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CN201059523Y - Heat source dispersion heat radiation module on LED lamp - Google Patents

Heat source dispersion heat radiation module on LED lamp Download PDF

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Publication number
CN201059523Y
CN201059523Y CNU200720142570XU CN200720142570U CN201059523Y CN 201059523 Y CN201059523 Y CN 201059523Y CN U200720142570X U CNU200720142570X U CN U200720142570XU CN 200720142570 U CN200720142570 U CN 200720142570U CN 201059523 Y CN201059523 Y CN 201059523Y
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Prior art keywords
heat
heat radiation
cover body
circuit board
led lamp
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Expired - Fee Related
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CNU200720142570XU
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Chinese (zh)
Inventor
姚培智
窦文虎
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Xingao Function Medical Electronic Co ltd
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Xingao Function Medical Electronic Co ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The utility model relates to a heat source dispersion heat dissipation module on emitting diode lamps and lanterns, be equipped with a lamp shade on this lamps and lanterns, a cup type heat dissipation cover body has been held in this lamp shade, be equipped with a power circuit board between this heat dissipation cover body and lamp shade, and be equipped with the heating panel of a plurality of cooperation this cover body shapes on this heat dissipation cover body, these heating panels overlap each other with the superpose mode, and be equipped with a reflector on these heating panels, a light source base plate has been held in this reflector, be equipped with emitting diode on this light source base plate, this emitting diode is and make electric connection with power circuit board by the electric current lead wire, therefore, can be respectively through the produced heat of heating panel conduction emitting diode, and simultaneously, the produced heat of power circuit board is through the outside conduction of heat dissipation cover body, reach the dispersion, divide and manage the heat.

Description

发光二极管灯具上的热源分散散热模组 Heat source dispersion cooling module on light-emitting diode lamps

技术领域 technical field

本实用新型有关于一种发光二极管灯具上的热源分散散热模组，其是由散热板及散热罩体分别将发光二极管及电源电路板的热以分散、分治散热方式，迅速向外散去。The utility model relates to a heat source dispersive cooling module on a light-emitting diode lamp, which uses a heat-dissipating plate and a heat-dissipating cover to dissipate the heat of a light-emitting diode and a power supply circuit board in a way of dispersing and dividing heat to the outside rapidly. .

背景技术 Background technique

在日常生活上最常接触的灯光光源有旧式灯泡、石英灯泡、日光灯泡及水银灯等，不同于前述的灯源，发光二极管是属于冷发光，具有耗电量低、组件寿命长、不需暖灯时间、反应速度快等优点，再加上其体积小、耐震动、适合量产、容易配合应用上的需求制作成极小及数组式组件，所以发光二极管在信息、通讯及消费性产品的指示、显示装置上，已成为日常生活上不可或缺的重要组件，同样地，以发光二极管为照明的光源将愈来愈受到重视。The light sources most commonly encountered in daily life include old-style light bulbs, quartz light bulbs, fluorescent light bulbs, and mercury lamps. Lighting time, fast response and other advantages, coupled with its small size, vibration resistance, suitable for mass production, easy to meet the needs of the application to make extremely small and array components, so light-emitting diodes are used in information, communication and consumer products. Indication and display devices have become an indispensable and important component in daily life. Similarly, light sources using light-emitting diodes will receive more and more attention.

