CN219627988U - Heat dissipation mechanism for circuit board and ultra-high-definition set top box with same - Google Patents

Abstract

The utility model discloses a heat dissipation mechanism for a circuit board and an ultra-high-definition set top box with the same. The heat dissipation mechanism includes: a first transverse portion having a plate shape and covering a first CPU on a first circuit board; a second transverse portion having a plate shape and covering a second CPU on a second circuit board; and a vertical portion connecting the first lateral portion and the second lateral portion, and at least one of the first lateral portion and the second lateral portion includes an inner recess recessed toward the corresponding CPU, wherein the inner recess is capable of abutting against the corresponding CPU when the heat dissipation mechanism is fixed. The radiating mechanism can improve the assembly efficiency and has better radiating effect.

Description

Heat dissipation mechanism for circuit board and ultra-high-definition set-top box with the mechanism

technical field

The utility model relates to the technical field of electrical mechanisms, in particular to a heat dissipation mechanism for circuit boards and an ultra-high-definition set-top box with the mechanism.

Background technique

With the technical development of electronic products, especially the functional requirements of set-top boxes, the current set-top box products are compatible with multi-function, 5G transmission + 8K ultra-high-definition video technology + ONU (Optical Network Unit), so there is a new demand for the circuit board of our products , in a limited space, it is necessary to use two circuit boards to realize the function. Due to the powerful functions of the product, the power consumption increases, which puts forward higher requirements for the heat dissipation of our products.

Therefore, it is urgent to design a new heat dissipation mechanism to meet the demand.

Utility model content

The technical problem to be solved by the utility model is how to increase the heat transfer rate of the heat dissipation mechanism so as to improve the heat dissipation performance of the circuit board.

The utility model solves the problems of the technologies described above by adopting the following technical solutions:

The utility model provides a heat dissipation mechanism for a circuit board, and the heat dissipation mechanism comprises:

a first transverse portion, the first transverse portion is plate-shaped and covers the first CPU on the first circuit board;

the second transverse portion, the second transverse portion is plate-shaped and covers the second CPU on the second circuit board; and

a vertical portion connecting the first lateral portion and the second lateral portion, and

At least one of the first lateral portion and the second lateral portion includes an inner concave portion that is recessed toward the corresponding CPU, wherein, when the heat dissipation mechanism is fixed, the inner concave portion can abut against the corresponding CPU superior.

According to some embodiments of the present utility model, the inner recess includes a first inner recess located on the first transverse portion and a second inner recess located on the second transverse portion, the first inner recess and the second inner recess The two inner recesses are recessed towards each other.

According to some embodiments of the present utility model, the first inner concave portion and the second inner concave portion are respectively located on opposite corners of the heat dissipation mechanism.

According to some embodiments of the present utility model, the vertical part is located on the same side of the first transverse part and the second transverse part, and the first transverse part and the second transverse part are away from the A threaded hole or a through hole for locking the heat dissipation mechanism is formed on one side of the vertical portion.

According to some embodiments of the present invention, at least one of the first transverse portion and the second transverse portion is formed in a wave shape on an inner surface facing the corresponding CPU.

According to some embodiments of the present invention, at least one of the first transverse portion and the second transverse portion is formed in a wave shape on an outer surface facing away from the corresponding CPU.

According to some embodiments of the present invention, the inner surface of the vertical portion facing the CPU is formed in a wave shape.

According to some embodiments of the present utility model, the concave depth of the concave part is not less than 18mm.

According to some embodiments of the present utility model, the heat dissipation mechanism is made of aluminum or copper.

In addition, the utility model also relates to an ultra-high-definition set-top box, which includes at least two circuit boards parallel to each other, and the ultra-high-definition set-top box includes a heat dissipation mechanism for the circuit board as described in any one of the above , the heat dissipation mechanism is fixed on the at least two circuit boards.

On the basis of conforming to common knowledge in the field, the above-mentioned preferred conditions can be combined arbitrarily to obtain the preferred examples of the present utility model.

The positive progressive effect of the present utility model is:

The heat dissipation mechanism for circuit boards according to the utility model is a product for two or more fast circuit boards, which can solve the simultaneous heat dissipation problem of multiple circuit boards. The heat dissipation mechanism proposed by the application is simple, convenient for assembly, reduces production cost, and improves heat dissipation performance.

Description of drawings

FIG. 1 is a schematic diagram of a heat dissipation mechanism for a circuit board according to a preferred embodiment of the present invention.

