CN201062757Y - Illuminating device of white light surface light source - Google Patents
Illuminating device of white light surface light source Download PDFInfo
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- CN201062757Y CN201062757Y CNU2007200072895U CN200720007289U CN201062757Y CN 201062757 Y CN201062757 Y CN 201062757Y CN U2007200072895 U CNU2007200072895 U CN U2007200072895U CN 200720007289 U CN200720007289 U CN 200720007289U CN 201062757 Y CN201062757 Y CN 201062757Y
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- light
- light source
- white
- semiconductor chip
- lens
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Abstract
The utility model relates to a light-emitting device for a white light source, which comprises a semiconductor chip and a base, a cavity is formed in a lens and is filled with light-converting material, and the lens is fixed above the semiconductor chip and is separated from the semiconductor chip. Because the lens with light-converting material is adopted, the utility model can effectively solve excitation wavelength shift, quantum efficiency reduction, ageing and other adverse effects caused by the heating of the semiconductor chip to the light-converting material; the light-emitting rate, color temperature, chroma and consistency of the fabricated light-emitting device of the white light source can also be improved effectively; the luminous surface and uniformity of the light source is enlarged and the emitted light is a white light source and can effectively avoid glaring phenomenon.
Description
Technical field
The utility model relates to a kind of luminescent device, and especially relating to a kind of is the generator of white-light surface light source of light-emitting component with the semiconductor.
Background technology
From the end of the nineties in last century, white light LEDs (light emitting diode abbreviates LED as) has obtained fast development.LED as the 4th generation lighting source, have energy-saving and environmental protection, an advantage such as the life-span is long, light efficiency is high, radiationless, shock resistance, this all is that conventional light source is incomparable.
Though LED has the advantage of numerous uniquenesses, because the light-emitting area of led chip is little, the brightness height, so the light source that LED produces is concentrated, is a spot light, as easy as rolling off a log generation dazzle and light pollution.If directly light-converting materials such as fluorescent material are covered chip surface, the aging of fluorescent material quickened in the as easy as rolling off a log influence that is subjected to led chip high temperature of fluorescent material, causes the light emission rate of LED and the shortening in service life.These all affect serviceability and the range of application of LED.
In the patent publication No. plated film LED of efficient " have improvement " patent for " CN03824703.8 ", it mainly is to cover transparent lens on the semiconductor and separate with semiconductor, and wherein phosphor layer is coated on the inner surface or the outer surface of lens.The light source that semiconductor produces, the phosphor layer on scioptics surface excite with original light and mix the generation white light, enlarge the light-emitting area of light source.Also can solve the spot light problem of LED although it is so, but because phosphor is the mixture of a glue, has certain fluidity, when therefore being coated on the lens, the difficult control of thickness and uniformity, requirement to processing technology is very high, and excites the uniformity and the colour temperature uniformity that produce white light also all to be difficult to control to LED.
Summary of the invention
The purpose of this utility model is the shortcoming that overcomes above-mentioned prior art, and providing a kind of is light-emitting component with the semiconductor chip, and absorbs, excites and transform by the lens that contain light-converting material, to produce the light-emitting device of white light area source.
For achieving the above object, the technical solution adopted in the utility model is: a kind of generator of white-light surface light source, include semiconductor chip, pedestal, wherein lens inside is formed with cavity, be filled with light-converting material in the cavity, lens are fixed in the semiconductor chip top, and separate with semiconductor chip.
Described semiconductor chip is fixed on the pedestal.
The emission wavelength scope of described semiconductor chip is 200nm～1000nm.
Described semiconductor chip is a led chip.
Described semiconductor chip is at least one.
Described light-converting material is fluorescent material or the mixture that contains fluorescent material.
Described lens are that plastic material or glass material are made.
Described light-converting material is planar distribution in the cavity of lens.
Described cavity cross section is square, annular or irregularly shaped.
Described cavity inner surface can be coarse or rugged non-shiny surface or male and fomale(M﹠F).
