CN221447005U - Solid electrolytic capacitor - Google Patents

Abstract

The present utility model provides a solid electrolytic capacitor, comprising: a capacitor element having an anode portion and a cathode portion; an anode terminal connected to the anode portion; a cathode terminal connected to the cathode portion; and an exterior resin having: the anode terminal has an anode terminal connection portion extending to the 1 st side, and the cathode terminal has a cathode terminal connection portion extending to the 2 nd side, as a lower surface of a mounting surface of the solid electrolytic capacitor, an upper surface on an opposite side of the lower surface, the 1 st side, and the 2 nd side, a distance L1 between the lower surface of the exterior resin and an upper end of the anode terminal connection portion closest to the upper surface of the exterior resin is smaller than a distance H between the lower surface of the exterior resin and the upper surface, a distance L2 between the lower surface of the exterior resin and an upper end of the cathode terminal connection portion closest to the upper surface of the exterior resin is smaller than a distance H, the distance H is 0.8mm or less, a difference between the distance H and the distance L1 is a distance L1 or more, and a difference between the distance H and the distance L2 is a distance L2 or more.

Description

Solid electrolytic capacitor

Technical Field

The present utility model relates to a solid electrolytic capacitor.

Background

Conventionally, a solid electrolytic capacitor is known in which an anode terminal and a cathode terminal are exposed from a lower surface to a side surface of an exterior resin serving as a mounting surface of the solid electrolytic capacitor (for example, refer to japanese patent application laid-open No. 2007-214168).

Further reduction in height of the solid electrolytic capacitor is required due to miniaturization of the device on which the solid electrolytic capacitor is mounted. As in the prior art described above, when the height of the solid electrolytic capacitor is further reduced by exposing the anode terminal and the cathode terminal from the lower surface to the side surface of the exterior resin, if the conductive structure is disposed on the upper side of the solid electrolytic capacitor when the solid electrolytic capacitor is mounted, there is a concern that the anode terminal and the cathode terminal come into contact with each other via the conductive structure and short-circuit occurs.

Disclosure of utility model

The present utility model has been made to solve the above-described problems, and an object of the present utility model is to provide a solid electrolytic capacitor capable of preventing a short circuit from occurring due to contact between an anode terminal and a cathode terminal via a conductive structure when the conductive structure is disposed on an upper side of the solid electrolytic capacitor.

Means for solving the problems

In order to achieve the above object, the present utility model provides a solid electrolytic capacitor comprising: a planar capacitor element having an anode portion and a cathode portion; an anode terminal connected to the anode portion; a cathode terminal connected to the cathode portion; and an exterior resin covering the capacitor element, a portion of the anode terminal, and a portion of the cathode terminal, wherein the exterior resin has: the solid electrolytic capacitor includes a bottom surface of a mounting surface of the solid electrolytic capacitor, an upper surface opposite to the bottom surface, a1 st side surface intersecting the bottom surface, and a2 nd side surface intersecting the bottom surface and opposite to the 1 st side surface, the anode terminal includes an anode terminal connecting portion exposed at the bottom surface of the exterior resin and extending to the 1 st side surface, the cathode terminal includes a cathode terminal connecting portion exposed at the bottom surface of the exterior resin and extending to the 2 nd side surface, a distance L1 between the bottom surface of the exterior resin and an upper end of the anode terminal connecting portion closest to the top surface of the exterior resin is smaller than a distance H between the bottom surface of the exterior resin and the top surface, a distance L2 between the bottom surface of the exterior resin and an upper end of the cathode terminal connecting portion closest to the top surface of the exterior resin is smaller than a distance H between the bottom surface of the exterior resin and the top surface by a distance L2 of 0.8mm, and a distance L2 is smaller than the distance L2.

In the solid electrolytic capacitor, a difference between the distance H and the distance L1 may be 0.4mm or more, and a difference between the distance H and the distance L2 may be 0.4mm or more.

In the solid electrolytic capacitor, the distance L1 may be 0.2mm or more, and the distance L2 may be 0.2mm or more.

In the above solid electrolytic capacitor, the anode portion of the capacitor element may be disposed so as to face the anode terminal connection portion on the opposite side of the face exposed on the lower surface of the exterior resin.

