CN202898574U

CN202898574U - Floating type microsphere electroplating device

Info

Publication number: CN202898574U
Application number: CN 201220566603
Authority: CN
Inventors: 张�林; 张云望; 金容�; 杜凯; 尹强; 乐玮; 周兰; 肖江; 张超
Original assignee: Laser Fusion Research Center China Academy of Engineering Physics
Current assignee: Laser Fusion Research Center China Academy of Engineering Physics
Priority date: 2012-10-31
Filing date: 2012-10-31
Publication date: 2013-04-24
Anticipated expiration: 2022-10-31

Abstract

The utility model provides a floating microsphere electroplating device, which can electrodeposit metal on the surface of microspheres that can float in a solution. The coating tank in the utility model is provided with a coating tank cover, and the cylinder is fixed on the bottom surface of the coating tank cover. The cathode and the anode are respectively fixed on the bottom surface of the coating tank cover in parallel with the center of the coating tank cover as the center of circle. A hole for adjusting the water level is provided between the cathode and the anode, and the ring array is fixed at the bottom of the plating tank. The floating microsphere electroplating device of the present utility model can obtain metal microspheres with excellent sphericity and surface roughness for various metals, such as gold, copper, nickel and their alloys, etc., under the conventional electroplating process parameters. The thickness can be adjusted by changing the plating time, with a diameter of 300 Take gold microspheres as an example, the coating thickness can reach up to 15

about.

Description

Floatation type microballoon electroplanting device

Technical field

The utility model belongs to electrochemical field, is specifically related to a kind of floatation type microballoon electroplanting device, is applicable to the electroplanting device that the floating microsphere surface to the unlike material of various surface-coated conductive layers carries out galvanic deposit.

Background technology

Mostly at present microsphere surface metallization is to adopt the methods such as physical vaporous deposition, chemical Vapor deposition process, electroless plating, but when these methods of use, along with thicknesses of layers increases, the film surface Quality Down, thickness evenness and surface smoothness all can reduce, can't satisfy well it at material, biological medicine, the application demand in the fields such as photoelectricity and catalysis.

Summary of the invention

In order to overcome the deficiency that the microballoon thickness of coating is partially thin in the prior art, surfaceness is larger, the utility model provides a kind of floatation type microballoon electroplanting device, can be in electroplating solution, understanding the electroplanting device of the surface electrical metal refining of floating microballoon, to be used for preparing thickness large and sphericity and the higher various metallic microspheres of surface smoothness.

The utility model adopts following technical scheme to realize:

Floatation type microballoon electroplanting device of the present utility model is characterized in: described electroplanting device comprises hole, negative electrode, anode, right cylinder, coating bath, rotor, circle ring array, the coating bath lid of regulating water level.Coating bath is cylindric, and the coating bath lid is shaped as cylinder, and the shape of negative electrode and anode is circular thin slice, and material is same with the metallographic phase of wanting plating.Its annexation is, the top of described coating bath is provided with the coating bath lid, and coating bath lid internal diameter is identical with the coating bath external diameter, and coating bath lid medial surface and coating bath upper port outer side are provided with the internal and external threads of mutual coupling, by rotation the coating bath lid is fixed on the coating bath, is used for the sealing coating bath; Coating bath tops outer side center is provided with a square projection, in order to auxiliary rotation coating bath lid.Right cylinder is fixed on the coating bath lid bottom surface centered by coating bath lid axis.Negative electrode, anode be parallel being fixed on the coating bath lid bottom surface respectively take coating bath lid center as the center of circle all, the anode external diameter is identical with coating bath lid internal diameter, the anode internal diameter is greater than the negative electrode external diameter, anode and negative electrode are in the same plane, cylinder diameter is identical with the negative electrode internal diameter, is used for limiting solution and the movement path of microballoon in coating bath.Be provided with the hole of regulating water level between the negative electrode and positive electrode of coating bath lid, the coating bath lid is vertically run through in the hole of adjusting water level, and coating bath inside and atmosphere are communicated with, and is used for injecting in coating bath or the taking-up plating bath.Make the inner and atmosphere connection of coating bath, be used in coating bath, injecting or the taking-up plating bath.Circle ring array is made of the one group of annulus that varies in size, and is fixed in the coating bath bottom as the center of circle take coating bath bottom centre, is used for being separated out the groove with certain depth in the coating bath bottom, and microballoon sinks rear motion in groove and can not smashed by rotor.The rotor level places the center of described circle ring array, drives solution during rotor and flows centered by the coating bath axis.

