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CN215976007U - Shielding device and substrate processing chamber with same - Google Patents

Shielding device and substrate processing chamber with same Download PDF

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Publication number
CN215976007U
CN215976007U CN202120515649.2U CN202120515649U CN215976007U CN 215976007 U CN215976007 U CN 215976007U CN 202120515649 U CN202120515649 U CN 202120515649U CN 215976007 U CN215976007 U CN 215976007U
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China
Prior art keywords
driving rod
space
base
rod body
processing chamber
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CN202120515649.2U
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Chinese (zh)
Inventor
林俊成
郭大豪
郑啓鸿
沈祐德
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Xintianhong Xiamen Technology Co ltd
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Xintianhong Xiamen Technology Co ltd
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Abstract

The utility model provides a shielding device and a substrate processing chamber with the same, mainly comprising a reaction cavity, a bearing disc, a containing cavity and a shielding device, wherein the reaction cavity is connected with the containing cavity, and the bearing disc is positioned in the reaction cavity. The shielding device comprises at least one driving rod body, at least one base and a shielding part, wherein the driving rod body extends to the reaction cavity from the accommodating cavity. The base is connected with the shielding part and the driving rod body, wherein the driving rod body drives the shielding part to move between the accommodating cavity and the reaction cavity through the base. When the deposition process is performed, the driving rod body drives the shielding part to move into the accommodating cavity. When the cleaning process is carried out, the driving rod body drives the shielding part to move into the reaction cavity so as to avoid polluting the bearing disc in the process of cleaning the processing chamber.

Description

Shielding device and substrate processing chamber with same
Technical Field
The utility model relates to a shielding device and a substrate processing chamber with the same, wherein the shielding device is mainly used for isolating a reaction space of the processing chamber and a bearing disc so as to avoid polluting the bearing disc in the process of cleaning the processing chamber
Background
Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), and Atomic Layer Deposition (ALD) are commonly used thin film deposition equipment and are commonly used in integrated circuit, led, display, and other processes.
The deposition apparatus mainly includes a chamber and a wafer tray, wherein the wafer tray is located in the chamber and is used for carrying at least one wafer. For example, in physical vapor deposition, a target is disposed in the chamber, wherein the target faces the wafer on the wafer carrier. During physical vapor deposition, inert gas and/or reaction gas can be conveyed into the cavity, bias voltage is respectively applied to the target material and the wafer bearing plate, and the loaded wafer is heated through the wafer bearing plate.
The inert gas in the cavity forms ionized inert gas under the action of the high-voltage electric field, and the ionized inert gas is attracted by bias voltage on the target material to bombard the target material. Target atoms or molecules sputtered from the target are attracted by the bias on the wafer carrier plate and deposit on the surface of the heated wafer to form a film on the surface of the wafer.
After a period of time, the inner surface of the chamber forms a deposition film, and thus the chamber needs to be periodically cleaned to prevent the deposition film from falling off during the process and further contaminating the wafer. Furthermore, oxides or other contaminants may also form on the surface of the target, and thus periodic cleaning of the target is also required. Generally, plasma ions are bombarded against the target in the chamber by a burn-in process to remove oxides or other contaminants from the surface of the target.
When the chamber and the target are cleaned, the wafer carrying tray and the wafer in the chamber need to be taken out, or the wafer carrying tray needs to be isolated, so that the wafer carrying tray and the wafer are prevented from being polluted in the cleaning process.
SUMMERY OF THE UTILITY MODEL
Generally, after a period of use of a substrate processing chamber, a cleaning process is typically performed to remove oxide or nitride from films and targets deposited in the chamber. Particles generated during the cleaning process contaminate the carrier plate, thereby requiring isolation of the carrier plate from contaminants. The utility model provides a shielding device and a substrate processing chamber with the same.