Detailed ways

The preferred embodiments of the present utility model will be further described in detail below in conjunction with the accompanying drawings. The following descriptions are exemplary and not limiting to the present utility model. Any other similar situations will also fall within the scope of protection of the present utility model. middle.

In the following detailed description, directional terms, such as "left", "right", "upper", "lower", "front", "rear", etc., are used with reference to directions described in the drawings. Components in various embodiments of the present invention may be positioned in a variety of different orientations, and directional terms are used for purposes of illustration and not limitation.

Referring to the heat dissipation mechanism 3 for a circuit board according to a preferred embodiment of the present invention shown in FIG. 1 , it includes a first transverse portion 31 , a second transverse portion 32 , and a vertical portion 33 . The heat dissipation mechanism 3 is suitable for the ultra-high-definition set-top box 100 with more than two layers of circuit boards as shown in FIG. 1 . In the example in FIG. 1, the UHD set-top box 100 has two circuit boards. The two circuit boards are arranged in parallel from top to bottom. For ease of description, the upper circuit board is marked as the first circuit board 1 , and the lower circuit board is marked as the second circuit board 2 . The two ends of each circuit board 1, 2 are arranged on the rack riser 4 arranged vertically.

The first transverse portion 31 of the heat dissipation mechanism 3 is plate-shaped and covers the first CPU on the first circuit board 1 . Generally speaking, the area of the first transverse portion 31 is set to cover more than half of the area of the first circuit board 1 .

The second transverse portion 32 of the heat dissipation mechanism 3 is plate-shaped and covers the second CPU on the second circuit board 2 . The second transverse portion 32 is located below the first transverse portion 31 , and the two are connected to each other through a vertical portion 33 . In the example of FIG. 1 , the shape of the second transverse portion 32 is generally the same as that of the first transverse portion 31 .

At least one of the first lateral portion 31 and the second lateral portion 32 includes an inner recess 34 recessed toward the corresponding CPU. For example, if the corresponding CPU of the first transverse portion 32 is located below it, the inner concave portion 34 of the first transverse portion 32 is depressed downward. After the cooling mechanism 3 is fixed, the inner concave portion 34 can abut against the corresponding CPU, so as to dissipate the heat generated by the CPU as the main heat source in time.

Since the vertical portion 33 connects the first horizontal portion 31 and the second horizontal portion 32, the vertical portion 33 can thus function as a side portion of the first horizontal portion 31 and the second horizontal portion 32, so that The first transverse portion 31 and the second transverse portion 32 do not need additional locking and support at this position, which can save the locking operation of the first transverse portion 31 and the second transverse portion 32 at this position, thereby improving installation efficiency. At the same time, compared with the two separate heat dissipation plates in the prior art, the vertical portion 33 in the heat dissipation mechanism 3 can provide an additional heat dissipation area, so the heat dissipation speed of the heat dissipation mechanism 3 can be improved.

In addition, since the inner concave portion 34 that can form an abutting relationship with the CPU is provided inside the heat dissipation mechanism 3 , the CPU (circuit board) can provide stable support for the heat dissipation mechanism 3 inside the heat dissipation mechanism 3 . After the heat dissipation mechanism 3 is locked on the circuit board by a locking member such as a bolt, referring to FIG. 1 , taking the first transverse portion 31 of the heat dissipation mechanism 3 as an example, the bolt exerts a downward locking force on the first transverse portion 31 , while the relatively large surface area of the CPU exerts an upward and stable support force on the first lateral portion 31 . The coordinated action of the downward locking force and the upward stable support force ensures the stable fixing of the heat dissipation mechanism 3 .

Preferably, the inner recess 34 includes a first inner recess 34 located on the first transverse portion 31 and a second inner recess located on the second transverse portion 32, the first inner recess 34 and the second inner recess are recessed toward each other (the first inner recess 34 The inner concave portion 34 is concave toward, and the second inner concave portion is concave upward). More preferably, the first inner concave portion 34 and the second inner concave portion are located on opposite diagonal sides of the heat dissipation mechanism 3 . Specifically, in the example of FIG. 1 , the first inner concave portion 34 is located on the right side of the first transverse portion 31 of the heat dissipation mechanism 3 ; the second inner concave portion is located on the left side of the second transverse portion 32 of the heat dissipation mechanism 3 . In this way, the first inner recess 34 and the second inner recess itself can lock the heat dissipation mechanism 3 on the first circuit board 1 and the second circuit board 2 to a certain extent.

