CN203784667U - LED (light emitting diode) lamp - Google Patents
LED (light emitting diode) lamp Download PDFInfo
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- CN203784667U CN203784667U CN201420022360.7U CN201420022360U CN203784667U CN 203784667 U CN203784667 U CN 203784667U CN 201420022360 U CN201420022360 U CN 201420022360U CN 203784667 U CN203784667 U CN 203784667U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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Abstract
LED灯具,涉及LED技术。本实用新型包括灯管、灯座和LED灯条,所述LED灯条设置于条形灯管内,与LED灯条连接的LED驱动电路设置于灯座内,所述LED灯条由透明的基板、涂覆于基板上表面的混合涂料层、设置于混合涂料层上的LED发光单元、与LED发光单元电连接的电极和荧光胶构成,荧光胶包覆LED发光单元和混合涂料层,所述混合涂料层的材质为掺有荧光粉的绝缘胶。本实用新型的安装接口完全与节能灯一致,具有更好的通用性;灯管内的LED灯条体积更小,原物料更节省。
An LED lamp relates to LED technology. The utility model comprises a lamp tube, a lamp holder and an LED lamp bar. The LED lamp bar is arranged in a bar-shaped lamp tube, and an LED drive circuit connected with the LED lamp bar is arranged in the lamp holder. The LED lamp bar is made of a transparent The substrate, the mixed paint layer coated on the upper surface of the substrate, the LED light-emitting unit arranged on the mixed paint layer, the electrodes electrically connected to the LED light-emitting unit, and fluorescent glue are composed. The fluorescent glue covers the LED light-emitting unit and the mixed paint layer. The material of the mixed paint layer is insulating glue mixed with fluorescent powder. The installation interface of the utility model is completely consistent with the energy-saving lamp, and has better versatility; the volume of the LED light bar in the lamp tube is smaller, and the raw materials are more saved.
Description
技术领域technical field
本实用新型涉及LED技术。The utility model relates to LED technology.
背景技术Background technique
节能灯,又称为紧凑型荧光灯(简称CFL灯)相对于白炽灯具有光效高,节能效果明显,寿命长,体积小,使用方便等优点,使用较为普遍,但其发光效率不及LED。照明用LED灯具是近年开始发展的新技术,现有技术LED灯具的接口有别于节能灯,其安装使用不及节能灯方便。Energy-saving lamps, also known as compact fluorescent lamps (CFL lamps for short), have the advantages of high luminous efficiency, obvious energy-saving effect, long life, small size, and convenient use compared with incandescent lamps. They are more commonly used, but their luminous efficiency is not as good as that of LEDs. LED lamps for lighting are a new technology that has been developed in recent years. The interfaces of existing LED lamps are different from energy-saving lamps, and their installation and use are not as convenient as energy-saving lamps.
现有技术中,有一种LED光源条,参见图1,其封装工艺为:将该发光二极管晶片单元42及该电性传导单元44设置于一个透明基板41上,并使该发光二极管晶片单元及该电性传导单元与外界电连接;然后依照所需的光色及色温调配适合的封装体(荧光胶);利用粘着剂单元45将透明保护板46与透明基板41结合,使透明基板、发光二极管晶片单元、电性传导单元、粘着剂单元及透明保护板组成灯板机构;最后利用灌模及固化的方式,使该封装体(荧光胶)包覆并定型于该灯板机构外。特别的,为了防止蓝光外泄,现有技术的荧光胶整体包覆灯板机构,包括透明基板的上下表面。In the prior art, there is an LED light source bar, as shown in FIG. 1 , the packaging process is as follows: the light emitting diode chip unit 42 and the electrical conduction unit 44 are arranged on a transparent substrate 41, and the light emitting diode chip unit and the The electrical conduction unit is electrically connected to the outside; then a suitable package (fluorescent glue) is prepared according to the required light color and color temperature; the transparent protective plate 46 is combined with the transparent substrate 41 by using the adhesive unit 45, so that the transparent substrate, light emitting The diode chip unit, the electrical conduction unit, the adhesive unit and the transparent protection plate form the light board structure; finally, the packaging body (fluorescent glue) is wrapped and shaped outside the light board structure by means of potting and curing. In particular, in order to prevent blue light from leaking out, the fluorescent glue in the prior art covers the lamp panel mechanism as a whole, including the upper and lower surfaces of the transparent substrate.