Described lens are made up of several portions, adopt one or more modes in ultrasonic bonding, adhesives, bayonet socket, the helicitic texture to be combined into one between the each several part, and portion is formed with cavity and perforate within it, and light-converting material is filled in the cavity by perforate.
Described adhesive is a kind of in silica gel, epoxy resin or the UV glue.
Be filled with a kind of in epoxy resin, silicones, acrylic resin, thermoplastic or the polyurethane material between described lens and the semiconductor chip.
The utility model is owing to adopted the lens that contain the light-converting material layer, therefore in the preparation process of white light parts, just can be omitted in this operation that chip surface covers light-converting material, make the processing technology of white light area source simpler, further shorten production procedure, enhance productivity, reduce production costs; And can effectively solve because semiconductor chip generated heat to harmful effects such as excitation wavelength skew, quantum efficiency that light-converting material caused descend, wear out, the service life of improving white light parts greatly.In addition, because light-converting material is included in the cavity of lens, the shape of the state of light-converting material, volume and lens cavity, the number of plies can be controlled, therefore light emission rate, colour temperature, colourity and the uniformity etc. of the generator of white-light surface light source of made also can be improved, and effectively improve yield rate.
LED as the 4th generation light source, though have advantages such as environmental protection, energy-conservation, long service life, but it produced is dazzling spot light, very easily causes the discomfort of human eye.The utility model is filled into light-converting material in the lens cavity, form the light-converting material layer, the light source that produces after the light-converting material layer excites is an area source, has enlarged the light-emitting area and the uniformity of light source, the light that sends is the white light area source, can effectively prevent glare phenomenon.
Description of drawings
Fig. 1 is the generalized section of the utility model embodiment 1;
Fig. 2 is the generalized section of the utility model embodiment 2;
Fig. 3 is the generalized section of the utility model embodiment 3;
Fig. 4 is the generalized section of the utility model embodiment 4;
Fig. 5 is the generalized section of the utility model embodiment 5;
The specific embodiment
The utility model will be further described below in conjunction with the specific embodiment:
As shown in Figure 1, be the profile of the utility model embodiment 1, lens 1 are the overall structure of making.Wherein, lens 1 are made up of several portions, adopt one or more modes in ultrasonic bonding, adhesives, bayonet socket, helicitic texture structure that is combined into one between the each several part, and portion is formed with cavity 13 and perforate 12 within it, and light-converting material 11 is filled in the cavity 13 by perforate 12.The cross section of its cavity 13 can be irregularly shaped for square, annular or other; The inner surface of cavity 13 can be smooth even curface, also can be coarse or rugged non-shiny surface or male and fomale(M﹠F).Wherein, if adopt adhesive bonding between lens 1 each several part, then adhesive can adopt any one in the materials such as epoxy resin, silicones, acrylic resin, UV glue, thermoplastic or polyurethane material.The making material of lens 1 then can adopt plastic material or glass materials such as PC, PMMA, PS.
In the present embodiment, light-converting material 11 is the mixture of yellow fluorescent powder and silica gel, can select different fluorescent material ratios for use according to different colour temperature requirements, and for example yellow fluorescent powder and silica gel adopt 1: 10 mass ratio mixing.The perforate 12 of light-converting material 11 scioptics 1, be filled in the cavity 13 after, again lens are put 1 and are gone in the baking oven, adopt 110 ℃～150 ℃ temperature, optimum temperature is 120 ℃, toasts continuously about 1 hour, and light-converting material 2 is solidificated in the cavity 13.In the present embodiment, the light-converting material 11 in the lens 1 is plane distribution, and the outward appearance of lens 1 and moulding then can require according to the optics of reality to design and make.
The utility model is owing to adopted the lens 1 that contain light-converting material 11, therefore in preparation process, just can reduce this operation at semiconductor chip 2 surface coverage light-converting materials, make the processing technology of white light area source simpler, further shorten production procedure, enhance productivity, reduce production costs.
