CN202276579U - Electronic device with bonding structure - Google Patents
Electronic device with bonding structure Download PDFInfo
- Publication number
- CN202276579U CN202276579U CN2011204060821U CN201120406082U CN202276579U CN 202276579 U CN202276579 U CN 202276579U CN 2011204060821 U CN2011204060821 U CN 2011204060821U CN 201120406082 U CN201120406082 U CN 201120406082U CN 202276579 U CN202276579 U CN 202276579U
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- Prior art keywords
- substrate
- solid
- electronic installation
- bonding structure
- gluing layer
- Prior art date
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- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 239000000126 substance Substances 0.000 claims abstract description 11
- 238000004026 adhesive bonding Methods 0.000 claims description 36
- 238000009434 installation Methods 0.000 claims description 30
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 6
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 230000001939 inductive effect Effects 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 20
- 239000007787 solid Substances 0.000 abstract description 6
- 239000011521 glass Substances 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 10
- 239000004568 cement Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000013459 approach Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 4
- 238000000429 assembly Methods 0.000 description 4
- 238000009461 vacuum packaging Methods 0.000 description 4
- 239000011324 bead Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- GJCOSYZMQJWQCA-UHFFFAOYSA-N 9H-xanthene Chemical compound C1=CC=C2CC3=CC=CC=C3OC2=C1 GJCOSYZMQJWQCA-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 229920001285 xanthan gum Polymers 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses an electronic device with a bonding structure. The electronic device comprises a first substrate, a second substrate and a solid bonding layer, wherein the solid bonding layer is arranged between the first substrate and the second substrate; and the solid bonding layer respectively forms a chemical link key with the first substrate and the second substrate, so that the first substrate and the second substrate are bonded together. Because of adopting solid bonding glue with physical and chemical bonding properties at the same time, the electronic device disclosed by the utility model has stronger anti-impact capability.
Description
Technical field
The utility model is relevant for a kind of electronic installation, and particularly relevant for a kind of electronic installation with bonding structure.
Background technology
Optical cement (OCA, Optical Clear Adhesive) is widely used in electronic equipment, like mobile phone, PDA(Personal Digital Assistant) or hand held personal computer, as the laminated material of those electronic equipment internal inter-modules.
The optical cement of industry use at present has pressure-sensing glue (PSA, pressure-sensitive adhesive), acryl glue (acrylic) etc.Normally utilize the physical characteristic (being to interpenetrate between pulling force or the molecule between the xanthan molecule) of optical cement itself to cohere two assemblies; Like glass assembly; But under bigger external impact force, utilize the physical characteristic of optical cement itself but can't cohere two assemblies securely.Particularly the environmental condition of some electronic equipments existence is relatively poor at present; As place outdoor ATM cash dispenser; Therefore these electronic equipments need have stronger impact resistance; But the impact resistance of the electronic equipment of fitting by optical cement at present a little less than, can't satisfy the demand of people to this class of electronic devices impact resistance.
So in order to promote the impact resistance of electronic equipment, the industry utmost point needs a kind of electronic equipment that the reinforcement version is cohered glue that has now, solves the disappearance that exists in the above-mentioned known techniques.
Summary of the invention
The utility model provides a kind of electronic installation with bonding structure, has physics and the close-burning solid-state glue that coheres of chemistry simultaneously by selecting for use, makes this electronic installation have stronger impact resistance.
The utility model provides a kind of electronic installation with bonding structure, comprises:
One first substrate;
One second substrate; And
One solid-state gluing layer is arranged between this first substrate and this second substrate, and this solid-state gluing layer forms a chemical bonds key and this first substrate and this second substrate are bonded together with this first substrate and this second substrate respectively.
Adopt the electronic product of the technology production of the utility model; Because selecting for use, it has physics and the close-burning solid-state glue that coheres of chemistry simultaneously; Make this electronic installation have stronger impact resistance; The cost of material is low than the adhesive glue of using traditionally for the material cost of this solid-state adhesion glue simultaneously, thereby also can further reduce production cost.
