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CN211426703U - Chip detection device - Google Patents

Chip detection device Download PDF

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CN211426703U
CN211426703U CN201922353851.5U CN201922353851U CN211426703U CN 211426703 U CN211426703 U CN 211426703U CN 201922353851 U CN201922353851 U CN 201922353851U CN 211426703 U CN211426703 U CN 211426703U
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detection
chip
host
circuit
communication
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李桂萍
周维
孙学进
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Jihai Microelectronics Co ltd
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Apex Microelectronics Co Ltd
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Abstract

本实用新型提供一种芯片检测装置,包括:至少一个检测头和检测主机,所述检测头,包括多个探针和通信接口,所述探针用于与被检测芯片的端子接触以使所述探针与所述被检测芯片通信连接;所述通信接口与所述探针连接,所述通信接口用于实现所述检测头与检测主机的通信;所述检测主机包括多个功能检测电路和选择电路,所述选择电路用于选择所需的功能检测电路与检测头通信,以使所述检测主机通过检测头对芯片执行相应的性能检测。本实用新型芯片检测装置采用若干个功能检测电路与选择电路相配合的方式,选择电路依据检测需求选择相应的功能检测电路,从而对芯片的不同功能实现检测。

Figure 201922353851

The utility model provides a chip detection device, comprising: at least one detection head and a detection host, the detection head includes a plurality of probes and a communication interface, the probes are used for contacting the terminals of the tested chips to make all the probes The probe is connected in communication with the chip to be tested; the communication interface is connected with the probe, and the communication interface is used to realize the communication between the detection head and the detection host; the detection host includes a plurality of function detection circuits and a selection circuit, the selection circuit is used to select the required function detection circuit to communicate with the detection head, so that the detection host can perform corresponding performance detection on the chip through the detection head. The chip detection device of the utility model adopts a mode in which several function detection circuits cooperate with the selection circuit, and the selection circuit selects the corresponding function detection circuit according to the detection requirements, thereby realizing detection of different functions of the chip.

Figure 201922353851

Description

芯片检测装置Chip detection device

技术领域technical field

本实用新型涉及芯片检测装置,尤其涉及一种打印机耗材中的芯片检测装置。The utility model relates to a chip detection device, in particular to a chip detection device in printer consumables.

背景技术Background technique

记录装置,例如打印机、复印机和传真机等,用于将需要记录的信息通过耗材(如墨水、碳粉等)记录到纸张等记录介质上。记录装置通常包括记录装置主体和耗材盒。耗材盒通常以可拆卸地方式安装在记录装置上,并且配置有用于标记耗材盒中耗材的消耗量或余量等数据信息的耗材芯片。耗材芯片通常以可拆卸地方式安装在耗材盒上,并且芯片中设置有存储元件,以便存储耗材的消耗量或余量等可改写数据,以及其它与耗材盒相关的只读数据。当耗材盒安装到记录装置上时,耗材盒上的芯片会与记录装置建立电连接,并与记录装置进行数据交换。Recording devices, such as printers, copiers, and facsimile machines, are used to record information to be recorded on a recording medium such as paper through consumables (such as ink, toner, etc.). The recording device generally includes a recording device main body and a consumable box. The consumables box is usually detachably mounted on the recording device, and is provided with a consumables chip for marking data information such as the consumption amount or the remaining amount of the consumables in the consumables box. The consumable chip is usually detachably mounted on the consumable box, and a storage element is provided in the chip to store rewritable data such as the consumption or remaining amount of the consumable, and other read-only data related to the consumable box. When the consumable box is installed on the recording device, the chip on the consumable box will establish an electrical connection with the recording device, and perform data exchange with the recording device.

现在的市场上,不仅销售有原装产商生产的原装耗材芯片,还有兼容产商销售的兼容耗材芯片,又或者芯片生产完成至销售这段时间中,由于环境因素、运输过程等因素的影响,可能会导致芯片的性能发生变化;种种因素导致安装到耗材盒上的耗材芯片性能良莠不齐,无法保证产品品质及用户利益。现有技术中的耗材芯片检测设备,只能检测耗材芯片中写入数据是否完整,不能检测耗材芯片的其它性能,对芯片的质量进行测评。In the current market, not only original consumable chips produced by original manufacturers, but also compatible consumable chips sold by compatible manufacturers are sold. , may lead to changes in the performance of the chip; various factors cause the performance of the consumable chips installed on the consumable box to be uneven, and the product quality and user interests cannot be guaranteed. The consumable chip detection device in the prior art can only detect whether the written data in the consumable chip is complete, but cannot detect other properties of the consumable chip, and evaluate the quality of the chip.

实用新型内容Utility model content

鉴于上述问题,本实用新型提供一种芯片检测装置,其能够对芯片性能进行全面的检测。In view of the above problems, the present invention provides a chip detection device, which can comprehensively test the performance of the chip.