An objective of the present invention is to provide a substrate processing chamber with a shielding device, which mainly includes a reaction chamber, a carrier, a receiving chamber and a shielding device, wherein the receiving chamber is connected to the reaction chamber. The shielding device comprises a driving rod body, a base and a shielding part, wherein the driving rod body is connected with the shielding part through the base, and the shielding part is driven to move between the accommodating cavity and the reaction cavity.
When the reaction cavity is cleaned, the driving rod drives the shielding part to move into the reaction cavity and shield the bearing plate in the reaction space, so that plasma used in the cleaning process or pollution generated in the cleaning process is prevented from contacting the bearing plate and/or a substrate borne by the bearing plate. When the deposition process is carried out, the driving rod body drives the shielding part to move into the accommodating cavity, and the thin film deposition is carried out on the substrate in the reaction cavity.
An objective of the present invention is to provide a substrate processing chamber with a shielding device, wherein the number of driving rods is two, and the driving rods are respectively connected to two sides of a shielding portion. Through the use of two drive rods, the shielding part can be more stably supported and driven, and the shielding part with thicker thickness and heavier weight can be used. The thicker and heavier shielding part is used, so that the deformation of the shielding part in the process of cleaning the cavity can be avoided, and the contact of plasma used in the cleaning process or generated pollution to the bearing plate or the substrate through the deformed shielding part can be prevented.
In addition, the two driving rod bodies can be further respectively coated by the two bushings, so that particles generated when the driving rod bodies drive the shielding parts to move are prevented from diffusing into the accommodating space of the reaction cavity. The distance between the two driving rods and the two bushings is larger than the diameters of the bearing disc and the substrate, so that the bearing disc is prevented from being interfered and the deposition process is prevented from being influenced.
It is an object of the present invention to provide a substrate processing chamber with a shutter device, wherein the liner is made of a conductive material and is electrically connected to a biasing unit. The bias unit is used for forming bias on the lining so as to adsorb particles generated when the driving rod body drives the base and the shielding part to move and prevent the particles from entering the accommodating space of the reaction cavity.
It is an object of the present invention to provide a substrate processing chamber having a shutter device, wherein the isolated volume of the liner is fluidly connected to a pumping unit. The air pumping unit is used for pumping the gas and the particles in the isolation space and preventing the particles from entering the accommodating space of the reaction cavity.
In order to achieve the above object, the present invention provides a substrate processing chamber, comprising: a reaction cavity comprising a containing space; a stopper located in the containing space of the reaction cavity, wherein one end of the stopper is connected with the reaction cavity, and the other end forms an opening; a bearing disc positioned in the containing space and used for bearing at least one substrate; the accommodating cavity is connected with the reaction cavity and comprises an accommodating space which is in fluid connection with the accommodating space; and a shielding device, comprising: at least one driving rod body extending from the accommodating space to the accommodating space; at least one base connected with the driving rod body; and the shielding part is connected with the base, wherein the driving rod body drives the shielding part to move between the accommodating space and the accommodating space through the base, and the displacement direction of the shielding part is parallel to the driving rod body.
The utility model provides a shielding device, which is suitable for a substrate processing chamber and is characterized by comprising the following components: at least one driving rod body; the driving unit is connected with the driving rod body; at least one base connected with the driving rod body; and the shielding part is connected with the base, wherein the driving unit is used for driving the driving rod body to rotate so as to drive the base and the shielding part to move along the driving rod body, and the moving direction of the shielding part is parallel to the driving rod body.
The substrate processing chamber comprises a driving unit and a magnetic fluid shaft seal, wherein the driving rod body is arranged in the accommodating cavity or the reaction cavity through the magnetic fluid shaft seal, the driving unit is connected with the driving rod body and drives the driving rod body to rotate so as to drive the base connected with the driving rod body to move along the driving rod body, the driving rod body is a screw rod, the base comprises a screw hole or a thread, and the base is connected with the screw rod through the screw hole or the thread.
The substrate processing chamber comprises at least one position sensing unit arranged in the accommodating cavity or the reaction cavity and used for sensing the position of the shielding part.
