CN218784026U - Heat abstractor and appearance that moults - Google Patents
Heat abstractor and appearance that moults Download PDFInfo
- Publication number
- CN218784026U CN218784026U CN202221537383.2U CN202221537383U CN218784026U CN 218784026 U CN218784026 U CN 218784026U CN 202221537383 U CN202221537383 U CN 202221537383U CN 218784026 U CN218784026 U CN 218784026U
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- cooling
- heat dissipation
- temperature
- cooling channel
- assembly
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- 238000001816 cooling Methods 0.000 claims abstract description 129
- 230000017525 heat dissipation Effects 0.000 claims abstract description 82
- 239000002826 coolant Substances 0.000 claims abstract description 37
- 239000004065 semiconductor Substances 0.000 claims description 28
- 238000005057 refrigeration Methods 0.000 claims description 13
- 239000013078 crystal Substances 0.000 claims description 12
- 229910052594 sapphire Inorganic materials 0.000 claims description 12
- 239000010980 sapphire Substances 0.000 claims description 12
- 230000000712 assembly Effects 0.000 claims description 9
- 238000000429 assembly Methods 0.000 claims description 9
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000007704 transition Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 230000002951 depilatory effect Effects 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 6
- 239000002537 cosmetic Substances 0.000 abstract description 2
- 230000003796 beauty Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 206010053615 Thermal burn Diseases 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000035617 depilation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model is suitable for a cosmetic field of medical treatment provides a heat abstractor and appearance that moults, heat abstractor includes: the cooling driving assembly is used for driving a cooling medium to flow; a light emitting assembly including a light source; the heat dissipation and cooling assembly is used for transmitting a cooling medium and carrying away heat in the heat dissipation device through the cooling medium and comprises a first cooling channel, and the light source is positioned in the first cooling channel; and the refrigerating device is positioned in the first cooling channel and at the inlet of the first cooling channel, and is used for cooling the cooling medium flowing into the first cooling channel. The utility model is provided with the refrigerating device at the inlet of the first cooling channel to cool the flowing cooling medium, which is beneficial to the cooling medium to take more heat away from the heat dissipation device; on the other hand, the influence of the ambient temperature on the temperature of the cooling medium can be reduced, and the influence on the heat dissipation efficiency of the heat dissipation device is avoided.
Description
Technical Field
The utility model belongs to the cosmetic field of medical treatment especially relates to a heat abstractor of medical treatment beauty instrument, in particular to appearance that moults.
Background
With the development of the medical beauty industry, various instruments are applied. Most instruments act on the skin in an instant energy release mode, and the needed energy is large, so that the instruments are easy to generate heat. At present, most instruments are radiated by a mode of taking heat away by sucking air through a fan. However, in this method, the temperature of the air taken in by the fan is the ambient temperature, and the heat dissipation efficiency is low. On the other hand, the efficiency of heat dissipation is also affected by the ambient temperature, and when the ambient temperature is high, the heat dissipation efficiency becomes low, and the temperature of the instrument itself rises, especially in the area where the instrument directly functions, such as the area where the light emitting assembly of the epilating apparatus is located, so that the user experience becomes poor.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat abstractor and appearance that moults aims at solving among the prior art radiating efficiency low and easily receive ambient temperature to influence, leads to the poor problem of user experience.
An aspect of the present invention provides a heat dissipation device, including:
the cooling driving component is used for driving a cooling medium to flow and provided with a cooling driving port;
a light emitting assembly including a light source;
the heat dissipation cooling assembly is used for transmitting cooling media and comprises a first cooling channel, an inlet of the first cooling channel is communicated with the cooling driving port, the light source is positioned in the first cooling channel, and the temperature of the light source is reduced through the cooling media flowing through the first cooling channel;
the refrigerating device is located in the first cooling channel and located at the inlet of the first cooling channel, and the cooling medium flowing into the first cooling channel is cooled, so that the cooling medium can take away more heat from the first cooling channel, and the heat dissipation efficiency of the heat dissipation device is improved.