本实用新型提供一种芯片检测装置,包括:至少一个检测头和检测主机,The utility model provides a chip detection device, comprising: at least one detection head and a detection host,

所述检测头,包括多个探针和通信接口,所述探针用于与被检测芯片的端子接触以使所述探针与所述被检测芯片通信连接;所述通信接口与所述探针连接,所述通信接口用于实现所述检测头与检测主机的通信;The detection head includes a plurality of probes and a communication interface, the probes are used for contacting the terminals of the tested chip to make the probes communicate with the tested chip; the communication interface is connected to the probe. needle connection, the communication interface is used to realize the communication between the detection head and the detection host;

所述检测主机包括多个功能检测电路和选择电路,所述选择电路用于选择所需的功能检测电路与检测头通信,以使所述检测主机通过检测头对芯片执行相应的性能检测。The detection host includes a plurality of function detection circuits and a selection circuit, and the selection circuit is used for selecting a required function detection circuit to communicate with the detection head, so that the detection host performs corresponding performance detection on the chip through the detection head.

可选地,所述检测主机还具有信息存储单元,所述信息存储单元用于预存多种不同芯片的信息。Optionally, the detection host further has an information storage unit, and the information storage unit is used for pre-storing information of a variety of different chips.

可选地,所述检测头内还包括配置存储单元,所述配置存储单元与所述通信接口通信连接,所述配置存储单元用于存储多种通信协议和/或端子的多种电气定义排布方式。Optionally, the detection head further includes a configuration storage unit, the configuration storage unit is communicatively connected to the communication interface, and the configuration storage unit is used to store multiple communication protocols and/or multiple electrical definition arrays of terminals. cloth method.

可选地,所述配置存储单元还用于暂存所述被检测芯片的检测结果。Optionally, the configuration storage unit is further configured to temporarily store the detection result of the detected chip.

可选地,所述多个功能检测电路包括端子电气定义检测电路、通信协议检测电路、读写功能检测电路、数据获取电路、功耗检测电路、频率检测电路、芯片最高/低工作电压检测电路或保护能力检测电路中的任意两个或两个以上的组合。Optionally, the plurality of function detection circuits include a terminal electrical definition detection circuit, a communication protocol detection circuit, a read-write function detection circuit, a data acquisition circuit, a power consumption detection circuit, a frequency detection circuit, and a chip maximum/low working voltage detection circuit. Or any combination of two or more of the protection capability detection circuits.

可选地,所述检测主机用于根据多个所述功能检测电路的性能检测结果对所述被检测芯片的性能综合评分。Optionally, the detection host is configured to comprehensively score the performance of the tested chip according to performance detection results of a plurality of the function detection circuits.

可选地,所述检测主机还包括输入接口和输出接口;Optionally, the detection host further includes an input interface and an output interface;

所述输入接口用于接收用户需要检测的芯片性能,以使所述选择电路选择相应的功能检测电路并通过所述检测头执行检测操作;The input interface is used to receive the chip performance that the user needs to detect, so that the selection circuit selects the corresponding function detection circuit and performs the detection operation through the detection head;

所述输出接口用于接收所述检测头的检测结果在所述检测主机上显示。The output interface is used for receiving the detection result of the detection head and displaying it on the detection host.

可选地,所述输入接口与所述检测主机上的按键单元连接,用户通过所述按键单元选择检测需求;所述输出接口与所述检测主机上的显示屏连接,所述显示屏用于显示所述检测结果;Optionally, the input interface is connected to a button unit on the detection host, and the user selects detection requirements through the button unit; the output interface is connected to a display screen on the detection host, and the display screen is used for displaying the detection result;

或者,所述输入接口和所述输出接口与所述检测主机上的触摸显示屏连接,所述触摸显示屏既能供用户选择检测需求,又能显示所述检测结果。Alternatively, the input interface and the output interface are connected to a touch display screen on the detection host, and the touch display screen can not only allow the user to select detection requirements, but also display the detection results.

可选地,所述检测头与所述检测主机通过有线通信或无线通信的方式建立通信连接。Optionally, a communication connection is established between the detection head and the detection host through wired communication or wireless communication.

本实用新型芯片检测装置采用若干个功能检测电路与选择电路相配合的方式,选择电路依据检测需求选择相应的功能检测电路,从而对芯片的不同功能实现检测。因此,本实用新型能够对芯片的性能进行全面的检测和评价,有利于全面提高产品的质量。The chip detection device of the utility model adopts the mode that several function detection circuits cooperate with the selection circuit, and the selection circuit selects the corresponding function detection circuit according to the detection requirements, thereby realizing detection of different functions of the chip. Therefore, the utility model can comprehensively detect and evaluate the performance of the chip, which is beneficial to improve the quality of the product in an all-round way.

附图说明Description of drawings

图1是本实用新型芯片检测装置一实施例的检测电路的组成;Fig. 1 is the composition of the detection circuit of an embodiment of the chip detection device of the present invention;

图2是本实用新型芯片检测装置一实施例的内部电路模块结构;2 is an internal circuit module structure of an embodiment of the chip detection device of the present invention;

图3是本实用新型芯片检测装置一实施例的外部结构;3 is an external structure of an embodiment of the chip detection device of the present invention;

图4是本实用新型芯片检测装置一实施例的端子电气定义检测电路;4 is a terminal electrical definition detection circuit of an embodiment of the chip detection device of the present invention;

图5是本实用新型芯片检测装置一实施例的电压检测电路的内部电路结构。5 is an internal circuit structure of a voltage detection circuit of an embodiment of the chip detection device of the present invention.

