CN201204679Y - dustproof microphone - Google Patents
dustproof microphone Download PDFInfo
- Publication number
- CN201204679Y CN201204679Y CNU2008200944963U CN200820094496U CN201204679Y CN 201204679 Y CN201204679 Y CN 201204679Y CN U2008200944963 U CNU2008200944963 U CN U2008200944963U CN 200820094496 U CN200820094496 U CN 200820094496U CN 201204679 Y CN201204679 Y CN 201204679Y
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- Prior art keywords
- dust
- microphone
- proof
- shell
- boron film
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- Expired - Lifetime
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 10
- 229910052796 boron Inorganic materials 0.000 claims description 10
- 238000005516 engineering process Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000000428 dust Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
本实用新型提供了一种新的防尘麦克风,在该麦克风外壳的内表面上设有一层覆盖其上入声孔的防尘网。与现有技术相比,该新的防尘麦克风防尘效果佳、不会增加产品高度、而且能适应表面贴装技术(SMT)的生产工艺。
The utility model provides a new dust-proof microphone, and a layer of dust-proof net covering the upper sound inlet hole is arranged on the inner surface of the microphone shell. Compared with the existing technology, the new dust-proof microphone has good dust-proof effect, does not increase the height of the product, and can adapt to the production process of surface mount technology (SMT).
Description
【技术领域】 【Technical field】
本实用新型涉及一种麦克风,尤其是涉及一种防尘麦克风。The utility model relates to a microphone, in particular to a dustproof microphone.
【背景技术】 【Background technique】
随着无线通讯的发展,全球移动电话用户越来越多,用户对移动电话的要求已不仅满足于通话,而且要能够提供高质量的通话效果,尤其是目前移动多媒体技术的发展,移动电话的通话质量更显重要,移动电话的麦克风作为移动电话的语音拾取装置,其设计好坏直接影响通话质量。With the development of wireless communication, there are more and more mobile phone users around the world. The requirements of users for mobile phones are not only satisfied with calls, but also to be able to provide high-quality call effects. Especially the current development of mobile multimedia technology, the mobile phone Call quality is more important. The microphone of a mobile phone is used as a voice pick-up device for the mobile phone, and its design directly affects the call quality.
为阻止外界灰尘等颗粒进入到麦克风内部而影响麦克风的性能时,传统的防范措施是在麦克风外壳的外表面上粘贴一层覆盖其上入声孔的防尘网。如图1所示,相关麦克风10,在外壳11的外表面上粘贴一层防尘网12,该防尘网12覆盖外壳上的入声孔,以阻止外界灰尘等颗粒进入到麦克风内部。此措施虽然能达到阻止外界灰尘等颗粒进入到麦克风内部的目的,但是却增加了麦克风的高度,占用了更多的空间。In order to prevent particles such as external dust from entering the microphone and affecting the performance of the microphone, the traditional preventive measure is to paste a layer of dust-proof net covering the sound inlet hole on the outer surface of the microphone shell. As shown in FIG. 1 , for the
另,目前的麦克风正逐步向满足兼容表面贴装技术(SMT)的生产工艺要求过渡,而在外壳外表面粘贴的防尘网会影响兼容表面贴装技术的生产过程中的吸取操作。因此,目前,兼容表面贴装器件的SMD麦克风均不能在外壳的外表面粘贴一层防尘网。然而,无此防尘网,产品在回流焊的工艺过程中和使用过程中,均会出现外界灰尘等颗粒物进入到产品内部,从而导致产品性能下降。In addition, the current microphone is gradually transitioning to meet the production process requirements of surface mount technology (SMT), and the dust-proof net pasted on the outer surface of the shell will affect the suction operation in the production process of surface mount technology compatible. Therefore, at present, none of the SMD microphones compatible with surface mount devices can paste a layer of dust-proof net on the outer surface of the housing. However, without this dust-proof net, particles such as external dust will enter the product during the reflow process and use of the product, resulting in a decrease in product performance.
因此,有必要研究一种能达到良好的防尘效果的新型麦克风。Therefore, it is necessary to study a new type of microphone that can achieve a good dust-proof effect.
【实用新型内容】【Content of utility model】
本实用新型需解决的技术问题是克服上述的不足,提供一种防尘效果佳,且能适合SMT生产工艺的新的防尘麦克风。The technical problem to be solved by the utility model is to overcome the above-mentioned deficiencies and provide a new dust-proof microphone with good dust-proof effect and suitable for SMT production process.
根据上述需解决的技术问题,设计了一种防尘麦克风,包括振膜组及收容振膜组的外壳,所述外壳的底部设有入声孔、包括内表面和外表面,所述振膜组包括硼膜环和振膜,硼膜环与外壳内表面相抵接,在外壳的内表面上还设有一层覆盖所述入声孔的防尘网According to the above-mentioned technical problems to be solved, a dust-proof microphone is designed, which includes a diaphragm group and a casing for containing the diaphragm group. The bottom of the casing is provided with a sound inlet hole, including an inner surface and an outer surface. The set includes a boron film ring and a diaphragm, the boron film ring is in contact with the inner surface of the shell, and a dust-proof net covering the sound inlet hole is also arranged on the inner surface of the shell
作为上述发明创造的改进,所述防尘网的直径少于硼膜环的内径;所述防尘网的厚度少于硼膜环的厚度。As an improvement of the above invention, the diameter of the dust-proof net is less than the inner diameter of the boron film ring; the thickness of the dust-proof net is less than the thickness of the boron film ring.