此技术的不足之处是,光源条体积较大,封装工艺复杂,导致成本较高。The disadvantage of this technology is that the volume of the light source bar is large and the packaging process is complicated, resulting in high cost.
实用新型内容Utility model content
本实用新型所要解决的技术问题是,提供一种具有与节能灯相同的安装接口的LED灯具,其内置成本更低、体积更为小巧的LED发光装置。The technical problem to be solved by the utility model is to provide an LED lamp with the same installation interface as the energy-saving lamp, which has a built-in LED light-emitting device with lower cost and smaller volume.
本实用新型解决所述技术问题采用的技术方案是,LED灯具,其特征在于,包括灯管、灯座和LED灯条,所述LED灯条设置于条形灯管内,与LED灯条连接的LED驱动电路设置于灯座内,所述LED灯条由透明的基板、涂覆于基板上表面的混合涂料层、设置于混合涂料层上的LED发光单元、与LED发光单元电连接的电极和荧光胶构成,荧光胶包覆LED发光单元和混合涂料层,所述混合涂料层的材质为掺有荧光粉的绝缘胶。The technical scheme adopted by the utility model to solve the technical problem is that the LED lamp is characterized in that it includes a lamp tube, a lamp holder and an LED light bar, and the LED light bar is arranged in a strip-shaped light tube and connected with the LED light bar The LED driving circuit is set in the lamp holder, and the LED light bar is composed of a transparent substrate, a mixed paint layer coated on the upper surface of the substrate, an LED light-emitting unit arranged on the mixed paint layer, and an electrode electrically connected to the LED light-emitting unit Composed of fluorescent glue, the fluorescent glue covers the LED light-emitting unit and the mixed paint layer, and the material of the mixed paint layer is insulating glue mixed with phosphor powder.
所述LED发光单元由串联设置的LED芯片构成,且各LED芯片设置为两行。所述基板为玻璃板,所述荧光胶仅设置于基板的上方。所述电极包括正负两个电极,两个电极形状对称,设置于基板上。LED灯条整体为长条形。灯管为U型玻璃管或者H型玻璃管。灯座包括灯头和底座,LED驱动电路设置在底座内,底座和灯头连接,灯头外壁设置有安装螺纹。The LED light-emitting unit is composed of LED chips arranged in series, and each LED chip is arranged in two rows. The substrate is a glass plate, and the fluorescent glue is only arranged on the top of the substrate. The electrodes include positive and negative electrodes, the two electrodes are symmetrical in shape and arranged on the substrate. The LED light bar is in the shape of a long strip as a whole. The lamp tube is a U-shaped glass tube or an H-shaped glass tube. The lamp holder includes a lamp holder and a base, the LED driving circuit is arranged in the base, the base is connected with the lamp holder, and the outer wall of the lamp holder is provided with mounting threads.
本实用新型的有益效果是,本实用新型的安装接口完全与节能灯一致,具有更好的通用性;灯管内的LED灯条体积更小,原物料更节省。相对于现有技术,本实用新型的LED灯条去掉了透明保护板,简化了生产工艺流程,原物料使用量减少1/3以上。由于本实用新型采用了掺有荧光粉的绝缘胶作为混合涂料,现有技术中为防止蓝光外泄而设置于透明基板背面的封装体单元被简化掉。这两项原物料的减省使本实用新型更环保。由于透明基板背面封装体单元的省略,完成后的灯板机构不再需要修剪,这一单元的简化很大程度上节省了人力成本。The beneficial effect of the utility model is that the installation interface of the utility model is completely consistent with the energy-saving lamp, and has better versatility; the volume of the LED light bar in the lamp tube is smaller, and the raw materials are more saved. Compared with the prior art, the LED light bar of the utility model removes the transparent protective plate, simplifies the production process, and reduces the consumption of raw materials by more than 1/3. Since the utility model adopts the insulating glue mixed with fluorescent powder as the mixed paint, the package unit arranged on the back of the transparent substrate in the prior art to prevent blue light leakage is simplified. The reduction of these two raw materials makes the utility model more environmentally friendly. Due to the omission of the package unit on the back of the transparent substrate, the completed lamp panel mechanism no longer needs to be trimmed, and the simplification of this unit greatly saves labor costs.
附图说明Description of drawings
图1是现有技术的LED灯条结构示意图。Fig. 1 is a schematic structural diagram of an LED light bar in the prior art.
图2是本实用新型的LED灯条的分解图。Fig. 2 is an exploded view of the LED light bar of the present invention.