Preferably, the refrigerating device comprises a first semiconductor refrigerating sheet, a refrigerating fin assembly and a first temperature-equalizing plate, wherein the cold end of the first semiconductor refrigerating sheet is attached to the refrigerating fin assembly, and the hot end of the first semiconductor refrigerating sheet is attached to the first temperature-equalizing plate. Utilize first semiconductor refrigeration piece to cool down refrigeration fin subassembly, and then reduce coolant's temperature, the heat transfer who produces first semiconductor refrigeration piece is walked through first temperature-uniforming plate simultaneously.
Preferably, the heat dissipation cooling assembly further comprises a second cooling channel communicated with the cooling driving port and mutually independent from the first cooling channel, and a temperature equalizing radiator partially arranged in the second cooling channel, and an inlet of the second cooling channel is arranged opposite to the cooling fin assembly of the refrigerating device, so that different parts can be simultaneously cooled, and the heat dissipation efficiency of the heat dissipation device is effectively improved.
Preferably, the temperature-equalizing radiator comprises a second temperature-equalizing plate and at least one radiating fin assembly arranged on the second temperature-equalizing plate, the first temperature-equalizing plate is connected with the second temperature-equalizing plate, and the inner cavity of the first temperature-equalizing plate is communicated with the inner cavity of the second temperature-equalizing plate.
Preferably, the heat dissipation cooling assembly further comprises a lower support and an upper support covered with the lower support, the refrigerating device is fixed on the upper support, the first cooling channel is formed between the upper support and the lower support, and the second temperature equalization plate is fixedly arranged on one side of the upper support, which is back to the lower support.
Preferably, the upper bracket comprises a base part, a first inner side plate convexly arranged on the base part and arranged opposite to the light emitting assembly, and a second inner side plate convexly arranged on the base part, wherein the second inner side plate and the first inner side plate are arranged on the same side of the base part and are in arc transition connection. The base part is provided with a first opening and a second opening in a penetrating mode, the first temperature-equalizing plate covers the first opening, and the second temperature-equalizing plate covers the second opening. The second inner side plate is provided with an inlet of the second cooling channel in a penetrating mode.
Preferably, the light emitting assembly further comprises a light filter and a light reflecting cup, the light filter and the light reflecting cup are enclosed to form an accommodating cavity, and the light source is suspended in the accommodating cavity.
The beneficial effects of the utility model reside in that: 1. the refrigerating device is arranged at the inlet of the first cooling channel, so that the temperature of the cooling medium flowing into the first cooling channel is effectively reduced, more heat can be taken away by the cooling medium in the first cooling channel, and the heat dissipation efficiency of the heat dissipation device is improved; meanwhile, as the cooling medium is sucked from the outside, the temperature of the cooling medium can change along with the temperature of the external environment, and the refrigerating device is beneficial to avoiding the influence of the temperature of the environment on the temperature of the flowing cooling medium as much as possible so as to influence the heat dissipation efficiency of the heat dissipation device; 2. through setting up the second cooling channel mutually independent with first cooling channel, can make heat abstractor dispel the heat to different parts simultaneously, effectively improve its whole radiating efficiency.
Another aspect of the present invention provides a depilating device, including the above-mentioned heat dissipation device.
Preferably, the depilating apparatus further comprises a housing, a first heat dissipation outlet communicated with the first cooling channel and the second cooling channel is arranged at a side end of the housing, a second heat dissipation outlet communicated with the second cooling channel is arranged at the bottom of the housing, two sets of heat dissipation fin assemblies are arranged, the two sets of heat dissipation fin assemblies are respectively arranged at two opposite sides of the second temperature equalizing plate, and the two sets of heat dissipation fin assemblies are respectively arranged opposite to the first heat dissipation outlet and the second heat dissipation outlet.
Preferably, the appearance that moults still includes the ice compress portion, and the ice compress portion includes sapphire crystal and second semiconductor refrigeration piece, and the cold junction and the sapphire crystal of second semiconductor refrigeration piece are laminated mutually, and the hot junction is laminated mutually with heat dissipation cooling module. Utilize the second semiconductor refrigeration piece to cool down the sapphire crystal, guarantee the ice sense of touch in the use, user experience is good.
