CN2188253Y - semiconductor laser device - Google Patents

Abstract

A semiconductor laser device comprises a sleeve, a washer, a lens, a ring body and a base, wherein the washer and the lens are arranged in the sleeve, a wafer and a luminosity monitor and a guide pin connecting circuit board are arranged on the base, the wafer and the monitor are respectively connected with the guide pin through power lines, when the wafer emits laser, a monitoring signal returns to a control circuit from the monitor, the wafer obtains fixed light output power, and when the wafer emits excitation, the laser is focused through the lens, so that an aperture can be avoided.

Description

The utility model relates to a semiconductor laser device, in particular to a semi-body laser device with few components, convenient and reliable assembly, and low failure rate.

At present, there is a laser device on the market, which is mainly used as a light source on a laser pointer. For its structure, please refer to the exploded perspective view of the existing laser device in Figure 1A and the combined sectional view of the existing laser device in Figure 1B, as shown in the figure, the The laser-like device is mainly composed of a locking cap 1, a lens 2, a sleeve 3, and a base 4. The inside of the locking cap 1 is a "convex" hollow shape, which can be locked by the lens 2. The convex surface of the lens 2 faces forward, and the outside of the end is provided with a threaded part 11. The sleeve 3 is in the shape of a hollow tube, and the inside of the front end is provided with a screw part 31 which can be matched with the screw part 11. The base 4 is a Disc-shaped, a chip 41 and a photometric monitor 42 are provided on the surface facing the inside of the sleeve 3, and several guide pins 43 extending outward are provided on the base 4, and the guide pins 43 are used for connecting the control circuit board 44 , the aforementioned chip 41 and the photometric monitor 42 are respectively connected to a guide pin by a power cord (not shown in the figure), the base 4 is provided with a protective cap 45 on the chip 41 and the photometric monitor 42, and the top of the protective cap 45 There is a lens 46 in the center, and the protective cap 45 and the base 4 are processed and bonded to each other and then combined and placed inside the sleeve 3, and then the lens 2 and the base are adjusted through the threaded parts 11 and 31 between the aforementioned locking cap 1 and the sleeve 3. The distance between the seats 4 is fixed by dispensing glue on the outside, but the above-mentioned existing structure and combination method have the following disadvantages:

1. There are many components and the manufacturing cost is high.

2. Many components, difficult to assemble and replace.

3. The lens 2 must be tightly fitted in the locking cap 1, otherwise it is easy to loosen. However, the structure of the lens 2 is fragile and it is easy to break due to improper force.

4. The protective cap 45 and the lens 46 are small in size, making it extremely difficult to process.

5. The bonding process between the protective cap 45 and the base 4 is difficult, and the rate of defective products is high.

6. The user rotates the locking cap 1 from the outside, which will cause the structure to loosen.

7. The channel through the center of the locking cap 1 for the lens 2 to transmit light is a straight channel. When the laser passes through the lens 2 and refracts and touches the wall of the channel, an aperture is easily formed, which reduces the laser effect.

The purpose of the utility model is to provide a semiconductor laser device.

The purpose of this utility model is achieved by providing a semiconductor laser device, which is composed of a sleeve, a gasket, a lens, a ring, and a base. The sleeve is a hollow tube, and the front end of the sleeve is It is a cone-shaped structure that expands from the center of the tube at an appropriate angle. There is a lens engaging part inside the sleeve on the back of the cone-shaped structure. Put the gasket in order first, and then put the lens into the lens engaging part. , There is a ring body locking part inside the sleeve behind the lens locking part, for the ring body to be locked in tightly, the ring body presses the gasket and the lens into the lens locking part, and the end of the inner wall of the sleeve is provided with Threaded part, the periphery of the base is provided with a threaded part that can cooperate with it, and a wafer and a photometric monitor are arranged on the base inside the casing, and the wafer is placed on a platform that is arranged on the base and is perpendicular to it , and the photometric monitor is arranged on the base, and the chip and the photometric monitor are arranged relative to each other at 90 degrees. The base is provided with several outwardly extending guide pins connected to a control circuit board. The aforementioned chip and the photometric monitor are powered by a power supply. Each wire is connected to a lead pin.