The substrate processing chamber comprises a target material arranged in the accommodating space and facing the bearing disc, and a shielding part which is displaced to the accommodating space and is positioned between the target material and the bearing disc.
The substrate processing chamber comprises at least one lining positioned in the accommodating space and the containing space, and an isolation space, wherein the driving rod body and the base seat are positioned in the isolation space of the lining.
The substrate processing chamber and the shielding device comprise at least one lining which comprises an isolation space, and the driving rod body and the base are positioned in the isolation space of the lining, wherein the lining is made of a conductive material and is electrically connected with a bias unit.
The substrate processing chamber and the shielding device comprise an air pumping unit which is in fluid connection with the isolation space of the lining and is used for pumping the gas in the isolation space.
The utility model has the beneficial effects that: the novel shielding device and the substrate processing chamber with the shielding device are provided, the shielding part is driven by the driving rod body to move between a containing position and a shielding position along the driving rod body, and particles generated when a cavity or a target material is cleaned can be prevented from polluting the bearing disc.
Drawings
FIG. 1 is a schematic perspective cross-sectional view illustrating an embodiment of a substrate processing chamber of the present invention operating in a blocked state.
FIG. 2 is a schematic perspective cross-sectional view illustrating an embodiment of a substrate processing chamber of the present invention operating in a stowed state.
FIG. 3 is an enlarged cross-sectional view of a shadow apparatus of a substrate processing chamber according to an embodiment of the present invention.
FIG. 4 is a schematic side sectional view of one embodiment of a substrate processing chamber operating in a blocked state.
Figure 5 is a schematic side cross-sectional view of one embodiment of a substrate processing chamber of the present invention operating in a stowed state.
FIG. 6 is a schematic top cross-sectional view of one embodiment of a substrate processing chamber of the present invention operating in a blocked state.
Figure 7 is a schematic top cross-sectional view of one embodiment of a substrate processing chamber of the present invention operating in a stowed state.
FIG. 8 is a schematic cross-sectional perspective view of another embodiment of a substrate processing chamber of the present invention.
FIG. 9 is a schematic cross-sectional perspective view of another embodiment of a substrate processing chamber of the present invention.
FIG. 10 is a schematic cross-sectional view of another embodiment of a substrate processing chamber of the present invention.
Description of reference numerals: 10-a substrate processing chamber; 11-a reaction chamber; a 111-stop; 112-opening; 12-an accommodating space; 121-a reaction space; 123-a clean space; 13-a carrier tray; 14-a storage space; 15-a receiving cavity; 151-position sensing unit; 161-target material; 163-substrate; 17-a shielding device; 171-a drive rod body; 1711-magnetofluid shaft seal; 1713-bearings; 173-a base; 175-a shield; 177-a drive unit; 179-liner; 1791 — isolation space; 1792-bottom; 1793-lateral; 1794-interval; 18-a bias unit; 19-an air extraction unit; 191-an exhaust line; 193-vacuum line.
Detailed Description
Referring to fig. 1 and 2, schematic perspective cross-sectional views of a substrate processing chamber operating in a shielding state and a storage state according to an embodiment of the utility model are shown. As shown in the figure, the substrate processing chamber 10 mainly includes a reaction chamber 11, a susceptor 13, a receiving chamber 15 and a shielding device 17, wherein the reaction chamber 11 is connected to the receiving chamber 15, and the susceptor 13 is disposed in the reaction chamber 11.
The reaction chamber 11 has a receiving space 12 for receiving a carrier plate 13. The receiving chamber 15 is connected to the reaction chamber 11 and has a receiving space 14, wherein the receiving space 14 is fluidly connected to the receiving space 12 and is used for receiving the shielding portion 175.
The susceptor 13 is disposed in the accommodating space 12 of the reaction chamber 11 and is used for supporting at least one substrate 163. Taking the substrate processing chamber 10 as a pvd chamber, as shown in fig. 4 and 5, a target 161 is disposed in the reaction chamber 11, wherein the target 161 faces the substrate 163 and the susceptor 13.
