CN206557704U - Heat dissipation structure of power supply - Google Patents

Abstract

The utility model provides a power supply ware heat radiation structure, power supply ware has a shell, and one hold in circuit module in the shell, power supply ware heat radiation structure includes: the heat dissipation plate is arranged inside the shell in a buried injection molding mode, and an inner material layer and an outer material layer are respectively formed on the inner side surface and the outer side surface of the shell; the circuit substrate is provided with a power assembly, and the inner material layer of the shell is provided with a notch part corresponding to the position of the power assembly, so that the power chip is contacted with the heat dissipation plate through the notch part. The utility model discloses an above-mentioned technical means can promote power supply's radiating efficiency to simplify its equipment procedure, reach reduce cost's purpose.

Description

Power Supply Heat Dissipation Structure

technical field

The utility model relates to a heat dissipation structure of a power supply, in particular to a heat dissipation structure of the power supply used in an external power supply device.

Background technique

Existing notebook computers or mobile electronic devices mostly use external power supplies as the source of power supply. The power supply will generate electromagnetic wave interference and the circuit components will emit high heat when in use. Therefore, the design of the power supply must consider the anti-electromagnetic wave Interference, and heat dissipation issues.

As shown in Figure 1 and Figure 2, it is an existing external power supply. The structure of the existing external power supply usually includes a housing 1, and an accommodation space is formed inside the housing 1 to accommodate a The circuit module 2 is further coated with an insulating sheet 3 on the outside of the circuit module 2 , and then coated with a metal isolation plate 4 on the outside of the insulating sheet 3 .

As shown in FIG. 2 , when the power supply is assembled, the metal isolation plate 4 is covered on the outside of the circuit module 2 , and an adhesive 5 is filled between the outer surface of the metal isolation plate 4 and the inner surface of the housing 1 . The outer surface of the metal isolation plate 4 and the inner surface of the housing 1 are attached together. The temperature generated by the circuit components on the circuit module 2 can be indirectly transmitted to the metal isolation plate 4, and then transferred from the metal isolation plate 4 to the housing 1 through the adhesive 5, and then dissipated to the outside air through the housing 1, thereby Make the circuit module 2 cool down. In addition, one end of the metal isolation plate 4 is provided with a lead portion 6, through which the lead portion 6 is connected to a circuit substrate of the circuit module 2, thereby electrically connecting the grounding line of the circuit module 2 to the metal isolation plate 4, by This makes the metal isolation plate 4 also have the functions of shielding and eliminating electromagnetic wave interference of the circuit module 2 .

The existing power supply adopts the above-mentioned heat dissipation structure, in which an insulating sheet 3 must be used to isolate the circuit module 2 and the metal isolation plate 4, so that the temperature conduction path of the circuit module 2 is additionally blocked by an insulating sheet 3, Therefore, the heat dissipation efficiency of the power supply is reduced. In addition, in the current assembly procedure of the power supply, it is necessary to cover the outer side of the circuit module 2 with the insulating sheet 3 and the metal isolation plate 4 in order, and then apply the adhesive 5 on the outer surface of the metal isolation plate 4 , Then assemble the circuit module 2 together with the insulation sheet 3 and the metal isolation plate 4 inside the casing 1 . The above-mentioned assembling procedures are quite complicated, and it will take a lot of man-hours to apply the adhesive on the outer side of the metal isolation plate 4, thus resulting in the disadvantages of complicated assembling procedures and poor efficiency.

Due to the above reasons, the existing power supply has the disadvantages of poor cooling effect and increased assembly cost. Therefore, how to overcome the above disadvantages by improving the structural design has become one of the important issues to be solved by this project.

Contents of the invention

The main purpose of the utility model is to solve the disadvantages of poor heat dissipation efficiency and high assembly cost of the existing external power supply.

An embodiment of the present invention provides a heat dissipation structure for a power supply. The power supply has a casing, and a circuit module accommodated in the casing, wherein the circuit module has a circuit substrate, and is characterized in that the power supply The heat dissipation structure of the supplier includes: at least one heat dissipation plate, and the heat dissipation plate is installed inside the housing by embedded injection molding, and the heat dissipation plate has at least one flat plate portion and two The side plate portion, the flat plate portion and at least one of the two side plate portions are adjacent to the circuit substrate and parallel to the circuit substrate; the housing is on a side of the heat dissipation plate facing the circuit module An inner material layer is formed, and an outer material layer is formed on the side of the heat dissipation plate opposite to the circuit module, the heat dissipation plate is sandwiched between the outer material layer and the inner material layer, and the The inner material layer of the casing is located between the heat sink and the circuit module; the circuit substrate has a power component, and the inner material layer of the casing is provided with a notch at a position corresponding to the power component , so that the heat dissipation plate is exposed from the notch, and the power component can directly or indirectly contact the heat dissipation plate through the notch, so that the temperature generated by the power component is conducted to the heat dissipation plate .

