CN201087904Y - Light-emitting diode chip packaging structure with ceramic as substrate - Google Patents

Abstract

A light emitting diode chip packaging structure using ceramic as a substrate comprises: the LED package comprises a ceramic substrate, a conductive unit, a hollow ceramic shell, a plurality of LED chips and a packaging colloid. The ceramic substrate is provided with a body and a plurality of lugs extending out of three surfaces of the body; the conductive unit has a plurality of conductive layers formed on the surfaces of the bumps respectively; the hollow ceramic shell is fixed on the top surface of the body to form an accommodating space, and the accommodating space exposes the top surfaces of the conductive layers; the light emitting diode chips are respectively arranged in the accommodating space, and the positive electrode end and the negative electrode end of each light emitting diode chip are respectively and electrically connected with different conducting layers; the packaging colloid is filled in the containing space to cover the light-emitting diode chips.

Description

Packaging structure of light-emitting diode chip with ceramic as substrate

technical field

The utility model relates to a light-emitting diode chip packaging structure, in particular to a light-emitting diode chip packaging structure with ceramics as a substrate.

Background technique

Please refer to FIG. 1 , which is a schematic cross-sectional view of a conventional vertical LED chip packaging structure. It can be seen from the figure that the conventional vertical LED chip packaging structure includes: an insulating substrate 1a, a conductive frame 2a, a LED chip 3a and a fluorescent colloid 4a.

Wherein, the conductive frame 2a has two conductive pins 20a, 21a respectively bent twice along two opposite sides of the insulating base 1a, so that the lower end surfaces of the conductive pins 20a, 21a can be connected with a circuit board 5a makes electrical contact, and the conductive pins 20a, 21a respectively have a positive electrode area 200a and a negative electrode area 210a.

Furthermore, the LED chip 3a has a positive electrode terminal 300a and a negative electrode terminal 310a, and the LED chip 3a is directly disposed on the conductive pin 20a, so that the positive electrode terminal 300a is directly connected to the conductive pin 20a The positive electrode region 200a of the light-emitting diode chip 3a is electrically connected to the positive electrode region 200a, and the negative electrode terminal 310a of the LED chip 3a is electrically connected to the negative electrode region 210a of the conductive pin 21a through a wire 6a.

Finally, the fluorescent colloid 4a covers the LED chip 3a to protect the LED chip 3a. In this way, the conventional vertical LED chip packaging structure can produce a luminous effect of projecting light upward (as indicated by the arrow).

Please refer to FIG. 2 and FIG. 3 , which are respectively a three-dimensional schematic diagram of a conventional side-type light-emitting diode chip packaging structure and a cross-sectional view at 3-3 of FIG. 2 . It can be seen from the figure that the conventional side-type LED chip packaging structure includes: an insulating substrate 1b, a conductive frame 2b, an LED chip 3b and a fluorescent glue 4b.

Wherein, the conductive frame 2b has two conductive pins 20b, 21b respectively bent twice along one side of the insulating base 1b, so that the side end surfaces of the conductive pins 20b, 21b can be connected with a circuit board 5b An electrical contact is made, and the conductive pins 20b, 21b respectively have a positive electrode region 200b and a negative electrode region 210b.

Furthermore, the light emitting diode chip 3b has a positive electrode end 300b and a negative electrode end 310b, and the light emitting diode chip 3b is directly arranged on the conductive pin 20b, so that the positive electrode end 300b is directly connected to the conductive pin 20b The positive electrode region 200b of the light-emitting diode chip 3b is electrically connected to the positive electrode region 200b, and the negative electrode terminal 310b of the LED chip 3b is electrically connected to the negative electrode region 210b of the conductive pin 21b through a wire 6b.

Finally, the fluorescent colloid 4b covers the LED chip 3b to protect the LED chip 3b. Thereby, the conventional side-type LED chip packaging structure can produce the luminous effect of side-projected light (as shown by the arrow in FIG. 3 ).

However, the conductive pins (20a, 21a, 20b, 21b) of the above vertical and side LED chip packaging structures must be bent to make contact with the circuit board (5a, 5b), thus increasing the complexity of the manufacturing process .

Utility model content

The technical problem to be solved by the utility model is to provide a light-emitting diode chip packaging structure with ceramics as the substrate, which can form the conductive layer on the ceramic substrate by any forming method, and then through the ceramic co-firing technology ( Low-Temperature Cofired Ceramics, LTCC) fixes the hollow ceramic shell on the ceramic substrate, so the utility model does not need to use a conductive frame like the conventional ones, and it needs to be bent to be electrically connected to the circuit board.