The utility model has the advantage of providing a semiconductor laser device, the components of which are packaged in the same package, which is not only easy to assemble, but also easier to weld the chip and the circuit, and has good protection; the combination and fixing of the components is simple and reliable, and will not damage Components; components are simplified, not only easy to replace, but also can reduce manufacturing costs; easy to process components, not only save time and effort, but also improve yield; a cone-shaped structure is provided at the front end of the sleeve to avoid the formation of apertures, and the laser effect is good.

Below in conjunction with accompanying drawing, describe embodiment of the present utility model in detail, wherein:

FIG. 1A is an exploded perspective view of an existing laser device;

Fig. 1B is the combined sectional view of existing laser device;

Fig. 2 is the exploded perspective view of the embodiment of the utility model;

Figure 3A is a combined sectional view of an embodiment of the present utility model;

Fig. 3B is a schematic cross-sectional view of a concentrating light according to an embodiment of the present invention;

Fig. 4A is a combined upper sectional view of another embodiment of the utility model;

Fig. 4B is a combined side sectional view of another embodiment of the present invention;

Fig. 5A is another embodiment diagram of the control circuit board of the present invention;

Fig. 5B is a schematic diagram of light gathering of an embodiment using a circular circuit board in Fig. 4A;

Fig. 6A is a combined upper sectional view of another embodiment of the utility model;

Fig. 6B is a combined side sectional view of another embodiment of the present invention.

Please refer to FIG. 2 , which is an exploded perspective view of an embodiment of the present invention, and FIG. 3A is a combined cross-sectional view of an embodiment of the present invention.

As shown in the figure, the utility model is mainly composed of a sleeve 5, a gasket 6, a lens 7, a ring body 8, and a base 9. The sleeve 5 is a hollow tube, and its front end is a tube A cone-shaped structure 51 with a proper angle is expanded outward from the center, and a lens engaging part 52 is provided in the casing 5 on the back of the cone-shaped structure 51, and the gasket 6 is first inserted in sequence, and then the lens 7 is inserted into the lens card A joint part 52, behind the lens joint part 52, a ring body joint part 53 is provided inside the casing 5, for the ring body 8 to be clamped in tightly, and the ring body 8 can press the gasket 6 and the lens 7 tightly. In the lens engaging portion 52, the washer 6 has the effect of cushioning the pressure on the lens 7. A threaded portion 54 is provided at the end of the inner wall of the sleeve 5, and a threaded portion 91 that can cooperate with it is provided on the periphery of the base 9. The two threads The cooperation of the parts 54 and 91 can adjust the distance between the base 9 and the lens 7, and the base 9 is locked on the sleeve 5, and then the groove 98 formed at the ends of the two is sealed with glue, which not only plays a fixing role, but also Two-way cooperation with the aforementioned gasket 6 can achieve an airtight effect. In addition, a wafer 93 and a photometric monitor 94 are arranged inside the sleeve 5 on the base 9. As shown in the figure, the wafer 93 is placed on a 9 and on the platform 96 perpendicular to it, and the photometric monitor 94 is arranged on the base 9, the relative setting position of the wafer 93 and the photometric monitor 94 is 90 degrees, and the base 9 is provided with several outwardly extending The guide pin 92, the guide pin 92 is for connecting the control circuit board (not shown in the figure, can refer to the circuit board 44 shown in Figure 1A), and the aforementioned chip 93 and photometric monitor 94 are respectively connected with a guide pin 92 by the power line 95 connection, as shown in Figure 3B, when the chip 93 emits laser light, the signal is monitored by the photometric monitor 94 and fed back to the control circuit, so that the chip 93 obtains a fixed optical output power, and when the chip 93 emits laser light, the laser light Focusing is completed through the lens 7, and the formation of an aperture can be avoided because the front end of the bushing 5 is provided with a tapered structure 51.