Referring to fig. 3, the shielding device 17 includes at least one driving rod 171, at least one base 173 and a shielding portion 175, wherein the base 173 connects the shielding portion 175 and the driving rod 171, and the shielding portion 175 and the base 173 can move relative to the driving rod 171.
In an embodiment of the present invention, the driving rod 171 may be a screw, wherein the surface of the driving rod 171 has a thread. Base 173 includes a thread or a threaded hole that engages a thread on the surface of drive rod 171. When the driving rod 171 rotates, the base 173 and the shielding portion 175 are driven to move along the driving rod 171 between the accommodating space 14 and the accommodating space 12, wherein the direction of movement of the shielding portion 175 is parallel to the axial direction of the driving rod 171.
In practical applications, the driving rod 171 can be connected to a driving unit 177, and the driving rod 171 is driven to rotate by the driving unit 177, for example, the driving unit 177 can be a motor or a stepping motor.
In an embodiment of the utility model, the driving rod 171 extends from the receiving space 14 of the receiving cavity 15 to the receiving space 12 of the reaction cavity 11, for example, a wall of the receiving cavity 15 faces a wall of the reaction cavity 11, and the driving rod 171 extends from the wall of the receiving cavity 15 to the wall of the reaction cavity 11. The driving rod 171 may penetrate through the wall of the receiving cavity 15 or the reaction cavity 11 and is connected to the driving unit 177 disposed outside the receiving cavity 15 and the reaction cavity 11.
Specifically, the driving rod 171 can be disposed on the wall of the receiving cavity 15 through a shaft seal or a magnetic fluid shaft seal 1711, so that when the driving unit 177 drives the driving rod 171 to rotate relative to the receiving cavity 15, the vacuum of the receiving space 12 and the receiving space 14 is not damaged. In addition, the other end of the driving rod 171 can be connected to the wall of the reaction chamber 11 through a bearing 1713.
In the above embodiment of the present invention, the driving rod 171 penetrates the wall surface of the receiving cavity 15 and is connected to the driving unit 177 adjacent to the receiving cavity 15. In another embodiment of the present invention, the driving rod 171 may be changed to penetrate the wall surface of the reaction chamber 11 and be connected to the driving unit 177 adjacent to the reaction chamber 11.
The substrate processing chamber 10 of the present invention is operable in two states, a storage state and a blocking state. The driving unit 177 can drive the pedestal 173 and the shielding portion 175 to move to the receiving space 14 of the receiving cavity 15 through the driving rod 171, so that the substrate processing chamber 10 operates in a receiving state, as shown in fig. 2 and 5, in which the shielding portion 175 does not exist between the target 161 and the substrate 163 and the susceptor 13.
The susceptor 13 and the substrate 163 may then be driven toward the target 161, and a gas, such as an inert gas, passing through the accommodating space 12 may impinge on the target 161 to deposit a thin film on the surface of the substrate 163.
In an embodiment of the utility model, the accommodating space 12 of the reaction chamber 11 may be provided with a stopper 111, wherein one end of the stopper 111 is connected to the reaction chamber 11, and the other end of the stopper 111 forms an opening 112. When the susceptor 13 approaches the target 161, the susceptor enters or contacts the opening 12 formed by the stopper 111, wherein the reaction chamber 11, the susceptor 13 and the stopper 111 separate a reaction space 121 in the accommodating space 12, thereby preventing a deposited film from being formed on the surfaces of the reaction chamber 11 and the susceptor 13 outside the reaction space 121.
In addition, the driving unit 177 drives the pedestal 173 and the shielding portion 175 to move to the accommodating space 12 of the reaction chamber 11 through the driving rod 171, such that the substrate processing chamber 10 operates in a shielding state, as shown in fig. 1 and 4. The shielding portion 175 is located between the target 161, the substrate 163 and the susceptor 13, and is used to isolate the target 161, the substrate 163 and the susceptor 13.
