CN216359813U - Heat conduction insulation graphene gasket - Google Patents
Heat conduction insulation graphene gasket Download PDFInfo
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- CN216359813U CN216359813U CN202122827863.4U CN202122827863U CN216359813U CN 216359813 U CN216359813 U CN 216359813U CN 202122827863 U CN202122827863 U CN 202122827863U CN 216359813 U CN216359813 U CN 216359813U
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- graphene
- gasket
- heat
- boron nitride
- insulating
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 130
- 229910021389 graphene Inorganic materials 0.000 title claims abstract description 126
- 238000009413 insulation Methods 0.000 title claims abstract description 17
- 239000010410 layer Substances 0.000 claims abstract description 68
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 51
- 229910052582 BN Inorganic materials 0.000 claims abstract description 45
- 239000000835 fiber Substances 0.000 claims abstract description 27
- 239000012790 adhesive layer Substances 0.000 claims abstract description 19
- 238000003475 lamination Methods 0.000 claims abstract description 8
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 12
- 239000010439 graphite Substances 0.000 claims description 12
- -1 graphite alkene Chemical class 0.000 claims description 10
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 7
- 239000004917 carbon fiber Substances 0.000 claims description 7
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 7
- 239000011229 interlayer Substances 0.000 abstract description 12
- 238000010030 laminating Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000005553 drilling Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 230000005389 magnetism Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000001739 rebound effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application relates to a heat conduction and insulation graphene gasket, which comprises a graphene block body formed by sequentially stacking a plurality of layers of graphene films, wherein adjacent graphene films are connected through an adhesive layer; heat-conducting fiber wires are fixedly arranged in the graphene block body in a penetrating manner along the lamination direction; the graphene film is characterized in that insulating layers are fixedly arranged on the opposite surfaces of the graphene blocks, the thickness direction of each insulating layer is perpendicular to the lamination direction of the graphene film, and the insulating layers contain anisotropic magnetic boron nitride. After the graphene film is laminated, the heat-conducting fiber wires are fixedly penetrated along the laminating direction, so that the heat-conducting insulating graphene gasket has good heat-conducting property and mechanical property in the horizontal direction and the interlayer direction; the surface of the graphene gasket is covered with the magnetic boron nitride, and the magnetic boron nitride is oriented to have high thermal conductivity and excellent insulating property, so that the graphene gasket has excellent mechanical property, thermal conductivity and insulating property.
Description
Technical Field
The application relates to the technical field of electronic product heat dissipation devices, in particular to a heat conduction and insulation graphene gasket.
Background
The electronic products in the 5G era are developed towards light weight and high integration, so that the heat productivity of the electronic products in the working process is obviously improved in unit area, and the overhigh heat productivity can lead to the situation that electronic components cannot dissipate heat in time, so that the electronic products are prone to failure.
In order to solve the problem that electronic products cannot efficiently dissipate heat, thermal interface materials are produced, and the thermal interface materials are a general term of materials used for being fixed between a heat dissipation device and a heating device and reducing contact thermal resistance between the heat dissipation device and the heating device. The commonly used thermal interface materials mainly include phase change metal sheets, graphite gaskets, etc.
However, the conventional thermal interface material has at least the following disadvantages: firstly, the mechanical property of the traditional thermal interface material is poor, and the traditional thermal interface material is easy to damage and the like when being acted by external force; secondly, the phase change metal sheet and the graphite gasket are made of materials with excellent conductivity, and cannot be suitable for scenes with high insulation performance requirements; third, the thermal conductivity of conventional thermal interface materials is limited, generally about 1-10W/(m · k), and it is difficult to meet the high heat conduction requirement in the current heat dissipation field of chip with large heat flux density.
Disclosure of Invention
In order to enable the graphene film to have excellent mechanical property, insulating property and heat conducting property, the application provides a heat conducting and insulating graphene gasket.