图3是本实用新型的LED灯条的电极与基板连接示意图(拆解状态)。Fig. 3 is a schematic diagram of the connection between the electrode and the substrate of the LED light bar of the present invention (disassembled state).
图4是本实用新型的LED灯条的电极与基板连接示意图(连接完成状态)。Fig. 4 is a schematic diagram of the connection between the electrode and the substrate of the LED light bar of the present invention (connection completed state).
图5是本实用新型采用的Y-300荧光剂测试频谱图。Fig. 5 is the Y-300 fluorescent agent test frequency chart that the utility model adopts.
图6是本实用新型采用的Y-300荧光剂的YAG:Ce电镜照片。Fig. 6 is the YAG of the Y-300 fluorescent agent that the utility model adopts: Ce electron micrograph.
图7是实施例1的LED灯具的结构示意图(拆解状态)。Fig. 7 is a schematic structural view (disassembled state) of the LED lamp of Embodiment 1.
图8是实施例1的外观示意图。FIG. 8 is a schematic view of the appearance of Embodiment 1. FIG.
图9是实施例2的灯条组合示意图。FIG. 9 is a schematic diagram of the combination of light bars in Embodiment 2. FIG.
具体实施方式Detailed ways
参见图2~4。See Figures 2-4.
本实用新型的LED灯条由透明的玻璃基板1、涂覆于基板1上表面的混合涂料层2、设置于混合涂料层2上的LED发光单元3、与LED发光单元3电连接的电极5和荧光胶4构成,荧光胶4包覆LED发光单元3和混合涂料层2,所述混合涂料层2的材质为掺有荧光粉的绝缘胶。The LED light bar of the present utility model consists of a transparent glass substrate 1, a mixed paint layer 2 coated on the upper surface of the substrate 1, an LED light-emitting unit 3 arranged on the mixed paint layer 2, and an electrode 5 electrically connected to the LED light-emitting unit 3 Composed of fluorescent glue 4, the fluorescent glue 4 covers the LED light-emitting unit 3 and the mixed paint layer 2, and the material of the mixed paint layer 2 is insulating glue mixed with phosphor powder.
本实用新型的LED灯具包括灯管、灯座和LED灯条,所述LED灯条设置于条形灯管内,与LED灯条连接的LED驱动电路设置于灯座内。The LED lamp of the present utility model comprises a lamp tube, a lamp holder and an LED lamp bar. The LED lamp bar is arranged in the bar-shaped lamp tube, and the LED driving circuit connected with the LED lamp bar is arranged in the lamp holder.
本实用新型所述的“条形灯管”既包括单独的条形结构,也包括两个条形结构的组合,例如U型或者H型(U型为两个条形灯管在端部连接,H型为两个条形灯管在中部连接),以及三个或三个以上条形灯管的组合。The "strip-shaped lamp tube" described in the utility model includes not only a single strip-shaped structure, but also a combination of two strip-shaped structures, such as U-shaped or H-shaped (U-shaped is two strip-shaped lamps connected at the end , Type H is two strip lamps connected in the middle), and a combination of three or more strip lamps.
所述LED灯条由透明的基板1、涂覆于基板1上表面的混合涂料层2、设置于混合涂料层2上的LED发光单元3、与LED发光单元3电连接的电极5和荧光胶4构成,荧光胶4包覆LED发光单元3和混合涂料层2,所述混合涂料层2的材质为掺有荧光粉的绝缘胶。The LED light bar is composed of a transparent substrate 1, a mixed paint layer 2 coated on the upper surface of the substrate 1, an LED light-emitting unit 3 arranged on the mixed paint layer 2, an electrode 5 electrically connected to the LED light-emitting unit 3, and fluorescent glue. 4, the fluorescent glue 4 covers the LED light-emitting unit 3 and the mixed paint layer 2, and the material of the mixed paint layer 2 is insulating glue mixed with phosphor powder.
所述LED发光单元由串联设置的LED芯片构成,且各LED芯片设置为两行。所述基板1为玻璃板,所述荧光胶4仅设置于基板1的上方。所述电极5包括正负两个电极,两个电极形状对称,设置于基板1上。所述LED灯条整体为长条形。The LED light-emitting unit is composed of LED chips arranged in series, and each LED chip is arranged in two rows. The substrate 1 is a glass plate, and the fluorescent glue 4 is only disposed above the substrate 1 . The electrodes 5 include positive and negative electrodes, the two electrodes are symmetrical in shape, and are arranged on the substrate 1 . The LED light bar is generally in the shape of a long strip.