Described rotor is ellipsoid shaped.

When adopting this device to carry out the microsphere surface galvanic deposit, the bead episphere is larger towards the current density of anode one side part, make the coating speed of growth of these parts very fast, skew occurs and rotates in the center of gravity of microballoon, makes the thicker part of coating deviate from anode under action of gravity, and the thinner partial rotation of coating is to top, thereby realize the even growth of coating, in this process, flowing of plating bath can prevent that bead and cathode sheets from sticking together, and guarantees that microballoon has enough freedoms of motion.

Floatation type microballoon electroplanting device beneficial effect of the present utility model is: simple to operation, controllability is strong.The utility model floatation type microballoon electroplanting device, to various metals, such as gold, copper, nickel and alloy thereof etc., under its conventional electroplating technological parameter, rotating speed by suitable adjusting rotor, can obtain the good metallic microspheres of sphericity and surfaceness, thickness of coating can be regulated by changing electroplating time, take diameter as 300

About gold microsphere be example, the thickness of coating maximum can reach 15

About.

Description of drawings

Fig. 1 is the structural representation of floatation type microballoon electroplanting device of the present utility model;

Among the figure, 1. regulate hole 2. negative electrodes, 3. anodes, 4. right cylinders, 5. coating baths, 6. rotors, 7. circle ring arrays, the 8. coating baths lid of water level.

Embodiment

Below in conjunction with accompanying drawing the utility model is described further.

Embodiment 1

Fig. 1 is the structural representation of floatation type microballoon electroplanting device of the present utility model, in Fig. 1, floatation type microballoon electroplanting device of the present utility model comprises hole 1, negative electrode 2, the anode 3 of regulating water level), right cylinder 4, coating bath 5, rotor 6, circle ring array 7, coating bath lid 8; Coating bath 5 is cylindric, and coating bath lid 8 is shaped as cylinder, and the shape of negative electrode 2 and anode 3 is circular thin slice; Its annexation is, the top of described coating bath 5 is provided with coating bath lid 8, and it is identical with coating bath 5 external diameters that coating bath covers 8 internal diameters, and coating bath covers the internal and external threads that 8 medial surfaces and coating bath 5 upper port outer sides are provided with mutual coupling, by rotation coating bath lid 8 is fixed on the coating bath 5, is used for sealing coating bath 5; Coating bath covers 8 top outer centers and is provided with a square projection, in order to auxiliary rotation coating bath lid 8; Right cylinder 4 is fixed in coating bath and covers on 8 bottom surfaces centered by coating bath covers 8 axis; Negative electrode 2, anode 3 all take coating bath cover 8 centers as the center of circle respectively the parallel coating bath that is fixed in cover on 8 bottom surfaces, it is identical that anode 3 external diameters and coating bath cover 8 internal diameters, anode 3 internal diameters are greater than negative electrode 2 external diameters, and anode 3 and negative electrode 2 are in the same plane, and right cylinder 4 diameters are identical with negative electrode 2 internal diameters; Be provided with the hole 1 of regulating water level between the negative electrode 2 of coating bath lid 8 and anode 3, the hole 1 of regulating water level is vertically run through coating bath and is covered 8; Make coating bath 5 inner and atmosphere connections, be used for to coating bath 5 interior injections or taking-up plating bath; Circle ring array 7 is made of the one group of annulus that varies in size, and is fixed in coating bath 5 bottoms as the center of circle take coating bath 5 bottom centre; Rotor 6 levels place the center of described circle ring array 7.