In the solid electrolytic capacitor, the cathode terminal may further include: and a component mounting portion connected to the cathode terminal connecting portion and connected to the cathode portion of the capacitor element, the component mounting portion being embedded in the exterior resin, the component mounting portion being disposed closer to the anode portion of the capacitor element than the cathode terminal connecting portion.

In the above solid electrolytic capacitor, the lower surface of the anode terminal connection portion may be flush with the lower surface of the exterior resin, and the lower surface of the cathode terminal connection portion may be flush with the lower surface of the exterior resin.

In the above solid electrolytic capacitor, the solid electrolytic capacitor may have a plurality of capacitor elements including the capacitor element, and the plurality of capacitor elements may be stacked.

In the above solid electrolytic capacitor, the plurality of capacitor elements may be two of the capacitor elements.

In the above solid electrolytic capacitor, the capacitor element may include: the semiconductor device includes a metal foil, a dielectric layer disposed on the metal foil, a solid electrolyte layer covering at least a portion of the dielectric layer, and a cathode layer covering at least a portion of the solid electrolyte layer.

In the solid electrolytic capacitor, the solid electrolyte layer may be a conductive polymer layer.

Effects of the utility model

According to the solid electrolytic capacitor of the present utility model, in the solid electrolytic capacitor in which the distance H between the upper surface and the lower surface of the exterior resin is 0.8mm or less due to the low profile, the distance between the lower surface of the exterior resin and the upper end of the anode terminal connecting portion closest to the upper surface of the exterior resin is the distance L1, the distance between the lower surface of the exterior resin and the upper end of the cathode terminal connecting portion closest to the upper surface of the exterior resin is the distance L2, and by setting the difference between the distance H and the distance L1 to be the distance L1 or more, the difference between the distance H and the distance L2 to be the distance L2 or more, it is possible to prevent the anode terminal and the cathode terminal from coming into contact with each other via the conductive structure and causing a short circuit when the conductive structure is arranged on the upper side of the solid electrolytic capacitor.

Drawings

Fig. 1 is a front view of a solid electrolytic capacitor in an embodiment.

Fig. 2 is a bottom view of the solid electrolytic capacitor shown in fig. 1.

Fig. 3 is a sectional view of the solid electrolytic capacitor shown in fig. 1 at line A-A.

Fig. 4 is a sectional view of the solid electrolytic capacitor shown in fig. 1 at line B-B.

Fig. 5 is a sectional view of the solid electrolytic capacitor shown in fig. 1 at line C-C.

Fig. 6 is a cross-sectional view of a capacitor element of the solid electrolytic capacitor shown in fig. 1.

Symbol description:

10. 10A capacitor element (element);

11 cathode parts;

12 anode sections;

an anode body;

A 14 dielectric layer;

15a solid electrolyte layer;

a 16 cathode layer;

17 separation part;

18 cut-out portions;

A 20 cathode terminal;

21 anode terminal;

22 conductive adhesive parts;

23 an outer resin part;

24 mounting surfaces;

30 terminal connection parts (cathode terminal connection parts);

31 element mounting parts;

32 cathode connection parts (connection parts);

33 cathode holding parts (holding parts);

34 protrusions;

38 a support;

39 upper section;

40 terminal connection parts (anode terminal connection parts);

41 anode connection (connection);

42 mounting portion

43 Anode holding portion (holding portion).

Detailed Description

Embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, unnecessary detailed description may be omitted, and for example, detailed description of known matters and repeated description of substantially the same structure may be omitted. This is to avoid that the following description becomes unnecessarily redundant, as will be readily understood by those skilled in the art. In addition, the drawings and the following description are provided for a full understanding of the present disclosure by those skilled in the art, and are not intended to limit the subject matter recited in the claims.

The scale and shape of the parts shown in the drawings are set for convenience of explanation, and are not to be construed in a limiting sense unless otherwise mentioned. In addition, even in the same component, there may be a slight difference in scale or the like between the drawings.

