CN201408286Y - Novel coaxial imaging system for LED laser cutting device - Google Patents
Novel coaxial imaging system for LED laser cutting device Download PDFInfo
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- CN201408286Y CN201408286Y CN 200920045235 CN200920045235U CN201408286Y CN 201408286 Y CN201408286 Y CN 201408286Y CN 200920045235 CN200920045235 CN 200920045235 CN 200920045235 U CN200920045235 U CN 200920045235U CN 201408286 Y CN201408286 Y CN 201408286Y
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Abstract
The utility model relates to a novel coaxial imaging system for LED laser cutting device, which comprises a coaxial LED point light source module group, a 45-degree total reflection mirror, a wide-angle CCD module group, a first 45-degree spectroscope, a small-visual-field high-rate upper CCD module group, a second 45-degree spectroscope, a wavelength selection mirror, an LED ring-shaped light source, a focusing lens, a small-visual-field high-rate lower CCD module group; the coaxial LED point light source module group, the wide-angle CCD module group and the small-visual-field high-rate upperCCD module group are arranged side by side from up to down; the wavelength selection mirror is arranged between the upper CCD module group and the focusing lens; the LED ring-shaped light source clings to the focusing lens; the focusing lens just faces the workpiece; and the small-visual-field high-rate lower CCD module group is installed under the workpiece. The novel coaxial imaging system forLED laser cutting device realizes the coaxial real-time imaging positioning function in the LED laser cutting device, the combined use of the wide-angle CCD and the small-visual-field high-rate upperCCD realizes the measurement precision of micron-scale; the convenient switching of the small-visual-field high-rate upper CCD and the small-visual-field high-rate lower CCD meets the requirements offront-cutting, back-cutting, surface roughening, and the cutting of the back aluminum plating wafer.
Description
Technical field
The utility model relates to a kind of image optical system, relates in particular to the coaxial image system that is applied in the LED laser cutting device, belongs to the laser accurate processing technique field.
Background technology
The LED laser cutting device is a kind of specialized laser devices that is used for the cutting of Sapphire Substrate GaN blue-ray LED wafer, the blue-ray LED wafer normally by adopting vapour phase to become long-pending technology growing GaN crystal on sapphire substrate, adopts screen printing technique to add top electrode at last on wafer and forms the LED luminescence unit that several have independent lighting function.
At present, blue-ray LED wafer cutting equipment upgrades to cut from the diamond tool cutting gradually.Adopt the non-contact type Laser Processing, equipment must possess the accurate localization function, and general LED wafer is reserved the wide 20～30um that is about of Cutting Road, even narrow to 15um, therefore and Laser Processing influences live width near 10um, requires the measuring accuracy of image system need reach the fineness of micron dimension.General blue-ray LED wafer cutting mode has the tangent and the back of the body to cut dual mode, tangent is that laser is from the incision of GaN luminescent material surface, the back of the body is cut then and is cut from the sapphire substrates material surface, and the Cutting Road generally labeling is at the upper surface of wafer, therefore cut function and need system to possess last image and the coaxial observing function of play image in order to possess the tangent and the back of the body simultaneously, cutting for image system for surface coarsening and the wafer of carrying on the back the type of aluminizing in addition also is a major challenge.
In order to overcome the above-mentioned problem of mentioning of blue-ray LED wafer diced system, satisfy the needs of blue-ray LED wafer cutting, be badly in need of developing one and overlap coaxial image system targetedly.
Summary of the invention
The purpose of this utility model is to overcome the deficiency that prior art exists, a kind of coaxial image system that is applicable to blue-ray LED wafer laser cutting equipment is provided, be intended to effectively to solve the real-time micron dimension image positioning function of blue-ray LED wafer cutting and satisfy that tangent, the back of the body are cut, functional requirement such as surface coarsening and the back of the body are aluminized, satisfy the requirement of blue-ray LED wafer cutting volume production.