Rotor described in the present embodiment 6 is ellipsoid shaped.

Floatation type microballoon electroplanting device workflow of the present utility model is as follows

Hole 1 by regulating water level is to coating bath 5 interior injection plating baths and applied the microballoon of conductive layer, tightness system then, plugged.Floating microballoon contacts and metal refining with negative electrode 3, and magnetic stirring apparatus rotates the drive liquid-flow by rotor 6 and makes the microballoon free movement, under the restriction of the right cylinder 4 that groove pushes up, microballoon is moved in a circle around right cylinder 4 at negative electrode 2 simultaneously.Anode 3 and negative electrode 2 are placed in parallel in coating bath and cover on 8 internal surfaces, electric field distribution law according to electrodeposition process, the part coating deposition rate is very fast near microballoon and negative electrode 2 contacts site, the center of gravity of ball constantly changes, microballoon rotates under the disturbance of flow of solution, thereby the face that makes microballoon face anode 3 constantly changes, and realizes the even growth of coating.Flowing of solution can be improved the degree of freedom of microballoon motion, avoids the adhesion of microballoon and negative electrode 2.When the gravity of metallic microspheres during greater than buoyancy, microballoon sinks to bottom land.The circle ring array 7 of bottom land has been separated out the groove with certain depth, ball is sunk after motion and can not smashed by rotor 6 in groove.

Correlation technique parameter of the present utility model is as follows

1) the stirring velocity scope is 100～250r/min;

2) the microballoon coating bath is processed into synthetic glass, diameter be 3.8cm in logical right cylinder;

3) right cylinder is processed into synthetic glass, and radius is 1.8cm;

4) the negative electrode internal diameter is 1.8cm, and external diameter is 2.3cm, and the anode internal diameter is 3cm, and external diameter is 3.5cm.

Claims

1. A floating microsphere electroplating device, characterized in that: the electroplating device includes a hole (1) for adjusting the water level, a cathode (2), an anode (3), a cylinder (4), a plating tank (5), Rotor (6), ring array (7), plating tank cover (8); plating tank (5) is cylindrical, plating tank cover (8) is cylindrical in shape, cathode (2) and anode (3) The shapes are all circular flakes; the connection relationship is that a plating tank cover (8) is arranged above the plating tank (5), and the inner diameter of the plating tank cover (8) is the same as the outer diameter of the plating tank (5). The inner surface of the cover (8) and the outer surface of the upper port of the plating tank (5) are provided with matching internal and external threads; the center of the outer top of the plating tank cover (8) is provided with a square bump; the cylinder (4) is covered with a plating tank cover ( 8) The central axis is fixed on the bottom surface of the plating tank cover (8); the cathode (2) and the anode (3) are respectively fixed on the bottom surface of the plating tank cover (8) in parallel with the center of the plating tank cover (8) as the center of the circle. The outer diameter of the anode (3) is the same as the inner diameter of the plating tank cover (8), the inner diameter of the anode (3) is larger than the outer diameter of the cathode (2), the anode (3) and the cathode (2) are located on the same plane, and the diameter of the cylinder (4) is the same as The inner diameter of the cathode (2) is the same; a hole (1) for adjusting the water level is provided between the cathode (2) and the anode (3) of the plating tank cover (8), and the hole (1) for adjusting the water level runs through the plating tank cover (8) vertically ); the ring array (7) is composed of a group of rings of different sizes, fixed on the bottom of the plating tank (5) with the center of the bottom of the plating tank (5) as the center; the rotor (6) is placed horizontally in the ring array ( 7) Center.

2. The electroplating device according to claim 1, characterized in that: the rotor (6) is in the shape of an ellipsoid.