As shown in Figure 1, the vertical portion 33 is located on the same side of the first transverse portion 31 and the second transverse portion 32, and the first transverse portion 31 and the second transverse portion 32 are formed on the side away from the vertical portion 33. The threaded hole or the through hole 35 is used to lock the cooling mechanism 3 . A plurality of threaded holes or through holes 35 may be arranged in a row. For the heat dissipation mechanism 3 shown in FIG. 1 , the first inner concave portion 34 and the second inner concave portion are located behind opposite corners of the heat dissipation mechanism 3 . It is even only necessary to fasten one screw on each of the first transverse portion 31 and the second transverse portion 32 .

At least one of the first transverse portion 31 and the second transverse portion 32 is formed in a wave shape on an inner surface facing the corresponding CPU. The corrugated surface facing the heat source helps to increase the heat absorption area.

Based on a similar mechanism, at least one of the first transverse portion 31 and the second transverse portion 32 is formed in a wave shape on the outer surface facing away from the corresponding CPU. The wavy surface towards the heat sink helps to increase the heat dissipation area.

Similarly, the inner surface of the vertical portion 33 facing the CPU may optionally be waved.

As a preferred embodiment, the concave depth of the first transverse portion 31 or the inner concave portion 34 of the second transverse portion 32 is set to be not less than 18 mm, so as to provide the space for avoiding air convection inside the ultra-high-definition set-top box 100 .

For the heat dissipation mechanism 3 of the present application, it is preferably made of aluminum or copper.

In addition, the utility model also relates to an ultra-high-definition set-top box 100, which includes at least two circuit boards parallel to each other, and the ultra-high-definition set-top box 100 includes the heat dissipation mechanism 3 for the circuit board as described above, and the heat dissipation The mechanism 3 is fixed on at least two circuit boards.

Although the specific embodiments of the present invention have been described above, those skilled in the art should understand that these are only examples, and the protection scope of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principle and essence of the present invention, and these changes and modifications all fall within the protection scope of the present invention.

Explanation of reference signs

UHD STB: 100;

first circuit board: 1;

Second circuit board: 2;

Heat dissipation mechanism for circuit board: 3;

first transverse section: 31;

Second transverse section: 32;

vertical part: 33;

inner recess: 34;

Rack Risers: 4.

Claims (10)

1. a heat dissipation mechanism for a circuit board, the heat dissipation mechanism comprising:

a first transverse portion which is plate-shaped and covers a first CPU on the first circuit board;

a second transverse portion having a plate shape and covering a second CPU on the second circuit board; and

a vertical portion connecting the first and second lateral portions, an

At least one of the first lateral portion and the second lateral portion includes an inner recess recessed toward the corresponding CPU, wherein the inner recess is capable of abutting against the corresponding CPU when the heat dissipation mechanism is fixed.

2. The heat dissipation mechanism for a circuit board of claim 1, wherein the recess comprises a first recess located on the first lateral portion and a second recess located on the second lateral portion, the first and second recesses being recessed toward each other.

3. The heat dissipation mechanism for a circuit board as recited in claim 2, wherein the first and second dimples are located at opposite corners of the heat dissipation mechanism, respectively.

4. The heat dissipating mechanism for a circuit board according to claim 1 or 2, wherein the vertical portion is located on the same side as the first and second lateral portions, and the first and second lateral portions are formed with screw holes or through holes for locking the heat dissipating mechanism on a side facing away from the vertical portion.

5. The heat dissipating mechanism for a circuit board of claim 1, wherein at least one of the first lateral portion and the second lateral portion is formed in a wavy shape at an inner surface toward the corresponding CPU.

6. The heat dissipating mechanism for a circuit board according to claim 1 or 4, wherein at least one of the first lateral portion and the second lateral portion is formed in a wavy shape on an outer surface facing away from the corresponding CPU.

7. The heat dissipating mechanism for a circuit board of claim 6, wherein said vertical portion is formed in a wavy shape at an inner surface facing the CPU.

8. The heat dissipating mechanism for a circuit board according to claim 1 or 2, wherein the concave depth of the concave portion is not less than 18mm.

9. The heat dissipation mechanism for a circuit board of claim 1, wherein the heat dissipation mechanism is an aluminum or copper part.

10. An ultra-high-definition set-top box comprising at least two circuit boards parallel to each other, characterized in that it comprises a heat dissipation mechanism for circuit boards according to any one of claims 1-9, which is fixed on the at least two circuit boards.