CN216668236U - Wafer drying device and wafer drying equipment - Google Patents

Abstract

The utility model relates to the field of wafer drying, and discloses a wafer drying device and a wafer drying device. The wafer drying device is used for drying of wafers, and the wafers are placed on the transfer support. The wafer drying device includes a carrying drying support, a carrying plane and a negative pressure device, wherein the carrying plane is used for carrying and positioning the transfer support. When the bracket is arranged on the bearing plane, the bearing drying bracket contacts the wafer and lifts the wafer. The negative pressure device includes a ventilation pipe, the ventilation pipe is connected to the negative pressure environment, and the ventilation pipe is provided with a ventilation hole. By arranging the ventilation holes of the negative pressure device close to the bearing drying bracket, the equilibrium diffusion and suction force of the negative pressure on the phase-separated interface at the water surface of the wafer is improved, and the drying process of the wafer is accelerated. The wafer drying apparatus includes the aforementioned wafer drying device.

Description

Wafer drying device and wafer drying equipment

technical field

The utility model relates to the field of wafer drying, in particular to a wafer drying device and a wafer drying device.

Background technique

In the process of drying wafers using isopropyl alcohol drying and dehydration process, the wafers are generally placed in the wafer basket, and the contact points between the wafer and the wafer basket are prone to accumulation of water, usually more than 1/3 of the entire wafer drying process. The time is to dry the contact points of these wafers with other components, and there are defects of long time and low efficiency of wafer drying.

Utility model content

The technical problem to be solved by the present utility model is to provide a wafer drying device and a wafer drying device in order to overcome the defect that the wafer drying takes a long time in the prior art.

The utility model solves the above-mentioned technical problems through the following technical solutions:

A wafer drying device for drying wafers, the wafers being placed on a transport support, characterized in that the wafer drying device comprises:

Bearing drying bracket;

a carrying plane, the carrying plane is used for carrying and positioning the transmission support, and the position of the carrying drying support relative to the carrying plane is set such that when the transmission support is arranged on the carrying plane, the carrying The drying support is in contact with the wafer, and lifts the wafer relative to the transfer support;

A negative pressure device, the negative pressure device includes a ventilation pipe for communicating with a negative pressure environment, a plurality of ventilation holes are opened on the ventilation pipe, and the ventilation holes are arranged close to the bearing drying bracket.

In this technical solution, the wafer is placed on the transfer support and lifted up by the carrying drying support, so as to reduce the contact point between the transfer support and the wafer, thereby reducing the accumulation of water on the surface of the wafer. The ventilation pipe is connected to the negative pressure environment, and the negative pressure acts on the wafer surface through the ventilation holes of the ventilation pipe, which produces equilibrium diffusion and negative pressure suction of the water on the wafer surface at the phase-separated interface, and sucks the water away from the wafer surface. Speed up the wafer drying process; where the ventilation holes are set close to the bearing and drying bracket, and the path between the contact point of the wafer and the bearing and drying bracket from the ventilation hole is short, that is, the path for the negative pressure to act on the wafer and the bearing and drying bracket is short, and the suction force is strong and beneficial The diffusion of residual water molecules on the wafer surface accelerates the drying of the wafer.

Preferably, the bearing and drying rack is disposed at the lower part of the transport rack, and the bearing and drying rack is in point contact with the bottom of the wafer.

In this technical solution, the carrier drying bracket is in contact with the bottom of the wafer and lifts the wafer upward. Due to the action of gravity, the water on the wafer surface moves down along the wafer surface, and the last remaining water trace on the wafer surface is located on the carrier. Dry the point contact between the holder and the wafer. Since the carrier drying bracket is close to the ventilation holes, the water traces at the contact point between the carrier drying bracket and the wafer can be quickly sucked away by negative pressure, so as to speed up the drying process of the wafer.

Preferably, the bearing and drying bracket is arranged on the surface of the ventilation pipe, and is located above the ventilation pipe.