The purpose of this utility model is achieved through the following technical solutions:
A kind of new application is in the coaxial image system of LED laser cutting device, comprise coaxial LED pointolite module, 45 degree total reflective mirrors, wide-angle CCD module, the one 45 degree spectroscope, CCD module on the low coverage high magnification, the 2 45 degree spectroscope, wavelength-selective mirror, the LED annular light source, focus lamp, CCD module under the low coverage high magnification, characteristics are: described coaxial LED pointolite module, CCD module three arranges from top to bottom side by side on wide-angle CCD module and the low coverage high magnification, wavelength-selective mirror is installed between CCD module and the focus lamp, the LED annular light source is close on the focus lamp, focus lamp is right against workpiece, and CCD module under the low coverage high magnification is being installed below the workpiece;
The lighting source of described coaxial LED pointolite module output forms vertical irradiation from top to bottom by 45 degree total reflective mirrors, sees through the one 45 degree spectroscope, the 2 45 degree spectroscope, wavelength-selective mirror and focus lamp successively with workpiece projection imaging CCD module under the low coverage high magnification;
The lighting source of described LED annular light source outgoing reflects line focus mirror, wavelength-selective mirror, the 2 45 degree spectroscope and the one 45 degree spectroscope with surface of the work and images in wide-angle CCD module;
The lighting source of CCD module outgoing sees through focus lamp, wavelength-selective mirror and the 2 45 degree spectroscope respectively with the workpiece projection and images in CCD module on the low coverage high magnification under the described low coverage high magnification.
Further, above-mentioned a kind of new application is in the coaxial image system of LED laser cutting device, and wherein, described coaxial LED pointolite module is furnished with optics collimator.
Further, above-mentioned a kind of new application is in the coaxial image system of LED laser cutting device, and wherein, described the one 45 degree spectroscope and the spectroscopical reflection and transmission ratio of the 2 45 degree are 1: 1.
Again further, above-mentioned a kind of new application is in the coaxial image system of LED laser cutting device, wherein, the CCD module comprises the three-dimensional micropositioning stage of X-Y-Z, following CCD and second high-power LED light source under the described low coverage high magnification, the following CCD and second high-power LED light source are installed on the three-dimensional micropositioning stage of X-Y-Z, and second high-power LED light source is coaxial with following CCD.
The substantive distinguishing features of technical solutions of the utility model and progressive being mainly reflected in:
The utility model is implemented in the coaxial real-time imaging positioning function in the LED laser cutting device, CCD is used in combination the measurement fineness that realizes micron dimension on wide-angle CCD and the low coverage high magnification, on the low coverage high magnification under CCD and the low coverage high magnification the convenient switching of CCD satisfy tangent, the back of the body is cut, surface coarsening and the back of the body are aluminized wafer cutting, on wide-angle CCD, the low coverage high magnification under CCD and the low coverage high magnification CCD all be equipped with three-dimensional fine adjustment function and realize ccd image and laser coaxial blur-free imaging.The utility model design is unique, function is remarkable, ease in use, be rated as have novelty, the good technology of creativeness, practicality, application prospect is boundless.
Description of drawings
Below in conjunction with accompanying drawing technical solutions of the utility model are described further:
Fig. 1: the structural representation of the utility model coaxial image system;
Fig. 2: the structural representation of coaxial LED pointolite module;
Fig. 3: the structural representation of wide-angle CCD module;
Fig. 4: the structural representation of CCD module on the low coverage high magnification;
Fig. 5: the structural representation of CCD module under the low coverage high magnification.