The shielding portion 175 can separate a cleaning space 123 in the accommodating space 12, wherein the cleaning space 123 overlaps or is close to the area of the reaction space 121. A burn-in process may be performed in the cleaning space 123 to clean the target 161 and the reaction chamber 11 and/or the stopper 111 in the cleaning space 123, and remove oxides or other contaminants on the surface of the target 161 and the deposited film on the surface of the reaction chamber 11 and/or the stopper 111.
During cleaning of the substrate processing chamber 10, the susceptor 13 and/or the substrate 163 may be shielded or isolated by the shielding portion 175 to prevent the substances generated during the cleaning process from contaminating or depositing on the surface of the susceptor 13 and/or the substrate 163.
The shielding portion 175 of the present invention is generally plate-shaped, such as a circular plate, but not limited thereto, wherein the area of the shielding portion 175 is larger than the area of the opening 112 formed by the stopper 111 and/or the area of the carrier tray 13.
In an embodiment of the present invention, the number of the driving rod 171 and the base 173 of the shielding device 17 may be one, wherein the driving rod 171 is connected to the side of the shielding portion 175 through the base 173. The driving rods 171 do not overlap or interfere with the openings 112 of the stoppers 111, the substrate 163 and/or the susceptor 13, so as to prevent the lifting of the susceptor 13 and the deposition process from being affected.
In another embodiment of the present invention, as shown in fig. 6 and 7, the number of the driving rod 171 and the base 173 may be two, wherein the two driving rod 171 are respectively connected to two sides of the shielding portion 175 through the base 173. In addition, the two driving rods 171 do not overlap or interfere with the openings 112 of the stoppers 111, the substrate 163 and/or the carrier plate 13, wherein the vertical distance between the two driving rods 171 is greater than the maximum length, such as the diameter, of the openings 112 of the stoppers 111, the substrate 163 and/or the carrier plate 13. Therefore, the driving rods 171 will not affect the elevation of the susceptor 13 and the deposition process.
Specifically, when the number of the driving rod 171 and the base 173 is two or more, the shielding portion 175 can be more stably supported and driven to displace. In addition, the use of two actuating rods 171 and a base 173 is beneficial for carrying the thicker or heavier shielding portion 175. The thicker shielding 175 prevents high temperature deformation during cleaning of the substrate processing chamber 10 and prevents plasma from contacting the underlying susceptor 13 or substrate 163 through the deformed shielding 175 during cleaning.
When a plurality of actuating rods 171 are provided, only one of the actuating rods 171 is connected to the driving unit 177, and the other actuating rods 171 are not connected to the driving unit 177. Specifically, the driving rod 171 connected to the driving unit 177 is a screw, and the other driving rods 171 not connected to the driving unit 177 may not have threads.
When the driving unit 177 drives the connected driving rod 171 to rotate, the base 173 and the shielding portion 175 connected to the driving rod 171 will be driven to displace along the axial direction parallel to the driving rod 171, and the shielding portion 175 drives the other base 173 to displace along the driving rod 171 not connected to the driving unit 177. In other words, the driving rod 171 connected to the driving unit 177 drives the shielding portion 175 to move, and the driving rod 171 not connected to the driving unit 177 carries and guides the shielding portion 175 to move.
In addition, when the number of the driving units 177 is one, the driving units 177 may be connected to the two driving rods 171 through a linkage mechanism to rotate synchronously. In different embodiments, the number of the driving units 177 can also be two, and the two driving rods 171 are respectively connected and driven to rotate.
In an embodiment of the present invention, the shielding device 17 may include at least one bushing 179, wherein the bushing 179 is disposed in the accommodating space 12 and the receiving space 14 and is used for covering the driving rod 171 and the base 173. Specifically, the bushing 179 may be elongated and extend from the wall of the receiving chamber 15 to the wall of the reaction chamber 11 facing thereto.
