CN219536704U - Heat abstractor for be used for heating components and parts - Google Patents
Heat abstractor for be used for heating components and parts Download PDFInfo
- Publication number
- CN219536704U CN219536704U CN202320406354.0U CN202320406354U CN219536704U CN 219536704 U CN219536704 U CN 219536704U CN 202320406354 U CN202320406354 U CN 202320406354U CN 219536704 U CN219536704 U CN 219536704U
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- Prior art keywords
- heat dissipation
- heat
- circuit board
- air channel
- dissipation air
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 36
- 230000017525 heat dissipation Effects 0.000 claims abstract description 109
- 239000002184 metal Substances 0.000 claims description 3
- 238000013021 overheating Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 7
- 239000010410 layer Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation device for a heating element, which comprises a heat dissipation fan, a first heat dissipation air channel, a second heat dissipation air channel and a third heat dissipation air channel, wherein the first heat dissipation air channel, the second heat dissipation air channel and the third heat dissipation air channel are respectively communicated with the heat dissipation fan, and the first heat dissipation air channel is formed between the heating element and a circuit board; the second heat dissipation air duct is formed between the circuit board and the support plate; and the third heat dissipation air duct is used for being formed at the bottom of the supporting plate and dissipating heat of pins of the heating element. The multi-air-duct layered arrangement can ensure that all parts of the heating element fully dissipate heat, avoid local overheating and is beneficial to improving the heat dissipation efficiency.
Description
Technical Field
The utility model relates to the technical field of power electronic thermal management, in particular to a heat dissipation device for heating components.
Background
In industries such as new energy, photovoltaic inverter, converter, etc., limited by the prior art, most heating components mostly adopt no-air-duct heat dissipation, or single-layer air-duct heat dissipation, and phenomena such as local overhigh temperature, thermal runaway, unobvious heat dissipation effect, etc. can occur in the heat dissipation modes, even more energy is lost, and the heat dissipation efficiency is relatively poor.
Disclosure of Invention
Therefore, the utility model aims to provide a heat dissipation device for heating components, wherein three heat dissipation air channels are arranged in a layered manner, so that the heat dissipation of each part is ensured to be fully realized, the local overheating is avoided, and the heat dissipation efficiency is effectively improved.
The heat dissipating device for the heating element comprises a heat dissipating fan, a first heat dissipating air channel, a second heat dissipating air channel and a third heat dissipating air channel which are respectively communicated with the heat dissipating fan,
the first heat dissipation air duct is formed between the heating element and the circuit board;
the second heat dissipation air duct is formed between the circuit board and the support plate;
and the third heat dissipation air duct is used for being formed at the bottom of the supporting plate and dissipating heat of pins of the heating element.
Preferably, the first heat dissipation air channel, the second heat dissipation air channel and the third heat dissipation air channel are arranged layer by layer from top to bottom.
Preferably, the air inlets of the first heat dissipation air channel, the second heat dissipation air channel and the third heat dissipation air channel are opposite to the heat dissipation fan.
Preferably, a gap formed between the heating element and the circuit board forms a first heat dissipation air duct.
Preferably, the support plate is fixedly provided with a plurality of support columns, and all the support columns are used for supporting the circuit board so that a cavity between the circuit board and the support plate forms a second heat dissipation air channel.
Preferably, the support column is integrally fixed on the support plate, and the circuit board is fixed on the support column by means of a fastening screw.
Preferably, the support plate is in particular a sheet metal part.
Preferably, the support plate is provided with a plurality of flanges for guiding cold air to flow through the pins along the third heat dissipation air duct.
Preferably, the flange comprises a first flange and a second flange which are respectively arranged on the same side of the circuit board, and the first flange and the second flange are both bent at an angle in a direction away from the circuit board.
Preferably, the second side of the circuit board is provided with at least two second turned-ups, and all the second turned-ups are uniformly distributed along the line.
Compared with the background art, the heat dissipation device of the heating element comprises a heat dissipation fan, a first heat dissipation air channel, a second heat dissipation air channel and a third heat dissipation air channel. The first radiating air channel, the second radiating air channel and the third radiating air channel are communicated with the radiating fan.
The first heat dissipation air duct is formed between the heating element and the circuit board, the second heat dissipation air duct is formed between the circuit board and the supporting plate, and the third heat dissipation air duct is formed at the bottom of the supporting plate.