Description of drawings
Fig. 1 is the sketch map of the electronic installation with bonding structure of the invention; And
Fig. 2 A to 2D is the continuous sketch map of manufacturing approach of the electronic installation with bonding structure of the invention.
Embodiment
Have the knack of under the utility model as one of technical field art and can further understand the utility model for making; The hereinafter spy enumerates the preferred embodiment of the utility model; And cooperating appended graphicly, the effect reached is desired by constitution content and the institute that specifies the utility model.
The electronic installation with bonding structure shown in Fig. 1 comprises: one first substrate 12, one second substrate 14 and a solid-state gluing layer 16.Wherein, Electronic installation for example is a contactor control device, and then first substrate 12 is a touch base plate, and this first substrate 12 comprises first surface 121 and second surface 122; One touch-control sensing assembly is formed at the first surface 121 of this first substrate 12, and 122 of its second surfaces and second substrate 14 are fitted.This touch-control sensing assembly can be capacitance touching control inductive component or electric resistance touch-control inductive component.In one embodiment, this capacitance touching control inductive component comprises the induction electrode of vertical axial and horizontal axis.
Solid-state gluing layer 16 is arranged between first substrate 12 and second substrate 14; Solid-state gluing layer 16 is except itself has viscosity; Also with the contact surface generation chemical reaction of first substrate 12 and second substrate 14; Be that the hydrogen bond of solid-state adhesion layer 16 combines with the hydrogen bond of first substrate and second substrate and forms the chemical bonds key, and then form cohesive force, win substrate 12 and second substrate 14 are bonded together by this solid-state gluing layer 16.
Solid-state gluing layer 16 is a solid-state adhesion glue, for example is polyvinyl butyral resin (PVB) solid-state adhesion glue.The hot strength of this solid-state gluing layer 16 is more than or equal to 200kg/cm
2, shrinkage is less than 3%, and these characteristics make this solid-state gluing layer 16 have good viscosity, toughness and elasticity.
When first substrate 12 was touch base plate, second substrate 14 can be the loam cake substrate, and this second substrate 14 has first surface 141 and second surface 142, and wherein the second surface 122 of the first surface 141 and first substrate 12 is fitted.In one embodiment, this first substrate 12 and second substrate 14 are glass substrate.In another embodiment, this electronic installation is a display unit, and this first substrate is a display floater, and second substrate is optical modules such as polaroid or filter.
Because this solid-state adhesion layer 16 not only has good physical behavior, like good viscosity, toughness and elasticity; And chemical reactions also can take place with first substrate 12 and second substrate 14 and form cohesive forces in this solid-state adhesion layer 16, and win substrate 12 and second substrate 14 can be bonded together securely, the electronic installation in the prior art; The impulsive force that can bear at most is no more than 12 joules; The electronic installation of the utility model can bear higher impact force, and for example can bear 20 joules impulsive force at least, in addition; Even this electronic product is clashed when broken; Solid-state adhesion layer 16 will absorb significant amount of energy, fragment is firmly sticked on this solid-state adhesion layer 16, and can not disperse.
Fig. 2 A to 2D shows the continuous sketch map of the manufacturing approach of the electronic installation with bonding structure, and the assembly among Fig. 2 A to 2D is to use identical element numbers with the identical person of assembly among Fig. 1.
Manufacturing approach with electronic installation of bonding structure comprises the following step: a solid-state gluing layer 16 is set between one first substrate 12 and one second substrate 14; Form a chemical bonds key between the solid-state gluing layer 16 and first substrate 12 and between the solid-state gluing layer 16 and second substrate 14.The processing procedure that forms this chemical bonds key comprises heats and pressurizes processing procedure.Wherein, this chemical bonds key is to do link with hydrogen bond.
In Fig. 2 A, prepare second substrate 14, in one embodiment, second substrate 14 is put on the tool 20, and this tool 20 is used for fixing the position of second substrate 14, makes it when fitting, and can not slide.In Fig. 2 B, put solid-state gluing layer 16 on second substrate 14, wherein, solid-state gluing layer 16 is can be the polyvinyl butyral resin gluing layer.The hot strength that this solid-state gluing layer 16 has is more than or equal to 200kg/cm
2And its shrinkage is less than 3%.