所述灯座包括灯头和底座,LED驱动电路设置在底座内,底座和灯头连接,灯头外壁设置有安装接口,例如螺纹。The lamp holder includes a lamp base and a base, the LED driving circuit is arranged in the base, the base is connected to the lamp base, and the outer wall of the lamp base is provided with an installation interface, such as a screw thread.
实施例1:参见图7、8。Embodiment 1: see Fig. 7,8.
本实施例包括灯管、灯座和LED灯条,所述LED灯条设置于条形灯管内,与LED灯条连接的LED驱动电路设置于灯座内。灯座包括免焊钉11、灯头12、底座13和上盖16,底座13内设置有驱动电源14和PCB电路板15。灯条17设置于灯光18内,并穿过上盖16上的孔,灯条17与PCB电路板15上的电路形成电路连接。本实施例的灯管为U型灯管。This embodiment includes a lamp tube, a lamp holder and an LED lamp bar. The LED lamp bar is arranged in the bar-shaped lamp tube, and the LED driving circuit connected with the LED lamp bar is arranged in the lamp holder. The lamp holder includes solder-free nails 11 , a lamp cap 12 , a base 13 and an upper cover 16 , and the base 13 is provided with a driving power supply 14 and a PCB circuit board 15 . The light bar 17 is arranged in the light 18 and passes through the hole on the upper cover 16 , and the light bar 17 is connected with the circuit on the PCB circuit board 15 to form a circuit. The lamp tube in this embodiment is a U-shaped lamp tube.
本实施例的的LED发光装置整体为长条形。The LED lighting device of this embodiment is in the shape of a strip as a whole.
本实用新型的荧光胶可采用成熟的现有技术,也可自行调配。The fluorescent glue of the utility model can adopt mature prior art, and can also be prepared by oneself.
参见图5、6。作为优选的实施例,采用的荧光胶是由粉状的荧光剂、固化剂、硅胶、硅烷和扩散剂混合固化而成。荧光剂的成分包括稀土元素,能够激发出红色、绿色、黄色的荧光粉以不同的比例调制为荧光剂。作为更具体的例子,选用YAG为黄色荧光粉、LuAG为绿色荧光粉以及SSN为红色荧光粉。YAG荧光粉分子式为Y3Al5O12:Ce,采用高温固相法制成,能提供540nm至580nm附近的黄色光;LuAG荧光粉的分子式为Lu3Al5O12:Ce,采用高温固相法制成,能提供500nm至540nm附近的绿色光;氮化物红色的SSN荧光粉的分子式为Sr2Si5N8:Eu,采用高温固相法制成,能提供620nm至660nm附近的红色光。See Figures 5 and 6. As a preferred embodiment, the fluorescent glue used is formed by mixing and curing powdered fluorescent agent, curing agent, silica gel, silane and diffusing agent. The composition of the fluorescent agent includes rare earth elements, which can excite red, green, and yellow fluorescent powders and modulate them into fluorescent agents in different proportions. As a more specific example, YAG is selected as a yellow phosphor, LuAG is selected as a green phosphor, and SSN is selected as a red phosphor. The molecular formula of YAG phosphor is Y 3 Al 5 O 12 : Ce, which is made by high-temperature solid-phase method, and can provide yellow light near 540nm to 580nm; the molecular formula of LuAG phosphor is Lu 3 Al 5 O 12 : Ce, which is produced by high-temperature solid-phase Manufactured by method, it can provide green light near 500nm to 540nm; the molecular formula of nitride red SSN phosphor is Sr 2 Si 5 N 8 : Eu, it is made by high temperature solid phase method, and it can provide red light near 620nm to 660nm.