Fig. 2 is another embodiment of the present utility model, and the light-converting material 11 in its lens 1 is the circular distribution of curved surface.Semiconductor chip 2 is for sending out the led chip of ultraviolet light, and light-converting material 11 is the mixture of RGB fluorescent material and UV glue, and wherein UV glue also can adopt silica gel or epoxy resin to wait to replace.Light-converting material 11 also can be a kind of for fluorescent material, do not need other mixture.When fluorescent material and UV glue mixed, fluorescent material and UV glue after mixing according to a certain percentage, as adopted 1: 10 mass ratio according to the colour temperature requirement.The mixture of fluorescent material and UV glue is at the about 30mW/cm of light intensity
2, wavelength is that the UV light source about 365nm shines down, after several minutes, the light-converting material 11 that is filled in the cavity is solidified.This kind solidifies the method for fluorescent material fast, can significantly improve the production efficiency in the solidification process; And UV glue also has very big advantage with respect to silicones on its cost, therefore can effectively reduce production cost.
As shown in Figure 3, be the generalized section of another embodiment of the utility model.The perforate 12 of light-converting material 11 scioptics 1 is filled in the cavity 13 of lens 1, and wherein perforate 12, cavity 13 quantity and position can be carried out conversion and adjusting according to the actual needs.In the groove 51 of pedestal 5, eutectic or be bonded with many semiconductor chips 2 adopts the structure of in parallel and/or series connection to connect.Wherein used semiconductor chip 2 is the infrared LED chip of wave-length coverage at 830nm～980nm, light-converting material 11 is the mixture of IR fluorescence powder and UV glue, the infrared light irradiates light transition material 11 that sends by the infrared LED chip, excite also and mix, produce the white light of similar daylight with original light.
Wherein, between lens 1 and semiconductor chip 2, be filled with colloid 4, a kind of as in epoxy resin, silicones, acrylic resin, thermoplastic, the polyurethane material.Lens 1 adopt the structure of both sides projection, can make multicore sheet irradiates light transition material 11 after, excite to produce soft, uniform surface light source.
As shown in Figure 4, be the profile of the utility model embodiment 4.Be formed with a cavity 13 and perforate 12 in lens 1, the quantity of its cavity 13 and perforate 12 can be regulated according to the demand of reality.Light-converting material 11 is filled in the cavity 13 by perforate 12, forms the light-converting material layer.Semiconductor chip 2 is fixed in the groove 51 of pedestal 5, and isolating between lens 1 and the semiconductor chip 2 has certain distance, fills colloid 4 therebetween.Because big at interval distance between the light-converting material 11 in the cavity 13 of semiconductor chip 2 and lens 1, effectively solved because semiconductor chip 2 generated heat to harmful effects such as excitation wavelength skew, quantum efficiency that light-converting material 11 caused descend, wear out, the service life of improving white light parts greatly.
As shown in Figure 5, be the profile of the utility model embodiment 5.Lens 1 contain light-converting material 11, the outward appearance of lens 1 and moulding then can require according to the optics of reality to design and make, plastic material such as its material then can PC, PMMA, PS or glass material are made, and light-converting material 11 forms irregular that is made up of curved surface and plane in the cavity 13 of lens 1.The emission wavelength scope is that the ultraviolet semiconductor chip 2 of 200～380nm is fixed in the groove 51 of pedestal 5, lens 1 are fixed on semiconductor chip 2 tops, fill colloid 4 therebetween, as materials such as epoxy resin, silicones, acrylic resin, thermoplastic, polyurethane materials.The light that semiconductor chip 2 produces shines light-converting material 11, excites the back to produce planar soft, a uniform white light area source by light-converting material 11.
Above embodiment is several preferred version of the present utility model, but the utility model is not limited to above scheme, and the simple change of any format surface and structure is all in the protection domain of the utility model patent.
Claims (12)
1. a generator of white-light surface light source includes semiconductor chip, pedestal, it is characterized in that lens inside is formed with cavity, is filled with light-converting material in the cavity, and lens are fixed in the semiconductor chip top, and separates with semiconductor chip.