In order to solve the above technical problems, the utility model provides a light-emitting diode chip packaging structure with ceramics as the substrate, which includes: a ceramic substrate, a conductive unit, a hollow ceramic shell, a plurality of light-emitting diode chips, and a packaging colloid . Wherein, the ceramic substrate has a body, and a plurality of protrusions separated from each other and respectively extended from the body; the conductive unit has a plurality of conductive layers respectively formed on the surfaces of the protrusions; the hollow ceramic shell is fixed on An accommodating space is formed on the top surface of the body of the ceramic substrate, and the accommodating space exposes the top surfaces of the conductive layers; the light emitting diode chips are respectively arranged in the accommodating space, and each light emitting diode The positive and negative electrode ends of the chip are electrically connected to different conductive layers; and the encapsulation gel is filled in the accommodating space to cover the light emitting diode chips.

Wherein, the above-mentioned protrusions respectively extend from three sides of the main body.

Furthermore, according to one solution of the present invention, the above-mentioned conductive unit may be a combination of a first conductive unit, a hardness strengthening unit and a second conductive unit. Wherein, the first conductive unit has a plurality of first conductive layers respectively formed on the surfaces of the protrusions; the hardness strengthening unit has a plurality of hardness enhancement layers respectively formed on the first conductive layers; and, the first The second conductive unit has a plurality of second conductive layers respectively formed on the hardness strengthening layers; thereby, the first conductive layers, the hardness strengthening layers and the second conductive layers are sequentially combined to form the conductive layer .

In addition, the aforementioned conductive unit may also be a combination of a first conductive unit and a second conductive unit. Wherein, the first conductive unit has a plurality of first conductive layers respectively formed on the surfaces of the protrusions; the second conductive unit has a plurality of second conductive layers respectively formed on the first conductive layers, wherein each A second conductive layer is a hardness enhanced conductive layer (consolidated layer); thereby, the first conductive layers and the second conductive layers are combined into the conductive layer.

The utility model has the advantage that the conductive layer can be formed on the ceramic substrate by any forming method, and then the hollow ceramic shell can be fixed on the ceramic substrate through the ceramic co-firing technology (Low-Temperature Cofired Ceramics, LTCC). Therefore, the utility model does not require the use of a conductive frame as in the prior art and is also bent to be electrically connected to the circuit board.

In order to further understand the technology, means and effects that the utility model adopts to achieve the predetermined purpose, please refer to the following detailed description and accompanying drawings of the utility model, and believe that the purpose, features and characteristics of the utility model can be obtained from this For an in-depth and specific understanding, the attached drawings are only for reference and illustration, and are not intended to limit the present invention.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a conventional vertical light-emitting diode chip packaging structure;

Fig. 2 is a three-dimensional schematic diagram of a conventional side-type light-emitting diode chip packaging structure;

Fig. 3 is a 3-3 sectional view of Fig. 2;

4 is a flow chart of the first embodiment of the manufacturing method of the light-emitting diode chip packaging structure with ceramics as the substrate of the utility model;

5A to 5C are schematic diagrams of the manufacturing process of the first embodiment of the manufacturing method of the light-emitting diode chip packaging structure using ceramics as the substrate of the present invention;

6 is a schematic cross-sectional view of the first embodiment of the LED chip packaging structure with ceramics as the substrate of the present invention;

Fig. 7 is a schematic side view of the first arrangement of the light-emitting diode chip in the first embodiment of the present invention;

Fig. 8 is a schematic side view of a second arrangement of light emitting diode chips in the first embodiment of the present invention;

Fig. 9 is a schematic side view of a third arrangement of light-emitting diode chips according to the first embodiment of the present invention;

Fig. 10 is a schematic side view of the fourth arrangement mode of the light-emitting diode chip of the present invention;

Fig. 11 is a flow chart of the second embodiment of the manufacturing method of the light-emitting diode chip packaging structure using ceramics as the substrate of the present invention;

Fig. 12 is a side sectional view of the second embodiment of the LED chip packaging structure using ceramics as the substrate of the present invention; and

FIG. 13 is a schematic perspective view of the LED chip packaging structure using ceramics as the substrate in a side state according to the first embodiment of the present invention.