The implication of each Reference numeral sees the following form among the figure:
| Reference numeral | Implication | Reference numeral | Implication | | Implication | |
| 1 | Coaxial |
2 | 45 degree total |
3 | Wide- |
|
| 4 | The one 45 |
5 | CCD module on the low coverage |
6 | The 2 45 |
|
| 7 | Wavelength- |
8 | The LED annular light source | 9 | |
|
| 10 | CCD module under the low coverage high magnification | 11 | |
12 | First high-power |
|
| 13 | The first two- |
14 | The first focal |
15 | Wide- |
|
| 16 | The second two- |
17 | The second focal |
18 | Last CCD |
| Reference numeral | Implication | Reference numeral | Implication | Reference | Implication | |
| 19 | The three-dimensional micropositioning stage of |
20 | Following |
20 | Second high-power LED light source | |
| A | Laser instrument | B | Workpiece |
Embodiment
As shown in Figure 1, be applied to the coaxial image system of LED laser cutting device, comprise coaxial LED pointolite module 1,45 degree total reflective mirrors 2, wide-angle CCD module 3, the one 45 degree spectroscope 4, CCD module 5 on the low coverage high magnification, the 2 45 degree spectroscope 6, wavelength-selective mirror 7, LED annular light source 8, focus lamp 9, CCD module 10 under the low coverage high magnification, coaxial LED pointolite module 1, CCD module 5 threes arrange from top to bottom side by side on wide-angle CCD module 3 and the low coverage high magnification, wavelength-selective mirror 7 is installed between CCD module 5 and the focus lamp 9, LED annular light source 8 is close on the focus lamp 9, focus lamp 9 is right against workpiece B, and CCD module 10 under the low coverage high magnification is being installed below the workpiece B.Wherein, form vertical irradiation from top to bottom from the lighting source of coaxial LED pointolite module 1 output by 45 degree total reflective mirrors 2, see through the one 45 degree spectroscope the 4, the 2 45 degree spectroscope 6, wavelength-selective mirror 7 and focus lamp 9 successively workpiece projection imaging CCD module 10 under the low coverage high magnification.From the lighting source of LED annular light source 8 outgoing surface of the work is reflected line focus mirror 9, wavelength-selective mirror the 7, the 2 45 degree spectroscope 6 and the one 45 degree spectroscope 4 and image in wide-angle CCD module 3.The lighting source of CCD module 10 outgoing sees through focus lamp 9, wavelength-selective mirror 7 and the 2 45 degree spectroscope 6 successively with the workpiece projection and images in CCD module 5 on the low coverage high magnification under the low coverage high magnification.
It should be noted that coaxial LED pointolite module 1 is furnished with optics collimator, guarantee that the spot diameter that led light source shines workplace is controlled in the 3mm, and light source is shone from top to bottom by one 45 degree total reflective mirror.Wide-angle CCD module 3 has the big characteristics of field of view, finds a view from top to bottom by one 45 degree spectroscope.The reflection and transmission ratio of the one 45 degree spectroscope 4 and the 2 45 degree spectroscope 6 is 1: 1.The 355nm laser of 7 pairs of laser instrument A outputs of wavelength-selective mirror carries out 45 degree and is all-trans, and to the led light source full impregnated.
As shown in Figure 2, coaxial LED pointolite module 1 comprises first high-power LED light source 12 and optics collimator 11, the front end of first high-power LED light source 12 of 3w is furnished with optics collimator 11, and assurance lighting source directional light is exported and is controlled in the 3mm at the working face spot diameter.
As shown in Figure 3, wide-angle CCD module 3 comprises the first two-dimentional trimming part 13, the first focal length trimming part 14 and wide-angle CCD15, wide-angle CCD15 front end is equipped with the first focal length trimming part 14 and the first two-dimentional trimming part 13 successively, wherein the first focal length trimming part 14 is realized the fine adjustment function of CCD axial focal length, the first two-dimentional trimming part 13 is realized the fine adjustment function of ccd image two dimensional surface, realizes ccd image and laser coaxial blur-free imaging by the first focal length trimming part 14 and the first two-dimentional trimming part 13.
As shown in Figure 4, CCD module 5 comprises the second two-dimentional trimming part 16, the second focal length trimming part 17 and last CCD18 on the low coverage high magnification, last CCD18 front end is equipped with the second focal length trimming part 17 and the second two-dimentional trimming part 16 successively, wherein the second focal length trimming part 17 is realized the fine adjustment function of CCD axial focal length, the second two-dimentional trimming part 16 is realized the fine adjustment function of ccd image two dimensional surface, realizes ccd image and laser coaxial blur-free imaging by the second focal length trimming part 17 and the second two-dimentional trimming part 16.CCD module 5 is found a view from top to bottom by one 45 degree spectroscope on the low coverage high magnification.