Because the hair removal device comprises the heat dissipation device, the hair removal device also has the beneficial effects of the heat dissipation device, and the overall heat dissipation efficiency of the hair removal device is effectively improved compared with the prior art.
Drawings
Fig. 1 is an overall structure diagram of a depilating apparatus according to an embodiment of the present invention;
fig. 2 is an overall exploded view of the depilation instrument according to an embodiment of the present invention;
fig. 3 is a schematic view of a portion of an epilating apparatus according to an embodiment of the present invention;
fig. 4 is a schematic view of a heat dissipation cooling assembly according to an embodiment of the present invention;
fig. 5 is a schematic view of an upper bracket according to an embodiment of the present invention;
fig. 6 is a combination diagram of a light emitting module and an ice compress portion according to an embodiment of the present invention.
Reference numerals:
a housing 10; an air inlet 11; a first heat dissipation outlet 12; a second heat dissipation outlet 13; cooling the drive assembly 20; a cooling drive port 21; driving the fan 22; a light emitting assembly 30; a light source 31; a filter 32; a light-reflecting cup 33; a heat sink cooling assembly 40; the first cooling passage 41; the second cooling passage 42; a second temperature equalization plate 431; a heat radiation fin assembly 432; an upper bracket 44; a base portion 441; a first inner side plate 442; a second inner side plate 443; a first opening 444; the second opening 445; a third opening 446; a lower bracket 45; a refrigeration device 50; a first semiconductor cooling fin 51; a cooling fin assembly 52; a first vapor chamber 53; an ice compress portion 60; a sapphire crystal 61; a second semiconductor chilling plate 62.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.
It should be noted that the terms of orientation such as left, right, up, down, etc. in the present embodiment are only relative concepts or reference to the normal use state of the product, and should not be considered as limiting.
As shown in fig. 2-4, one aspect of the present invention provides a heat dissipation device, including:
the cooling driving assembly 20 is used for driving a cooling medium to flow, and the cooling driving assembly 20 is provided with a cooling driving port 21;
a light emitting assembly 30 including a light source 31;
the heat dissipation cooling assembly 40 is used for transmitting a cooling medium, the heat dissipation cooling assembly 40 comprises a first cooling channel 41, the inlet of the first cooling channel 41 is communicated with the cooling driving port 21, the light source 31 is positioned in the first cooling channel 41, and the temperature of the light source 31 is reduced through the cooling medium flowing through the first cooling channel 41;
the cooling device 50 is located in the first cooling channel 41 and at the inlet of the first cooling channel 41, and cools the cooling medium flowing into the first cooling channel 41, so that the cooling medium can take away more heat from the first cooling channel 41, and the heat dissipation efficiency of the heat dissipation device is improved.
In some embodiments, the cooling drive assembly further comprises a drive fan 22, and the cooling drive port 21 is disposed at a side of the drive fan 22. The driving fan 22 sucks a cooling medium such as air from the outside, and feeds the cooling medium into the cooling device 50 and the heat dissipation cooling unit 40 through the cooling driving port 21 on the side to power the flow of the cooling medium in the heat dissipation device.
In some embodiments, the refrigeration device 50 includes a first semiconductor cooling sheet 51, a cooling fin assembly 52 and a first temperature-equalizing plate 53, wherein the cold end of the first semiconductor cooling sheet 51 is attached to the cooling fin assembly 52, and the hot end is attached to the first temperature-equalizing plate 53. The first semiconductor refrigerating sheet 51 is used for cooling the refrigerating fin assembly 52, so that the temperature of a cooling medium is reduced, and meanwhile, heat generated by the first semiconductor refrigerating sheet 51 is transferred away through the first temperature equalizing plate 53. It can be understood that the cooling fin assembly 52 includes a plurality of parallel cooling fins arranged at intervals, the flowing direction of the cooling medium is the same as the parallel direction of the cooling fins, which is beneficial to the rapid flowing of the cooling medium, and meanwhile, the contact area between the cooling medium and the cooling fins is also increased, so as to achieve the rapid cooling of the cooling medium, so that the temperature of the cooling medium flowing to the downstream of the first cooling channel 41 is lower, and thus the heat of the components needing to be cooled in the first cooling channel 41 can be more rapidly dissipated.