Explanation of main component symbols

1. Knowledge

Insulating base 1a

Conductive frame 2a Conductive pins 20a, 21a

Positive electrode area 200a

Negative electrode area 210a

Light-emitting diode chip 3a Positive terminal 300a

Negative terminal 310a

Fluorescent colloid 4a

circuit board 5a

Wire 6a

Insulation base 1b

Conductive frame 2b Conductive pins 20b, 21b

Positive electrode area 200b

Negative Electrode Area 210b

LED Chip 3b Positive Terminal 300b

Negative terminal 310b

Fluorescent colloid 4b

circuit board 5b

Wire 6b

Two, the utility model

Ceramic substrate 1 1 body 10

                                                 

                                                         

The first conductive layer 2

Hardness strengthening layer 3

The second conductive layer 3′

Second Conductive Layer 4 Positive Electrode Conductive Part 40

Negative Conductive Part 41

The second conductive layer 4′ positive conductive part 40′

Negative Conductive Part 41′

Second conductive layer 4″ Positive electrode conductive part 40″

Negative Conductive Part 41″

Hollow Ceramic Shell 5 Accommodating Space 50

LED Chip 6 Positive Terminal 60

Negative terminal 61

Light-emitting diode chip 6′ positive terminal 60

Negative electrode terminal 61′

LED Chip 6″ Positive Terminal 60″

Negative terminal 61″

Wire 7, 7′

Solder Ball 7″

Encapsulation colloid 8

Light-emitting diode chip 9 positive terminal 90

Negative terminal 91

                                     

Conductor 93

Positive Conductive Part 94

Negative Conductive Part 95

Detailed ways

Please refer to FIG. 4 to FIG. 6 , which are respectively the flow chart, the schematic diagram of the fabrication process, and the schematic cross-section of the first embodiment of the manufacturing method of the light-emitting diode chip packaging structure using ceramics as the substrate of the present invention. As can be seen from the flow chart in Fig. 4, the utility model provides a packaging structure of a light-emitting diode chip using ceramics as a substrate. There is a body 10, and a plurality of protrusions 11 (S100) which are separated from each other and extend from three sides of the body 10, wherein the side of the body 10 of the ceramic substrate 1 has a plurality of protrusions formed on every two sides of the body 10. 11 between half through holes 12 .

Then, form a plurality of first conductive layers 2 on the surfaces of the protrusions 11 (S102), wherein the first conductive layer 2 is a silver paste layer; then, form a plurality of hardness strengthening layers 3 respectively On the first conductive layers 2 (S104), wherein the hardness-enhancing layer is a nickel layer (nickel layer); then, forming a plurality of second conductive layers 4 on the hardness-enhancing layers 3 respectively (S106), Wherein the second conductive layer 4 is a gold layer or a silver layer.

Next, as shown in FIG. 5B and FIG. 6 , a hollow ceramic shell 5 is fixed on the top surface of the body 10 of the ceramic substrate 1 to form an accommodating space 50, and the accommodating space 50 exposes the second The top surface (S108) of the conductive layer 4, wherein the body 10 of the ceramic substrate 1 and the hollow ceramic shell 5 are two cuboids that cooperate with each other, and the hollow ceramic shell 5 is made by using ceramic co-firing technology (Low-Temperature Cofired Ceramics, LTCC), to be fixed on the top surface of the body 10 of the ceramic substrate 1.

Next, as shown in FIG. 5C and FIG. 6, a plurality of light emitting diode chips 6 are arranged in the accommodating space 50, and the positive and negative electrodes of each light emitting diode chip 6 are respectively electrically connected to different second conductive electrodes. Layer 4 (S110), wherein the positive and negative electrodes of each light emitting diode chip 6 can pass through two wires 7 to be electrically connected to different second conductive layers 4 respectively; finally, fill an encapsulant 8 in the container placed in the space 50 to cover the LED chips 6 (S112). In this way, the bottom surfaces of the second conductive layers 4 are in contact with a circuit board (not shown) through the accommodating space 50 facing upwards, so that the light emitting diode chip packaging structure of the present invention can be erected The way to cast light upwards (as shown by the arrow in Figure 6).

Please refer to FIG. 7 , which is a schematic side view of the first arrangement of the light emitting diode chips according to the first embodiment of the present invention. It can be seen from the figure that the second conductive layers 4 are divided into a plurality of positive conductive parts 40 and negative conductive parts 41, and the positive and negative electrode terminals 60, 61 of the light emitting diode chip 6 are respectively arranged on the top of each light emitting diode chip 6. surface; thereby, through wire-bounding, the positive and negative electrode terminals 60, 61 of each LED chip 6 are electrically connected to the adjacent positive electrode conductive part through two wires 7 40 and the negative electrode conductive part 41.