In Fig. 2 C, put first substrate 12 on solid-state gluing layer 16, and aim at and fixing first substrate 12, solid-state gluing layer 16 and second substrate 14 by tool 20 location.
In Fig. 2 D, first substrate 12, the solid-state gluing layer 16 that fix are put into a vacuum packaging bag 22 with second substrate 14 together with tool 20, and carried out vacuum packaging by a vacuum packing machine (not shown).
Then, carry out a cold-draw and heat and take out processing procedure, utilize pressure reduction that the air that reaches between the solid-state gluing layer 16 and first substrate 12 between the solid-state gluing layer 16 and second substrate 14 is discharged.The decompression vacuum pumping degree is more than the 650mmHg, and the cold-draw temperature is below 25 ℃, and the cold-draw time is more than 15 minutes, and substrate surface temperature need reach 70-120 ℃ when heat was taken out, and it is more than 30 minutes that heat is found time.
Packaged first substrate 12, solid-state gluing layer 16 are put into a pressure furnace (not shown) with second substrate 14 together with tool 20, seal the high pressure fire door after inserting pressure furnace, heat up earlier and make the pressure furnace internal temperature reach 45 ℃, then warming and pressurizing simultaneously.Programming rate is controlled at 5 ℃/minute, and pressing speed was controlled at 0.06MPa/ minute.Treat that temperature reaches 120-140 ℃, when pressure reaches 1.0-1.5MPa, beginning heat-insulation pressure keeping 30-60 minute.Pressurize is cooled to 45 ℃ then, and last removal pressure furnace internal pressure is promptly accomplished the high-pressure molding process to atmospheric pressure.Temperature when pressurization, release must be controlled well in strictness, produces bubble to avoid substrate edges portion.Therefore; First substrate 12, solid-state gluing layer 16 and second substrate 14 pressurize and heat by pressure furnace to form the chemical bonds key between solid-state gluing layer 16 and first substrate 12 and between the solid-state gluing layer 16 and second substrate 14, for example the formation of the hydrogen bond between the COH base of the SIOH in the substrate of glass and this gluing layer chemical bonds key.
Then; Remove the vacuum packaging bag 22 of packing first substrate 12, solid-state gluing layer 16, second substrate 14 and tool 20; And remove tool 20, and for example remove the unnecessary solid-state gluing layer 16 in the edge of first substrate 12 and second substrate 14 to accomplish attaching process with blade.
In conventional art; The physical characteristic of general using optical cement itself is cohered two assemblies; But under bigger external impact force, the physical characteristic of utilizing optical cement itself is to cohere two assemblies securely, and the anti-impact force that can bear is very limited; And the utility model select for use have simultaneously physics with the chemistry the close-burning solid-state glue that coheres, make electronic installation have stronger cohesive force and impact resistance.
Compare with the solid state optics glue of convention; For example; Pressure-sensing glue (PSA), thus it is to make glass substrate and solid state optics glue produce distortion through pressure the bubble between glass substrate and the solid-state glue is extruded, but when fitting, be difficult for producing distortion for the large-size glass substrate of some thickenings; Cause bubble to extrude fully, and cause the product yield not high; The invention adopts cold-draw heat to take out and technology applying glass such as warming and pressurizing, does not need the glass substrate distortion just can bubble to be discharged, thereby the invention can be suitable for fitting glass substrate of size dimension, for example, and the product of its 23 inch of can fitting.
Moreover the cost of material is low for the PVB glue that the invention is adopted, and is merely 1/20th of present touch screen field applying optical cement material cost, so the invention can reduce the manufacturing cost of product.