具体实施方式Detailed ways

为使本实用新型实施例的目的、技术方案和优点更加清楚,下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。In order to make the purposes, technical solutions and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. The embodiments described above are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

如图1所示,本实用新型实施例提供一种芯片检测装置,包括:至少一个检测头1和检测主机2,As shown in FIG. 1 , an embodiment of the present invention provides a chip detection device, comprising: at least one detection head 1 and a detection host 2 ,

所述检测头1,包括多个探针11和通信接口,所述探针11用于与被检测芯片的端子接触以使所述探针11与所述被检测芯片通信连接;所述通信接口与所述探针11连接,所述通信接口用于实现所述检测头1与检测主机2的通信;The detection head 1 includes a plurality of probes 11 and a communication interface, the probes 11 are used for contacting the terminals of the tested chip so that the probes 11 are communicatively connected with the tested chip; the communication interface Connected with the probe 11, the communication interface is used to realize the communication between the detection head 1 and the detection host 2;

所述检测主机2包括多个功能检测电路26和选择电路24,所述选择电路24用于选择所需的功能检测电路26与检测头1通信,以使所述检测主机2通过检测头4执行对芯片的性能检测。The detection host 2 includes a plurality of function detection circuits 26 and a selection circuit 24, and the selection circuit 24 is used to select a desired function detection circuit 26 to communicate with the detection head 1, so that the detection host 2 is executed by the detection head 4. Check the performance of the chip.

作为本实施例的可选实施方式,所述若干功能检测电路26包括端子电气定义检测电路261、通信协议检测电路262、读写功能检测电路263、数据获取电路264、功耗检测电路265、频率检测电路266、芯片最高/低电压检测电路267和保护能力检测电路268。当然,本实施方式并不对本实用新型的保护范围形成限制,在其他实施方式中,还可以选择上述功能检测模块中的任意两个或者两个以上的功能模块。As an optional implementation of this embodiment, the several function detection circuits 26 include a terminal electrical definition detection circuit 261, a communication protocol detection circuit 262, a read/write function detection circuit 263, a data acquisition circuit 264, a power consumption detection circuit 265, a frequency Detection circuit 266 , chip highest/low voltage detection circuit 267 and protection capability detection circuit 268 . Of course, this embodiment does not limit the protection scope of the present invention, and in other embodiments, any two or more function modules from the above-mentioned function detection modules may also be selected.

在本实施例中,采用选择电路24对功能检测电路进行选择,从而,本实施例芯片检测装置采用若干个功能检测电路与选择电路24相配合的方式,选择电路24依据检测需求选择相应的功能检测电路,从而对芯片的不同功能实现检测。因此,本实施例能够对芯片的性能进行全面的检测和评价,有利于全面提高产品的质量。In this embodiment, the selection circuit 24 is used to select the function detection circuit. Therefore, the chip detection device of this embodiment adopts a method in which several function detection circuits cooperate with the selection circuit 24, and the selection circuit 24 selects the corresponding function according to the detection requirements. Detection circuit, so as to realize the detection of different functions of the chip. Therefore, this embodiment can comprehensively test and evaluate the performance of the chip, which is beneficial to improve the quality of the product in an all-round way.

检测主机需要与被检测芯片建立通信连接,例如,如图3所示,芯片检测装置还包括检测头1,所述检测头1包括若干探针11和与所述探针11通信连接的通信接口;The detection host needs to establish a communication connection with the tested chip. For example, as shown in FIG. 3 , the chip detection device further includes a detection head 1 , and the detection head 1 includes a plurality of probes 11 and a communication interface for communication with the probes 11 . ;

所述若干探针11用于与被测芯片的检测端子接触并建立通信连接。The plurality of probes 11 are used to make contact with the detection terminals of the chip under test and establish a communication connection.

检测头1与检测主机2通过有线通信或无线通信的方式建立通信连接,其中,有线通信即检测头与检测主机通过信号线实现通信连接,无线通信即检测头与检测主机通过蓝牙、RFID等实现通信连接。The detection head 1 and the detection host 2 establish a communication connection through wired communication or wireless communication, wherein the wired communication means that the detection head and the detection host realize the communication connection through a signal line, and the wireless communication means that the detection head and the detection host are realized through Bluetooth, RFID, etc. communication connection.

上述的检测头1采用与探针11接触的方式与被检测芯片建立通信连接,其优点在于该连接方式能够方便快捷的实现连接。但是,该连接方式并不对本实用新型形成限定,还可以采用其他任何能够实现通信连接的方式。The above-mentioned detection head 1 establishes a communication connection with the detected chip by contacting with the probe 11 , and the advantage is that the connection can be realized conveniently and quickly. However, the connection manner does not limit the present invention, and any other manner capable of realizing communication connection can also be adopted.

