CN219017613U - Centering adjusting structure and wafer lifting device - Google Patents
Centering adjusting structure and wafer lifting device Download PDFInfo
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- CN219017613U CN219017613U CN202223398389.9U CN202223398389U CN219017613U CN 219017613 U CN219017613 U CN 219017613U CN 202223398389 U CN202223398389 U CN 202223398389U CN 219017613 U CN219017613 U CN 219017613U
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- 230000005540 biological transmission Effects 0.000 claims abstract description 87
- 238000000034 method Methods 0.000 claims abstract description 18
- 230000000712 assembly Effects 0.000 claims description 4
- 238000000429 assembly Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 38
- 230000000694 effects Effects 0.000 description 3
- 210000001503 joint Anatomy 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000009916 joint effect Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a centering adjusting structure and a wafer lifting device, which comprise a first connecting piece sleeved outside a first transmission rod, a second connecting piece and a positioning piece, wherein the second connecting piece and the positioning piece are connected with a second transmission rod; the positioning piece comprises a first through hole arranged on the first connecting piece, a second through hole arranged on the second connecting piece and a locking piece, wherein the locking piece is arranged in the first through hole and the second through hole and is used for locking the position after the first transmission rod and the second transmission rod are centered; according to the utility model, no assembly error is generated in the assembly process of the transmission rod between the adjacent worm gears, so that the wafer can be ensured to be kept horizontal in the wafer conveying process.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing equipment, in particular to a centering adjusting structure and a wafer lifting device.
Background
Wafer level is required for wafer transfer between different processes during semiconductor processing. In the prior art, a combination of two worm and gear assemblies, a transmission rod and a driving motor is adopted to drive a screw rod to move up and down, so that the lifting of a wafer is realized. However, assembly errors are easily generated in the assembly process of the transmission rod between the adjacent worm gears, and even if the situation is found in the starting process, the assembly errors still exist in the process of stopping adjustment and reassembling, so that the wafer cannot be kept horizontal. In order to solve the above problems, the present utility model provides a centering adjustment structure and a wafer lifting device.
Disclosure of Invention
The utility model aims to provide a centering adjusting structure and a wafer lifting device, so as to ensure that assembly errors are not generated in the assembly process of transmission rods between adjacent worm gears, and further ensure that wafers are kept horizontal in the wafer conveying process.
In order to achieve the above purpose, the utility model provides a centering adjustment structure for adjusting the horizontal position of a wafer in a wafer conveying process, which comprises a first connecting piece sleeved outside a first transmission rod, a second connecting piece and a positioning piece, wherein the second connecting piece and the positioning piece are connected with a second transmission rod, the first connecting piece is abutted with the second connecting piece, and when the first connecting piece and the second connecting piece move mutually in a vertical plane, the central axis of the first transmission rod and the central axis of the second transmission rod are overlapped and centered;
the locating piece is including locating first through-hole on the first connecting piece, locating second through-hole on the second connecting piece, and locking piece, wherein, the locking piece is located in first through-hole with in the second through-hole is used for carrying out the position locking after first transfer line with the second transfer line is accomplished the centering.
Optionally, the first connecting piece includes the cover and establishes the stay tube outside the first transfer line, and connect the stay tube is close to the support ring on the one end of second connecting piece, wherein, form an inwards concave groove around the inner ring of support ring.
Optionally, a first threaded hole is formed in the support tube, a second threaded hole matched with the first threaded hole is formed in the first transmission rod, and a bolt is installed in the first threaded hole and the second threaded hole in a threaded mode.
Optionally, the second connecting piece includes with the disc that the second transfer line links to each other, and locates the disc is kept away from the protruding of second transfer line one side, wherein, protruding locating in the recess.
Optionally, the first through holes are arranged on the supporting ring, and the number of the first through holes is a plurality of the first through holes;
the number of the second through holes is provided with a plurality of second through holes, wherein the aperture of the first through holes is larger than that of the second through holes, and a plurality of second through holes are exposed in a single first through hole.
Optionally, the hole cavity of the first through hole is in an arc-shaped structure bent towards the first transmission rod.
Optionally, the locking piece includes a locking screw and a thread groove disposed in the second through hole, wherein the locking screw is screwed in the second through hole through the thread groove.
The wafer lifting device comprises two worm gear assemblies, a driving motor and the centering adjusting structure;
the two worm and gear components are respectively arranged on the first transmission rod and the second transmission rod, and the driving end of the driving motor is connected with one end, far away from the second transmission rod, of the first transmission rod; the centering adjusting structure is arranged between the two worm and gear components.