As shown in fig. 3-5, in some embodiments, the heat dissipation cooling assembly 40 further includes a second cooling channel 42 communicating with the cooling driving port 21 and independent from the first cooling channel 41, and a temperature equalization heat sink partially disposed in the second cooling channel 42, wherein an inlet of the second cooling channel 42 is disposed opposite to the cooling fin assembly 52 of the cooling device 50. When the first cooling channel 41 dissipates heat from the light source 31, other components can be independently dissipated, and the overall heat dissipation efficiency of the heat dissipation device is effectively improved.
In some embodiments, the temperature equalizing heat sink includes a second temperature equalizing plate 431 and at least one heat dissipating fin assembly 432 disposed on the second temperature equalizing plate 431, the first temperature equalizing plate 53 is connected to the second temperature equalizing plate 431, and an inner cavity of the first temperature equalizing plate 53 is communicated with an inner cavity of the second temperature equalizing plate 431. It can be understood that the heat dissipating fin assembly 432 includes a plurality of heat dissipating fins disposed in parallel and spaced from each other, and the parallel direction of the heat dissipating fins is the same as the flowing direction of the cooling medium, which is beneficial to the rapid flowing of the cooling medium, and increases the contact area between the heat dissipating fins and the cooling medium, thereby achieving rapid heat dissipation.
In some embodiments, the inner cavities of the first temperature equalizing plate 53 and the second temperature equalizing plate 431 are both formed by sealing the cavity wall, and a heat conducting net and a heat conducting medium flowing in the inner cavity are arranged in the inner cavities, wherein the heat conducting net is connected with the cavity wall, so that the contact area between the heat conducting medium and the cavity wall is increased, and the heat absorbed by the first temperature equalizing plate 53 from the hot end of the first semiconductor chilling plate 51 and the heat absorbed by the second temperature equalizing plate 431 from other heat generating components can be sufficiently conducted to the heat dissipating fin assembly 432 for heat dissipation. On the other hand, because the inner cavities of the first temperature equalizing plate 53 and the second temperature equalizing plate 431 are communicated, heat dissipation is performed through the same heat dissipation fin assembly 432, the overall size is reduced, and the installation space of the heat dissipation device is effectively saved.
In some embodiments, the thermal module 40 further includes a lower bracket 45 and an upper bracket 44 covering the lower bracket 45, the refrigeration device 50 is fixed on the upper bracket 44, the first cooling channel 41 is formed between the upper bracket 44 and the lower bracket 45, and the second temperature equalizing plate 431 is fixed on a side of the upper bracket 44 facing away from the lower bracket 45.
In some embodiments, the upper bracket 44 includes a base 441, a first inner side plate 442 protruding from the base 441 and disposed opposite to the light-emitting assembly 30, and a second inner side plate 443 protruding from the base 441, wherein the second inner side plate 443 and the first inner side plate 442 are disposed on the same side of the base 441 and are in arc transition connection. The base 441 has a first opening 444 and a second opening 445 formed therethrough. The first temperature equalizing plate 53 covers the first opening 444, and the second temperature equalizing plate 431 covers the second opening 445. The second inner side plate 443 is provided with an inlet of the second cooling passage 42 therethrough.
In the present embodiment, it is understood that the first cooling passage 41 is enclosed by the base 441, the first inner side plate 442, the second inner side plate 443, and the lower bracket 45. The first cooling passage 41 and the second cooling passage 42 are separated from each other by the first inner side plate 442 and the second inner side plate 443, so that the light emitting module 30 and the heat dissipation cooling module 40 can dissipate heat independently from each other, contributing to improvement of heat dissipation efficiency of the entire heat dissipation device.
In the present embodiment, the cooling fin assembly 52 is located in the first cooling channel 41, the first semiconductor cooling fin 51 is attached to the first temperature equalizing plate 53 at the first opening 444, and the heat is conducted to the heat dissipating fin assembly 432 through the first temperature equalizing plate 53 for heat dissipation.
