CN201097052Y - Backlight source LED module structure - Google Patents
Backlight source LED module structure Download PDFInfo
- Publication number
- CN201097052Y CN201097052Y CNU2007201717375U2007201717375U CN200720171737U CN201097052Y CN 201097052 Y CN201097052 Y CN 201097052Y CN U2007201717375U2007201717375 U CNU2007201717375U2007201717375 U CN U2007201717375U2007201717375U CN 200720171737 U CN200720171737 U CN 200720171737U CN 201097052 Y CN201097052 Y CN 201097052Y
- Authority
- CN
- China
- Prior art keywords
- emitting diode
- light emitting
- base board
- diode module
- bar shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims abstract description 9
- 230000000994 depressogenic effect Effects 0.000 claims description 12
- 239000000084 colloidal system Substances 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 2
- 230000008676 import Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000021715 photosynthesis, light harvesting Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
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- Planar Illumination Modules (AREA)
Abstract
The utility model provides a back light source light emitting diode module structure, which is suitable for the light emitting diode module structure. The back light source light emitting diode module structure comprises a bar heat conducting circuit base plate, the bar heat conducting circuit base plat is provided with a first surface and a second surface, the second surface comprises a circuit layer, a plurality of inner concave cup bodies are formed in the second surface, light emitting diode chips are arranged at the bottom parts of the cup bodies of the second surface, and the circuit layer is electrically connected with the light emitting diode chips through a conducting wire; the back light source light emitting diode module structure also comprises a casing body, the casing body is fixed on the bar heat conducting circuit base plate, hollow parts are arranged on the casing body corresponding to the positions of the cup bodies on the second surface of the bar heat conducting circuit base plate, light reflecting material is arranged on the inner surfaces of the hollow parts, light transmitting colloidal matter is introduced into the hollow parts, and the colloidal matter is covered with the light emitting diode chips. The bar heat conducting circuit base plate used by the utility model ensures the heat generated by the light emitting diode to be more effectively emitted out, and the light reflecting material arranged in the hollow parts can effectively improve the projection efficiency of the light source.
Description
Technical field
The utility model belongs to light emitting diode module group structure, relates in particular to a kind of backlight light emitting diode module group structure that can be used for LCD etc.
Background technology
At present, general on the market light emitting diode, its life cycle life-span and fiduciary level all are subjected to Temperature Influence control, after light emitting diode receives electric energy, transfer a spot of electric energy to luminous energy and shinny come out, all the other most electric energy all become the heat energy loss and go out.Yet, concerning high-power light emitting diode, the electric energy that this High Power LED chip is received, nearly all be converted into heat energy dissipation, therefore the accumulation of heat causes temperature to rise, and then it electrically is affected, also shorten the serviceable life of High Power LED, so the heat dissipation problem of light emitting diode just becomes an important problem.
Tradition only just utilizes the circuit board of bottom to dispel the heat easily when making the light emitting diode of backlight, makes heat effectively to emit.
In addition, tradition is when making the light emitting diode of backlight, and general employing is carried out sealing in the mode that the housing depressed part directly imports the printing opacity colloid, and this mode makes that the projection efficiency of LED source is limited.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of backlight light emitting diode module group structure, and it is low to be intended to solve the light source projects efficient that exists in the prior art, and the low problem of radiating efficiency.
The utility model is to realize like this, a kind of backlight light emitting diode module group structure, comprise bar shaped thermal conductive wire base board, this bar shaped thermal conductive wire base board has first surface and second surface, described second surface includes circuit layer, form several cups in described second surface indent, light-emitting diode chip for backlight unit is arranged at described second surface bottom of cup, and by lead circuit layer and light-emitting diode chip for backlight unit is electrically connected; The backlight light emitting diode module group structure also comprises housing, described housing is fixed on the bar shaped thermal conductive wire base board, cup place on corresponding bar shaped thermal conductive wire base board second surface on the described housing is provided with depressed part, at described depressed part inside surface light reflection material is set, and at described depressed part importing printing opacity colloid, described colloid covering luminousing diode chip.
In the utility model, the bar shaped thermal conductive wire base board of use can make the heat that light emitting diode produced more effectively distribute, and can effectively improve the projection efficiency of light source in the mode that depressed part is provided with reflective material.
Description of drawings
Fig. 1 is the schematic perspective view of the utility model one preferred embodiment.
Fig. 2 is the reverse side schematic perspective view of backlight light emitting diode module group structure shown in Figure 1.
Fig. 3 is the diagrammatic cross-section of backlight light emitting diode module group structure shown in Figure 1.
Fig. 4 is the schematic perspective view of another preferred embodiment of the utility model.
Fig. 5 is the reverse side schematic perspective view of backlight light emitting diode module group structure shown in Figure 4.
Fig. 6 is the diagrammatic cross-section of backlight light emitting diode module group structure shown in Figure 4.
Embodiment
In order to make technical problem to be solved in the utility model, technical scheme and beneficial effect clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
See also Fig. 1 to Fig. 3, the utility model backlight light emitting diode module group structure comprises bar shaped thermal conductive wire base board 10 and housing 16.