但现今以发光二极管作为照明用的灯具，因转换效率问题，使用时皆会产生高热，持续的高热对于灯具中的电子元件会造成损害，因此会将散热材料贴覆于发热的电子元件上或利用风扇将热散去，请参照图1所示，其设有一灯座100，该灯座100上设有电源接头110，且该灯座100上设有电源电路板120，而在灯座100上则有复数个直立且排列成碗状的散热鳍片130，该等散热鳍片130并由一环圈131加以固定，且该等散热鳍片130中设有一反光罩体140，该反光罩体140具有反射光源的作用，且该反光罩体140中设有一光源基板150，该光源基板150上设有发光二极管151，该发光二极管151上设有一光学镜头152，且该发光二极管151并由电流引线与电源电路板120做电性连接，该电源电路板120上并设有一导热座160，该导热座160并与散热鳍片130密接，此种装置虽可将电源电路板120及发光二极管151所产生的热分别通过导热座160、光源基板150及反光罩体140传导至散热鳍片130上，而使热散发至外界上，但由于是共同使用相同散热鳍片130进行散热，致使发光二极管151及电源电路板120的热源相互影响，特别在使用高瓦数的低电压高电流的电源电路，其转换效率也低，故产生的热也高，若能将发光二极管及电源电路的热分别进行散热，则对发光二极管的寿命将可大幅提高，同时，由于散热鳍片130是以铝挤或冲压成型，其形状、大小皆须依照每个灯具不同而重新开模制作，且组装的人工成本也高，在使用上并非理想。However, nowadays light-emitting diodes are used as lighting fixtures. Due to the problem of conversion efficiency, high heat will be generated during use. The continuous high heat will cause damage to the electronic components in the lamps. Therefore, heat dissipation materials will be pasted on the heating electronic components or Utilize fan to dissipate heat, please refer to as shown in Figure 1, it is provided with a lamp holder 100, and this lamp holder 100 is provided with power connector 110, and this lamp holder 100 is provided with power supply circuit board 120, and on lamp holder 100 There are a plurality of heat dissipation fins 130 upright and arranged in a bowl shape, and these heat dissipation fins 130 are fixed by a ring 131, and a reflector body 140 is arranged in these heat dissipation fins 130, and the reflector The body 140 has the function of reflecting light source, and a light source substrate 150 is arranged in the reflector body 140, a light emitting diode 151 is arranged on the light source substrate 150, an optical lens 152 is arranged on the light emitting diode 151, and the light emitting diode 151 is composed of The current leads are electrically connected to the power circuit board 120, and a heat conduction seat 160 is arranged on the power circuit board 120, and the heat conduction seat 160 is in close contact with the cooling fins 130. Although this kind of device can connect the power circuit board 120 and the light emitting diode The heat generated by 151 is conducted to the heat dissipation fins 130 through the heat conduction base 160, the light source substrate 150 and the reflective cover body 140 respectively, so that the heat is dissipated to the outside world. The heat sources of the diode 151 and the power supply circuit board 120 affect each other, especially when using a high-wattage low-voltage high-current power supply circuit, the conversion efficiency is also low, so the heat generated is also high. If the heat of the light-emitting diode and the power supply circuit can be reduced If the heat dissipation is carried out separately, the service life of the light-emitting diodes will be greatly improved. At the same time, since the heat dissipation fins 130 are formed by extruding or stamping aluminum, their shape and size must be re-made according to each lamp. The labor cost is also high, which is not ideal in use.

本发明人有鉴于上述的缺点，因此针对其症结所在，开始着手加以谋求改善，以期寻求一项合理解决之道，经过无数次的研析、设计，终于完成本实用新型的发光二极管灯具上的热源分散散热模组。In view of the above-mentioned shortcomings, the inventor began to seek improvement for the crux of the problem, in order to seek a reasonable solution. After countless studies and designs, he finally completed the light-emitting diode lamp of the present utility model. The heat source disperses the cooling module.

发明内容 Contents of the invention

本实用新型的目的在于提供一种发光二极管灯具上的热源分散散热模组，将发光二极管及电源电路板所产生的热，以分散方式迅速向外界散去，进而达到散热分治的目的。The purpose of this utility model is to provide a heat source dispersive heat dissipation module on the light emitting diode lamp, which quickly disperses the heat generated by the light emitting diode and the power supply circuit board to the outside in a dispersed manner, and then achieves the purpose of dividing and conquering heat dissipation.

本实用新型的另一目的在于提供一种发光二极管灯具上的热源分散散热模组，可方便制作及组装散热板，该散热板可依灯具形状、大小不同，任意搭配适合的散热板形状及数量。Another purpose of the present utility model is to provide a heat source dispersing heat dissipation module on LED lamps, which can facilitate the manufacture and assembly of heat sinks. The heat sinks can be arbitrarily matched with the shape and quantity of heat sinks according to the shape and size of the lamps. .