When the cooling fan is started, under the guidance of the cooling fan, cold air flows to the first cooling air channel, the second cooling air channel and the third cooling air channel respectively, heat between the heating element and the circuit board can be taken away, heat released by the pins of the heating element positioned at the bottom of the supporting plate can be taken away between the circuit board and the supporting plate, and the multi-air-channel layered arrangement can ensure that all parts of the heating element are fully cooled, avoid local overheating and be beneficial to improving the cooling efficiency.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present utility model, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is an axial side view of a heat dissipating device for a heat generating component according to an embodiment of the present utility model;
FIG. 2 is another isometric view of FIG. 1;
FIG. 3 is an assembly view of the heat generating component, circuit board and support plate of FIG. 1;
FIG. 4 is an assembled view of the heat generating component and circuit board of FIG. 1;
fig. 5 is a structural view of the support plate of fig. 1;
fig. 6 is another view of fig. 5.
The reference numerals are as follows:
the heat dissipation fan comprises a heat dissipation fan 1, a first heat dissipation air duct 2, a second heat dissipation air duct 3, a third heat dissipation air duct 4, a heating element 5, a circuit board 6, a support plate 7 and a fastening screw 8;
a pin 51;
support post 71, first flange 72, and second flange 73.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In order that those skilled in the art will better understand the present utility model, the following description will be given in detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1 to 6, fig. 1 is an axial side view of a heat dissipating device for a heat generating component according to an embodiment of the present utility model; FIG. 2 is another isometric view of FIG. 1; FIG. 3 is an assembly view of the heat generating component, circuit board and support plate of FIG. 1; FIG. 4 is an assembled view of the heat generating component and circuit board of FIG. 1; fig. 5 is a structural view of the support plate of fig. 1; fig. 6 is another view of fig. 5.
The embodiment of the utility model discloses a heat dissipation device for heating components, which comprises a heat dissipation fan 1, a first heat dissipation air duct 2, a second heat dissipation air duct 3 and a third heat dissipation air duct 4.
The heat dissipation fan 1 is fixedly arranged and can be specifically arranged on the shell. The heat dissipation fan 1 is used for accelerating convection exchange between external cold air and hot air of the heating element 5 accessory, and improving heat dissipation efficiency. The structure and the working principle of the heat dissipation fan 1 can be specifically referred to the prior art.
The first heat dissipation air channel 2, the second heat dissipation air channel 3 and the third heat dissipation air channel 4 are all communicated with the heat dissipation fan 1, so that the heat dissipation fan 1 can blow external cold air into the first heat dissipation air channel 2, the second heat dissipation air channel 3 and the third heat dissipation air channel 4 at the same time.
The first heat dissipation air duct 2 is formed between the heating component 5 and the circuit board 6, so that cold air flows into the space between the heating component 5 and the circuit board 6, and further hot air between the heating component 5 and the circuit board 6 is taken away. The second heat dissipation air duct 3 is formed between the circuit board 6 and the support plate 7, so that cold air flows into the space between the circuit board 6 and the support plate 7, and hot air between the circuit board 6 and the support plate 7 is taken away. The third heat dissipation air duct 4 is formed at the bottom of the supporting plate 7 and is used for driving heat at the bottom of the supporting plate 7 to dissipate heat of the pins 51 of the heating element 5.
When the heat dissipation fan 1 is started, under the guidance of the heat dissipation fan 1, cold air flows to the first heat dissipation air channel 2, the second heat dissipation air channel 3 and the third heat dissipation air channel 4 respectively, heat between the heating element 5 and the circuit board 6 can be taken away, heat released by the pins 51 of the heating element 5 positioned at the bottom of the support board 7 can be taken away between the circuit board 6 and the support board 7, and the multi-air channel layered arrangement can ensure that all parts of the heating element 5 are fully dissipated, so that local overheating is avoided, and the heat dissipation efficiency is improved.
It should be noted that, the heat dissipation fan 1 may be manually controlled by a switch, or may be automatically controlled by a temperature controller.
The first heat dissipation air channel 2, the second heat dissipation air channel 3 and the third heat dissipation air channel 4 are arranged layer by layer from top to bottom, the multilayer air channel design is realized, the layered cooling effect is achieved, and the heat dissipation efficiency is higher.
The air inlets of the first heat dissipation air channel 2, the second heat dissipation air channel 3 and the third heat dissipation air channel 4 are opposite to the heat dissipation fan 1, so that the heat dissipation fan 1 can blow cold air into the three heat dissipation air channels simultaneously. The heat dissipation fan 1 can be arranged in one or a plurality of ways, and can be specifically and adaptively adjusted according to the intervals among the first heat dissipation air channel 2, the second heat dissipation air channel 3 and the third heat dissipation air channel 4.
The heating components 5 are not closely attached to the circuit board 6, and gaps formed between the heating components 5 and the circuit board 6 form the first heat dissipation air duct 2, so that cold air flows through the surfaces of the heating components 5 along the first heat dissipation air duct 2, heat released by the heating components 5 is taken away, and heat dissipation efficiency is high.