利用前述3种荧光粉可以调制出4种荧光剂,按重量配比为:Four kinds of fluorescent agents can be prepared by using the aforementioned three kinds of phosphors, and the ratio by weight is:
(1)H3000荧光剂:色温3000±300K(1) H3000 fluorescent agent: color temperature 3000±300K
YAG:LuAG:SSN=0.2:0.4:0.1~0.15YAG:LuAG:SSN=0.2:0.4:0.1~0.15
(2)H4500荧光剂:色温4500±300K(2) H4500 fluorescent agent: color temperature 4500±300K
YAG:LuAG:SSN=0.2:0.4:0.05~0.1YAG:LuAG:SSN=0.2:0.4:0.05~0.1
(3)H6000荧光剂:色温6000±300K(3) H6000 fluorescent agent: color temperature 6000±300K
YAG:LuAG:SSN=0.2:0.4:0.01~0.05YAG:LuAG:SSN=0.2:0.4:0.01~0.05
(4)Y-300荧光剂:(4) Y-300 fluorescent agent:
YAG=100%YAG=100%
上述黄色荧光粉也可以采用氮氧化物黄色荧光粉,分子式为β-SiAlON,绿色荧光粉也可以采用氮化物绿色荧光粉,分子式为BaAlON,红色荧光粉也可以是氮化物红色荧光粉SASN,分子式为SrAlSiN8:Eu。The above-mentioned yellow phosphor can also be a nitrogen oxide yellow phosphor with a molecular formula of β-SiAlON, the green phosphor can also be a nitride green phosphor with a molecular formula of BaAlON, and the red phosphor can also be a nitride red phosphor SASN with a molecular formula is SrAlSiN 8 :Eu.
本实用新型的荧光胶使用的荧光剂可以是前述荧光剂之一,或者前述荧光剂的组合。以重量百分比计算,荧光剂占荧光胶的60%~70%,扩散剂不大于2%,硅烷不大于0.1%,其余为硅胶与固化剂按1:4调合。作为更具体的例子,采用Y-003荧光粉,由图5、6可知其激发光谱中波长460nm的光刚好和发光二极管的发射光谱(440~470nm)匹配,从图中可知Y-003可获得550nm的发射光,从图6可知,荧光粉体粒度参数D10=9.74微米。The fluorescent agent used in the fluorescent glue of the present invention can be one of the aforementioned fluorescent agents, or a combination of the aforementioned fluorescent agents. Calculated by weight percentage, the fluorescent agent accounts for 60% to 70% of the fluorescent glue, the diffusing agent is not more than 2%, the silane is not more than 0.1%, and the rest is made of silica gel and curing agent at a ratio of 1:4. As a more specific example, using Y-003 phosphor, it can be seen from Figures 5 and 6 that the light with a wavelength of 460nm in the excitation spectrum just matches the emission spectrum (440-470nm) of the light-emitting diode. From the figure, it can be seen that Y-003 can obtain For the emitted light at 550nm, it can be seen from Figure 6 that the phosphor particle size parameter D10=9.74 microns.
实施例2:Example 2:
本实施例的每个灯管内设置有两个LED灯条17,参见图9。图9A为分解状态,图9B为组合状态。两个灯条17通过铁丝22连接,21为光源条的电极。In this embodiment, two LED light bars 17 are arranged inside each lamp tube, see FIG. 9 . Fig. 9A is an exploded state, and Fig. 9B is an assembled state. The two light bars 17 are connected by iron wire 22, and 21 is an electrode of the light source bar.
实施例3:Example 3:
本实用新型的LED发光装置的封装方法包括下述步骤:The packaging method of the LED lighting device of the present utility model comprises the following steps:
A、在基板1上设置电极5:通过高温树脂6将电极粘接在基板1上;A. Setting the electrode 5 on the substrate 1: bonding the electrode to the substrate 1 through a high-temperature resin 6;
B、在基板1的上表面涂覆混合涂料形成混合涂料层2,所述混合涂料的材质为掺有荧光粉的绝缘胶;B. Coating a mixed paint on the upper surface of the substrate 1 to form a mixed paint layer 2, the material of the mixed paint is insulating glue mixed with fluorescent powder;
C、在混合涂料层2上设置LED发光单元3,C, LED light-emitting unit 3 is set on the mixed paint layer 2,
D、使LED发光单元3与电极5形成电连接;D, making the LED light emitting unit 3 and the electrode 5 form an electrical connection;
E、在基板1的上方涂覆荧光胶4,使其包覆LED发光单元3和混合涂料层2。E. Coating fluorescent glue 4 on the substrate 1 so as to cover the LED light emitting unit 3 and the mixed paint layer 2 .