(Embodiment)

Fig. 1 is a front view of a solid electrolytic capacitor in an embodiment. Fig. 2 is a bottom view of the solid electrolytic capacitor shown in fig. 1. Fig. 3 is a sectional view of the solid electrolytic capacitor shown in fig. 1 at line A-A. Fig. 4 is a sectional view of the solid electrolytic capacitor shown in fig. 1 at line B-B. Fig. 5 is a sectional view of the solid electrolytic capacitor shown in fig. 1 at line C-C. Fig. 6 is a cross-sectional view of a capacitor element (hereinafter, referred to as an element) of the solid electrolytic capacitor shown in fig. 1. Note that fig. 1, 3, and 4 omit descriptions concerning cross sections of the inside of the element 10.

The solid electrolytic capacitor of the present embodiment includes a plurality of flat plate-like elements 10, a cathode terminal 20, an anode terminal 21, and an exterior resin 23. A plurality of elements 10 are stacked. In order to make the solid electrolytic capacitor low, the plurality of elements 10 may be two elements 10. Alternatively, the element 10 may be one.

The element 10 has a cathode portion 11 and an anode portion 12, respectively. The cathode terminal 20 is connected to the stacked cathode portions 11. The anode terminal 21 is connected to the stacked anode portions 12. The exterior resin 23 covers a part of the cathode terminal 20, a part of the anode terminal 21, and the stacked element 10.

As shown in fig. 6, the anode portion 12 of the element 10 is provided at the 1 st end of the anode body 13 of the foil formed of a valve metal such as aluminum, and the cathode portion 11 is provided at the 2 nd end of the anode body 13 divided by the insulating separating portion 17 provided in a band shape.

As the valve metal, tantalum, niobium, titanium, or the like can be used in addition to aluminum. The portion of the anode body 13 where the cathode portion 11 is formed may be a porous sintered body formed of a powder of a valve metal.

The cathode portion 11 includes a dielectric layer 14, a solid electrolyte layer 15, and a cathode layer 16 formed on the surface of the anode body 13. The solid electrolyte layer 15 is made of a conductive polymer formed on the dielectric layer 14. The cathode layer 16 is formed by laminating a silver paste layer on a carbon layer. A solid electrolyte layer 15 and a cathode layer 16 are sequentially formed on the dielectric layer 14.

As the conductive polymer of the solid electrolyte layer 15, polypyrrole, polythiophene, polyaniline, and the like can be used. These polymers have high conductivity and excellent ESR characteristics. In addition, manganese oxide such as manganese dioxide can be used for the solid electrolyte layer 15.

The exterior resin 23 is made of a heat-resistant insulating resin such as an epoxy resin.

The cathode terminal 20 and the anode terminal 21 are each composed of a lead frame having a metal such as copper, iron, nickel, or an alloy thereof as a base material. As shown in fig. 1 and 2, the cathode terminal 20 and the anode terminal 21 have terminal connection portions 30 and 40, respectively. The terminal connection portions 30 and 40 are exposed on the mounting surface 24 (lower surface of the exterior resin 23) of the solid electrolytic capacitor. In more detail, the lower surfaces of the terminal connection portions 30, 40 are formed on the same plane (flush) with the lower surface of the exterior resin 23.

As shown in fig. 4 and 5, the exterior resin 23 is provided on the upper surfaces of the terminal connection portions 30 and 40, and the exterior resin 23 is provided between the cathode portion 11 of the element 10A located at the lowermost side among the stacked elements 10 and the terminal connection portion 30. Similarly, an exterior resin 23 is provided between the anode portion 12 and the terminal connection portion 40 of the element 10A.

As shown in fig. 2, the terminal connection portions 30 and 40 are preferably formed in a substantially rectangular shape and have the same mounting area on the mounting surface 24. In the following description, the direction connecting the anode portion 12 and the cathode portion 11 is referred to as a longitudinal direction, the side closer to the anode portion 12 in the longitudinal direction is referred to as an anode side, the side closer to the cathode portion 11 is referred to as a cathode side, and the direction perpendicular to the longitudinal direction is referred to as a width direction. That is, the terminal connection portion 30 extends in the longitudinal direction to the end portion of the exterior resin 23 on the cathode side, and the terminal connection portion 40 extends in the longitudinal direction to the end portion of the exterior resin 23 on the anode side, on the mounting surface 24.