Please refer to FIG. 8 , which is a schematic side view of the second arrangement of the LED chips in the first embodiment of the present invention. It can be seen from the figure that the second conductive layers 4' are divided into a plurality of positive conductive parts 40' and negative conductive parts 41', and the positive and negative electrode terminals 60' and 61' of the LED chip 6' are respectively arranged on each The lower surface and the upper surface of the light-emitting diode chip 6'; thereby, through the wire-bounding method, the positive electrode terminal 60' of each light-emitting diode chip 6' is directly electrically connected to the corresponding The positive conductive part 40', and the negative electrode terminal 61' of each LED chip 6' is electrically connected to the corresponding negative conductive part 41' through a wire 7'.

Please refer to FIG. 9 , which is a schematic side view of a third arrangement of LED chips according to the first embodiment of the present invention. It can be seen from the figure that the second conductive layers 4" are divided into a plurality of positive conductive parts 40" and negative conductive parts 41", and the positive and negative electrode terminals 60", 61" of the LED chip 6" are respectively arranged on each The lower surface of the light-emitting diode chip 6 "; thereby, through the flip-chip (flip-chip) method, so that the positive and negative electrode terminals 60 ", 61 " of each light-emitting diode chip 6 " respectively pass through a plurality of corresponding The solder ball 7" is electrically connected to the adjacent positive conductive part 40" and negative conductive part 41".

Please refer to FIG. 10 , which is a schematic side view of the fourth arrangement mode of the LED chip of the present invention. It can be seen from the figure that the positive and negative electrode terminals 90 and 91 of the light emitting diode chip 9 are respectively arranged on the upper surface of each light emitting diode chip 9, and each light emitting diode chip 9 is respectively arranged between every two protrusions 92; In this way, through wire-bounding, the positive and negative electrode terminals 90, 91 of each LED chip 9 are electrically connected to the adjacent positive electrode conductive portion 94 and the adjacent positive electrode conductive portion 94 through two wires 93 respectively. Negative electrode conductive part 95 .

Please refer to FIG. 11 and FIG. 12 , which are respectively a flow chart and a side cross-sectional view of a second embodiment of the manufacturing method of the ceramic-based light-emitting diode chip packaging structure of the present invention. It can be seen from the figure that S200 and S202 and S206 to S210 of the second embodiment are respectively the same as S100 to S102 and S108 to S112 of the first embodiment. The biggest difference between the second embodiment and the first embodiment is that after the step S202, a plurality of second conductive layers 3' are respectively formed on the first conductive layers 2, wherein each second conductive layer 3' It is a hardness enhanced conductive layer (consolidated layer) (S204).

Please refer to FIG. 13 , which is a three-dimensional schematic diagram of a LED chip packaging structure with a ceramic substrate in a side state according to the first embodiment of the present invention. It can be seen from the figure that through the way that the accommodating space 50 faces sideways, the side surfaces of the second conductive layers 4 are in contact with a circuit board (not shown), so that the light emitting diode chip packaging structure of the present invention can Cast light sideways in a sideways manner.

To sum up, the utility model has the advantage that the conductive layer can be formed on the ceramic substrate by any forming method, and then the hollow ceramic shell can be fixed by the Low-Temperature Cofired Ceramics (LTCC) technology. On the ceramic substrate, the utility model does not need to use a conductive frame as in the prior art and needs to be bent to be electrically connected to the circuit board.

However, the above descriptions are only the detailed description and drawings of the best specific embodiments of the present utility model, and the features of the present utility model are not limited thereto, and are not intended to limit the utility model and the entire scope of the utility model Should be based on the scope of the patent application, all the embodiments that conform to the spirit of the scope of the patent application of the present utility model and its similar changes, all should be included in the category of the present utility model, any person who is familiar with this skill is in the field of the present utility model , all changes or modifications that can be easily thought of can be covered by the patent scope of the present utility model.