This bar shaped thermal conductive wire base board 10 has first surface 101 and second surface 102, and this first surface 101 can directly contact with air, and second surface 102 includes circuit layer 1021; Form a plurality of cup 1022 structures in these second surface 102 mediad indents, a plurality of light-emitting diode chip for backlight unit 12 can be arranged at second surface 102 cups 1022 bottoms, by lead 14 circuit layer 1021 and light-emitting diode chip for backlight unit 12 are electrically connected, this bar shaped thermal conductive wire base board 10 can be metallic circuit substrate or ceramic thread base board.This circuit layer 1021 comprises many wirings and terminal a plurality of electrode contacts 1023 thereof, is responsible for power supply and carries out luminous for light-emitting diode chip for backlight unit 12.
The material of this housing 16 is an exotic material; this housing 16 is fixed on this bar shaped thermal conductive wire base board 10; cup 1022 structure places on corresponding bar shaped thermal conductive wire base board 10 second surfaces 102 on this housing 16 are provided with several depressed parts; and light reflection material 161 is set respectively at surface within each depressed part; effectively promote the projection efficiency of light source; and respectively at this depressed part importing printing opacity colloid 18; these colloid 18 materials can be silica gel; epoxy resin or the combination of the two; in order to cover and these a plurality of light-emitting diode chip for backlight unit 12 of protection; the light that light-emitting diode chip for backlight unit 12 is sent can outwards throw by the colloid 18 of this depressed part; on this bar shaped thermal conductive wire base board 10; and the bearing that is positioned at housing 16 is provided with at least one hole 100 structures; this housing 16 can be selected from ejaculation with the fixed form of bar shaped thermal conductive wire base board 10; one of model or mode such as bonding are to reach firm effect.
See also Fig. 4 to Fig. 6 again, be another embodiment of the utility model backlight light emitting diode module group structure.As shown in the figure, the first surface 101 of this bar shaped thermal conductive wire base board 10 comprises at least one groove 20 and is positioned at this housing 16 bearings with hole 100 the two structure that have concurrently, and the bottom part aperture diameter of this hole 100 is more than or equal to the aperture, top, to reach firm effect.
The above only is preferred embodiment of the present utility model; not in order to restriction the utility model; all any modifications of within spirit of the present utility model and principle, being done, be equal to and replace and improvement etc., all should be included within the protection domain of the present utility model.
Claims (8)
1, a kind of backlight light emitting diode module group structure, comprise bar shaped thermal conductive wire base board, this bar shaped thermal conductive wire base board has first surface and second surface, described second surface includes circuit layer, form several cups in described second surface indent, light-emitting diode chip for backlight unit is arranged at described second surface bottom of cup, and by lead circuit layer and light-emitting diode chip for backlight unit is electrically connected; It is characterized in that, the backlight light emitting diode module group structure also comprises housing, described housing is fixed on the bar shaped thermal conductive wire base board, cup place on corresponding bar shaped thermal conductive wire base board second surface on the described housing is provided with depressed part, at described depressed part inside surface light reflection material is set, and import printing opacity colloid, described colloid covering luminousing diode chip at described depressed part.
2, backlight light emitting diode module group structure as claimed in claim 1 is characterized in that, described bar shaped thermal conductive wire base board is the metallic circuit substrate.
3, backlight light emitting diode module group structure as claimed in claim 1 is characterized in that, described bar shaped thermal conductive wire base board is the ceramic thread base board.
4, backlight light emitting diode module group structure as claimed in claim 1 is characterized in that, comprises at least one pore space structure on the described bar shaped thermal conductive wire base board and is positioned at described housing bearing.
5, backlight light emitting diode module group structure as claimed in claim 1 is characterized in that, comprises at least one groove structure on the described bar shaped thermal conductive wire base board and is positioned at described housing bearing.
6, backlight light emitting diode module group structure as claimed in claim 1 is characterized in that, comprises at least one groove and the two structure that has concurrently of hole on the described bar shaped thermal conductive wire base board and is positioned at described housing bearing.
7, as claim 4 or 6 described backlight light emitting diode module group structures, it is characterized in that the bottom part aperture diameter of described hole is more than or equal to the aperture, top.
8, backlight light emitting diode module group structure as claimed in claim 1 is characterized in that, described circuit layer comprises many wirings and terminal a plurality of electrode contacts thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201717375U2007201717375U CN201097052Y (en) | 2007-09-06 | 2007-09-06 | Backlight source LED module structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201717375U2007201717375U CN201097052Y (en) | 2007-09-06 | 2007-09-06 | Backlight source LED module structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201097052Y true CN201097052Y (en) | 2008-08-06 |
Family
ID=39924104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201717375U2007201717375U Expired - Lifetime CN201097052Y (en) | 2007-09-06 | 2007-09-06 | Backlight source LED module structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201097052Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101782204A (en) * | 2010-04-21 | 2010-07-21 | 广东昭信光电科技有限公司 | LED backlighting structure provided with converted light source and using free-form surface reflector |
| CN109888080A (en) * | 2019-02-01 | 2019-06-14 | 中山市凹凸灯饰配件有限公司 | A kind of lamp bar mould group production technology |
-
2007
- 2007-09-06 CN CNU2007201717375U2007201717375U patent/CN201097052Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101782204A (en) * | 2010-04-21 | 2010-07-21 | 广东昭信光电科技有限公司 | LED backlighting structure provided with converted light source and using free-form surface reflector |
| CN109888080A (en) * | 2019-02-01 | 2019-06-14 | 中山市凹凸灯饰配件有限公司 | A kind of lamp bar mould group production technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080806 |
|
| CX01 | Expiry of patent term |