As shown in fig. 1, the tip end portions of the terminal connecting portions 30, 40 are bent upward along the side surface of the exterior resin 23 from the end portion of the lower surface of the exterior resin 23. Tin plating layers for soldering with the circuit board are provided at the terminal connection portions 30, 40.

As shown in fig. 1, in the terminal connection portion 40, a distance L1 between the lower surface of the exterior resin 23 and the upper end of the terminal connection portion 40 closest to the upper surface of the exterior resin is smaller than a distance H between the lower surface and the upper surface of the exterior resin 23. Further, in the terminal connection portion 30, a distance L2 between the lower surface of the exterior resin 23 and the upper end of the terminal connection portion 30 closest to the upper surface of the exterior resin is smaller than a distance H between the lower surface and the upper surface of the exterior resin 23.

In the conventional solid electrolytic capacitor, the distance H is 0.95mm or more, but in the present embodiment, the distance H is set to 0.8mm or less according to the requirement of low-profile. In this case, when the conductive structure is disposed on the upper side of the solid electrolytic capacitor at the time of mounting the solid electrolytic capacitor, there is a concern that the anode terminal and the cathode terminal may come into contact with each other via the conductive structure and short-circuit. For this reason, in the present embodiment, the difference between the distance H and the distance L1 is equal to or greater than the distance L1, and the difference between the distance H and the distance L2 is equal to or greater than the distance L2. In the present embodiment, for example, the difference between the distance H and the distance L1 is 0.4mm or more, and the difference between the distance H and the distance L2 is 0.4mm or more.

In addition, in order to reliably fix the solid electrolytic capacitor by increasing the contact area between the solder and each of the anode terminal and the cathode terminal by forming a good fillet and to prevent the solder from contacting the exterior resin 23 when the solid electrolytic capacitor is mounted by the solder or the like, it is preferable that the distance L1 is 0.2mm or more and the distance L2 is 0.2mm or more.

The cathode terminal 20 further includes an element mounting portion 31 bonded to the lower surface of the cathode portion 11 of the element 10A via the conductive adhesive portion 22. As shown in fig. 1 and 2, the element mounting portion 31 is connected to an end portion on the anode side of the terminal connection portion 30 via a cathode connection portion (hereinafter, connection portion) 32. That is, the element mounting portion 31 is connected to an end portion of the terminal connecting portion 30 near the anode terminal 21. The element mounting portion 31 and the connection portion 32 have the same width as the terminal connection portion 30.

The conductive adhesive portion 22 is composed of a conductive filler such as silver or copper as a main component, an adhesive such as a thermosetting resin or a thermoplastic resin such as an epoxy resin, a urethane resin, a silicone resin, an acrylic resin, or a polyimide resin. For example, the conductive adhesive portion 22 is formed using a conductive paste in which a conductive filler, an adhesive, and a solvent are mixed.

As described above, the cathode terminal 20 includes the terminal connection portion 30, the connection portion 32, and the element mounting portion 31. The connection portion 32 is formed by bending the entire width of the end portion on the anode side of the terminal connection portion 30 vertically or obliquely upward, and is embedded in the exterior resin 23. The component mounting portion 31 is provided at an upper end of the upwardly bent connection portion 32. In this way, the terminal connecting portion 30 and the element mounting portion 31 are connected in a stepped shape.

The component mounting portion 31 is provided on the anode side of the terminal connection portion 30, and is embedded in the exterior resin 23, and the exterior resin 23 is provided on the lower surface of the component mounting portion 31. The upper surface of the component mounting portion 31 is flat, and is parallel to and spaced apart from the mounting surface 24 by a predetermined distance. The element mounting portion 31 is preferably provided at the center portion in the longitudinal direction on the cathode side of the center portion of the cathode portion 11.

As shown in fig. 1 and 2, the cathode terminal 20 further includes protruding portions 34 provided in pairs along both sides of the side portion of the element mounting portion 31. The protruding portion 34 protrudes from a side edge of the component mounting portion 31 in the longitudinal direction and extends in the width direction on the same plane as the component mounting portion 31. The width of the protruding portion 34 is narrowed stepwise in the protruding direction.

As described above, the conductive adhesive portion 22 is provided between the upper surface of the element mounting portion 31 and the lower surface of the cathode portion 11 of the element 10A, and bonds the element mounting portion 31 to the cathode portion 11.

