的管体部位,则贯穿一以多片散热鳍片12所堆栈排列而成的散热器11,用以协助散热;另,该散热板1未经过热管10的边缘部位上则设有多个穿孔13。The
该固定座2大致呈一方形的厚板体,设于散热板1下方,并在该固定座2上开设一与上述热管10相对应的凹槽20,以供该热管10容置于此凹槽20中,同时,在该固定座2底面设有一导热部21,该导热部21底面是用以与上述的中央处理器40面对面相贴合(如图5所示),且该导热部21顶面处可由凹槽20而直接与该热管10相接触,进而帮助该中央处理器40进行散热。The
该固定座2上设有多个螺接槽22,该多个螺接槽22与该散热板1的穿孔13相对应,且该螺接槽22底缘均设有导孔23。The
多个连接组件3分别设于该固定板2的螺接槽22内,且该连接组件3均包含一弹性组件(压缩弹簧)30、一套筒31及一螺接组件(螺丝)32,其中的弹性组件30容置于该螺接槽22内,而该套筒31顶缘则形成一环边33,以供该套筒31套置于弹性组件30中并可抵止于该弹性组件30顶端,另外,该螺接组件32穿设于该套筒31上,且该螺接组件32的长度较该套筒31的长度为长;又,也可在该螺接组件32外缘形成一垫圈34,该垫圈34大于该散热板1上的穿孔13,以避免该螺接组件32由穿孔13掉落而出,同时,还可于该套筒31的底缘形成一导角35(如图3A所示)以提高该套筒31的引导作用。A plurality of
所以,借助上述的构造组成,即可得到本实用新型的中央处理器散热装置的承载结构。Therefore, with the above-mentioned structural composition, the bearing structure of the central processing unit cooling device of the present invention can be obtained.
如图4及图5所示,分别是本实用新型与中央处理器的立体分解图及平面剖视图;当欲将本实用新型连接于该主机板4上时,先由螺设工具(图略)对该螺接组件32施以向下的压力,以使该套筒31穿过螺接槽22底缘的导孔23,并穿入位于该主机板4上的定位孔41,从而提供了该螺接组件32在对位上的引导作用,使该螺接组件32在整个锁固的动作中皆保持直立的状态,故可顺利地锁固于定位孔41下方的螺孔42(如图5所示),而达到便于螺接组件32在锁固上的对位效果。As shown in Fig. 4 and Fig. 5, it is respectively the three-dimensional exploded view and the plane sectional view of the utility model and the central processing unit; Apply downward pressure to the threaded
在该螺接组件32锁固于螺孔42的同时,该弹性组件30将受到套筒31顶缘的环边33的压迫,而处于弹力储存的状态,故可以通过该弹力适当调整该螺接组件30的锁紧压力,进而使组装操作上较为快速容易,且有效地降低成本产生。While the threaded
由于该套筒31的底缘上可形成一导角35,故对于穿入该主机板4的定位孔41时还有提高引导作用的功效。Since a
综上所述,本实用新型中央处理器散热装置的承载结构不但有助于锁固上的对位效果,同时还能在组装上更为快速容易,以有效解决现有技术诸多不便与缺陷To sum up, the load-bearing structure of the central processing unit heat sink of the utility model not only contributes to the alignment effect of the locking, but also makes the assembly faster and easier, so as to effectively solve many inconveniences and defects of the prior art
以上所述仅为本实用新型的较佳可行实施例,并非因此即限制本实用新型的专利范围,所有运用本实用新型说明书及附图内容所做出的等效结构变化,均包含在本实用新型的专利范围内。The above descriptions are only preferred feasible embodiments of the present utility model, and are not intended to limit the patent scope of the present utility model. within the scope of the new patent.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03236419 CN2603431Y (en) | 2003-01-17 | 2003-01-17 | The bearing structure of the central processing unit cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03236419 CN2603431Y (en) | 2003-01-17 | 2003-01-17 | The bearing structure of the central processing unit cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2603431Y true CN2603431Y (en) | 2004-02-11 |
Family
ID=34166764
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03236419 Expired - Fee Related CN2603431Y (en) | 2003-01-17 | 2003-01-17 | The bearing structure of the central processing unit cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2603431Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1308788C (en) * | 2004-03-16 | 2007-04-04 | 奇鋐科技股份有限公司 | External cooling device |
| CN100349094C (en) * | 2005-02-01 | 2007-11-14 | 英业达股份有限公司 | heat sink |
| CN100390703C (en) * | 2005-02-02 | 2008-05-28 | 英业达股份有限公司 | Heat conducting part structure of radiator |
| CN102759946A (en) * | 2011-04-26 | 2012-10-31 | 鸿富锦精密工业(深圳)有限公司 | Locking element and computer housing employing same |
| CN108562984A (en) * | 2018-05-11 | 2018-09-21 | 温州意华接插件股份有限公司 | A kind of radiating subassembly and its high speed connector |
-
2003
- 2003-01-17 CN CN 03236419 patent/CN2603431Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1308788C (en) * | 2004-03-16 | 2007-04-04 | 奇鋐科技股份有限公司 | External cooling device |
| CN100349094C (en) * | 2005-02-01 | 2007-11-14 | 英业达股份有限公司 | heat sink |
| CN100390703C (en) * | 2005-02-02 | 2008-05-28 | 英业达股份有限公司 | Heat conducting part structure of radiator |
| CN102759946A (en) * | 2011-04-26 | 2012-10-31 | 鸿富锦精密工业(深圳)有限公司 | Locking element and computer housing employing same |
| CN108562984A (en) * | 2018-05-11 | 2018-09-21 | 温州意华接插件股份有限公司 | A kind of radiating subassembly and its high speed connector |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN2603431Y (en) | The bearing structure of the central processing unit cooling device | |
| US20070115639A1 (en) | Method and Apparatus for Fastening Heat Exchanger | |
| CN101193536A (en) | Heat sink structure and assembling jig thereof | |
| CN2881953Y (en) | Fixed structure and heat dissipation device using the fixed structure | |
| CN2641700Y (en) | heat sink | |
| CN2519324Y (en) | Computer radiator fixing device assembly | |
| CN2912204Y (en) | Radiator | |
| TWM244506U (en) | Carrying structure of CPU heat sink | |
| CN200944723Y (en) | heat sink | |
| CN2649826Y (en) | Radiating device | |
| CN2362257Y (en) | Heat sink for electronic components | |
| CN2798168Y (en) | External heat conduction cooling device for microcomputer | |
| CN2560020Y (en) | Fixing device for cooling mechanism | |
| CN1282056C (en) | Heat dissipation device with riveted heat dissipation substrate and metal heat transfer block | |
| CN200947433Y (en) | radiator fixing structure | |
| CN2690953Y (en) | heat sink | |
| JP3094851U (en) | Mounting structure of heat dissipation device of central processing unit | |
| CN2655329Y (en) | Adjustable cooling mechanism | |
| CN2896809Y (en) | radiator fixing structure | |
| CN2526976Y (en) | CPU cooler | |
| CN2377593Y (en) | CPU carrier | |
| CN2613975Y (en) | Improved Structure of Radiator Buckle | |
| CN2599643Y (en) | Back board structure for heat radiation and fixing of central processor | |
| CN2645124Y (en) | Radiator with improved bottom plate structure | |
| CN2566351Y (en) | High Efficiency Cooling Module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040211 Termination date: 20110117 |