具体地,如图2所示,是芯片检测装置的内部电路模块结构,其中检测头1包括:触针单元11和通信接口12,通信接口12设置在检测头1的内部电路结构中;通信接口12分别与多个触针11和主机2的内部电路连接,多个触针11能够与芯片的端子一一对应接触,通信接口12接收到从主机2侧发送过来的检测指令后,通过多个触针11与芯片实现通信,完成检测并将检测结果反馈回主机2。作为本实施例的可选实施方式,检测头1的内部电路还包括有配置存储单元13,配置存储单元13可用于存储多种不同的通信协议、端子的多种电气定义排布方式等信息,通信接口12分别与多个触针11、配置存储单元13和主机2的内部电路连接,通信接口12接收到从主机2侧发送过来的检测指令后,从配置存储单元13中调用所需的数据或程序经多个触针11与芯片进行通信,完成检测并将检测结果反馈回主机2。Specifically, as shown in FIG. 2, it is the internal circuit module structure of the chip detection device, wherein the detection head 1 includes: a stylus unit 11 and a communication interface 12, and the communication interface 12 is provided in the internal circuit structure of the detection head 1; the communication interface 12 is respectively connected with a plurality of contact pins 11 and the internal circuit of the host 2, and the plurality of contact pins 11 can be in contact with the terminals of the chip one by one. After the communication interface 12 receives the detection command sent from the host The stylus 11 communicates with the chip, completes the detection and feeds back the detection result to the host 2 . As an optional implementation of this embodiment, the internal circuit of the detection head 1 further includes a configuration storage unit 13, and the configuration storage unit 13 can be used to store a variety of different communication protocols, a variety of electrical definition arrangements of terminals and other information, The communication interface 12 is respectively connected with the plurality of contact pins 11, the configuration storage unit 13 and the internal circuit of the host 2. After the communication interface 12 receives the detection instruction sent from the host 2 side, it calls the required data from the configuration storage unit 13. Or the program communicates with the chip via a plurality of contact pins 11 to complete the detection and feed back the detection result to the host 2 .

作为本实施例的可选实施方式,主机2还包括设置在外部的显示屏21和按键单元22,设置在内部电路模块的输入接口23、选择电路24、信息存储单元25、检测电路26和输出接口27。按键单元22与输入接口23连接,用户按下需要检测的芯片性能的对应按键时,输入接口23将其转换成电信号并将电信号发送与其连接的选择电路24中;选择电路24分别与信息存储单元25和检测电路26连接,其中,信息存储单元中预存有与芯片型号对应的使用机型、对应产商等信息,检测电路26中包括有多个检测不同的芯片性能的电路,选择电路24根据上述电信号选择对应检测电路26经检测头1对芯片进行检测,检测头1将检测结果反馈到输出接口27中,输出接口27与显示屏21连接,因此检测结果在显示屏上显示。进一步地,主机还可以根据检测出来的多个性能结果综合评分并显示在显示屏21上。在本实施例中,显示屏21作为显示模块设置在检测主机的外部,但是,该方式并不唯一,还可以采用其他的方式,例如,还可以采用外接的显示设备进行显示,或者通过投影显示等。而按键单元22作为本实施例的输入模块,同理,该方式也不是唯一的,还可以采用如键盘或触摸屏等其他能够完成信息输入的模块作为输入模块。As an optional implementation of this embodiment, the host 2 further includes a display screen 21 and a key unit 22 disposed outside, an input interface 23, a selection circuit 24, an information storage unit 25, a detection circuit 26 and an output disposed in the internal circuit module interface 27. The button unit 22 is connected with the input interface 23. When the user presses the corresponding button of the chip performance to be detected, the input interface 23 converts it into an electrical signal and sends the electrical signal to the selection circuit 24 connected to it; the selection circuit 24 is respectively associated with the information The storage unit 25 is connected to the detection circuit 26, wherein the information storage unit is pre-stored with information such as the model of use corresponding to the chip model, the corresponding manufacturer, etc., and the detection circuit 26 includes a plurality of circuits for detecting different chip performances, and a selection circuit 24 Select the corresponding detection circuit 26 according to the above-mentioned electrical signal to detect the chip through the detection head 1, and the detection head 1 feeds back the detection result to the output interface 27, and the output interface 27 is connected to the display screen 21, so the detection result is displayed on the display screen. Further, the host can also comprehensively score and display on the display screen 21 according to the multiple detected performance results. In this embodiment, the display screen 21 is set outside the detection host as a display module, but this method is not unique, and other methods can also be used, for example, an external display device can also be used for display, or a projection display can be used. Wait. The key unit 22 is used as the input module in this embodiment. Similarly, this method is not unique, and other modules capable of completing information input, such as a keyboard or a touch screen, can also be used as the input module.

通过本实施例中的芯片检测装置,可以检测芯片的多种不同性能,并且可以根据芯片的不同性能结果进行综合评分,便于对芯片的质量进行评估,将质量不好的芯片除去,留下质量较好的芯片,以保证用户的利益。The chip detection device in this embodiment can detect a variety of different performances of the chip, and can perform comprehensive scoring according to the different performance results of the chip, which is convenient to evaluate the quality of the chip, remove the chip with poor quality, and leave the quality of the chip. Better chips to ensure the interests of users.

对于上述的各个功能检测电路的检测过程具体描述如下:The specific description of the detection process of each of the above functional detection circuits is as follows:

端子电气定义检测电路:如图4所示,为了方便描述,本实施例以芯片具有VCC(供电端子)、GND(接地端子)、RST(复位端子)、CLK(时钟端子)、SDK(数据端子)五个端子为例,通信接口12中包括有MCU和模拟打印机侧相对应端子输入相应时序的VCC、GND、RST、CLK、SDK模块,所示模块中的每一个都分别与每一个探针11连接,即通信接口12中的VCC、GND、RST、CLK、SDK模块通过探针11分别向芯片的VCC、GND、RST、CLK、SDK端子输入信号。Terminal electrical definition detection circuit: As shown in Figure 4, for the convenience of description, in this embodiment, the chip has VCC (power supply terminal), GND (ground terminal), RST (reset terminal), CLK (clock terminal), SDK (data terminal) ) as an example with five terminals, the communication interface 12 includes VCC, GND, RST, CLK, and SDK modules that input corresponding timings to the corresponding terminals on the side of the MCU and the analog printer, and each of the modules shown is respectively associated with each probe 11 is connected, that is, the VCC, GND, RST, CLK, and SDK modules in the communication interface 12 respectively input signals to the VCC, GND, RST, CLK, and SDK terminals of the chip through the probe 11 .