As shown in fig. 1, 2, and 3, a cathode holding portion (hereinafter, holding portion) 33 is preferably provided at the tip of the protruding portion 34. The holding portion 33 is formed by bending the front end portion of the mounting portion 31 substantially vertically upward. That is, the holding portion 33 extends from the protruding portion 34 in the stacking direction of the elements 10. As shown in fig. 2, the cathode 11 is preferably provided with a notch 18. The notch 18 is provided on both sides of the side portion of the cathode portion 11, separated from the end portion of the cathode portion 11. The holding portion 33 is fitted into the cutout portion 18 of the cathode portion 11 and joined thereto.

The cathode terminal 20 preferably has a support portion 38 that is not in contact with the lower surface of the end portion side of the cathode portion 11 via the conductive adhesive portion 22. As shown in fig. 1, 2 and 4, the support portion 38 is connected to a part of the side portion of the terminal connection portion 30, and the shape of the connection between the terminal connection portion 30 and the support portion 38 is stepped. That is, the support portion 38 extends from the side of the terminal connection portion 30. The support portions 38 are provided in pairs on both sides of the side portions of the terminal connecting portion 30, which are bent vertically or obliquely upward in the exterior resin 23 from the side portions of the terminal connecting portion 30. Further, an upper stage 39 is provided at the upper end of the support portion 38.

As shown in fig. 4, the upper surface of the upper portion 39 of the support portion 38 is provided substantially in parallel with a height difference of a predetermined interval with respect to the mounting surface 24, and the exterior resin 23 is provided on the lower surface of the upper portion 39. By providing the exterior resin 23 on the lower surface of the upper portion 39, deformation of the terminal connection portion 30 can be suppressed, and mountability can be ensured.

Further, the upper portion 39 is preferably folded so as to spread outward in the width direction with respect to the terminal connection portion 30, and is formed further outward than the side portion side of the terminal connection portion 30. Thus, the upper portion 39 is provided on the outer side of the cathode-side end portion of the element mounting portion 31 in the width direction, and the upper surface of the upper portion 39 is further provided away from the upper surface of the element mounting portion 31. Therefore, the conductive paste can be prevented from spreading and reaching the upper stage 39 when the conductive adhesive portion 22 is formed in the component mounting portion 31, and the upper stage 39 can be reliably brought into a non-fixed state. The cathode-side end portion of the element mounting portion 31 is bent at the upper end portion of the connecting portion 32 as shown in fig. 1 and 2.

As shown in fig. 4, the front end portion of the upper stage 39 on the side of the cathode 11 preferably protrudes outward from the side of the cathode 11. With this structure, since the periphery of the distal end portion of the upper stage portion 39 is covered with the exterior resin 23, deformation of the terminal connection portion 30 can be suppressed, and mountability can be ensured. The upper portion 39 may be bent inward in the width direction and may be provided directly above the upper surface of the terminal connection portion 30.

Preferably, the upper surface of the upper stage 39 is in contact with the end portion of the lower surface of the cathode portion 11 including the lowermost element 10A. The upper surface of the upper stage 39 is preferably disposed on the same plane as the upper surface of the component mounting portion 31, and is preferably smaller than the upper surface of the component mounting portion 31. The upper surface of the upper step 39 is preferably provided higher than the upper surface of the component mounting portion 31 by a portion corresponding to the thickness of the conductive adhesive portion 22 provided on the component mounting portion 31.

Before the element 10 is covered with the exterior resin 23, if stress that deviates from each other between the upper stage 39 and the cathode 11 acts, the upper stage 39 and the cathode 11 may move relatively. That is, the upper stage 39 and the cathode 11 are not fixed to each other. When the element 10 is covered with the exterior resin 23, the support portion 38 and the cathode portion 11 are fixed so as not to be movable with respect to each other by the exterior resin 23.