In this technical solution, the bearing drying bracket is arranged on the surface of the ventilation pipe, so that the structure of the wafer drying device is compact, and the distance between the ventilation hole and the wafer surface is reduced, and the phase-separation interface balance between the negative pressure and the water on the wafer surface is improved. state diffusion rate and suction force. The wafer is located above the bearing and drying bracket, and the bearing and drying bracket is located above the ventilation pipe, and the negative pressure absorbs water downward, which doubles with gravity to improve the drying efficiency of the wafer.

Preferably, the position of the ventilation hole on the surface of the ventilation pipe is set such that when the transmission bracket is arranged on the bearing plane, the ventilation hole faces the wafer.

In this technical solution, the vent hole faces the wafer, reducing the distance from the vent hole to the wafer, the suction force of the negative pressure on water is stronger, and the drying is faster. At the same time, the ventilation holes are arranged to face the wafer, that is, the direction of the force of the negative pressure on the accumulated water is adjusted, so that the suction force of the negative pressure on the water on the surface of the wafer is enhanced.

Preferably, a chamfer is provided at one end of the bearing and drying bracket for contacting with the wafer.

In this technical solution, the bearing and drying bracket is provided with a chamfer to reduce the contact area with the wafer and reduce the accumulation of water in the contact portion of the bearing and drying bracket and the wafer. At the same time, the chamfer also has a drainage effect on the stagnant water.

Preferably, the bearing and drying bracket is plate-shaped, and the position of the bearing and drying bracket relative to the bearing plane is set as follows: when the transmission bracket is arranged on the bearing plane, the bearing and drying bracket moves along the direction of the bearing plane. The direction of the wafer extends.

In this technical solution, the bearing and drying bracket is arranged in a plate shape, so as to reduce the contact area with the wafer and reduce the accumulation of water in the contact part.

Preferably, the number of the bearing and drying racks is plural, and is arranged in a one-to-one correspondence with the wafers on the transport rack, and the ventilation holes are provided on both sides of a single said bearing and drying rack.

In this technical solution, ventilation holes are provided on both sides of the drying bracket, so that the negative pressure sucks the water on the wafer surface from multiple directions, thereby improving the drying efficiency.

Preferably, the negative pressure device further comprises a venturi tube for generating the negative pressure environment, and the venturi tube communicates with the ventilation tube.

In the technical solution, the negative pressure environment is generated by the venturi tube, and the venturi tube is connected with the ventilation tube, and the ventilation tube can take into account the functions of ventilation and drainage.

Preferably, one end of the ventilation pipe is closed, and the other end is connected to a negative pressure environment.

In the technical solution, one end of the ventilation pipe is closed, one-way conduction, and the structure is simple.

A wafer drying equipment, comprising:

The aforementioned wafer drying device;

an accommodating groove, the bearing and drying bracket and the ventilation pipe are arranged in the accommodating groove, and the accommodating groove is provided with an opening for placing the transporting support carrying the wafer.

Preferably, the wafer drying device further includes a water outlet for draining water, the vent hole is located above the water outlet, and the end of the bearing drying bracket for contacting the wafer is located at the outlet. above the water outlet.

In this technical solution, the vent hole is located above the water outlet. When the liquid level of the water is located below the bottom of the wafer and has not been completely discharged, negative pressure can be generated to suck the remaining water on the wafer surface.

The positive progressive effect of the present utility model is:

By setting up a negative pressure device, the vent pipe is connected to the negative pressure environment, and the equilibrium diffusion and suction effect of the negative pressure on the water phase-separated interface is used to suck the accumulated water on the surface of the wafer, speed up the drying process of the wafer, and improve the crystallinity. Round drying efficiency. By arranging the ventilation hole of the negative pressure device close to the bearing drying bracket for contacting the wafer, the suction force of the negative pressure on the water on the surface of the wafer is improved, and the drying process of the wafer is further accelerated.

Description of drawings

1 is a schematic structural diagram of a wafer drying apparatus according to Embodiment 1 of the present invention;

Fig. 2 is a partial enlarged view in Fig. 1;

FIG. 3 is a schematic structural diagram of the first embodiment of the present utility model before the transport bracket and the wafer are placed on the bearing plane;

FIG. 4 is a schematic structural diagram of the first embodiment of the present invention after the transmission support and the wafer are placed on the bearing plane;

5 is a cross-sectional view of a wafer drying apparatus according to an embodiment of the present invention;

6 is a cross-sectional view of a wafer drying device according to Embodiment 2 of the present invention;

FIG. 7 is a schematic structural diagram of a wafer drying apparatus according to a second embodiment of the present invention.