As shown in Figure 5, CCD module 10 comprises the three-dimensional micropositioning stage 19 of X-Y-Z, following CCD20 and second high-power LED light source 21 under the low coverage high magnification, the following CCD20 and second high-power LED light source 21 are installed on the three-dimensional micropositioning stage 19 of X-Y-Z, it is coaxial that second high-power LED light source 21 and following CCD20 remain, and 19 pairs of following CCD images of the three-dimensional micropositioning stage of X-Y-Z are realized focal lengths fine setting and two dimensional image center fine adjustment function.Mouthful installation filter plate of finding a view of CCD module 10 under the low coverage high magnification.
In sum, the utility model is implemented in the coaxial real-time imaging positioning function in the LED laser cutting device, CCD is used in combination the measurement fineness that realizes micron dimension on wide-angle CCD and the low coverage high magnification, on the low coverage high magnification under CCD and the low coverage high magnification the convenient switching of CCD satisfy tangent, the back of the body is cut, surface coarsening and the back of the body are aluminized wafer cutting, on wide-angle CCD, the low coverage high magnification under CCD and the low coverage high magnification CCD all be equipped with three-dimensional fine adjustment function and realize ccd image and laser coaxial blur-free imaging.The utility model modern design, simple and easy being suitable for has excellent economic and social effect.
Below only be concrete exemplary applications of the present utility model, protection domain of the present utility model is not constituted any limitation.All employing equivalents or equivalence are replaced and the technical scheme of formation, all drop within the utility model rights protection scope.
Claims (4)
1. a new application is in the coaxial image system of LED laser cutting device, comprise coaxial LED pointolite module (1), 45 degree total reflective mirrors (2), wide-angle CCD module (3), the one 45 degree spectroscope (4), CCD module (5) on the low coverage high magnification, the 2 45 degree spectroscope (6), wavelength-selective mirror (7), LED annular light source (8), focus lamp (9), CCD module (10) under the low coverage high magnification, it is characterized in that: described coaxial LED pointolite module (1), CCD module (5) three arranges from top to bottom side by side on wide-angle CCD module (3) and the low coverage high magnification, wavelength-selective mirror (7) is installed between CCD module (5) and the focus lamp (9), LED annular light source (8) is close on the focus lamp (9), focus lamp (9) is right against workpiece, and CCD module (10) under the low coverage high magnification is being installed below the workpiece;
The lighting source of described coaxial LED pointolite module (1) output forms vertical irradiation from top to bottom by 45 degree total reflective mirrors (2), sees through the one 45 degree spectroscope (4), the 2 45 degree spectroscope (6), wavelength-selective mirror (7) and focus lamp (9) successively with workpiece projection imaging CCD module (10) under the low coverage high magnification;
The lighting source of described LED annular light source (8) outgoing reflects line focus mirror (9), wavelength-selective mirror (7), the 2 45 degree spectroscope (6) and the one 45 degree spectroscope (4) with surface of the work and images in wide-angle CCD module (3);
The lighting source of CCD module (10) outgoing sees through focus lamp (9), wavelength-selective mirror (7) and the 2 45 degree spectroscope (6) with the workpiece projection and images in CCD module (5) on the low coverage high magnification under the described low coverage high magnification.
2. a kind of new application according to claim 1 is characterized in that in the coaxial image system of LED laser cutting device: described coaxial LED pointolite module (4) is furnished with optics collimator.
3. a kind of new application according to claim 1 is characterized in that in the coaxial image system of LED laser cutting device: the reflection and transmission ratio of described the one 45 degree spectroscope (4) and the 2 45 degree spectroscope (6) is 1: 1.