Claims (18)

1. one kind is the LED encapsulation construction of substrate with the pottery, it is characterized in that, comprising:

One ceramic substrate, it has a body, reaches a plurality of projections that are separated from each other and extend from this body respectively;

One conductive unit, it has a plurality of being formed separately in the conductive layer on these projection surfaces;

One hollow ceramic housing, it is fixed on the end face of body of this ceramic substrate forming an accommodation space, and this accommodation space exposes the end face of these conductive layers;

A plurality of light-emitting diode chip for backlight unit, it is arranged at respectively in this accommodation space, and the positive and negative electrode end of each light-emitting diode chip for backlight unit is electrically connected at different conductive layers respectively; And

One packing colloid, it is filled in this accommodation space, to cover these light-emitting diode chip for backlight unit.

2. as claimed in claim 1 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: the side of the body of this ceramic substrate has a plurality of chadlesses that are formed at respectively between per two projections.

3. as claimed in claim 1 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: this body and this hollow ceramic housing are two cuboids that cooperatively interact.

4. as claimed in claim 1 is the LED encapsulation construction of substrate with the pottery, and it is characterized in that: this conductive unit further comprises:

One first conductive unit, it has a plurality of first conductive layers that are formed separately in these projection surfaces;

One hardness is strengthened the unit, and it has a plurality of hardness strengthening layers that are formed separately on these first conductive layers; And

One second conductive unit, it has a plurality of second conductive layers that are formed separately on these hardness strengthening layers;

By this, these first conductive layers, these hardness strengthening layers and these second conductive layers are combined into this conductive layer in regular turn.

5. as claimed in claim 4 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: this first conductive layer is a silver paste layer.

6. as claimed in claim 4 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: this hardness strengthening layer is a nickel dam.

7. as claimed in claim 4 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: this second conductive layer is gold layer or silver layer.

8. as claimed in claim 1 is the LED encapsulation construction of substrate with the pottery, and it is characterized in that: this conductive unit further comprises:

One first conductive unit, it has a plurality of first conductive layers that are formed separately in these projection surfaces; And

One second conductive unit, it has a plurality of second conductive layers that are formed separately on these first conductive layers, and wherein each second conductive layer is a hardness reinforced conductive layer;

By this, these first conductive layers and these second conductive layer combination become this conductive layer.

9. as claimed in claim 8 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: this first conductive layer is a silver paste layer.

10. as claimed in claim 8 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: this second conductive layer is gold layer or silver layer.

11. as claimed in claim 1 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: this accommodation space is the mode with up, so that the bottom surface of these conductive layers is contacted with a circuit board.

12. as claimed in claim 1 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: this accommodation space is in the mode towards the side, so that the contacts side surfaces of these conductive layers is in a circuit board.

13. as claimed in claim 1 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: these conductive layers are divided into a plurality of anodal conductive parts and negative pole conductive part.

14. as claimed in claim 13 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: the positive and negative electrode end of this light-emitting diode chip for backlight unit is arranged at the upper surface of each light-emitting diode chip for backlight unit respectively; By this, see through the mode of routing, so that the positive and negative electrode end of each light-emitting diode chip for backlight unit sees through two leads respectively and is electrically connected at adjacent anodal conductive part and negative pole conductive part.

15. as claimed in claim 13 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: the positive and negative electrode end of this light-emitting diode chip for backlight unit is arranged at the lower surface and the upper surface of each light-emitting diode chip for backlight unit respectively; By this, see through the mode of routing, so that the positive electricity end of each light-emitting diode chip for backlight unit directly is electrically connected at corresponding anodal conductive part, and the negative electricity of each light-emitting diode chip for backlight unit extremely then sees through a lead and is electrically connected at corresponding negative pole conductive part.

16. as claimed in claim 13 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: the positive and negative electrode end of this light-emitting diode chip for backlight unit is arranged at the lower surface of each light-emitting diode chip for backlight unit respectively; By this, see through and cover brilliant mode, so that the positive and negative electrode end of each light-emitting diode chip for backlight unit sees through a plurality of corresponding tin balls respectively and is electrically connected at adjacent anodal conductive part and negative pole conductive part.

17. as claimed in claim 13 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: the positive and negative electrode end of this light-emitting diode chip for backlight unit is arranged at the upper surface of each light-emitting diode chip for backlight unit respectively, and each light-emitting diode chip for backlight unit is arranged at respectively between per two projections; By this, see through the mode of routing, so that the positive and negative electrode end of each light-emitting diode chip for backlight unit sees through two leads respectively and is electrically connected at adjacent anodal conductive part and negative pole conductive part.

18. as claimed in claim 1 is the LED encapsulation construction of substrate with the pottery, it is characterized in that: each projection is that wherein three faces from this body extend.

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