The bushing 179 has an isolated space 1791, wherein the actuating lever 171 and the base 173 are located in the isolated space 1791. Due to the bushing 179, particles generated during the displacement of the base 173 and the shielding portion 175 driven by the driving rod 171 can be prevented from falling into the accommodating space 12 and/or the receiving space 14, so as to maintain the cleanliness of the accommodating space 12 of the vacuum chamber 11.
The bushing 179 extends from the receiving space 14 to the accommodating space 12, and includes a bottom 1792 and two side portions 1793, wherein the two side portions 1793 are respectively connected to two sides of the bottom 1792, so that the bottom 1792 and the two side portions 1793 have a U-shaped cross section, and an isolated space 1791 is formed between the bottom 1792 and the side portions 1793. The top of the bushing 179 is provided with an elongated gap 1794 and the base 173 is displaced along the gap 1794.
In an embodiment of the utility model, at least one position sensing unit 151 may be further disposed on the receiving cavity 15, wherein the position sensing unit 151 faces the receiving space 14 and is used for sensing whether the shielding portion 175 enters the receiving space 14. The position sensing unit 151 may be a light sensing unit, for example.
If the shielding portion 175 is not separated from the receiving space 12 of the reaction chamber 11, the susceptor 13 is displaced toward the target 161, which may cause the susceptor 13 to collide with the shielding portion 175, thereby causing damage to the susceptor 13 and/or the shielding portion 175. In practical applications, it can be set that the susceptor 13 can approach the target 161 only after the position sensing unit 151 senses that the shielding portion 175 completely enters the receiving cavity 15, so as to avoid collision between the susceptor 13 and the shielding portion 175.
In another embodiment of the present invention, the position sensing unit 151 may also be disposed on the reaction chamber 11 and face the accommodating space 12 of the reaction chamber 11, wherein the sensing unit 151 is used for sensing whether the shielding portion 175 is still in the accommodating space 12. Specifically, the position sensing unit 151 may sense the position of the shielding portion 175, for example, it is only required to confirm that the shielding portion 175 completely enters the receiving cavity 15 and/or the shielding portion 175 does not exist in the reaction cavity 11, and the installation position or type of the position sensing unit 151 is not limited by the scope of the present invention.
In one embodiment of the present invention, as shown in fig. 8, the bushing 179 may be made of a conductive material, such as a metal bushing, wherein the bushing 179 is electrically connected to a biasing unit 18. The bias unit 18 is used to form a bias on the bushing 179, and particles generated when the driving rod 171 drives the base 173 and the shielding portion 175 to displace are generally charged and attracted by the bias on the bushing 179.
By forming a bias on the liner 179, the particles are further attracted and collected on the liner 179 and prevented from diffusing into the accommodating space 12. In practical applications, the driving rod 171 drives the base 173 and the shielding portion 175 to displace, and the biasing unit 18 provides a bias voltage to the bushing 179.
In another embodiment of the present invention, as shown in FIG. 9, a pumping cell 19 can be fluidly connected to the isolated space 1791 of the liner 179, wherein the pumping cell 19 can be a separate or additional component. The pumping unit 19 is used to pump out the gas in the isolated space 1791 to form a negative pressure in the isolated space 1791. Particles generated when the driving rod 171 drives the base 173 and the shielding portion 175 to move enter the isolation space 1791, and then are pumped out by the pumping unit 19, so as to prevent the particles from contaminating the accommodating space 12.
The pumping cell 19 may be an original component of the substrate processing chamber 10, as shown in FIG. 10, wherein the pumping cell 19 is connected to the isolation volume 1791 of the liner 179 through a pumping line 191, and to the reaction volume 12 through a vacuum line 193.