4. a kind of new application according to claim 1 is in the coaxial image system of LED laser cutting device, it is characterized in that: CCD module (10) comprises the three-dimensional micropositioning stage (19) of X-Y-Z, following CCD (20) and second high-power LED light source (21) under the described low coverage high magnification, following CCD (20) and second high-power LED light source (21) are installed on the three-dimensional micropositioning stage of X-Y-Z (19), and second high-power LED light source (21) is coaxial with following CCD (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920045235 CN201408286Y (en) | 2009-05-12 | 2009-05-12 | Novel coaxial imaging system for LED laser cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920045235 CN201408286Y (en) | 2009-05-12 | 2009-05-12 | Novel coaxial imaging system for LED laser cutting device |
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| Publication Number | Publication Date |
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| CN201408286Y true CN201408286Y (en) | 2010-02-17 |
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| CN 200920045235 Expired - Fee Related CN201408286Y (en) | 2009-05-12 | 2009-05-12 | Novel coaxial imaging system for LED laser cutting device |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102091866A (en) * | 2010-12-29 | 2011-06-15 | 中国电子科技集团公司第四十五研究所 | Processing visual device for light-emitting diode (LED) laser cutting-up machine |
| CN101559629B (en) * | 2009-05-12 | 2011-08-17 | 苏州德龙激光有限公司 | Coaxial image system applied to LED laser cutting device |
| CN104972229A (en) * | 2014-04-07 | 2015-10-14 | 株式会社迪思科 | Unevenness detecting device |
| CN104999178A (en) * | 2015-08-15 | 2015-10-28 | 岳睿 | Laser welding device carrying multiple sensors |
| CN106077959A (en) * | 2016-07-06 | 2016-11-09 | 中国电子科技集团公司第四十五研究所 | Laser scribing method for GPP wafer bottom alignment |
| US11534860B2 (en) * | 2017-02-13 | 2022-12-27 | Precitec Gmbh & Co. Kg | Method for identifying joining points of workpieces and laser machining head comprising a device for carrying out this method |
-
2009
- 2009-05-12 CN CN 200920045235 patent/CN201408286Y/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101559629B (en) * | 2009-05-12 | 2011-08-17 | 苏州德龙激光有限公司 | Coaxial image system applied to LED laser cutting device |
| CN102091866A (en) * | 2010-12-29 | 2011-06-15 | 中国电子科技集团公司第四十五研究所 | Processing visual device for light-emitting diode (LED) laser cutting-up machine |
| CN104972229A (en) * | 2014-04-07 | 2015-10-14 | 株式会社迪思科 | Unevenness detecting device |
| CN104972229B (en) * | 2014-04-07 | 2018-01-23 | 株式会社迪思科 | Asperity detection device |
| CN104999178A (en) * | 2015-08-15 | 2015-10-28 | 岳睿 | Laser welding device carrying multiple sensors |
| CN104999178B (en) * | 2015-08-15 | 2017-05-03 | 龙光电子集团有限公司 | Laser welding unit with multiple sensors |
| CN106077959A (en) * | 2016-07-06 | 2016-11-09 | 中国电子科技集团公司第四十五研究所 | Laser scribing method for GPP wafer bottom alignment |
| US11534860B2 (en) * | 2017-02-13 | 2022-12-27 | Precitec Gmbh & Co. Kg | Method for identifying joining points of workpieces and laser machining head comprising a device for carrying out this method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: JIANGYIN DELI LASER INSTRUMENT CO., LTD. Free format text: FORMER OWNER: JIANGYIN DEFEI LASER INSTRUMENT CO., LTD. |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20110706 Address after: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Co-patentee after: Jiangyin Deli Laser Equipment Co., Ltd. Patentee after: Suzhou Delphi Laser Co., Ltd. Address before: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Co-patentee before: Jiangyin Defei Laser Equipment Co., Ltd. Patentee before: Suzhou Delphi Laser Co., Ltd. |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Patentee after: Suzhou Delphi Laser Co., Ltd. Patentee after: Jiangyin Deli Laser Equipment Co., Ltd. Address before: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Patentee before: Suzhou Delphi Laser Co., Ltd. Patentee before: Jiangyin Deli Laser Equipment Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100217 Termination date: 20120512 |