本实用新型的又一目的在于提供一种发光二极管灯具上的热源分散散热模组，其电源电路板、散热罩体、散热板、反光罩及光源基板，可由一连结件的连结而串接在一起。Yet another object of the present utility model is to provide a heat source dispersive heat dissipation module on a light-emitting diode lamp. The power supply circuit board, heat dissipation cover, heat dissipation plate, reflector and light source substrate can be connected in series by a connecting piece. Together.

本实用新型的再一目的在于提供一种发光二极管灯具上的热源分散散热模组，其散热板上设有复数个通风孔，以确保气流可以流通其中，不会受到阻碍。Another object of the present invention is to provide a heat source dispersing heat dissipation module on the LED lamp, in which a plurality of ventilation holes are provided on the heat dissipation plate to ensure that the air flow can flow through it without being hindered.

本实用新型的目的是这样实现的，一种发光二极管灯具上的热源分散散热模组，包括有：The purpose of this utility model is achieved in this way, a heat source dispersive cooling module on a light-emitting diode lamp, including:

一电源电路板，其是作为驱动发光二极管作动之用；A power circuit board, which is used to drive the light-emitting diodes;

复数个散热板，其是由散热性佳的材料所组成的片状体，该等散热板并叠置固定在一起；A plurality of cooling plates, which are sheet-shaped bodies composed of materials with good heat dissipation, and the cooling plates are stacked and fixed together;

一光源基板，其是平行设置在该等散热板上，该光源基板上设有发光二极管，且该光源基板上设有电流引线，该电流引线并与电源电路板作电性连接；A light source substrate, which is arranged in parallel on the heat dissipation plates, on which light emitting diodes are arranged, and a current lead is provided on the light source substrate, and the current lead is electrically connected to the power circuit board;

一散热罩体，其是以导热材料制成，该散热罩体设于散热板与电源电路板间，并配合散热板的形状，而将该等散热板容置其中，且该电源电路板与散热罩体接触，以使电源电路板及发光二极管所产生的热分别由散热罩体及散热板以分散、分治方式向外界散去。A heat dissipation cover, which is made of heat-conducting material, the heat dissipation cover is arranged between the heat dissipation plate and the power supply circuit board, and matches the shape of the heat dissipation plate, and the heat dissipation plates are accommodated therein, and the power supply circuit board and the power supply circuit board The heat dissipation cover is in contact with each other, so that the heat generated by the power supply circuit board and the light-emitting diode is dissipated to the outside by the heat dissipation cover and the heat dissipation plate in a divided and divided manner.

散热板与光源基板间设有一反光罩，该反光罩由导热材料所组成，具有增加光源反射及热传导之用。A reflector is arranged between the heat dissipation plate and the light source substrate, and the reflector is made of heat-conducting material, which can increase the reflection and heat conduction of the light source.

散热罩体与散热板间设有一隔热垫体，通过该隔热垫体以避免散热板及散热罩体的热互相影响。A heat insulation pad is provided between the heat dissipation cover and the heat dissipation plate, through which the heat of the heat dissipation plate and the heat dissipation cover will not be affected by each other.

散热板是由石墨所组成。The heat sink is made of graphite.

散热罩体外围及散热板上设有若干通风孔，通过该通风孔可保持空气保持流通。A number of ventilation holes are arranged on the periphery of the heat dissipation cover body and the heat dissipation plate, and the air can be kept in circulation through the ventilation holes.

散热板间设有面积较小的片状导热板，该导热板可使散热板间保持适当间隙，以确保气流可以流通其中，不会受到阻碍，且该导热板由导热性佳的材料所组成，通过该导热板可加速发光二极管的热，迅速向外界散去。There is a sheet-shaped heat conduction plate with a small area between the heat dissipation plates. The heat conduction plate can maintain a proper gap between the heat dissipation plates to ensure that the airflow can flow through it without being hindered, and the heat conduction plate is made of materials with good thermal conductivity. , the heat of the light-emitting diodes can be accelerated through the heat conduction plate, and quickly dissipated to the outside.