The application provides a pair of heat conduction insulation graphite alkene gasket adopts following technical scheme:
a heat conduction and insulation graphene gasket comprises a graphene block body formed by sequentially stacking a plurality of layers of graphene films, wherein adjacent graphene films are connected through an adhesive layer; heat-conducting fiber wires are fixedly arranged in the graphene block body in a penetrating manner along the lamination direction; insulating layers are fixedly arranged on the opposite surfaces of the graphene blocks, the thickness direction of each insulating layer is perpendicular to the lamination direction of the graphene film, and the magnetic boron nitride in each insulating layer is anisotropic.
By adopting the technical scheme, the graphene film has anisotropic heat conductivity, high thermal conductivity in the horizontal direction in the layer and low thermal conductivity in the interlayer direction, so that the graphene film is bonded through the adhesive layer, and after being stacked to a target height, holes are formed in the lamination direction of the graphene blocks, so that the heat-conducting fiber filaments are conveniently penetrated and fixed, and the thermal conductivity in the interlayer direction is improved;
meanwhile, the graphene-heat conducting fiber three-dimensional structure formed by the graphene film and the heat conducting fiber leads the rebound rate and the tensile property between the graphene films to be improved, so that the possibility of damage of the heat conducting insulating graphene gasket is reduced through the rebound effect when the heat conducting insulating graphene gasket is impacted;
the magnetic boron nitride in the insulating layer has better electrical insulating property, so that the volume resistivity of the heat-conducting insulating graphene gasket is obviously improved; the magnetic boron nitride can be oriented under the action of a magnetic field, so that the magnetic boron nitride is anisotropic, the heat conduction performance in the insulating layer is good, and the heat conduction and insulation graphene gasket has excellent insulating performance, heat conduction performance and mechanical performance; in addition, the insulating layer covers the boundary of the graphene film, so that the possibility of powder falling of the heat conduction and insulation graphene gasket is reduced.
Optionally, the magnetic boron nitride in the insulating layer includes sheet-shaped magnetic boron nitride and spherical magnetic boron nitride, the sheet-shaped magnetic boron nitride forms a plurality of parallel heat conducting paths, and the spherical magnetic boron nitride abuts against the sheet-shaped magnetic boron nitride of the adjacent heat conducting paths.
Through adopting above-mentioned technical scheme, slice magnetic boron nitride is arranged neatly under the effect in magnetic field, and end to end can form many parallel heat conduction paths, and spherical magnetic boron nitride fills between two adjacent heat conduction paths, and spherical boron nitride forms two-dimensional heat conduction network with many parallel heat conduction paths, and the heat conduction path figure in the insulating layer increases, and the coefficient of heat conductivity of insulating layer further promotes to make the holistic coefficient of heat conductivity of heat conduction insulation graphite alkene gasket improve.
Optionally, a non-magnetic graphene oxide layer is disposed between the insulating layer and the graphene block.
By adopting the technical scheme, the non-magnetic graphene oxide contains a large number of polar groups, so that a good bridging effect can be achieved, and the bonding strength between the graphene film and the magnetic boron nitride is improved.
Optionally, the heat-conducting fiber filaments are carbon fiber filaments.
By adopting the technical scheme, the structure of the carbon fiber filament in the filament direction is similar to a graphite structure, so that the carbon fiber filament has good heat-conducting property.
Optionally, the heat conducting fiber filaments are uniformly distributed in the graphene block.
By adopting the technical scheme, the quantity of the heat-conducting fiber wires directly determines the heat conduction efficiency of the graphene heat-conducting gasket in the laminating direction of the graphene film, and the heat conduction fiber wires are provided with a plurality of heat-conducting fiber wires, so that the heat conduction efficiency of the heat-conducting insulating graphene gasket in the interlayer direction can be obviously improved; and meanwhile, the arrangement among the heat-conducting fiber yarns is uniform, so that the heat transfer in the interlayer direction of the heat-conducting insulating graphene gasket is uniform.
Optionally, the adhesive layer has a thickness of 10 to 100 μm.
By adopting the technical scheme, the adhesive layer is used for bonding and fixing the two adjacent graphene films, so that the graphene films of the heat-conducting insulating graphene gasket are prevented from being separated. When the thickness of the bonding layer exceeds 100 micrometers, the bonding layer is too thick, so that the heat conduction effect in the interlayer direction of the heat conduction insulation graphene gasket is influenced; when the thickness of the adhesive layer is less than 10 μm, the adhesive strength between the adhesive layer and the graphene film is not good.