Please refer to FIG. 4A , which is a combined top sectional view of another embodiment of the present invention, and FIG. 4B is a combined side sectional view of another embodiment of the present invention.

As shown in the figure, the photometric monitor 94 is arranged on the platform 96 , and the wafer 93 is arranged on the photometric monitor 94 , which is not limited to the above-mentioned relative position of 90 degrees.

Please refer to FIG. 5A , which is a diagram of another embodiment of the control circuit of the present invention, and FIG. 5B is a schematic diagram of an embodiment using a circular circuit board in FIG. 4A for concentrating light.

As shown in Figure 5A, several holes 551 are provided on the circular circuit board 55 for the guide pins 92 to penetrate and weld. Or riveting way is processed and fixed, because circular circuit board 55 and bushing 5 are combined as a whole, the length of guide pin 92 can be greatly shortened, and can avoid guide pin 92 bending, breaking, or circuit board damage, this circular circuit The arrangement of the plate 55 is not only applicable to the embodiment shown in FIG. 3A (whose combined cross-sectional view is shown in FIG. 5B ), but also applicable to the embodiment shown in FIG. 4A .

Please refer to FIG. 6A , which is a combined top sectional view of another embodiment of the present utility model, and FIG. 6B is a combined side sectional view of another embodiment of the present utility model.

As shown in the figure, the photometric monitor 94 is placed in the semiconductor 97, and the chip 93 is placed at the front end of the semiconductor 97, that is, the aforementioned platform 96 and the circuit board are replaced with the semiconductor 97. This design can save materials, reduce the volume, and at the same time The number of guide pins can be reduced, only the guide pin 99 for connecting the power supply needs to be left, and the chip 93 and the photometric monitor 94 can not only be arranged on the same plane (as shown in Figure 6A, 6B), but also can be set into a relative position of 90 degrees to each other as shown in Figure 3A.

Claims (7)

1, a kind of semicondcutor laser unit, by a sleeve pipe, one packing ring, one lens, one ring body, one pedestal constitutes, sleeve pipe is a hollow tube, it is characterized in that the sleeve pipe front end is one and expands outwardly the cone structure of a suitable angle by tube hub, inside pipe casing in this cone structure back is provided with a lens holding section, earlier packing ring is inserted in regular turn, lens are inserted in the lens holding section again, inside pipe casing behind the lens holding section is provided with a ring body holding section, in the confession ring body is placed in tightly, ring body is with packing ring, lens are pressed in the lens holding section, the internal surface of sleeve pipe end is provided with the threaded portion, the pedestal periphery then is provided with the threaded portion that can cooperate with it, be positioned at inside pipe casing on the pedestal and be provided with a wafer and a luminosity monitor, this wafer places one to be located on the platform also vertical with it on the pedestal, and the luminosity monitor is arranged on the pedestal, wafer and luminosity monitor are mutually 90 degree and are oppositely arranged the position, pedestal is provided with several outward extending lead foots and connects a control circuit board, and each is connected with a lead foot aforementioned wafer with power line with the luminosity monitor.

2, semicondcutor laser unit as claimed in claim 1 is characterized in that, the luminosity monitor is arranged on the platform, and wafer is arranged on the luminosity monitor.

3, semicondcutor laser unit as claimed in claim 1 is characterized in that, control circuit board is rounded, which is provided with several holes, and circular circuit board engages in tube ends.

4, semicondcutor laser unit as claimed in claim 3 is characterized in that, the luminosity monitor is arranged on the platform, and wafer is arranged on the luminosity prison device.

5, semicondcutor laser unit as claimed in claim 1 is characterized in that, platform and control circuit board also can be semiconductor.

6, semicondcutor laser unit as claimed in claim 5 is characterized in that, the luminosity monitor is arranged in the semiconductor, and wafer is arranged at semi-conductive front portion.

7, semicondcutor laser unit as claimed in claim 1 is characterized in that, pedestal is locked on sleeve pipe, and for formed groove injecting glue sealing between both ends.

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