CN201315318Y - Conductor frame structure - Google Patents

Abstract

A lead frame structure includes a lead frame frame and a plurality of lead regions arranged in the lead frame frame. Wherein, each wire area includes: two supporting legs, the two ends of which are respectively connected to the lead frame frame; a plastic base, arranged between the supporting legs; a plurality of pins, from any one of the plastic base extending laterally to the supporting legs of the adjacent lead area; and a stress buffer connecting the pins to the supporting legs of the adjacent lead area. The beneficial effect of the utility model is that: the improved stress buffering part can absorb shrinkage stress. In the utility model, a buffer member is arranged between the end of the pin and the support leg to release stress and contraction. The utility model not only solves the phenomenon that the lead frame does not warp, but also does not need to change the original mold, thereby reducing the cost of product improvement.

Description

Lead frame structure

technical field

The utility model relates to an improvement of a lead frame structure.

Background technique

Please refer to FIG. 1A and FIG. 1B , in the existing lead frame structure, a plastic base 130 is formed by injection molding plastic on the lead frame, and chips are disposed in the chip carrying area 113 of the plastic base 130 . However, due to the effect of stress shrinkage, the lead frame will be warped. Therefore, as shown in FIG. 1A , in order to eliminate the shrinkage stress, holes 111 can be added at the feet 121 of the lead frame. However, this approach must change the original mold. In addition, the pin 124 and the leg 121 can also be cut apart to retain a buffer seam 142 to release the shrinkage stress, as shown in FIG. 1B .

Utility model content

In order to solve the above problems, one of the purposes of the present invention is to provide a lead frame structure, which releases the stress contraction by providing a buffer member between the end of the lead and the leg.

In order to achieve the above purpose, a lead frame structure according to an embodiment of the present invention includes a lead frame body and a plurality of lead regions disposed in the lead frame frame. Wherein, each wire area includes: two supporting legs, the two ends of which are respectively connected to the frame of the lead frame; a plastic base, arranged between the supporting legs; a plurality of pins, from any One side extends toward the supporting leg of the adjacent wire area; and a stress buffer part, which connects the lead and the supporting leg of the adjacent wire area.

Through the above technical features, the beneficial effect of the utility model is that the improved stress buffering part can absorb the shrinkage stress. In the utility model, a buffer member is arranged between the end of the pin and the support leg to release stress and contraction. The utility model solves the problem that the lead frame does not warp, and at the same time does not need to change the original mold, thereby reducing the improvement cost of the product.

Description of drawings

1A and 1B are schematic diagrams of a conventional lead frame structure.

2A and 2B are schematic diagrams according to an embodiment of the present invention.

Fig. 3 is a schematic diagram according to different embodiments of the present invention.

Explanation of main component symbols

111 hole 113 Chip carrying area 121 feet 124 pin 130 plastic base 10 Lead frame frame 12 wire area 20 Support feet 30 plastic base 32 Chip carrying area 40 pin 50 stress buffer

Detailed ways

2A and 2B are schematic diagrams according to an embodiment of the present invention. The lead frame structure includes: a lead frame body 10 and a plurality of lead regions 12 disposed in the lead frame body 10 . In this embodiment, each wire area 12 includes: two supporting legs 20 ; a plastic base 30 ; and a plurality of pins 40 .

Wherein, both ends of the supporting legs 20 are respectively connected to the lead frame frame 10 . The plastic base 30 is disposed between the supporting legs 20 , and the chip (not shown in the figure) is disposed in the chip carrying area 32 of the plastic base 30 . Pins 40 extend from either side of the plastic base 30 toward the support feet 20 of the adjacent lead area 12 . The lead frame body 10 , the supporting legs 20 and the pins 40 are integrally formed by a metal base material.

The utility model is characterized in that a stress buffer 50 is provided between the pin 40 and the supporting leg 20 of the adjacent wire area 12 to connect the pin 40 and the supporting leg 20 . The stress buffer 50 can absorb shrinkage stress. The utility model arranges a buffer member between the end of the pin 40 and the support leg 20 to release the stress shrinkage.

Please refer to FIG. 2A and FIG. 3 , in one embodiment, the stress buffering portion 50 may be a bent structure, such as L-shape, ㄇ-shape, W-shape, S-shape or a combination thereof. In one embodiment, the stress buffer portion 50 may be a wide and narrow staggered structure, such as a Y shape, a trapezoid shape, a saw ruler shape or a combination thereof. In addition, in one embodiment, the stress buffering portion 50 has at least one opening, such as a circular, square, polygonal, or irregular hole.

The above-described embodiments are only to illustrate the technical ideas and characteristics of the present utility model, and its purpose is to enable those skilled in the art to understand the content of the present utility model and implement it accordingly; rather than to limit the patent scope of the present utility model . All equivalent changes or modifications made according to the spirit disclosed in the utility model should still be understood as being included in the patent scope of the utility model.

Claims (8)

1. conducting wire frame structure, it comprises a lead frame framework and a plurality of conductor sections that are arranged in this lead frame framework, it is characterized in that each described conductor section comprises respectively:

Two are supported leg, and its two ends are connected with described lead frame framework respectively;

One plastic feet is arranged between the described support leg;

A plurality of pins extend from the either side of the described plastic feet support leg to the adjacent wires district; And

One stress buffer portion connects the support leg in described pin and adjacent wires district.

2. conducting wire frame structure as claimed in claim 1 is characterized in that, the integrated formed structure that described lead frame framework, support leg and pin are made in one-body molded mode by metal base.

3. conducting wire frame structure as claimed in claim 1 is characterized in that, described stress buffer portion is a bending structure.

4. conducting wire frame structure as claimed in claim 3 is characterized in that, described bending structure is L shaped, ㄇ shape, W shape, S shape or above combination.

5. conducting wire frame structure as claimed in claim 1 is characterized in that, described stress buffer portion is a width cross structure.

6. conducting wire frame structure as claimed in claim 5 is characterized in that, described width cross structure is Y shape, trapezoidal, saw chi shape or above combination.

7. conducting wire frame structure as claimed in claim 1 is characterized in that, described stress buffer portion has at least one perforate.

8. conducting wire frame structure as claimed in claim 7 is characterized in that, described perforate is circular, square, polygon or irregularly shaped.

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