Optionally, the thickness of the insulating layer is 10-100 μm.
By adopting the technical scheme, the insulating layer contains sizing materials such as polyurethane resin, epoxy resin and the like, so that the insulating layer can be fixed on the surface of the graphene block, and when the thickness of the insulating layer exceeds 100 micrometers, the insulating layer is too thick, and the heat conduction effect in the interlayer direction of the heat conduction insulating graphene gasket is influenced; when the thickness of the insulating layer is less than 10 μm, the adhesive strength between the insulating layer and the graphene block is not good.
Optionally, the thickness of the heat-conducting and insulating graphene gasket is 0.1-5 mm.
By adopting the technical scheme, the thickness of the heat-conducting insulating graphene gasket can be adjusted according to the size of the heat-radiating component; for light-weight and high-precision heat dissipation components, the minimum thickness of the heat conduction and insulation graphene gasket can reach 0.1mm, and the heat dissipation requirements of precision electronic instruments such as mobile phones can be met.
In summary, the present application includes at least one of the following beneficial technical effects:
1. in the application, a graphene block is formed after the multiple graphene films are stacked, and the heat-conducting fiber wires penetrate through the graphene block to form a graphene film-heat-conducting fiber wire three-dimensional heat-conducting network structure, so that the heat-conducting performance of the graphene gasket in the horizontal and interlayer directions is excellent; the surface of graphite alkene gasket is provided with the insulating layer, and magnetism boron nitride presents anisotropy in the insulating layer to make graphite alkene gasket possess excellent insulating properties, and the heat conductivility of insulating layer is good, and the insulating layer does not influence the holistic coefficient of heat conductivity of graphite alkene gasket.
2. The insulating layer uses slice magnetism boron nitride to establish many parallel heat conduction paths in this application, uses spherical magnetism boron nitride to fill between adjacent parallel heat conduction path for form two-dimentional heat conduction network in the horizontal plane of insulating layer, thereby further improve the coefficient of heat conductivity of insulating layer, make the heat conductivility of heat conduction insulation graphite alkene gasket further improve.
3. Add non-magnetic graphene oxide layer between insulating layer and graphite alkene block in this application, non-magnetic graphene oxide layer plays the bridging effect, connects insulating layer and graphite alkene block through the effect of polar group to improve the adhesive strength between insulating layer and the graphite alkene block.
Drawings
Fig. 1 is a schematic structural diagram of a thermally conductive and insulating graphene gasket in the present application.
Fig. 2 is a schematic cross-sectional view of a thermally conductive and insulating graphene gasket in the direction of a-a in the present application.
Fig. 3 is a schematic diagram illustrating arrangement of boron nitride in the insulating layer in a side view direction of the thermally conductive and insulating graphene gasket of the present application.
Description of reference numerals: 1. a graphene film; 2. an adhesive layer; 3. heat-conducting fiber filaments; 4. an insulating layer; 51. flaky magnetic boron nitride; 52. spherical magnetic boron nitride; 6. a non-magnetic graphene oxide layer.
Detailed Description
The present application is described in further detail below with reference to figures 1-3.
The embodiment of the application discloses heat conduction insulation graphene gasket.
Referring to fig. 1, the thermally conductive and insulating graphene gasket includes a plurality of graphene films 1 stacked in sequence, the plurality of graphene films 1 stacked in layers forming a graphene block. The adjacent graphene films 1 are connected through adhesive layers 2, the adhesive layers 2 are formed by curing an adhesive, and the adhesive can be any one or more of polyurethane resin, silicon rubber and epoxy resin. The coating thickness of the adhesive layer 2 influences the heat conduction performance and the mechanical performance between the heat conduction insulating graphene gasket layers, when the thickness of the adhesive layer 2 is lower than 10 micrometers, the bonding strength between the connected graphene films 1 is low, the graphene films 1 are likely to be separated, and when the thickness of the adhesive layer 2 is higher than 100 micrometers, the heat dissipation performance between the heat conduction insulating graphene gasket layers is influenced due to the low heat conduction coefficient of the adhesive layer 2; therefore, in some preferred embodiments, the thickness of the adhesive layer 2 is set within a range of 10-100 μm, so that the adhesive layer 2 can be firmly bonded to the connected graphene film 1, and the thickness of the adhesive layer 2 does not affect the heat conduction effect in the interlayer direction of the heat-conducting insulating graphene gasket.