Description of reference numbers:

Wafer drying equipment 1;

wafer drying device 11;

A bearing plane 111, a bearing drying bracket 112, a negative pressure device 113, a negative pressure environment 1131, a ventilation pipe 1132, and a ventilation hole 11321;

accommodating tank 12, water inlet 121, water outlet 122, tank cover 123;

Nitrogen 13, isopropanol storage tank 14, atomization pipeline 15, nitrogen heater 16, antistatic device 17;

Wafer 21, transfer support 22;

Drain level 31.

Detailed ways

The present invention is further described below by way of examples, but the present invention is not limited to the scope of the described examples.

1-5 are schematic structural diagrams of Embodiment 1 of the present invention, and FIGS. 6 and 7 are schematic structural diagrams of Embodiment 2 of the present invention.

Example 1:

As shown in FIG. 1 and FIG. 5 , the wafer drying apparatus 1 includes a wafer drying device 11 , a holding tank 12 , an isopropyl alcohol storage tank 14 , an atomization pipeline 15 , a nitrogen heater 16 , and an antistatic device 17 . The top of the accommodating tank 12 is provided with an opening, the wafer 21 is placed on the transfer support 22, and the transfer support 22 can be put into the accommodating tank 12 from the opening of the accommodating tank 12; the isopropyl alcohol storage tank 14 and the nitrogen heater 16 are both connected Nitrogen 13; The bottom of the holding tank 12 is provided with a water inlet 121 and a water outlet 122.

In this embodiment, the transmission bracket 22 is in the shape of a flower basket. In other embodiments, the transmission bracket 22 can also be in other structural shapes, as long as the wafer 21 can be placed.

As shown in FIG. 1, FIG. 2 and FIG. 5, the drying process of the wafer 21 includes the following steps:

S1, the water inlet 121 of the accommodating tank 12 enters water, cleans the accommodating tank 12 and discharges the water;

S2, placing the wafer 21 on the transfer support 22, and placing the transfer support 22 on the bearing plane 111 in the accommodating groove 12;

S3, closing the tank cover 123 of the holding tank 12, and pouring water from the water inlet 121 at the bottom of the holding tank 12 until the wafer 21 is completely submerged;

S4, introduce atomized nitrogen gas 13 with isopropanol from the top of the holding tank 12, and control the water outlet 122 to drain slowly until the liquid level is lower than the bottom of the substrate;

S5, introducing heated nitrogen gas 13 into the holding tank 12 to thermally purge the substrate and eliminate static electricity on the surface of the substrate;

S6. When the liquid level drops to the liquid discharge level 31, start to drain rapidly;

S7, open the negative pressure device 113, connect the ventilation pipe 1132 to the negative pressure environment 1131, and improve the diffusion speed of water molecules at the phase separation interface and the suction effect through the negative pressure to suck the accumulated water on the surface of the wafer 21;

S8 , after the drying of the wafer 21 is completed, the slot cover 123 of the accommodating slot 12 is opened, and the wafer 21 and the transfer bracket 22 are taken out.

Wherein, steps S1-S5 are performed sequentially, and steps S6 and S7 are performed simultaneously. After reaching "the liquid level is lower than the bottom of the substrate" in step S4, step S5 is started; in other embodiments, "the liquid level is lower than the bottom of the substrate" in step S4 is specifically "the liquid level drops to the point where the liquid is drained" in step S6 Level 31". For steps S1-S5, the process in the prior art is very mature, and the detailed operation and structure configuration can refer to the prior art.

As shown in FIG. 3 and FIG. 4 , the wafer 21 is placed on the transfer support 22. Before the transfer support 22 is placed on the carrier plane 111, the wafer 21 has four contact points with the transfer support 22; After the wafer 21 is placed on the object platform, the bottom of the wafer 21 is in contact with the top of the carrying and drying support 112, and is lifted by the carrying and drying support 112. At this time, the wafer 21 and the transfer support 22 have two contact points, and the wafer 21 and the transfer support 22 There are a total of three contact points with the carrier drying bracket 112 , and the number of contact points on the surface of the wafer 21 is reduced. Accordingly, during the drying process of the wafer 21 , the water accumulated on the surface of the wafer 21 due to contact with other structures is reduced.