Optionally, the worm gear assembly includes with the supporting box that driving motor shell links to each other, cover locate the worm outside the first transfer line, and with worm wheel that worm engaged with, wherein, the worm wheel rotates and locates in the supporting box.
Optionally, the device further comprises a screw rod screwed in the middle of the worm wheel and a support disc fixed on one end of the screw rod far away from the worm wheel.
The beneficial effects of the utility model are as follows:
according to the wafer alignment device, the alignment adjusting structure is arranged between the first transmission rod and the second transmission rod, and fine adjustment of the first transmission rod and the second transmission rod can be achieved in a vertical plane through the alignment adjusting structure, so that the central axis of the first transmission rod and the central axis of the second transmission rod are ensured to be aligned in a superposition mode, and the wafer can be ensured to be always in a horizontal state in the wafer conveying process.
Drawings
FIG. 1 is a schematic diagram of the internal structure of a front cut of an embodiment of the present utility model;
FIG. 2 is a schematic view of section A-A of FIG. 1 in accordance with the present utility model;
FIG. 3 is a schematic diagram of a front view of an embodiment of the present utility model;
fig. 4 is an enlarged schematic view of the B structure of fig. 3 according to the present utility model.
Reference numerals
1. An adjustment structure; 11. a first connector; 111. a support tube; 112. a support ring; 1121. a groove; 12. a second connector; 121. a protrusion; 13. a first through hole; 14. a second through hole; 15. a first threaded hole; 16. a second threaded hole; 2. a first transmission rod; 3. a second transmission rod; 4. a worm gear assembly; 5. a screw rod; 6. and driving the motor.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model. Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this utility model belongs. As used herein, the word "comprising" and the like means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof without precluding other elements or items.
In view of the problems existing in the prior art, an embodiment of the present utility model provides a centering adjustment structure 1, which is used for adjusting a horizontal position of a wafer in a wafer conveying process, referring to fig. 1, the adjustment structure 1 includes a first connecting piece 11 sleeved outside a first transmission rod 2, a second connecting piece 12 connected with a second transmission rod 3, and a positioning piece (not numbered), the first connecting piece 11 is abutted against the second connecting piece 12, and when the first connecting piece and the second connecting piece move mutually in a vertical plane, the central axis of the first transmission rod 2 coincides with the central axis of the second transmission rod 3, so as to implement adjustment of the horizontal position of the wafer.
When in use, the first transmission rod 2 and the second transmission rod 3 can be adjusted through the relative adjusting movement between the first connecting piece 11 and the second connecting piece 12, and the central axis of the first transmission rod 2 and the central axis of the second transmission rod 3 can be aligned in a superposition manner, so that the wafer is ensured to be in a horizontal state in the wafer conveying process.
In one embodiment, the positioning member includes a first through hole 13 formed in the first connecting member 11, a second through hole 14 formed in the second connecting member 12, and a locking member (not shown), as shown in fig. 2, where the locking member is disposed in the first through hole 13 and the second through hole 14, and is used for fixing a position after the first transmission rod 2 and the second transmission rod 3 are centered.
When in use, the positioning piece is arranged, which can play a role in positioning, specifically, the positioning piece can determine whether the central axes of the first transmission rod 2 and the second transmission rod 3 coincide, and in the process of adjusting the second connecting piece 12 to center the second transmission rod 3 relative to the first transmission rod 2, the second through hole 14 is exposed into the first through hole 13, and when the locking piece can be installed in the first through hole 13 and the second through hole 14 in an unimpeded manner, the central axes of the first transmission rod 2 and the second transmission rod 3 coincide and center; the locking effect can be achieved, after the positions of the first transmission rod 2 and the second transmission rod 3 are adjusted and centered, the current positions of the first transmission rod 2 and the second transmission rod 3 are locked together through the locking piece, and the wafer can be kept horizontal in the wafer conveying process at the moment.
In one embodiment, the first connecting member 11 includes a support tube 111 sleeved outside the first transmission rod 2, and a support ring 112 connected to an end of the support tube 111 near the second connecting member 12, wherein an inward concave groove 1121 is formed around an inner ring of the support ring 112. In the example of fig. 1, the support tube 111 is provided for mounting with the first transmission rod 2; the support ring 112 is configured to be abutted with the second connecting member 12, and the support ring 112 may provide a larger support area, thereby ensuring convenience in processing the first through hole 13.
In one embodiment, the second connecting member 12 includes a disc (not numbered) connected to the second transmission rod 3, and a protrusion 121 disposed on a side of the disc away from the second transmission rod 3, wherein the protrusion 121 is disposed in the recess 1121. The provision of the disc provides a larger interface with the support ring 112, thereby providing greater convenience in interfacing the support ring 112 with the disc, and at the same time, providing a larger working surface for the second through-hole 14.