Referring to fig. 1 and 2, through holes are formed in the graphene film 1 along the stacking direction of the graphene film 1, the through holes penetrate through all the graphene films 1, an operator can perform hole drilling by means of laser drilling or mechanical drilling, and the through holes are used for penetrating through the heat-conducting fiber filaments 3. Carbon fiber yarns can be selected as the heat-conducting fiber yarns 3, and the structure of the carbon fiber yarns in the filament direction is similar to a graphite structure, so that the carbon fiber yarns have good heat-conducting performance. The periphery of the heat-conducting fiber filament 3 is uniformly wrapped with an adhesive, and the heat-conducting fiber filament 3 is fixed in the through hole through the adhesive.
Referring to fig. 1 and 2, the through holes are formed in the graphene block body in a plurality, all the through holes are distributed at equal intervals, and a heat-conducting fiber 3 is fixedly bonded in each through hole through an adhesive. The aperture and the distribution distance of the through holes can affect the heat conduction performance and the mechanical performance between the heat conduction and insulation graphene gasket layers. In some preferred embodiments, the aperture of the through holes may be 20-100 μm, and the spacing between the centers of adjacent through holes may be 50-200 μm.
Referring to fig. 1 and 2, the thermal conductive fiber 3 and the graphene block form a graphene film-thermal conductive fiber three-dimensional thermal conductive structure, and since the thermal conductive performance of the graphene film 1 has anisotropy, the thermal conductivity thereof is high in the horizontal direction in the layer and low in the interlayer direction, the thermal conductive fiber 3 is used to increase the interlayer thermal conductivity of the graphene film 1, so that the horizontal direction and the interlayer direction of the three-dimensional thermal conductive structure have excellent thermal conductive performance. Meanwhile, the graphene film 1 and the heat-conducting fiber 3 are two-dimensional materials with excellent mechanical properties, so that the graphene gasket is soft in texture and excellent in mechanical properties, and therefore the heat-conducting insulating graphene gasket has high resilience rate and tensile strength and excellent mechanical properties.
Referring to fig. 2 and 3, the insulating layers 4 are fixedly disposed on the opposite surfaces of the graphene block, and the thickness direction of the insulating layers 4 is perpendicular to the lamination direction of the graphene film 1. The insulating layer 4 is formed by sequentially carrying out magnetic field orientation and thermal curing on insulating glue. The insulating glue comprises magnetic boron nitride and an adhesive, the magnetic boron nitride is uniformly distributed in the adhesive, the insulating glue is coated on the graphene block and oriented in a magnetic field, the magnetic boron nitride is anisotropic after being oriented to form a plurality of heat conduction paths, and the insulating layer 4 has excellent heat conduction performance.
Referring to fig. 2 and 3, where the magnetic boron nitride may be a flake magnetic boron nitride 51 and/or a spherical magnetic boron nitride 52, in a preferred embodiment, after the magnetic boron nitride composed of the flake magnetic boron nitride 51 and the spherical magnetic boron nitride 52 is oriented, the flake magnetic boron nitride 51 is connected end to end in the plane direction of the insulating layer, forming a plurality of parallel heat conducting paths; spherical magnetic boron nitride 52 is filled between two adjacent heat conduction paths and is abutted against flaky magnetic boron nitride 51 on the two adjacent heat conduction paths to form a two-dimensional heat conduction network, heat conduction contact points on the two-dimensional heat conduction network are increased, the number of the heat conduction paths is increased, and the heat conduction performance of the insulating layer 4 is further improved.
Referring to fig. 2 and 3, the thickness of the insulating layer 4 has an influence on the thermal conductivity of the graphene film 1 in the horizontal direction, and when the thickness of the insulating layer 4 is less than 10 μm, the insulating layer 4 may be detached from the graphene bulk, and when the thickness of the insulating layer 4 is more than 100 μm, the thermal conductivity of the insulating layer 4 may be reduced. Therefore, in some preferred embodiments, the thickness of the insulating layer 4 is selected to be 10 μm to 100 μm.