Next, the anode terminal 21 will be described. The anode terminal 21 has an anode connection portion (hereinafter, connection portion) 41. As shown in fig. 5, the connection portion 41 extends in the width direction from a part of the side portion of the terminal connection portion 40, is bent vertically or obliquely upward in the exterior resin portion 23 from the side portion of the terminal connection portion 40, and is provided in pairs on both sides of the side portion of the terminal connection portion 40. The connection portion 41 is provided with a mounting portion 42. The placement portion 42 is provided further outside than the side portion of the terminal connection portion 40. The placement portion 42 is provided in a flat shape so as to place the lower surface of the anode portion 12 thereon.

As shown in fig. 1, the connection portion 41 is provided with an anode holding portion (hereinafter, holding portion) 43 extending from the mounting portion 42. The holding portion 43 extends along the end of the stacked anode portion 12 and is bent at the upper surface of the anode portion 12 to enclose the stacked anode portion 12. The holding portion 43 is bonded to the upper surface of the stacked anode portion 12 by laser welding or resistance welding.

In the above description, the terminal connecting portions 30 and 40 are exposed from the mounting surface 24 of the exterior resin portion 23, and the distal end portions are bent upward along the exterior resin portion 23. However, the shapes of the cathode terminal 20 and the anode terminal 21 are not limited thereto. The terminal connection portion 30 may be exposed from the mounting surface 24, or may be bent upward without being along the exterior resin portion 23.

(Effect)

According to the above embodiment, in the solid electrolytic capacitor in which the distance H between the upper surface and the lower surface of the exterior resin is 0.8mm or less due to the reduction in height, the distance L1 between the lower surface of the exterior resin and the upper end of the anode terminal connecting portion closest to the upper surface of the exterior resin is smaller than the distance H, the distance L2 between the lower surface of the exterior resin and the upper end of the cathode terminal connecting portion closest to the upper surface of the exterior resin is smaller than the distance H, the difference between the distance H and the distance L1 is equal to or greater than the distance L1, and the difference between the distance H and the distance L2 is equal to or greater than the distance L2, and therefore, it is possible to prevent the anode terminal and the cathode terminal from coming into contact via the conductive structure and shorting when the conductive structure is disposed on the upper side of the solid electrolytic capacitor.

According to the above embodiment, the difference between the distance H and the distance L1 is 0.4mm or more and the difference between the distance H and the distance L2 is 0.4mm or more, so that the anode terminal and the cathode terminal can be further reliably prevented from coming into contact with each other via the conductive structure when the conductive structure is disposed on the upper side of the solid electrolytic capacitor, and occurrence of short-circuiting can be prevented.

According to the above embodiment, by setting the distance L1 and the distance L2 to 0.2mm or more, the contact area with the solder can be increased to be reliably fixed and the solder can be prevented from contacting the exterior resin 23 when the solid electrolytic capacitor is mounted by the solder or the like.

According to the above embodiment, the anode portion of the capacitor element is disposed so as to face the surface of the anode terminal connecting portion opposite to the surface exposed to the lower surface of the exterior resin, and thus the length of the conductive path between the anode portion of the capacitor element and the exposed surface of the anode terminal connecting portion (the portion to be connected by solder or the like at the time of mounting) can be shortened, and therefore the ESR of the solid electrolytic capacitor can be reduced.

According to the above embodiment, the cathode terminal further has: the element mounting portion is connected to the cathode terminal connecting portion and connected to the cathode portion of the capacitor element, and the element mounting portion is buried in the exterior resin, and is disposed at a position closer to the anode portion of the capacitor element than the cathode terminal connecting portion, so that the cathode terminal connecting portion can be disposed at an end portion of the capacitor element, and the element mounting portion to which the capacitor element is connected can be disposed at a side closer to the center portion of the capacitor element, so that the capacitor element can be more stably fixed.

According to the above embodiment, the lower surface of the anode terminal connecting portion is flush with the lower surface of the exterior resin, and the lower surface of the cathode terminal connecting portion is flush with the lower surface of the exterior resin, and since the anode terminal connecting portion and the cathode terminal connecting portion do not protrude from the lower surface of the exterior resin, further reduction in height of the solid electrolytic capacitor can be achieved.

According to the above embodiment, the solid electrolytic capacitor includes the plurality of capacitor elements including the capacitor element, and the plurality of capacitor elements are stacked, and the electrostatic capacitance can be improved by stacking the plurality of capacitor elements.