As shown in fig. 6, in some embodiments, the light emitting assembly 30 further includes a filter 32 and a reflective cup 33, the filter 32 and the reflective cup 33 enclose to form a receiving cavity, and the light source 31 is suspended in the receiving cavity. It will be appreciated that the receiving cavity is located in the first cooling channel 41. After the light source 31 emits light, all light energy is reflected and collected by the reflective cup 33 and then emitted out through the optical filter 32, and in the light emitting assembly 30, not only a large amount of heat is accumulated on the light source 31, but also the optical filter 32 and the reflective cup 33 generate heat, so that the cooling medium circulating in the first cooling channel 41 is used for dissipating heat of the whole light emitting assembly 30.
On the other hand, the utility model also provides an appearance that moults, including foretell heat abstractor.
As shown in fig. 2-3, in some embodiments, the depilating apparatus further includes a housing 10, a first heat dissipation outlet 12 is disposed at a side end of the housing 10 and is communicated with the first cooling channel 41 and the second cooling channel 42, a second heat dissipation outlet 13 is disposed at a bottom of the housing 10 and is communicated with the second cooling channel 42, two sets of heat dissipation fin assemblies 432 are disposed at two opposite sides of the second temperature equalizing plate 431, and the two sets of heat dissipation fin assemblies 432 are disposed opposite to the first heat dissipation outlet 12 and the second heat dissipation outlet 13. It can be understood that two sets of heat dissipation fin assemblies 432 are respectively disposed on two opposite sides of the second temperature equalizing plate 431 and respectively correspond to the heat dissipation outlets, so that the heat dissipation area of the temperature equalizing heat sink is increased, and the heat dissipation efficiency is improved. On the other hand, because the appearance bottom that moults is equipped with second heat dissipation outlet 13, also provide the heat dissipation outlet for other parts that generate heat of the appearance that moults, the whole thermal accumulation when can further reduce the appearance that moults and use promotes user experience and feels. As shown in fig. 1, in some embodiments, it is understood that the housing 10 is further provided with an air inlet 11 corresponding to the cooling driving assembly 20, so as to facilitate the cooling driving assembly 20 to suck the cooling medium from the outside.
As shown in fig. 4-6, in some embodiments, the epilator further comprises an ice applying portion 60, the ice applying portion 60 comprises a sapphire crystal 61 and a second semiconductor chilling plate 62, the cold end of the second semiconductor chilling plate 62 is attached to the sapphire crystal 61, and the hot end is attached to the heat dissipation chilling assembly 40. The sapphire crystal 61 is disposed at the front end of the light emitting assembly 30, and the light emitted from the light emitting assembly 30 can penetrate through the sapphire crystal 61 to act on the portion of the user to be depilated. Specifically, second semiconductor refrigeration piece 62 can laminate with second samming board 431, constantly transmits the hot junction heat of second semiconductor refrigeration piece 62 for heat dissipation fin subassembly 432 through second samming board 431, through the combined action of samming radiator and second semiconductor refrigeration piece 62, constantly gives sapphire crystal 61 and dispels the heat to give the user with the ice compress effect, prevent to scald.
In this embodiment, the upper bracket 44 further includes a third opening 446, the hot end of the second semiconductor chilling plate 62 passes through the third opening 446 to be attached to the second temperature equalizing plate 431, and the heat generated by the sapphire crystal 61 is conducted to the heat dissipation fin assembly 432 through the second temperature equalizing plate 431 for heat dissipation.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the present invention.
Claims (10)
1. A heat dissipation device is characterized in that: the method comprises the following steps:
the cooling driving assembly is used for driving a cooling medium to flow and is provided with a cooling driving port;
a light emitting assembly including a light source;
the heat dissipation cooling assembly is used for transmitting the cooling medium and comprises a first cooling channel, the inlet of the first cooling channel is communicated with the cooling driving port, and the light source is positioned in the first cooling channel;
a refrigeration device located in the first cooling channel and at an inlet of the first cooling channel.