多个检测头1的探针11都能与待检测芯片的端子一一对应接触,但每个检测头1的探针11的电气定义排列顺序都不相同。选择电路24接收到该指令导通检测电路26中的端子电气定义检测电路261,通信接口12接收到检测端子电气定义的指令时,向芯片发送指令判断芯片是否能够正常工作,若能正常工作则说明所使用的检测头1的探针的电气定义排列顺序与芯片端子的电气定义排列顺序一致,将检测头1的电气定义排列顺序发送给主机的输出接口21,并在显示屏27上显示;若主机2显示表示通信异常等信息时,则更换其它检测头,直至主机2提示通信正常并返回端子定义排列顺序为止。The probes 11 of the plurality of test heads 1 can all be in one-to-one contact with the terminals of the chip to be tested, but the electrical definition arrangement order of the probes 11 of each test head 1 is different. The selection circuit 24 receives the instruction and turns on the terminal electrical definition detection circuit 261 in the detection circuit 26. When the communication interface 12 receives the instruction to detect the electrical definition of the terminal, it sends an instruction to the chip to determine whether the chip can work normally. Explain that the electrical definition arrangement order of the probes of the used detection head 1 is consistent with the electrical definition arrangement order of the chip terminals, and the electrical definition arrangement order of the detection head 1 is sent to the output interface 21 of the host, and displayed on the display screen 27; If the host 2 displays a message indicating that the communication is abnormal, replace other detection heads until the host 2 indicates that the communication is normal and returns to the terminal definition arrangement sequence.

或者,如图4所示,是电气定义检测电路的另一种实现方式。当用户通过检测主机2选择检测端子的电气定义时,选择电路24接收到该指令导通检测电路26中的端子电气定义检测电路261,通信接口12接收到检测端子电气定义的指令时,从配置存储单元13中读取预先存储的多种端子电气定义排列顺序,MCU根据每种电气定义排列顺序对应导通相应的探针11,向芯片输入相应的信号,当与芯片的实际端子电气定义排列顺序一致时,即通过了检测,MCU将对应的电气定义排列顺序发送给主机的输出接口21,并在显示屏27上显示。这种实现方式可以减少需要配置的检测头的数量。Alternatively, as shown in Figure 4, there is another implementation of an electrically defined detection circuit. When the user selects the electrical definition of the detection terminal through the detection host 2, the selection circuit 24 receives the instruction and turns on the terminal electrical definition detection circuit 261 in the detection circuit 26. When the communication interface 12 receives the instruction to detect the electrical definition of the terminal, the configuration The storage unit 13 reads the pre-stored electrical definition arrangement order of various terminals, and the MCU turns on the corresponding probe 11 according to each electrical definition arrangement order, and inputs the corresponding signal to the chip. When the order is consistent, that is, the test is passed, the MCU sends the corresponding electrical definition arrangement order to the output interface 21 of the host, and displays it on the display screen 27 . This implementation can reduce the number of detection heads that need to be configured.

由于其余电路性能检测电路都需要预知芯片端子的电气定义,因此在检测同一芯片的性能时,将检测出来的芯片端子的电气定义顺序暂存在配置存储单元13中,后续的每一次芯片性能检测电路都以此暂存的端子电气定义顺序为依据检测芯片。以检测头接触到某一芯片至离开该芯片的时间段内判定为同一芯片,若检测头检测到无芯片接触,即删除暂存在配置存储单元13中芯片端子的电气定义顺序,如此可以提高主机的检测速度,无需在每一次性能检测时都先确定端子的电气定义顺序。Since the other circuit performance detection circuits need to predict the electrical definitions of the chip terminals, when testing the performance of the same chip, the detected electrical definitions of the chip terminals are temporarily stored in the configuration storage unit 13, and each subsequent chip performance detection circuit The chips are detected based on the temporarily stored terminal electrical definition sequence. The time period from the detection head touching a certain chip to the time it leaves the chip is determined as the same chip. If the detection head detects no chip contact, the electrical definition sequence of the chip terminals temporarily stored in the configuration storage unit 13 is deleted, which can improve the performance of the host computer. The detection speed is very fast, and there is no need to determine the electrical definition sequence of the terminals for each performance test.