散热罩体的外缘设有一与其形状相同的灯罩，该灯罩上设有通风孔，该通风孔与散热罩体上的通风孔相对应，并使外界的冷空气保持流通。The outer edge of the heat dissipation cover is provided with a lampshade with the same shape as the lampshade, and the lampshade is provided with ventilation holes corresponding to the ventilation holes on the heat dissipation cover, and keeps the cold air from the outside in circulation.

电源电路板上贴附有导热垫，该导热垫并与散热罩体接触。A heat conduction pad is attached to the power supply circuit board, and the heat conduction pad is in contact with the heat dissipation cover.

电源电路板、散热罩体、散热板及光源基板由连结件串接固定在一起，且该连结件是由导热性佳的材料所组成。The power supply circuit board, the heat dissipation cover, the heat dissipation plate and the light source substrate are connected in series and fixed together by a connecting piece, and the connecting piece is made of a material with good thermal conductivity.

连结件为螺杆。The link is a screw.

由上所述，本实用新型的发光二极管灯具上的热源分散散热模组，通过光源基板及反光罩的导引，将热传导至散热板上，而电源电路板则可由散热罩体的传导，使热传导至外界，使将发光二极管及电源电路板所产生的热，以分散方式迅速向外界散去，进而达到散热分治的目的。From the above, the heat source dispersive heat dissipation module on the light emitting diode lamp of the present invention conducts heat to the heat dissipation plate through the guidance of the light source substrate and the reflector, and the power supply circuit board can be conducted by the heat dissipation cover, so that The heat is conducted to the outside, so that the heat generated by the light-emitting diode and the power circuit board can be quickly dissipated to the outside in a dispersed manner, thereby achieving the purpose of dividing and conquering heat dissipation.

附图说明 Description of drawings

图1：为已知装置的示意图。Figure 1: Schematic diagram of a known device.

图2：为本实用新型的立体示意图。Fig. 2: is the three-dimensional schematic view of the utility model.

图3：为本实用新型的立体分解示意图。Figure 3: is a three-dimensional exploded schematic view of the utility model.

图4：为本实用新型的散热板、导热板及光源基板的立体分解示意图。FIG. 4 : is a three-dimensional exploded schematic view of the heat dissipation plate, the heat conduction plate and the light source substrate of the present invention.

图5：为本实用新型实施时的俯视示意图。Fig. 5: It is a top view schematic diagram when the utility model is implemented.

图6：为本实用新型实施时的断面动作示意图。Fig. 6: Schematic diagram of cross-sectional action when the utility model is implemented.

附图标号：Figure number:

灯罩10Shade 10

灯座11Lampholder 11

电源接头12Power Connector 12

通风孔13、23、42Vents 13, 23, 42

散热罩体20Heat dissipation cover 20

穿孔21、221、31、41、51、61Perforation 21, 221, 31, 41, 51, 61

隔热垫体22Insulation pad body 22

电源电路板30Power circuit board 30

导热垫32Thermal Pad 32

散热板40Heat sink 40

导热板50Heat conduction plate 50

反光罩60Reflector 60

光源基板70Light source substrate 70

发光二极管71LED 71

缺口72Notch 72

连结件80Connector 80

具体实施方式 Detailed ways

请参阅图2、图3、图4、图5所示，本实用新型的一种发光二极管灯具上的热源分散散热模组，该灯具上设有一灯罩10，于本实施例是呈一碗状镂空体，于本实施例该灯罩是由塑料制成，且该灯罩10上设有一向外凸出的灯座11，该灯座11上设有电源接头12，该电源接头12与外部的电源(图中未示)相连接，又，于该灯罩10外围上设有镂空的通风孔13，通过该通风孔13可与外界的冷空气保持流通，且该灯罩10内并容置有一形状与之配合的散热罩体20，该散热罩体20是由导热性佳的金属散热材料所制成，且于该散热罩体20的底部及外围上设有穿孔21及镂空的通风孔23，又，该散热罩体20与灯罩10间设有一电源电路板30，该电源电路板30提供驱动发光二极管的电源，且该电源电路板30设有穿孔31及导热垫32，该导热垫32接触于散热罩体20。Please refer to Fig. 2, Fig. 3, Fig. 4, and Fig. 5, the heat source dispersion cooling module on a light-emitting diode lamp of the present invention is provided with a lampshade 10, which is in the shape of a bowl in this embodiment Hollow body, in this embodiment, the lampshade is made of plastic, and the lampshade 10 is provided with an outwardly protruding lamp holder 11, the lamp holder 11 is provided with a power connector 12, and the power connector 12 is connected to an external power supply (not shown in the figure) is connected, and, on this lampshade 10 periphery, be provided with the ventilation hole 13 of hollow out, can keep circulating with the cold air of the outside through this ventilation hole 13, and this lampshade 10 also accommodates a shape and The matching heat dissipation cover 20, the heat dissipation cover 20 is made of metal heat dissipation material with good thermal conductivity, and the bottom and periphery of the heat dissipation cover 20 are provided with perforations 21 and hollow ventilation holes 23, and A power circuit board 30 is arranged between the heat dissipation cover 20 and the lampshade 10, the power circuit board 30 provides power for driving the light-emitting diodes, and the power circuit board 30 is provided with a perforation 31 and a heat conduction pad 32, and the heat conduction pad 32 is in contact with The heat dissipation cover 20.

再者，该散热罩体20中设有一隔热垫体22，该隔热垫体22上设有穿孔221，而该散热罩体20在隔热垫体22上则设有复数个以叠置方式重叠在一起的片状散热板40(于本实施例的片状散热片为石墨所组成)，该等散热板40是配合散热罩体20形状，而由下向上的面积逐渐扩增，且该等散热板40间设有面积较小的导热板50，通过该等导热板50可使该等散热板40间保持适当间隙及导热效果，又，该等散热板40及导热板50上分别设有穿孔41、51，又，该等散热板40上则分别设有一个以上的通风孔42，由该等通风孔42及导热板50以确保气流可以流通其中，不会受到阻碍。Furthermore, the heat dissipation cover 20 is provided with a heat insulation pad 22, the heat insulation pad 22 is provided with perforations 221, and the heat dissipation cover 20 is provided with a plurality of heat insulation pads 22 for stacking. The sheet-like heat sinks 40 (the sheet-like heat sinks in this embodiment are made of graphite) are stacked together. These heat sinks 40 match the shape of the heat dissipation cover 20, and the area gradually increases from bottom to top, and These radiator plates 40 are provided with smaller heat conduction plates 50, through these heat conduction plates 50 can make these heat dissipation plates 40 maintain proper gap and heat conduction effect, again, on these heat dissipation plates 40 and heat conduction plates 50 respectively Perforations 41, 51 are provided, and more than one ventilation hole 42 is respectively arranged on the heat dissipation plates 40, and the ventilation holes 42 and the heat conduction plate 50 ensure that the air flow can circulate therein without being hindered.

此外，该等散热板40上设有一反光罩60，于本实施例为一碗状的反光罩，该反光罩60上设有穿孔61，且该反光罩60中容置有一光源基板70，该光源基板70并由电流引线与电源电路板30做电性连接，且该光源基板70上设有一个以上已封装的发光二极管71，该光源基板70设有凹入的缺口72，以令连结件80可穿过缺口72、穿孔61、51、41、221、21、31，而将散热罩体20、隔热垫体22、电源电路板30、散热板40、导热板50、反光罩60以及光源基板70串接在一起(如图6所示)，于本实施例中连结件80为螺杆，且该连结件80也作为传导热源用。In addition, the heat dissipation plates 40 are provided with a reflector 60, which is a bowl-shaped reflector in this embodiment. The reflector 60 is provided with a perforation 61, and a light source substrate 70 is accommodated in the reflector 60. The light source substrate 70 is electrically connected to the power supply circuit board 30 by the current leads, and more than one packaged light-emitting diode 71 is arranged on the light source substrate 70, and the light source substrate 70 is provided with a recessed gap 72 to make the connecting parts 80 can pass through the gap 72, perforation 61, 51, 41, 221, 21, 31, and heat dissipation cover 20, heat insulation pad body 22, power supply circuit board 30, heat dissipation plate 40, heat conducting plate 50, reflector 60 and The light source substrates 70 are connected in series (as shown in FIG. 6 ). In this embodiment, the connecting member 80 is a screw, and the connecting member 80 is also used as a heat conduction source.