Specifically, during the process that the driving rod 171 drives the base 173 and the shielding portion 175 to displace, the air-extracting unit 19 extracts the air in the isolation space 1791 through the air-extracting line 191. When performing the thin film deposition, the pumping unit 19 may pump out the gas inside the reaction space 12 through the vacuum line 193 so that the reaction space 12 is vacuumed. Furthermore, a filter unit may be disposed at one end of the pumping unit 19 connected to the pumping line 191 and/or the vacuum line 193 to prevent particles in the isolated space 1791 from entering the pumping unit 19.
The utility model has the advantages that:
the novel shielding device and the substrate processing chamber with the shielding device are provided, the shielding part is driven by the driving rod body to move between a containing position and a shielding position along the driving rod body, and particles generated when a cavity or a target material is cleaned can be prevented from polluting the bearing disc.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, i.e., all equivalent variations and modifications in the shape, structure, characteristics and spirit of the present invention described in the claims should be included in the scope of the present invention.

Claims (10)

1. A substrate processing chamber, comprising:
a reaction cavity comprising a containing space;
a stopper located in the accommodating space of the reaction chamber, wherein one end of the stopper is connected to the reaction chamber and the other end forms an opening;
a bearing disc which is positioned in the containing space and is used for bearing at least one substrate;
a receiving cavity connected with the reaction cavity, wherein the receiving cavity comprises a receiving space which is in fluid connection with the accommodating space; and
a shielding apparatus, comprising:
at least one driving rod body extending from the accommodating space to the accommodating space;
at least one base connected with the driving rod body; and
and the shielding part is connected with the base, wherein the driving rod body drives the shielding part to move between the accommodating space and the accommodating space through the base, and the displacement direction of the shielding part is parallel to the driving rod body.
2. The substrate processing chamber of claim 1, comprising a driving unit and a magnetic fluid shaft seal, wherein the driving rod is disposed in the receiving chamber or the reaction chamber through the magnetic fluid shaft seal, and the driving unit is connected to the driving rod and drives the driving rod to rotate so as to drive the base connected to the driving rod to move along the driving rod, wherein the driving rod is a screw, the base comprises a screw hole or a thread, and the base is connected to the screw through the screw hole or the thread.
3. The chamber of claim 1, comprising at least one position sensing unit disposed in the receiving cavity or the reaction cavity and configured to sense a position of the shielding portion.
4. The chamber of claim 1, comprising a target disposed in the receiving space and facing the susceptor, wherein the shielding portion displaced into the receiving space is located between the target and the susceptor.
5. The substrate processing chamber of claim 1, comprising at least one bushing disposed in the receiving space and comprising an isolation space, wherein the drive rod and the base are disposed in the isolation space of the bushing.
6. The substrate processing chamber of claim 5, wherein the liner is made of an electrically conductive material and is electrically connected to a biasing unit.
7. The substrate processing chamber of claim 5, comprising a pumping unit fluidly coupled to the isolated volume of the liner and configured to pump gas from the isolated volume.
8. A shutter apparatus adapted for use in a substrate processing chamber, comprising:
at least one driving rod body;
a driving unit connected with the driving rod body;
at least one base connected with the driving rod body; and
and the driving unit is used for driving the driving rod body to rotate so as to drive the base and the shielding part to move along the driving rod body, and the displacement direction of the shielding part is parallel to the driving rod body.
9. The shielding apparatus of claim 8, comprising at least one bushing having an isolation space, wherein the driving rod and the base are disposed in the isolation space of the bushing, and wherein the bushing is made of a conductive material and electrically connected to a biasing unit.
10. A screen apparatus according to claim 9, including a suction line in fluid communication with the isolated space of the sleeve for drawing gas from the isolated space.
CN202120515649.2U 2021-03-11 2021-03-11 Shielding device and substrate processing chamber with same Active CN215976007U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115074671A (en) * 2021-03-11 2022-09-20 鑫天虹(厦门)科技有限公司 Shielding mechanism and substrate processing chamber with same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115074671A (en) * 2021-03-11 2022-09-20 鑫天虹(厦门)科技有限公司 Shielding mechanism and substrate processing chamber with same

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