Referring to fig. 2 and 3, in order to increase the adhesive strength between the graphene block and the insulating layer 4, an operator may add non-magnetic graphene oxide into the insulating paste, and since the magnetic boron nitride is influenced by magnetic force during the orientation process and is separated from the non-magnetic graphene oxide, the magnetic boron nitride is easy to float on the surface of the insulating layer, and the non-magnetic graphene oxide is located between the magnetic boron nitride and the graphene block, so as to form the non-magnetic graphene oxide layer 6. The non-magnetic graphene oxide contains a large number of polar groups, and can serve as a bridge to connect the graphene block and the magnetic boron nitride, so that the connection strength between the graphene block and the magnetic boron nitride is further enhanced.
Referring to fig. 1, the overall thickness of the thermal conductive and insulating graphene gasket may be adjusted according to the product requirement requiring thermal conductivity, and in some preferred embodiments, the thickness of the thermal conductive and insulating graphene gasket may be 0.1 to 5 mm. The thinnest graphene heat conduction gasket provided by the embodiment of the application can be 0.1mm, and the heat dissipation requirement of a precise electronic component is completely met.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (8)
1. The utility model provides a heat conduction insulation graphite alkene gasket which characterized in that: the graphene film structure comprises graphene blocks formed by sequentially stacking a plurality of graphene films (1), wherein adjacent graphene films (1) are connected through an adhesive layer; a heat-conducting fiber (3) is fixedly arranged in the graphene block body in a penetrating manner along the lamination direction; insulating layers (4) are fixedly arranged on the opposite surfaces of the graphene blocks, the thickness direction of each insulating layer (4) is perpendicular to the lamination direction of the graphene film (1), and magnetic boron nitride in each insulating layer (4) is anisotropic.
2. The thermally conductive and electrically insulating graphene gasket of claim 1, wherein: the magnetic boron nitride in the insulating layer (4) comprises flaky magnetic boron nitride (51) and spherical magnetic boron nitride (52), the flaky magnetic boron nitride (51) forms a plurality of parallel heat conduction paths, and the spherical magnetic boron nitride (52) is abutted between the flaky magnetic boron nitride (51) adjacent to the heat conduction paths.
3. The thermally conductive and electrically insulating graphene gasket of claim 1, wherein: and a non-magnetic graphene oxide layer (6) is arranged between the insulating layer (4) and the graphene block.
4. The thermally conductive and electrically insulating graphene gasket of claim 1, wherein: the heat-conducting fiber wires (3) are carbon fiber wires.
5. The thermally conductive and electrically insulating graphene gasket of claim 4, wherein: the heat-conducting fiber filaments (3) are uniformly distributed in the graphene block.
6. The thermally conductive and electrically insulating graphene gasket of claim 1, wherein: the thickness of the adhesive layer (2) is 10-100 μm.
7. The thermally conductive and electrically insulating graphene gasket of claim 1, wherein: the thickness of the insulating layer (4) is 10-100 μm.
8. The thermally conductive and electrically insulating graphene gasket of claim 1, wherein: the thickness of the heat conduction and insulation graphene gasket is 0.1-5 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122827863.4U CN216359813U (en) | 2021-11-17 | 2021-11-17 | Heat conduction insulation graphene gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122827863.4U CN216359813U (en) | 2021-11-17 | 2021-11-17 | Heat conduction insulation graphene gasket |
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| CN216359813U true CN216359813U (en) | 2022-04-22 |
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| CN202122827863.4U Active CN216359813U (en) | 2021-11-17 | 2021-11-17 | Heat conduction insulation graphene gasket |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116039218A (en) * | 2023-01-17 | 2023-05-02 | 北京无线电测量研究所 | Composite graphene film and preparation method thereof |
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2021
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116039218A (en) * | 2023-01-17 | 2023-05-02 | 北京无线电测量研究所 | Composite graphene film and preparation method thereof |
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