使用时，请参照图5、图6所示，通过电源接头12将外部电源导入电源电路板30，而驱动发光二极管71发出亮光，同时，电源电路板30可通过导热垫32将热传导至散热罩体20，再由散热罩体20将热传导出去，同时，光源基板70上的发光二极管71所产生的热也可由反光罩60传导至叠置在一起的散热板40及导热板50，将热传导出去，进而达到将电源电路板30及发光二极管71所产生的热分散、分治传导的目的。When in use, please refer to Fig. 5 and Fig. 6, the external power is introduced into the power circuit board 30 through the power connector 12, and the light-emitting diode 71 is driven to emit bright light. At the same time, the power circuit board 30 can conduct heat to the heat dissipation cover through the heat conduction pad 32 body 20, and then the heat is conducted out by the heat dissipation cover 20, and at the same time, the heat generated by the light-emitting diodes 71 on the light source substrate 70 can also be conducted by the reflector 60 to the heat dissipation plate 40 and the heat conduction plate 50 stacked together to conduct the heat out , and further achieve the purpose of dissipating and dividing the heat generated by the power supply circuit board 30 and the light emitting diodes 71 .

Claims (10)

1. the thermal source on the led lamp disperses the heat radiation module, it is characterized in that including:
One drives the power supply circuit board that light emitting diode starts;
A plurality of heat sinks, the plates that it is made up of the good material of thermal diffusivity, these heat sinks and stacked being fixed together;
One light source substrate, it is to be set in parallel on these heat sinks, and this light source substrate is provided with light emitting diode, and this light source substrate is provided with current feed, and this current feed also electrically connects with power supply circuit board;
One heat radiation cover body, it is to make with Heat Conduction Material, this heat radiation cover body is located between heat sink and power supply circuit board, and cooperates the shape of heat sink, and these heat sinks are wherein ccontaining, and this power supply circuit board contacts with the heat radiation cover body.
2. the thermal source on the led lamp as claimed in claim 1 disperses the heat radiation module, and it is characterized in that: be provided with a reflection shield between heat sink and light source substrate, this reflection shield is made up of Heat Conduction Material.
3. the thermal source on the led lamp as claimed in claim 1 disperses the heat radiation module, it is characterized in that: be provided with a heat insulation pad between heat radiation cover body and heat sink.
4. the thermal source on the led lamp as claimed in claim 1 disperses the heat radiation module, and it is characterized in that: heat sink is made up of graphite.
5. the thermal source on the led lamp as claimed in claim 1 disperses the heat radiation module, and it is characterized in that: heat dissipating housing body periphery and heat sink are provided with some air vents.
6. the thermal source on the led lamp as claimed in claim 1 disperses the heat radiation module, it is characterized in that: be provided with the less sheet heat-conducting plate of area that makes heat sink keep appropriate gap between heat sink, this heat-conducting plate is made up of the good material of thermal conductivity.
7. the thermal source on the led lamp as claimed in claim 5 disperses the heat radiation module, it is characterized in that: the outer rim of heat radiation cover body is provided with a lampshade identical with its shape, this lampshade is provided with air vent, and this air vent is corresponding with the air vent on the heat radiation cover body.
8. the thermal source on the led lamp as claimed in claim 1 disperses the heat radiation module, it is characterized in that: be pasted with heat conductive pad on the power supply circuit board, this heat conductive pad contacts with the heat radiation cover body.
9. the thermal source on the led lamp as claimed in claim 1 disperses the heat radiation module, it is characterized in that: power supply circuit board, heat radiation cover body, heat sink and light source substrate are fixed together by the connecting piece serial connection, and this connecting piece is made up of the good material of thermal conductivity.
10. the thermal source on the led lamp as claimed in claim 9 disperses the heat radiation module, and it is characterized in that: connecting piece is a screw rod.
CNU200720142570XU 2007-05-23 2007-05-23 Heat source dispersion heat radiation module on LED lamp Expired - Fee Related CN201059523Y (en)