2. The heat dissipating device of claim 1, wherein: the refrigerating device comprises a first semiconductor refrigerating sheet, a refrigerating fin assembly and a first temperature-equalizing plate with an inner cavity, wherein the cold end of the first semiconductor refrigerating sheet is attached to the refrigerating fin assembly, and the hot end of the first semiconductor refrigerating sheet is attached to the first temperature-equalizing plate.
3. The heat dissipating device of claim 2, wherein: the heat dissipation cooling assembly further comprises a second cooling channel communicated with the cooling driving port and mutually independent with the first cooling channel, and a temperature equalizing radiator partially arranged in the second cooling channel, wherein an inlet of the second cooling channel is opposite to the refrigerating fin assembly of the refrigerating device.
4. The heat dissipating device of claim 3, wherein: the temperature-equalizing radiator comprises a second temperature-equalizing plate with an inner cavity and at least one radiating fin assembly arranged on the second temperature-equalizing plate, the first temperature-equalizing plate is connected with the second temperature-equalizing plate, and the inner cavity of the first temperature-equalizing plate is communicated with the inner cavity of the second temperature-equalizing plate.
5. The heat dissipating device of claim 4, wherein: the heat dissipation cooling assembly further comprises a lower support and an upper support covered with the lower support, the refrigerating device is fixed on the upper support, the first cooling channel is formed between the upper support and the lower support, and the second temperature equalizing plate is fixedly arranged on one side, back to the lower support, of the upper support.
6. The heat dissipating device of claim 5, wherein: the upper bracket comprises a base part, a first inner side plate which is convexly arranged on the base part and is arranged opposite to the light emitting assembly, and a second inner side plate which is convexly arranged on the base part, wherein the second inner side plate and the first inner side plate are arranged on the same side of the base part and are in arc transition connection; the base part is provided with a first opening and a second opening in a penetrating mode, the first temperature-equalizing plate covers the first opening, and the second temperature-equalizing plate covers the second opening;
and the second inner side plate is provided with an inlet of the second cooling channel in a penetrating manner.
7. The heat dissipating device of claim 1, wherein: the light emitting assembly further comprises a light filter and a light reflecting cup, the light filter and the light reflecting cup are enclosed to form an accommodating cavity, and the light source is suspended in the accommodating cavity.
8. An epilating apparatus comprising a heat sink as claimed in any one of claims 4-7.
9. An epilating apparatus as claimed in claim 8, characterized in that: the depilatory instrument further comprises an outer shell, a first heat dissipation outlet communicated with the first cooling channel and the second cooling channel is formed in the side end of the outer shell, a second heat dissipation outlet communicated with the second cooling channel is formed in the bottom of the outer shell, two sets of heat dissipation fin assemblies are arranged, the two sets of heat dissipation fin assemblies are arranged on two opposite sides of the second temperature equalizing plate respectively, and the two sets of heat dissipation fin assemblies are arranged opposite to the first heat dissipation outlet and the second heat dissipation outlet respectively.
10. An epilating apparatus as claimed in claim 8, characterized in that: the depilating instrument further comprises an icing part, wherein the icing part comprises a sapphire crystal and a second semiconductor refrigerating piece, the cold end of the second semiconductor refrigerating piece is attached to the sapphire crystal, and the hot end of the second semiconductor refrigerating piece is attached to the heat dissipation cooling assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221537383.2U CN218784026U (en) | 2022-06-17 | 2022-06-17 | Heat abstractor and appearance that moults |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221537383.2U CN218784026U (en) | 2022-06-17 | 2022-06-17 | Heat abstractor and appearance that moults |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218784026U true CN218784026U (en) | 2023-03-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221537383.2U Active CN218784026U (en) | 2022-06-17 | 2022-06-17 | Heat abstractor and appearance that moults |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218784026U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116602757A (en) * | 2023-05-23 | 2023-08-18 | 可孚医疗科技股份有限公司 | a hair removal device |
-
2022
- 2022-06-17 CN CN202221537383.2U patent/CN218784026U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116602757A (en) * | 2023-05-23 | 2023-08-18 | 可孚医疗科技股份有限公司 | a hair removal device |
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