2. a kind of generator of white-light surface light source according to claim 1 is characterized in that described semiconductor chip is fixed on the pedestal.
3. a kind of generator of white-light surface light source according to claim 1 is characterized in that described semiconductor chip is a led chip.
4. according to claim 1,2, or 3 described a kind of generator of white-light surface light source, it is characterized in that described semiconductor chip is at least one.
5. a kind of generator of white-light surface light source according to claim 1 is characterized in that described light-converting material is fluorescent material or the mixture that contains fluorescent material.
6. a kind of generator of white-light surface light source according to claim 1 is characterized in that described lens are that plastic material or glass material are made.
7. a kind of generator of white-light surface light source according to claim 1 is characterized in that described light-converting material is planar distribution in the cavity of lens.
8. according to claim 1 or 7 described a kind of generator of white-light surface light source, it is characterized in that described cavity cross section is square, annular or irregularly shaped.
9. according to claim 1 or 7 described a kind of generator of white-light surface light source, it is characterized in that described cavity inner surface can be coarse or rugged non-shiny surface or male and fomale(M﹠F).
10. a kind of generator of white-light surface light source according to claim 1, it is characterized in that described lens are made up of several portions, adopt one or more modes in ultrasonic bonding, adhesives, bayonet socket, the helicitic texture to be combined into one between the each several part, and portion is formed with cavity and perforate within it, and light-converting material is filled in the cavity by perforate.
11. a kind of generator of white-light surface light source according to claim 10 is characterized in that described adhesive is a kind of in silica gel, epoxy resin or the UV glue.
12. a kind of generator of white-light surface light source according to claim 1 is characterized in that being filled with between described lens and the semiconductor chip a kind of in epoxy resin, silicones, acrylic resin, thermoplastic or the polyurethane material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200072895U CN201062757Y (en) | 2007-06-05 | 2007-06-05 | Illuminating device of white light surface light source |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200072895U CN201062757Y (en) | 2007-06-05 | 2007-06-05 | Illuminating device of white light surface light source |
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| CN201062757Y true CN201062757Y (en) | 2008-05-21 |
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| CNU2007200072895U Expired - Fee Related CN201062757Y (en) | 2007-06-05 | 2007-06-05 | Illuminating device of white light surface light source |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008148342A1 (en) * | 2007-06-05 | 2008-12-11 | Jianping Zhu | An illuminator with white light planar light source |
| CN102384405A (en) * | 2010-08-27 | 2012-03-21 | 罗姆股份有限公司 | LED light source unit for backlight of liquid crystal display, and liquid crystal display |
| CN102956626A (en) * | 2011-08-19 | 2013-03-06 | 王大强 | LED structure |
| CN103262144A (en) * | 2010-12-17 | 2013-08-21 | 杜比实验室特许公司 | Quantum dots for display panels |
| CN103542326A (en) * | 2013-09-30 | 2014-01-29 | 易美芯光（北京）科技有限公司 | Optical device capable of realizing high-color-gamut backlight |
| CN105423161A (en) * | 2016-01-05 | 2016-03-23 | 东莞轩朗实业有限公司 | A kind of preparation method of point light source and lens thereof |
| US9746157B2 (en) | 2012-09-19 | 2017-08-29 | Dolby Laboratories Licensing Corporation | Quantum dot/remote phosphor display system improvements |
| US9911389B2 (en) | 2009-02-24 | 2018-03-06 | Dolby Laboratories Licensing Corporation | Locally dimmed quantum dot display |