It is noted that the second transmission rod 3 may also be provided as a square disk.
Illustratively, the butt joint of the protrusion 121 and the groove 1121 may have a better butt joint effect, and in particular, the mounting positions of the first connector 11 and the second connector 12 may be quickly aligned by the butt joint of the protrusion 121 and the groove 1121, thereby achieving an effect of high-efficiency operation.
In one embodiment, the first through holes 13 are disposed on the support ring 112, and the number of the first through holes 13 is several. The number of the second through holes 14 is provided with a plurality, wherein the aperture of the first through hole 13 is larger than that of the second through hole 14, and a plurality of the second through holes 14 are exposed in a single first through hole 13.
Illustratively, the bore of the first through hole 13 has an arc-shaped structure curved toward the first transmission rod 2. The arrangement of the arc structure can enable the first through holes 13 to expose more second through holes 14.
When the device is used, the number of the first through holes 13 and the number of the second through holes 14 are all set to be a plurality, so that the first through holes 13 and the second through holes 14 are guaranteed to have more butt joint possibility, the adjusting range of the first connecting piece 11 and the second connecting piece 12 is wider, the adjusting range of the first transmission rod 2 and the second transmission rod 3 is ensured to be wider, and the adjusting range of the device can be suitable for all assembly errors generated in the assembly process.
In one embodiment, the locking member includes a locking screw (not shown) and a thread groove (not shown) provided in the second through hole 14, wherein the locking screw is screwed into the second through hole 14 through the thread groove. The locking screw and the screw thread of the thread groove cooperate to achieve a firmer locking effect, and after the locking screw is installed in the thread groove, the nut of the locking screw forms an interference with the supporting ring 112, so that the first connecting piece 11 and the second connecting piece 12 are fixed together, and the first transmission rod 2 and the second transmission rod 3 after position adjustment are fixed together.
In one embodiment, the support tube 111 is provided with a first threaded hole 15, the first transmission rod 2 is provided with a second threaded hole 16 matched with the first threaded hole 15, and bolts (not shown) are screwed into the first threaded hole 15 and the second threaded hole 16, as shown in fig. 3 and 4. The first threaded hole 15, the second threaded hole 16 and the bolt combination structure are used for realizing the fixed connection of the support tube 111 and the first transmission rod 2, specifically, after the first transmission rod 2 is inserted into the support tube 111 in the horizontal direction and stops moving, the bolt is inserted into the first threaded hole 15 and screwed, so that the bolt rotates and moves downwards and enters into the second threaded hole 16, and the support tube 111 and the first transmission rod 2 are fixed together.
The utility model also provides a wafer lifting device which comprises two worm and gear assemblies 4, a driving motor 6 and the centering adjusting structure 1; the two worm and gear components 4 are respectively arranged on the first transmission rod 2 and the second transmission rod 3, and the driving end of the driving motor 6 is connected with one end, far away from the second transmission rod 3, of the first transmission rod 2; wherein, centering adjustment structure 1 locate between two worm gear assembly 4. The wafer lifting device is used for supporting the wafer in the wafer conveying process, and the wafer lifting device comprises the centering adjusting structure 1, so that the wafer can be kept horizontal when the wafer is conveyed by the wafer lifting device.
In this embodiment, the worm gear assembly 4 includes a supporting box connected to the casing of the driving motor 6, a worm sleeved outside the first transmission rod 2, and a worm wheel meshed with the worm, where the worm wheel is rotationally disposed in the supporting box. The wafer lifting device further comprises a screw rod 5 which is arranged in the middle of the worm wheel in a threaded mode, and a supporting disc which is fixed on one end, away from the worm wheel, of the screw rod 5. The screw rod 5 is vertically arranged and can move up and down relative to the supporting box. The screw rod 5 is provided with a telescopic limit rod, and the telescopic limit rod is arranged in the supporting box, so that the screw rod 5 can not rotate and can only move in the vertical direction through the telescopic limit rod.
When the wafer lifting device is used, the worm and gear assembly 4 is used for providing driving force of the screw rod 5 in the vertical direction, so that the screw rod 5 can move up and down with the supporting disc, and the wafer can be lifted through the supporting disc. Specifically, the driving motor 6 works to drive the first transmission rod 2, the centering adjusting structure 1 and the second transmission rod 3 to rotate through the driving end, and the first transmission rod 2 and the second transmission rod 3 rotate to drive the worm to rotate, so that the worm drives the worm wheel to rotate, and the screw rod 5 moves up and down through the rotation of the worm wheel, so that the wafer is lifted.