实施例4:Example 4:
本实用新型的LED发光装置的封装方法包括下述步骤:The packaging method of the LED lighting device of the present utility model comprises the following steps:
1)在基板1的上表面涂覆混合涂料形成混合涂料层2,所述混合涂料的材质为掺有荧光粉的绝缘胶;1) Coating a mixed paint on the upper surface of the substrate 1 to form a mixed paint layer 2, the material of the mixed paint is insulating glue mixed with fluorescent powder;
2)在基板1上设置电极5:通过高温树脂6将电极粘接在基板1上;2) Setting the electrode 5 on the substrate 1: bonding the electrode to the substrate 1 through a high-temperature resin 6;
3)在混合涂料层2上设置LED发光单元3,3) setting LED lighting unit 3 on the mixed paint layer 2,
4)使LED发光单元3与电极5形成电连接;4) Forming an electrical connection between the LED light emitting unit 3 and the electrode 5;
5)在基板1的上方涂覆荧光胶4,使其包覆LED发光单元3和混合涂料层2。5) Coating fluorescent glue 4 on the substrate 1 so as to cover the LED light emitting unit 3 and the mixed paint layer 2 .
实施例5:Example 5:
本实用新型的LED发光装置的封装方法包括下述步骤:The packaging method of the LED lighting device of the present utility model comprises the following steps:
1)在基板1的上表面涂覆混合涂料形成混合涂料层2,所述混合涂料的材质为掺有荧光粉的绝缘胶;1) Coating a mixed paint on the upper surface of the substrate 1 to form a mixed paint layer 2, the material of the mixed paint is insulating glue mixed with fluorescent powder;
2)在混合涂料层2上设置LED发光单元3;2) An LED light-emitting unit 3 is arranged on the mixed paint layer 2;
3)在基板1上设置电极5:通过高温树脂6将电极粘接在基板1上,3) Setting the electrode 5 on the substrate 1: bonding the electrode to the substrate 1 through a high-temperature resin 6,
4)使LED发光单元3与电极5形成电连接;4) Forming an electrical connection between the LED light emitting unit 3 and the electrode 5;
5)在基板1的上方涂覆荧光胶4,使其包覆LED发光单元3和混合涂料层2。5) Coating fluorescent glue 4 on the substrate 1 so as to cover the LED light emitting unit 3 and the mixed paint layer 2 .
说明书已经充分的说明了本实用新型的必要技术内容,普通技术人员能够依据说明书实施本实用新型,故不再赘述更具体的技术细节。The description has fully described the necessary technical content of the utility model, and those of ordinary skill can implement the utility model according to the description, so no more specific technical details are repeated.
Claims (7)
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104913219A (en) * | 2015-06-15 | 2015-09-16 | 何小平 | Clamped-connection type LED lamp filament energy-saving lamp |
| CN105889797A (en) * | 2014-12-22 | 2016-08-24 | 江苏银晶光电科技发展有限公司 | Energy-saving lamp with LED filaments |
| US20180010742A1 (en) * | 2015-06-30 | 2018-01-11 | Jianfeng Ke | Led energy-saving lamp, manufacturing method thereof and corn lamp |
| CN108613066A (en) * | 2018-05-24 | 2018-10-02 | 郑州森源新能源科技有限公司 | A kind of display lighting device |
| CN112420899A (en) * | 2020-09-29 | 2021-02-26 | 湖州市汉新科技有限公司 | High-color rendering index high-thermal conductivity fluorescent film, preparation method and application in display equipment |
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2014
- 2014-01-14 CN CN201420022360.7U patent/CN203784667U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105889797A (en) * | 2014-12-22 | 2016-08-24 | 江苏银晶光电科技发展有限公司 | Energy-saving lamp with LED filaments |
| CN104913219A (en) * | 2015-06-15 | 2015-09-16 | 何小平 | Clamped-connection type LED lamp filament energy-saving lamp |
| US20180010742A1 (en) * | 2015-06-30 | 2018-01-11 | Jianfeng Ke | Led energy-saving lamp, manufacturing method thereof and corn lamp |
| US10429015B2 (en) * | 2015-06-30 | 2019-10-01 | Zhejiang Setec Lighting Co., Ltd | LED energy-saving lamp, manufacturing method thereof and corn lamp |
| CN108613066A (en) * | 2018-05-24 | 2018-10-02 | 郑州森源新能源科技有限公司 | A kind of display lighting device |
| CN112420899A (en) * | 2020-09-29 | 2021-02-26 | 湖州市汉新科技有限公司 | High-color rendering index high-thermal conductivity fluorescent film, preparation method and application in display equipment |
| CN112420899B (en) * | 2020-09-29 | 2022-06-14 | 湖州市汉新科技有限公司 | High-color rendering index high-thermal conductivity fluorescent film, preparation method and application in display equipment |
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