| US9940881B2 (en) | 2013-03-08 | 2018-04-10 | Dolby Laboratories Licensing Corporation | Techniques for dual modulation display with light conversion |
| US10262603B2 (en) | 2014-03-26 | 2019-04-16 | Dolby Laboratories Licensing Corporation | Global light compensation in a variety of displays |
| CN112635639A (en) * | 2020-12-09 | 2021-04-09 | 佛山科学技术学院 | A white light LED device with uniform spatial role temperature distribution |
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2007
- 2007-06-05 CN CNU2007200072895U patent/CN201062757Y/en not_active Expired - Fee Related
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008148342A1 (en) * | 2007-06-05 | 2008-12-11 | Jianping Zhu | An illuminator with white light planar light source |
| US9911389B2 (en) | 2009-02-24 | 2018-03-06 | Dolby Laboratories Licensing Corporation | Locally dimmed quantum dot display |
| US10373574B2 (en) | 2009-02-24 | 2019-08-06 | Dolby Laboratories Licensing Corporation | Locally dimmed quantum dot display |
| US9464769B2 (en) | 2009-09-11 | 2016-10-11 | Dolby Laboratories Licensing Corporation | Techniques for using quantum dots to regenerate light in display systems |
| CN102384405A (en) * | 2010-08-27 | 2012-03-21 | 罗姆股份有限公司 | LED light source unit for backlight of liquid crystal display, and liquid crystal display |
| CN102384405B (en) * | 2010-08-27 | 2015-01-14 | 罗姆股份有限公司 | LED light source unit for backlight of liquid crystal display, and liquid crystal display |
| CN103262144A (en) * | 2010-12-17 | 2013-08-21 | 杜比实验室特许公司 | Quantum dots for display panels |
| CN104992630A (en) * | 2010-12-17 | 2015-10-21 | 杜比实验室特许公司 | Display system |
| CN103262144B (en) * | 2010-12-17 | 2016-08-17 | 杜比实验室特许公司 | Quantum dots for display panels |
| CN104992630B (en) * | 2010-12-17 | 2017-10-13 | 杜比实验室特许公司 | Display system |
| US9564078B2 (en) | 2010-12-17 | 2017-02-07 | Dolby Laboratories Licensing Corporation | Quantum dots for display panels |
| US9644804B2 (en) | 2010-12-17 | 2017-05-09 | Dolby Laboratories Licensing Corporation | Quantum dot modulation for displays |
| CN102956626A (en) * | 2011-08-19 | 2013-03-06 | 王大强 | LED structure |
| US9746157B2 (en) | 2012-09-19 | 2017-08-29 | Dolby Laboratories Licensing Corporation | Quantum dot/remote phosphor display system improvements |
| US10443818B2 (en) | 2012-09-19 | 2019-10-15 | Dolby Laboratories Licensing Corporation | Color filter arrays |
| US11454847B2 (en) | 2012-09-19 | 2022-09-27 | Dolby Laboratories Licensing Corporation | Quantum dot/remote phosphor display system improvements |
| US9940881B2 (en) | 2013-03-08 | 2018-04-10 | Dolby Laboratories Licensing Corporation | Techniques for dual modulation display with light conversion |
| US10657906B2 (en) | 2013-03-08 | 2020-05-19 | Dolby Laboratories Licensing Corporation | Techniques for dual modulation display with light conversion |
| US11074875B2 (en) | 2013-03-08 | 2021-07-27 | Dolby Laboratories Licensing Corporation | Techniques for dual modulation display with light conversion |
| CN103542326A (en) * | 2013-09-30 | 2014-01-29 | 易美芯光（北京）科技有限公司 | Optical device capable of realizing high-color-gamut backlight |
| US10262603B2 (en) | 2014-03-26 | 2019-04-16 | Dolby Laboratories Licensing Corporation | Global light compensation in a variety of displays |
| US11195483B2 (en) | 2014-03-26 | 2021-12-07 | Dolby Laboratories Licensing Corporation | Global light compensation in a variety of displays |
| CN105423161A (en) * | 2016-01-05 | 2016-03-23 | 东莞轩朗实业有限公司 | A kind of preparation method of point light source and lens thereof |
| CN112635639A (en) * | 2020-12-09 | 2021-04-09 | 佛山科学技术学院 | A white light LED device with uniform spatial role temperature distribution |
| CN112635639B (en) * | 2020-12-09 | 2022-03-22 | 佛山科学技术学院 | White light LED device with uniform space character temperature distribution |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080521 Termination date: 20100605 |