通信协议检测电路:配置存储单元13中存储有多种通信协议程序,如IIC、SPI、并口(I/O)、DMA等通信协议。当用户通过检测主机2选择检测芯片的通信协议时,选择电路24接收到该指令导通检测电路26中的通信协议检测电路262,通信接口12接收到检测芯片的通信协议的指令时,从配置存储单元13中读取通信协议程序和已确定的端子电气定义顺序,将不同的通信协议通过数据通信端子发送到芯片中,当芯片在某通信协议下可正常工作时,将该协议发送给主机的输出接口21,并在显示屏27上显示。Communication protocol detection circuit: The configuration storage unit 13 stores various communication protocol programs, such as IIC, SPI, parallel port (I/O), DMA and other communication protocols. When the user selects the communication protocol of the detection chip through the detection host 2, the selection circuit 24 receives the instruction and turns on the communication protocol detection circuit 262 in the detection circuit 26. When the communication interface 12 receives the instruction to detect the communication protocol of the chip, the configuration The storage unit 13 reads the communication protocol program and the determined electrical definition sequence of the terminals, and sends different communication protocols to the chip through the data communication terminals. When the chip can work normally under a certain communication protocol, the protocol is sent to the host. The output interface 21 is displayed on the display screen 27.

由于以下电路性能检测电路都需要预知芯片的通信协议,因此在检测同一芯片的性能时,将检测出来的通信协议暂存在配置存储单元13中,后续的每一次芯片性能检测电路都以此暂存的通信协议来操作芯片。以检测头接触到某一芯片至离开该芯片的时间段内判定为同一芯片,若检测头检测到无芯片接触,即删除暂存在配置存储单元13中通信协议,如此可以提高主机的检测速度,无需在每一次性能检测时都先确定芯片的通信协议。Since the following circuit performance detection circuits all need to predict the communication protocol of the chip, when detecting the performance of the same chip, the detected communication protocol is temporarily stored in the configuration storage unit 13, and each subsequent chip performance detection circuit is temporarily stored in this way. communication protocol to operate the chip. It is determined as the same chip within the time period from when the detection head touches a certain chip to when it leaves the chip. If the detection head detects no chip contact, the communication protocol temporarily stored in the configuration storage unit 13 is deleted, which can improve the detection speed of the host. There is no need to determine the communication protocol of the chip for every performance test.

读写功能检测电路:当用户通过检测主机2选择检测芯片的读写功能时,选择电路24接收到该指令导通检测电路26中的读写功能检测电路263,读写功能检测电路263向通信接口12发送读指令,通信接口12从配置存储单元13中读取已确定的端子电气定义顺序和通信协议程序,将读指令经数据通信端子发送到芯片中,判断芯片是否有回应,将判断结果反馈到输出接口27,若正常在显示屏上显示“读功能正常”,反之则显示“读功能异常”;检测写功能时,判断芯片接收到写指令至完成写指令响应的时间,判断响应时间是否在预设的时间范围内,将判断结果反馈到输出接口27,若响应时间在预设的时间范围内,则显示屏上显示“写功能正常”,反正则显示“写功能异常”;Read-write function detection circuit: when the user selects the read-write function of the detection chip through the detection host 2, the selection circuit 24 receives the instruction and turns on the read-write function detection circuit 263 in the detection circuit 26, and the read-write function detection circuit 263 sends the communication The interface 12 sends a read command, the communication interface 12 reads the determined terminal electrical definition sequence and communication protocol program from the configuration storage unit 13, sends the read command to the chip through the data communication terminal, and judges whether the chip has a response, and the judgment result is sent to the chip. Feedback to the output interface 27, if it is normal, it will display "reading function is normal" on the display screen, otherwise it will display "reading function abnormal"; when detecting the writing function, judge the time from when the chip receives the write command to the completion of the write command response, and judge the response time Whether it is within the preset time range, the judgment result is fed back to the output interface 27, if the response time is within the preset time range, the display screen will display "write function is normal", otherwise it will display "write function abnormal";

数据获取电路:当用户通过检测主机2选择获取芯片内部数据时,选择电路24接收到该指令导通检测电路26中的数据获取电路264,数据获取电路264向通信接口12发送读指令,通信接口12从配置存储单元13中读取已确定的端子电气定义顺序和通信协议程序,将读指令经数据通信端子发送到芯片中,芯片经数据通信端子向通信接口12返回芯片的基本信息,芯片的基本信息包括芯片型号、生产日期、序列号等,通信接口将从芯片中获取的基本信息返回到数据获取电路264。信息存储单元25中预存有每一种芯片型号所对应的打印机型号、对应的生产产商等信息,数据获取电路264根据芯片型号在信息存储单元25中获取对应的信号,再一起发送到输出接口27中,并在显示屏21中显示出来。Data acquisition circuit: when the user selects to acquire the internal data of the chip by detecting the host 2, the selection circuit 24 receives the instruction and turns on the data acquisition circuit 264 in the detection circuit 26, and the data acquisition circuit 264 sends a read instruction to the communication interface 12. The communication interface 12 reads the determined terminal electrical definition sequence and communication protocol program from the configuration storage unit 13, sends the read command to the chip through the data communication terminal, and the chip returns the basic information of the chip to the communication interface 12 through the data communication terminal. The basic information includes chip model, production date, serial number, etc., and the communication interface returns the basic information obtained from the chip to the data acquisition circuit 264 . The information storage unit 25 is pre-stored with information such as the printer model corresponding to each chip model, the corresponding manufacturer, etc. The data acquisition circuit 264 obtains the corresponding signal from the information storage unit 25 according to the chip model, and then sends it to the output interface. 27 and displayed on the display 21.

功耗检测电路:功耗检测电路265分为静态功耗检测电路和动态功耗检测电路。Power consumption detection circuit: The power consumption detection circuit 265 is divided into a static power consumption detection circuit and a dynamic power consumption detection circuit.