The support plate 7 is fixedly provided with a plurality of support columns 71, the support columns 71 can be integrally fixedly arranged on the support plate 7, and the circuit board 6 is fixed on the support columns 71 by means of the fastening screws 8, so that the circuit board 6 is stably supported.
All support columns 71 are used for supporting the circuit board 6, so that a cavity formed between the circuit board 6 and the support plate 7 forms the second heat dissipation air duct 3, cold air flows through the circuit board 6 and the support plate 7 along the second heat dissipation air duct 3, and heat released by the circuit board 6 and the support plate 7 is taken away.
The supporting plate 7 is specifically a sheet metal part, and can reliably support the circuit board 6 and conduct heat, thereby being beneficial to improving the heat dissipation efficiency.
The supporting plate 7 is provided with a plurality of flanges for guiding cold air to flow through the pins 51 of the heating element 5 along the third heat dissipation air duct 4, and taking away heat released by the pins 51, so that the bottom of the supporting plate 7 is enabled to realize efficient heat dissipation.
The flange includes a first flange 72 and a second flange 73 that are respectively disposed at two sides of the circuit board 6, where the first flange 72 and the second flange 73 are parallel and bend at an angle in a direction away from the circuit board 6, and the bending angles of the first flange 72 and the second flange 73 can be specifically adjusted adaptively according to the length and the distribution mode of the pins 51, which is not limited herein. The second side of the circuit board 6 is provided with at least two second turned-ups 73, all second turned-ups 73 being evenly distributed along the line. The number and arrangement of the second flanges 73 may also be adjusted according to the distribution of the pins 51, which is not limited herein.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. The heat dissipation device for the heating element is characterized by comprising a heat dissipation fan (1), a first heat dissipation air channel (2), a second heat dissipation air channel (3) and a third heat dissipation air channel (4) which are respectively communicated with the heat dissipation fan (1),
the first heat dissipation air duct (2) is used for being formed between the heating element (5) and the circuit board (6);
the second heat dissipation air duct (3) is formed between the circuit board (6) and the supporting plate (7);
the third heat dissipation air duct (4) is formed at the bottom of the supporting plate (7) and is used for dissipating heat of pins (51) of the heating element (5).
2. The heat dissipating device for a heat generating component according to claim 1, wherein the first heat dissipating air channel (2), the second heat dissipating air channel (3) and the third heat dissipating air channel (4) are arranged layer by layer from top to bottom.
3. The heat dissipating device for a heat generating component according to claim 1, wherein air inlets of the first heat dissipating air duct (2), the second heat dissipating air duct (3) and the third heat dissipating air duct (4) are opposite to the heat dissipating fan (1).
4. A heat sink for a heat generating component according to any one of claims 1 to 3, characterized in that a gap formed between the heat generating component (5) and the circuit board (6) constitutes the first heat dissipation air duct (2).
5. A heat sink for a heat generating component according to any one of claims 1 to 3, characterized in that the support plate (7) is fixedly provided with a plurality of support columns (71), all of the support columns (71) being adapted to support the circuit board (6) such that a cavity between the circuit board (6) and the support plate (7) constitutes the second heat dissipation air duct (3).
6. The heat dissipating device for a heat generating component according to claim 5, wherein the support post (71) is integrally fixed to the support plate (7), and the circuit board (6) is fixed to the support post (71) by means of a fastening screw (8).
7. Heat sink for heat generating components according to claim 5, characterized in that the support plate (7) is in particular a sheet metal part.
8. A heat dissipating device for a heat generating component according to any one of claims 1 to 3, wherein the support plate (7) is provided with a number of turned-ups for guiding cold air to flow through the pins (51) along the third heat dissipating duct (4).
9. The heat dissipating device for a heat generating component according to claim 8, wherein the flange comprises a first flange (72) and a second flange (73) which are respectively provided on the same side of the circuit board (6), and the first flange (72) and the second flange (73) are both bent at an angle in a direction away from the circuit board (6).
10. The heat sink for heat generating components according to claim 9, characterized in that the second side of the circuit board (6) is provided with at least two of the second flanges (73), all of the second flanges (73) being evenly distributed along the line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320406354.0U CN219536704U (en) | 2023-03-07 | 2023-03-07 | Heat abstractor for be used for heating components and parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320406354.0U CN219536704U (en) | 2023-03-07 | 2023-03-07 | Heat abstractor for be used for heating components and parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219536704U true CN219536704U (en) | 2023-08-15 |
Family
ID=87645870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320406354.0U Active CN219536704U (en) | 2023-03-07 | 2023-03-07 | Heat abstractor for be used for heating components and parts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219536704U (en) |
-
2023
- 2023-03-07 CN CN202320406354.0U patent/CN219536704U/en active Active
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