In this embodiment, a frame structure (not shown in the figure) is provided at the bottom of the accommodating groove 12 , the bearing plane 111 is formed on the upper surface of the frame structure, the ventilation pipe 1132 is fixed on the frame structure, and the bearing drying bracket 112 is fixed on the ventilation pipe 1132 The relative position of the bearing plane 111 to the bearing drying bracket 112 and the ventilation pipe 1132 is fixed.

In other embodiments, the specific positions of the carrier drying rack 112 and the carrier plane 111 may be different from those in this embodiment, and the carrier drying rack 112 may be used to contact the side surface of the wafer 21 to lift the wafer 21 laterally or obliquely upward For example, the carrying plane 111 only needs to be able to place the transport bracket 22 , and the carrying and drying bracket 112 can reduce the accumulation of water on the surface of the wafer 21 due to contact with other structures.

As shown in FIG. 5 , the ventilation pipe 1132 is connected to the negative pressure environment 1131 , and the top of the ventilation pipe 1132 is provided with a ventilation hole 11321 , and the negative pressure acts on the surface of the wafer 21 through the ventilation hole 11321 , and suctions the water accumulated on the surface of the wafer 21 . It can absorb the water and speed up the drying process of the wafer 21 .

The negative pressure environment 1131 is generated by a venturi tube (not shown in the figure), and the venturi tube communicates with the ventilation tube 1132 . There are many documents in the prior art that describe how to generate negative pressure by the Venturi tube, for details, please refer to the prior art.

As shown in FIG. 2 and FIG. 5 , in step S6 , when the liquid level drops to the liquid discharge level 31 , step S7 is performed simultaneously. At this time, when the liquid level is lower than the vent hole 11321 , the negative pressure device 113 is turned on, so that the vent pipe 1132 is connected to the negative pressure environment 1131 and starts to spread the negative pressure into the holding tank 12 to absorb the accumulated water on the surface of the wafer 21 . The working state of the negative pressure device 113 can be controlled by controlling the on-off of the venturi tube and the ventilation tube 1132, or by controlling the operation of the venturi tube. The negative pressure environment 1131 is generated by the venturi tube, and the venturi tube is connected to the ventilation tube 1132. The ventilation tube 1132 can take into account the functions of ventilation and drainage, and no additional sealing and waterproofing measures are required for the ventilation tube 1132, so that the structure of the wafer drying device 11 is improved. Simple. After the negative pressure device 113 is turned on, the accumulated water on the surface of the wafer 21 can be sucked into the ventilation pipe 1132 , or can be sucked to the bottom of the holding tank 12 to merge with the water at the bottom of the holding tank 12 .

As shown in FIG. 5 , one end of the ventilation tube 1132 is closed, and the other end is connected to the negative pressure environment 1131 . In other embodiments, the closed end of the ventilation pipe 1132 may be disposed in the accommodating groove 12 , and the other end penetrates through the accommodating groove 12 , so that the structure of the wafer drying apparatus 11 is simple.

As shown in FIG. 4 and FIG. 5 , the drying rack 112 is disposed above the ventilation pipe 1132 and fixed on the wall surface of the ventilation pipe 1132 , so that the structure of the wafer drying apparatus 11 is compact. The bearing and drying bracket 112 is close to the ventilation hole 11321 , so that the suction effect of negative pressure on the surface of the bearing and drying bracket 112 and the point of contact with the wafer 21 is enhanced. The bearing and drying bracket 112 is arranged above the ventilation pipe 1132, and the wafer 21 is placed above the bearing and drying bracket 112. Due to the action of gravity, in step S4, the last water trace on the surface of the wafer 21 is located between the bearing and drying bracket 112 and the wafer. 21 contact part, the bearing drying bracket 112 is close to the ventilation hole 11321, and the water accumulated at the contact point between the bearing drying bracket 112 and the wafer 21 is sucked away by negative pressure, so as to speed up the drying process of the wafer 21.