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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010022630A1 (en) * 2008-09-05 2010-03-04 Wong Pun Heat dissipating device for led source and led source
CN101975376A (en) * 2010-10-08 2011-02-16 深圳市华星光电技术有限公司 Luminous source heat-dissipation structure of backlight module
WO2011047565A1 (en) * 2009-10-22 2011-04-28 Shen Lihao Multilayered heat-dissipating structure for led illumination lamp
CN102200233A (en) * 2011-06-20 2011-09-28 广州莱迪光电股份有限公司 Light-emitting diode (LED) bulb lamp structure
CN101749682B (en) * 2008-12-19 2012-01-04 中山伟强科技有限公司 LED recessed lamp
CN102345833A (en) * 2011-10-28 2012-02-08 江苏国星电器有限公司 Energy-saving LED bulkhead lamp
CN102563419A (en) * 2011-12-29 2012-07-11 张翔 Self-heat-radiating LED (Light-Emitting Diode) lamp
US8246219B2 (en) 2008-11-04 2012-08-21 Advanced Optoelectronic Technology, Inc. Light emitting diode light module and optical engine thereof
US8491162B2 (en) 2009-01-14 2013-07-23 Zhongshan Weiqiang Technology Co., Ltd. LED lamp
CN103791308A (en) * 2012-10-30 2014-05-14 深圳市海洋王照明工程有限公司 Lamp
CN103851571A (en) * 2012-12-05 2014-06-11 黄泰瑜 Multifunctional LED (light emitting diode) lamp cap connection mechanism
CN115793364A (en) * 2022-12-02 2023-03-14 成都思越智能装备股份有限公司 Projection light source lamp box for macroscopic inspection machine

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010022630A1 (en) * 2008-09-05 2010-03-04 Wong Pun Heat dissipating device for led source and led source
US8246219B2 (en) 2008-11-04 2012-08-21 Advanced Optoelectronic Technology, Inc. Light emitting diode light module and optical engine thereof
CN101749682B (en) * 2008-12-19 2012-01-04 中山伟强科技有限公司 LED recessed lamp
US8491162B2 (en) 2009-01-14 2013-07-23 Zhongshan Weiqiang Technology Co., Ltd. LED lamp
WO2011047565A1 (en) * 2009-10-22 2011-04-28 Shen Lihao Multilayered heat-dissipating structure for led illumination lamp
CN101975376B (en) * 2010-10-08 2012-07-11 深圳市华星光电技术有限公司 Luminous source heat-dissipation structure of backlight module
CN101975376A (en) * 2010-10-08 2011-02-16 深圳市华星光电技术有限公司 Luminous source heat-dissipation structure of backlight module
CN102200233A (en) * 2011-06-20 2011-09-28 广州莱迪光电股份有限公司 Light-emitting diode (LED) bulb lamp structure
CN102345833A (en) * 2011-10-28 2012-02-08 江苏国星电器有限公司 Energy-saving LED bulkhead lamp
CN102563419A (en) * 2011-12-29 2012-07-11 张翔 Self-heat-radiating LED (Light-Emitting Diode) lamp
CN103791308A (en) * 2012-10-30 2014-05-14 深圳市海洋王照明工程有限公司 Lamp
CN103851571A (en) * 2012-12-05 2014-06-11 黄泰瑜 Multifunctional LED (light emitting diode) lamp cap connection mechanism
CN115793364A (en) * 2022-12-02 2023-03-14 成都思越智能装备股份有限公司 Projection light source lamp box for macroscopic inspection machine

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