The electronic product that the technology that adopts in the face of the invention is down produced like contact panel, is carried out the impact resistance test; Wherein, Sample 1 is traditional contact panel, the contact panel of sample 2 for adopting the invention technology to produce, and first substrate of sample 1 and sample 2 is all identical with thickness with the material of second substrate; Be that material is a glass, the thickness of first substrate and second substrate is 3.2mm and 4.0mm; Unique difference of sample 1 and sample 2 is to be positioned at that first substrate is different with the tack coat in the middle of second substrate, and sample 1 is traditional adhesive glue such as PSA glue, and sample 2 is the adhesive glue such as the PVB glue of the invention employing.This test mainly be through a bead from this sample of certain height drop impact 1 and sample 2, the height when measuring samples 1 is damaged with sample 2, and then draw the power of impact resistance.Test result is seen below table 1 and table 2.Table 1 is sample 1 a ball falling impact experimental result table, and table 2 is sample 2 ball falling impact experimental result tables, the test result of comparison sheet 1 and table 2; Can find; When bead when 40cm highly falls, sample 1 damages, and bead is when the height of 50cm to 125cm falls; Sample 2 is still intact, so but the impact strength of the electronic installation with bonding structure through this test knowledge capital utility model is about 3 times of impact strength that are higher than conventional art.
Table 1: sample 1 ball falling impact experimental result table
Table 2: sample 2 ball falling impact experimental result tables
The advantage of the invention provides a kind of electronic installation and manufacturing approach thereof with bonding structure, has physics and the close-burning solid-state glue that coheres of chemistry simultaneously by selecting for use, makes this electronic installation have stronger impact resistance, and can reduce material cost.
The above is merely the preferred embodiment of the utility model; Not in order to restriction the utility model; All within the spirit and principle of the utility model, any modification of being made, be equal to replacement, improvement etc., all should be included within the scope of the utility model protection.
Claims (8)
1. the electronic installation with bonding structure is characterized in that, comprises:
One first substrate;
One second substrate; And
One solid-state gluing layer is arranged between this first substrate and this second substrate, and this solid-state gluing layer forms a chemical bonds key and this first substrate and this second substrate are bonded together with this first substrate and this second substrate respectively.
2. the electronic installation with bonding structure according to claim 1 is characterized in that, this chemical bonds key is to do link with hydrogen bond.
3. the electronic installation with bonding structure according to claim 1 is characterized in that, this solid-state gluing layer is the polyvinyl butyral resin gluing layer.
4. the electronic installation with bonding structure according to claim 1 is characterized in that, the hot strength that this solid-state gluing layer has is more than or equal to 200kg/cm
2
5. the electronic installation with bonding structure according to claim 1 is characterized in that the shrinkage of this solid-state gluing layer is less than 3%.
6. the electronic installation with bonding structure according to claim 1 is characterized in that, this electronic installation is a contactor control device, and this first substrate is a touch base plate, and this touch base plate comprises a touch-control sensing assembly, and this second substrate is the loam cake substrate.
7. the electronic installation with bonding structure according to claim 6 is characterized in that, this touch-control sensing assembly is capacitance touching control inductive component or electric resistance touch-control inductive component.
8. the electronic installation with bonding structure according to claim 1 is characterized in that, this electronic installation is a display unit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204060821U CN202276579U (en) | 2011-10-15 | 2011-10-15 | Electronic device with bonding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204060821U CN202276579U (en) | 2011-10-15 | 2011-10-15 | Electronic device with bonding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202276579U true CN202276579U (en) | 2012-06-13 |
Family
ID=46196908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204060821U Expired - Lifetime CN202276579U (en) | 2011-10-15 | 2011-10-15 | Electronic device with bonding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202276579U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013053212A1 (en) * | 2011-10-15 | 2013-04-18 | Optera Technology (Xiamen) .Co. Ltd | Electronic device with laminated structure and manufacturing method thereof |
-
2011
- 2011-10-15 CN CN2011204060821U patent/CN202276579U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013053212A1 (en) * | 2011-10-15 | 2013-04-18 | Optera Technology (Xiamen) .Co. Ltd | Electronic device with laminated structure and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160512 Address after: 361009 Fujian Province, Xiamen torch hi tech Zone information photoelectric park is Sakamoto Road No. 199 Patentee after: TPK Touch Solutions (Xiamen) Inc. Address before: 361009 No. 195, Sakamoto Road, information photoelectric Park, torch hi tech Zone, Fujian, Xiamen Patentee before: Optera Technology Xiamen Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120613 |