It should be noted that the worm gear assembly 4 disposed on the second transmission rod 3, in which the supporting box is movably disposed with respect to the second transmission rod 3, so as to ensure that the second transmission rod 3 can move in a vertical direction by the worm gear with the screw rod 5 during rotation, specifically, in this example, the supporting box is connected with the housing of the driving motor.
According to the wafer alignment device, the alignment adjusting structures 1 are arranged on the first transmission rod 2 and the second transmission rod 3, and fine adjustment of the first transmission rod 2 and the second transmission rod 3 can be achieved through the alignment adjusting structures 1 in a vertical plane, so that the central axis of the first transmission rod 2 and the central axis of the second transmission rod 3 are ensured to be aligned in a superposition mode, and the wafer can be ensured to be always in a horizontal state in the wafer transfer process.
While embodiments of the present utility model have been described in detail hereinabove, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. It is to be understood that such modifications and variations are within the scope and spirit of the present utility model as set forth in the following claims. Moreover, the utility model described herein is capable of other embodiments and of being practiced or of being carried out in various ways.
Claims (10)
1. The centering adjusting structure is used for adjusting the horizontal position of a wafer in a wafer conveying process and is characterized by comprising a first connecting piece sleeved outside a first transmission rod, a second connecting piece connected with a second transmission rod and a positioning piece, wherein the first connecting piece is abutted with the second connecting piece, and when the first connecting piece and the second connecting piece move mutually in a vertical plane, the central axis of the first transmission rod and the central axis of the second transmission rod are overlapped and centered;
the locating piece is including locating first through-hole on the first connecting piece, locating second through-hole on the second connecting piece, and locking piece, wherein, the locking piece is located in first through-hole with in the second through-hole is used for carrying out the position locking after first transfer line with the second transfer line is accomplished the centering.
2. The centering adjustment mechanism of claim 1, wherein said first connector includes a support tube sleeved outside said first drive rod and a support ring attached to an end of said support tube adjacent said second connector, wherein an inwardly recessed groove is formed around an inner circumference of said support ring.
3. The centering adjustment mechanism of claim 2, wherein a first threaded hole is formed in the support tube, a second threaded hole matched with the first threaded hole is formed in the first transmission rod, and a bolt is installed in the first threaded hole and the second threaded hole in an internal thread mode.
4. The centering adjustment mechanism of claim 2, wherein said second connector comprises a disc coupled to said second drive rod and a protrusion disposed on a side of said disc remote from said second drive rod, wherein said protrusion is disposed within said recess.
5. The centering adjustment structure of claim 2, wherein said first through holes are provided on said support ring, and the number of said first through holes is several;
the number of the second through holes is provided with a plurality of second through holes, wherein the aperture of the first through holes is larger than that of the second through holes, and a plurality of second through holes are exposed in a single first through hole.
6. The centering adjustment structure of claim 1, wherein the bore of said first through bore has an arcuate configuration curving toward said first drive rod.
7. The centering adjustment structure of claim 1, wherein said locking member comprises a locking screw and a threaded slot provided in said second through hole, wherein said locking screw is threadably secured in said second through hole by said threaded slot.
8. A wafer lifting device, characterized by comprising two worm gear assemblies, a driving motor, and a centering adjustment structure according to any one of claims 1 to 7;
the two worm gear components are respectively arranged on the first transmission rod and the second transmission rod, and the driving end of the driving motor is connected with one end, far away from the second transmission rod, of the first transmission rod; the centering adjusting structure is arranged between the two worm and gear components.
9. The wafer lift apparatus of claim 8, wherein the worm gear assembly comprises a support box coupled to the drive motor housing, a worm gear disposed about the first drive rod, and a worm gear engaged with the worm gear, wherein the worm gear is rotatably disposed within the support box.
10. The wafer lift apparatus of claim 9, further comprising a screw threaded in a middle portion of the worm gear, and a support plate fixed to an end of the screw remote from the worm gear.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223398389.9U CN219017613U (en) | 2022-12-16 | 2022-12-16 | Centering adjusting structure and wafer lifting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223398389.9U CN219017613U (en) | 2022-12-16 | 2022-12-16 | Centering adjusting structure and wafer lifting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219017613U true CN219017613U (en) | 2023-05-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223398389.9U Active CN219017613U (en) | 2022-12-16 | 2022-12-16 | Centering adjusting structure and wafer lifting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219017613U (en) |
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2022
- 2022-12-16 CN CN202223398389.9U patent/CN219017613U/en active Active
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