与现有技术相比,本实用新型在外壳的内表面设有一层防尘网,具有防尘效果佳、不会增加麦克风高度的优点,而且能适应表面贴装技术(SMT)的生产工艺。Compared with the prior art, the utility model is provided with a layer of dust-proof net on the inner surface of the shell, which has the advantages of good dust-proof effect and no increase in the height of the microphone, and can adapt to the production process of surface mount technology (SMT).
【附图说明】 【Description of drawings】
图1是本实用新型实施例驻极体麦克风的立体分解图;Fig. 1 is the three-dimensional exploded view of the electret microphone of the embodiment of the present invention;
图2是本实用新型实施例驻极体麦克风装配后的立体示意图;Fig. 2 is a three-dimensional schematic diagram of an assembled electret microphone according to an embodiment of the present invention;
图3是图2中的A-A方向的剖视图;Fig. 3 is the sectional view of A-A direction in Fig. 2;
图4是相关结构驻极体麦克风的全剖示意图。FIG. 4 is a schematic diagram of a full cross-section of an electret microphone with a related structure.
【具体实施方式】 【Detailed ways】
下面结合附图和实施方式对本实用新型作进一步说明。Below in conjunction with accompanying drawing and embodiment the utility model is further described.
如图1、图2、图3所示,本实用新型实施例防尘麦克风20,包括外壳21和收容于外壳21内的振膜组22、垫片23、与振膜组22相对且被垫片23分隔的背极板24、用以收容背极板24和连接环26的背极座25、与连接环26相连的电路板27。As shown in Fig. 1, Fig. 2 and Fig. 3, the dust-
外壳21底部上设置有接受外部声源的入声孔210,包括内表面211和外表面212。The bottom of the
振膜组22包括振膜220和张绷振膜的绷膜环221。硼膜环221与外壳21底部内表面211相抵接,硼膜环221具有一定的厚度,因而,振膜组22与外壳21底部之间形成一腔体213。The
为阻止外界灰尘等颗粒进入到产品内部而影响产品的性能时,在外壳21的内表面上211粘贴一层覆盖入声孔210的防尘网28。防尘网28可使用无纺布或者网织品等材料制成,可通过双面胶与外壳粘附在一起。其直径少于绷膜环221的内径,厚度也少于绷膜环221的厚度,因而,该防尘网28处于振膜组22与外壳21形成的腔体213内,从而实现在产品本身的高度基础上不额外增加其高度,而且也不影响振膜220的振动反应。另,由于该防尘网28设置于外壳21内,因而,不会影响表面贴装技术(SMT)的生产工艺存在的吸附操作,故本实用新型能兼容表面贴装技术(SMT)。In order to prevent particles such as external dust from entering the product and affecting the performance of the product, a dust-
本实用新型实施例的背极板24与振膜组22之间实现电容效应。由于背极板24上分布有自由电荷,在电容器的两极之间就有了电荷量,当声波使振膜组22振动而产生位移时,改变了电容器的电容量,电容量的改变使电容器的输出端产生了相应的交变电场,就形成了与声波信号对应的电信号,于是就完成了声电转换的功能。Capacitance effect is realized between the
以上所述的仅是本实用新型的一种实施例,本实用新型的实施例还可是其他类型的麦克风,如动圈式麦克风、硅基麦克风等。在此应当指出,对于本领域的普通技术人员来说,在不脱离本实用新型创造构思的前提下,还可以做出改进,但这些均属于本实用新型的保护范围。The above is only one embodiment of the utility model, and the embodiment of the utility model may also be other types of microphones, such as dynamic microphones, silicon-based microphones, and the like. It should be pointed out here that those skilled in the art can make improvements without departing from the inventive concept of the present utility model, but these all belong to the protection scope of the present utility model.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200944963U CN201204679Y (en) | 2008-05-16 | 2008-05-16 | dustproof microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200944963U CN201204679Y (en) | 2008-05-16 | 2008-05-16 | dustproof microphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201204679Y true CN201204679Y (en) | 2009-03-04 |
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ID=40426992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200944963U Expired - Lifetime CN201204679Y (en) | 2008-05-16 | 2008-05-16 | dustproof microphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201204679Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102611954A (en) * | 2012-03-05 | 2012-07-25 | 广东步步高电子工业有限公司 | Microphone dustproof structure and assembling method thereof |
| WO2016095107A1 (en) * | 2014-12-16 | 2016-06-23 | 华为技术有限公司 | Microphone kit and electronic device |
| CN115942167A (en) * | 2021-08-17 | 2023-04-07 | 通用微(深圳)科技有限公司 | Antifouling microphone chip and sound collection device |
-
2008
- 2008-05-16 CN CNU2008200944963U patent/CN201204679Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102611954A (en) * | 2012-03-05 | 2012-07-25 | 广东步步高电子工业有限公司 | Microphone dustproof structure and assembling method thereof |
| WO2016095107A1 (en) * | 2014-12-16 | 2016-06-23 | 华为技术有限公司 | Microphone kit and electronic device |
| CN105940682A (en) * | 2014-12-16 | 2016-09-14 | 华为技术有限公司 | Microphone kit and electronic device |
| CN115942167A (en) * | 2021-08-17 | 2023-04-07 | 通用微(深圳)科技有限公司 | Antifouling microphone chip and sound collection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20090304 |
|
| CX01 | Expiry of patent term |