According to the above embodiment, by stacking two capacitor elements, the electrostatic capacitance can be improved and the solid electrolytic capacitor can be made low.

According to the above embodiment, the capacitor element includes: the ESR of the solid electrolytic capacitor can be reduced by using the metal foil, the dielectric layer disposed on the metal foil, the solid electrolyte layer covering at least a part of the dielectric layer, and the cathode layer covering at least a part of the solid electrolyte layer as the conductive polymer layer.

While the present utility model has been described with reference to the preferred embodiments thereof, those skilled in the art will appreciate that various modifications, substitutions and alterations can be made to the present utility model without departing from the spirit of the present utility model, and that each of those modifications, substitutions and alterations are also included in the scope of the present utility model.

Industrial applicability

The solid electrolytic capacitor of the present utility model can be widely applied to various devices using the solid electrolytic capacitor.

Claims (10)

1. A solid electrolytic capacitor is provided with:

a planar capacitor element having an anode portion and a cathode portion;

an anode terminal connected to the anode portion;

A cathode terminal connected to the cathode portion; and

An exterior resin covering the capacitor element, a portion of the anode terminal, and a portion of the cathode terminal,

It is characterized in that the method comprises the steps of,

The exterior resin has: a lower surface as a mounting surface of the solid electrolytic capacitor, an upper surface on the opposite side of the lower surface, a 1 st side surface intersecting the lower surface, and a 2 nd side surface intersecting the lower surface and on the opposite side of the 1 st side surface,

The anode terminal has an anode terminal connecting portion exposed at the lower surface of the exterior resin and extending to the 1 st side,

The cathode terminal has a cathode terminal connection part exposed at the lower surface of the exterior resin and extending to the 2 nd side,

A distance L1 between the lower surface of the exterior resin and an upper end of the anode terminal connection portion closest to the upper surface of the exterior resin is smaller than a distance H between the lower surface and the upper surface of the exterior resin,

A distance L2 between the lower surface of the exterior resin and an upper end of the cathode terminal connection portion closest to the upper surface of the exterior resin is smaller than a distance H between the lower surface and the upper surface of the exterior resin,

The distance H is less than 0.8mm,

The difference between the distance H and the distance L1 is equal to or greater than the distance L1,

The difference between the distance H and the distance L2 is equal to or greater than the distance L2.

2. The solid electrolytic capacitor according to claim 1, wherein,

The difference between the distance H and the distance L1 is more than 0.4mm,

The difference between the distance H and the distance L2 is 0.4mm or more.

3. The solid electrolytic capacitor according to claim 1 or 2, wherein,

The distance L1 is more than 0.2mm,

The distance L2 is more than 0.2 mm.

4. The solid electrolytic capacitor according to claim 1 or 2, wherein,

The anode portion of the capacitor element is disposed so as to face a surface of the anode terminal connection portion opposite to a surface exposed on the lower surface of the exterior resin.

5. The solid electrolytic capacitor according to claim 1 or 2, wherein,

The cathode terminal further has: a component mounting part connected to the cathode terminal connection part and connected to the cathode part of the capacitor component,

The element mounting portion is embedded in the exterior resin,

The element mounting portion is disposed at a position closer to the anode portion of the capacitor element than the cathode terminal connecting portion.

6. The solid electrolytic capacitor according to claim 1 or 2, wherein,

The lower surface of the anode terminal connection part is flush with the lower surface of the exterior resin,

The lower surface of the cathode terminal connection part is flush with the lower surface of the exterior resin.

7. The solid electrolytic capacitor according to claim 1 or 2, wherein,

The solid electrolytic capacitor has a plurality of capacitor elements including the capacitor element,

The plurality of capacitor elements are stacked.

8. The solid electrolytic capacitor according to claim 7, wherein,

The plurality of capacitor elements is two of the capacitor elements.

9. The solid electrolytic capacitor according to claim 1 or 2, wherein,

The capacitor element includes: the semiconductor device includes a metal foil, a dielectric layer disposed on the metal foil, a solid electrolyte layer covering at least a portion of the dielectric layer, and a cathode layer covering at least a portion of the solid electrolyte layer.

10. The solid electrolytic capacitor according to claim 9, wherein,

The solid electrolyte layer is a conductive polymer layer.