检测芯片的静态功耗时,静态功耗检测电路向通信接口12发送检测芯片静态功耗的指令,通信接口接收到指令后,通信接口12中的MCU导通VCC模块和对应芯片VCC端子的探针,对应芯片其余端子的探针全部与GND模块导通,此时检测芯片VCC端的电压及电流,并算出静态功耗,其中,静态功耗越小则芯片的性能越好。When detecting the static power consumption of the chip, the static power consumption detection circuit sends an instruction to detect the static power consumption of the chip to the communication interface 12. After the communication interface receives the instruction, the MCU in the communication interface 12 conducts the detection of the VCC module and the corresponding chip VCC terminal. The probes corresponding to the remaining terminals of the chip are all connected to the GND module. At this time, the voltage and current of the VCC terminal of the chip are detected, and the static power consumption is calculated. The smaller the static power consumption, the better the performance of the chip.

检测芯片的动态功耗时,动态功耗检测电路向通信接口12发送检测芯片动态功耗的指令,通信接口12从配置存储单元13中读取已确定的端子电气定义顺序和通信协议程序,通信接口12中的MCU导通各模块和芯片相应端子的探针,向芯片发送指令,检测芯片在正常工作的状态下VCC端的电压及电流,并算出动态功耗,其中,动态功耗越小则芯片的性能越好。When detecting the dynamic power consumption of the chip, the dynamic power consumption detection circuit sends an instruction to detect the dynamic power consumption of the chip to the communication interface 12, and the communication interface 12 reads the determined electrical definition sequence of the terminals and the communication protocol program from the configuration storage unit 13, and the communication The MCU in the interface 12 turns on the probes of each module and the corresponding terminal of the chip, sends instructions to the chip, detects the voltage and current of the VCC terminal when the chip is in a normal working state, and calculates the dynamic power consumption. The performance of the chip is better.

频率检测电路:当用户通过检测主机2选择检测芯片的工作频率时,选择电路24接收到该指令导通检测电路26中的频率检测电路266,频率检测电路266使用不同的频率经通信接口12向芯片发送指令,判断芯片是否能正常工作,确定芯片可正常工作的频率范围,芯片正常工作的频率范围越大,则性能越好,根据芯片可适应的工作频率范围划分为“优秀”、“良好”和“一般”,并在显示屏21上显示。Frequency detection circuit: when the user selects the operating frequency of the detection chip through the detection host 2, the selection circuit 24 receives the instruction and turns on the frequency detection circuit 266 in the detection circuit 26. The chip sends an instruction to judge whether the chip can work normally, and determine the frequency range that the chip can work normally. The larger the frequency range of the chip's normal work, the better the performance. ” and “General” are displayed on the display screen 21 .

电压检测电路:当用户通过检测主机2选择检测芯片的工作电压时,选择电路24接收到该指令导通检测电路26中的电压检测电路267,如图5所示,是电压检测电路267的电路原理图,图中仅列出了4级电阻,在实际应用过程中电阻可增减,通过控制开关S改变电路中接入的电阻R的值,电压检测电路267经通信接口12向芯片的VCC端提供不同的电压,并在不同电压下向芯片发送命令,判断出芯片可正常工作的最高电压和最低电压,芯片正常工作的电压范围越大,则性能越好,根据芯片可适应的工作电压范围划分为“优秀”、“良好”和“一般”,并在显示屏21上显示。Voltage detection circuit: when the user selects the working voltage of the detection chip through the detection host 2, the selection circuit 24 receives the instruction and turns on the voltage detection circuit 267 in the detection circuit 26. As shown in FIG. 5, it is the circuit of the voltage detection circuit 267. Schematic diagram, only 4-level resistors are listed in the figure. In the actual application process, the resistance can be increased or decreased. By controlling the switch S to change the value of the resistor R connected to the circuit, the voltage detection circuit 267 sends the VCC to the chip through the communication interface 12 The terminal provides different voltages, and sends commands to the chip under different voltages to determine the highest and lowest voltages that the chip can work normally. The larger the voltage range of the chip's normal operation, the better the performance. The ranges are divided into "Excellent", "Good" and "Fair" and displayed on the display screen 21 .

保护能力检测电路:保护能力检测电路268可以包括多种电路,例如过流保护、过压保护、温度保护、静电保护等,本实施例以过压保护能力检测为例。Protection capability detection circuit: The protection capability detection circuit 268 may include various circuits, such as overcurrent protection, overvoltage protection, temperature protection, electrostatic protection, etc. This embodiment takes overvoltage protection capability detection as an example.

保护能力检测电路268首先经电压检测电路267获取芯片的最高工作电压,经通信接口12向芯片的VCC端子施加大于所述最高工作电压的电压,然后恢复至正常工作电压,此时向芯片发送指令,判断芯片是否可以正常工作,若可以正常工作,则说明芯片的过压保护能力良好。The protection capability detection circuit 268 first obtains the maximum working voltage of the chip through the voltage detection circuit 267, applies a voltage greater than the maximum working voltage to the VCC terminal of the chip through the communication interface 12, and then returns to the normal working voltage, and sends an instruction to the chip at this time. , to judge whether the chip can work normally, if it can work normally, it means that the overvoltage protection capability of the chip is good.