Embodiment 2:

As shown in FIG. 6 and FIG. 7 , the carrier drying bracket 112 is a plate shape extending toward the wafer 21 , and the carrier drying bracket 112 corresponds to the wafer 21 one-to-one to reduce the contact area between the carrier drying bracket 112 and the wafer 21 . Thereby reducing the contact part of the water. One end of the drying carrier 112 in contact with the wafer 21 is provided with a chamfer to reduce the contact area between the drying carrier 112 and the wafer 21, thereby reducing water accumulation at the contact point. Ventilation holes 11321 are provided on both sides of the single drying rack 112 , so that the negative pressure sucks the residual water traces on the surface of the wafer 21 from multiple directions, thereby improving the drying efficiency of the wafer 21 . The ventilation hole 11321 faces the wafer 21 , reducing the distance between the ventilation hole 11321 and the wafer 21 , so that the negative pressure faces the surface of the wafer 21 , and the suction effect of the negative pressure on the surface of the wafer 21 is enhanced.

For other structures, refer to Embodiment 1.

Although the specific embodiments of the present invention are described above, those skilled in the art should understand that this is only an example, and the protection scope of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principle and essence of the present invention, but these changes and modifications all fall within the protection scope of the present invention.

Claims (11)

1. a wafer drying device, used for the drying of the wafer, the wafer is placed on a transmission support, it is characterized in that, the wafer drying device comprises: Bearing drying bracket; a carrying plane, the carrying plane is used for carrying and positioning the transmission support, and the position of the carrying drying support relative to the carrying plane is set such that when the transmission support is arranged on the carrying plane, the carrying The drying support is in contact with the wafer, and lifts the wafer relative to the transfer support; A negative pressure device, the negative pressure device includes a ventilation pipe for communicating with a negative pressure environment, a plurality of ventilation holes are opened on the ventilation pipe, and the ventilation holes are arranged close to the bearing drying bracket. 2 . The wafer drying apparatus according to claim 1 , wherein the carrying and drying support is disposed at the lower portion of the transport support, and the carrying and drying support is in point contact with the bottom of the wafer. 3 . 3 . The wafer drying apparatus according to claim 2 , wherein the bearing and drying bracket is disposed on the surface of the ventilation pipe and above the ventilation pipe. 4 . 4 . The wafer drying apparatus according to claim 1 , wherein the position of the ventilation hole on the surface of the ventilation pipe is set such that when the transmission bracket is set on the bearing plane, the The vents face the wafer. 5 . The wafer drying apparatus according to claim 1 , wherein the end of the bearing and drying bracket for contacting the wafer is provided with a chamfer. 6 . 6 . The wafer drying apparatus according to claim 1 , wherein the carrying and drying support is plate-shaped, and the position of the carrying and drying support relative to the carrying plane is set as follows: when the transmission support is set Behind the carrying plane, the carrying drying rack extends in a direction towards the wafer. 7. The wafer drying device according to claim 1 or 6, wherein the number of the bearing and drying racks is plural, and is arranged in a one-to-one correspondence with the wafers on the transport rack, and a single The ventilation holes are provided on both sides of the drying support. 8 . The wafer drying apparatus of claim 1 , wherein the negative pressure device further comprises a venturi tube for generating the negative pressure environment, and the venturi tube communicates with the ventilation tube. 9 . 9 . The wafer drying apparatus of claim 1 , wherein one end of the ventilation pipe is closed, and the other end is connected to a negative pressure environment. 10 . 10. A wafer drying device comprising: The wafer drying device according to any one of claims 1-9; an accommodating groove, the bearing and drying bracket and the ventilation pipe are arranged in the accommodating groove, and the accommodating groove is provided with an opening for placing the transporting bracket carrying the wafer. 11 . The wafer drying apparatus according to claim 10 , wherein the wafer drying apparatus further comprises a water outlet for water drainage, the ventilation hole is located above the water outlet, and the drying support is supported. 12 . The end for contacting the wafer is located above the water outlet.

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