本实施例芯片检测装置采用若干个功能检测电路与选择电路相配合的方式,选择电路依据检测需求选择相应的功能检测电路,从而对芯片的不同功能实现检测。需要说明的是,主机也可以同时执行多个功能检测电路的检测功能。因此,本实施例能够对芯片的性能进行全面的检测和评价,有利于全面提高产品的质量。The chip detection device of this embodiment adopts a manner in which several function detection circuits cooperate with the selection circuit, and the selection circuit selects the corresponding function detection circuit according to the detection requirements, so as to realize detection of different functions of the chip. It should be noted that the host can also execute the detection functions of multiple function detection circuits at the same time. Therefore, this embodiment can comprehensively test and evaluate the performance of the chip, which is beneficial to improve the quality of the product in an all-round way.

以上所述,仅为本实用新型的具体实施方式,但本实用新型的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本实用新型揭露的技术范围内,可轻易想到的变化或替换,都应涵盖在本实用新型的保护范围之内。因此,本实用新型的保护范围应该以权利要求的保护范围为准。The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art who is familiar with the technical field of the present invention can easily think of changes within the technical scope disclosed by the present invention. Or replacement should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims (10)

1. A chip detection apparatus, comprising: at least one detection head and a detection host,
the detection head comprises a plurality of probes and a communication interface, wherein the probes are used for contacting with terminals of a chip to be detected so as to enable the probes to be in communication connection with the chip to be detected; the communication interface is connected with the probe and is used for realizing the communication between the detection head and the detection host;
the detection host comprises a plurality of function detection circuits and a selection circuit, wherein the selection circuit is used for selecting the required function detection circuit to communicate with the detection head, so that the detection host can perform corresponding performance detection on the chip through the detection head.
2. The chip detection apparatus according to claim 1, wherein: the detection host is also provided with an information storage unit, and the information storage unit is used for prestoring information of various different chips.
3. The chip detection apparatus according to claim 1, wherein: the detection head also comprises a configuration storage unit, the configuration storage unit is in communication connection with the communication interface, and the configuration storage unit is used for storing a plurality of communication protocols and/or a plurality of electrical definition arrangement modes of terminals.
4. The chip detection apparatus according to claim 3, wherein: the configuration storage unit is also used for temporarily storing the detection result of the detected chip.
5. The chip detection device according to any one of claims 1 to 3, wherein: the plurality of function detection circuits include any two or more combinations of a terminal electrical definition detection circuit, a communication protocol detection circuit, a read-write function detection circuit, a data acquisition circuit, a power consumption detection circuit, a frequency detection circuit, a chip maximum/low working voltage detection circuit, or a protection capability detection circuit.
6. The chip detection apparatus according to claim 5, wherein: the detection host is used for comprehensively scoring the performance of the detected chip according to the performance detection results of the plurality of function detection circuits.
7. The chip detection apparatus according to claim 5, wherein: the detection host further comprises an input interface and an output interface;
the input interface is used for receiving the performance of a chip which needs to be detected by a user, so that the selection circuit selects the corresponding function detection circuit and executes detection operation through the detection head;
the output interface is used for receiving the detection result of the detection head and displaying the detection result on the detection host.
8. The chip detection apparatus according to claim 7, wherein: the input interface is connected with a key unit on the detection host, and a user selects a detection requirement through the key unit; the output interface is connected with a display screen on the detection host, and the display screen is used for displaying the detection result;
or the input interface and the output interface are connected with a touch display screen on the detection host, and the touch display screen can be used for a user to select a detection requirement and can display a detection result.
9. The chip detection apparatus according to claim 1, wherein: and the detection head and the detection host machine are in communication connection in a wired communication or wireless communication mode.
10. The chip detection apparatus according to claim 1, wherein: the detected chip is a printing consumable chip and is used for storing relevant information of consumables.
CN201922353851.5U 2019-12-23 2019-12-23 Chip detection device Expired - Fee Related CN211426703U (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113419160A (en) * 2021-06-18 2021-09-21 珠海美佳音科技有限公司 Chip detection interface circuit
CN113625155A (en) * 2021-08-11 2021-11-09 湖南省计量检测研究院 Multifunctional communication chip detection system based on big data
CN114994513A (en) * 2022-07-01 2022-09-02 浙江地芯引力科技有限公司 Chip detection method, device, equipment and storage medium
CN118170703A (en) * 2024-05-14 2024-06-11 北京宏思电子技术有限责任公司 Communication method and device for one master and multiple slaves

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113419160A (en) * 2021-06-18 2021-09-21 珠海美佳音科技有限公司 Chip detection interface circuit
CN113419160B (en) * 2021-06-18 2023-09-29 珠海美佳音科技有限公司 Chip detection interface circuit
CN113625155A (en) * 2021-08-11 2021-11-09 湖南省计量检测研究院 Multifunctional communication chip detection system based on big data
CN113625155B (en) * 2021-08-11 2024-06-11 湖南省计量检测研究院 Multifunctional communication chip detection system based on big data
CN114994513A (en) * 2022-07-01 2022-09-02 浙江地芯引力科技有限公司 Chip detection method, device, equipment and storage medium
CN118170703A (en) * 2024-05-14 2024-06-11 北京宏思电子技术有限责任公司 Communication method and device for one master and multiple slaves

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