A preferred embodiment of the present invention, wherein the power component is a power chip, a heat conduction component is arranged between the power component and the surface of the heat dissipation plate at the notch, and the heat conduction component is a heat conduction Spacers or thermal paste.

In a preferred embodiment of the present invention, the circuit substrate is provided with a contact assembly, one end of the contact assembly is electrically connected to a grounding line of the circuit substrate, and the other end of the contact assembly is connected to the heat sink electrical connection.

In a preferred embodiment of the present invention, the contact component is a metal rod, and the heat sink is provided with a socket corresponding to the position of the contact component, and the socket is electrically connected to the heat sink , and the top surface of the receptacle is provided with a socket corresponding to the position of the contact assembly, and a plurality of slits around the socket, the diameter of the socket matches the diameter of the contact assembly , and the contact assembly can be inserted into the socket, so that the contact assembly can be electrically connected to the heat sink through the socket.

In a preferred embodiment of the present invention, the contact component can be selected from one of the following conductive components: conductive shrapnel, conductive spring, wire, and conductive sponge.

In a preferred embodiment of the present invention, the casing includes an upper casing and a lower casing, and the heat dissipation plate is separately arranged in the lower casing.

In a preferred embodiment of the present invention, the outer casing includes an upper casing and a lower casing, wherein a heat dissipation plate is respectively arranged inside the upper casing and the lower casing, and the upper casing After being combined with the lower case, the upper case and the two heat dissipation plates in the lower case contact each other to form an electrical connection.

The beneficial effect of the utility model is that it can improve the heat dissipation efficiency of the power supply, simplify its assembly procedure, and achieve the purpose of reducing cost.

In order to further understand the features and technical content of the present utility model, please refer to the following detailed description and accompanying drawings of the present utility model. However, the attached drawings are only for reference and illustration, and are not intended to limit the present utility model.

Description of drawings

FIG. 1 is an exploded perspective view of a conventional heat dissipation structure of a power supply.

FIG. 2 is a combined cross-sectional view of a conventional heat dissipation structure of a power supply.

FIG. 3 is a three-dimensional exploded view of the heat dissipation structure of the power supply of the present invention.

Fig. 4 is an exploded cross-sectional view of the heat dissipation structure of the power supply of the present invention.

FIG. 4A is an exploded cross-sectional view of the heat dissipation structure of the power supply of the present invention.

FIG. 5 is a combined cross-sectional view of the heat dissipation structure of the power supply of the present invention.

FIG. 6 is a combined cross-sectional view of the second embodiment of the heat dissipation structure of the power supply of the present invention.

FIG. 7 is a combined cross-sectional view of a third embodiment of the heat dissipation structure of the power supply of the present invention.

FIG. 8 is a combined cross-sectional view of a fourth embodiment of the heat dissipation structure of the power supply of the present invention.

detailed description

[First embodiment]

As shown in FIG. 3 to FIG. 5 , it is a structure of a power supply made by adopting the heat dissipation structure of the power supply of the present invention. The power supply includes a housing 10, and a circuit module 20, the circuit module 20 is accommodated inside the housing 10, and a heat sink 30, the heat sink 30 is embedded in the inside of the housing 10, and covers on the outside of the circuit module 20 .

Wherein, the casing 10 is a casing made of plastic material and injection molding, and an accommodating chamber is formed inside the casing 10 to accommodate the circuit module 20 . The circuit module 20 has a circuit substrate 21 and a plurality of circuit components 25 on the circuit substrate 21. The plurality of circuit components 25 constitute the rectification and voltage transformation circuits of the power supply. The heat dissipation plate 30 is made of a material with good thermal and electrical conductivity (such as a metal plate), and the heat dissipation plate 30 is embedded in the casing 10 of the power supply by using an insert molding method. Each of the heat dissipation plates 30 has a flat plate portion 31, and side plate portions 32 connected to both side edges of the flat plate portion 31, and at least one of the flat plate portion 31 and the two side plate portions 32 is adjacent to the The circuit substrate 21 is parallel to the circuit substrate 21 , so the temperature generated by the circuit module 20 can be transmitted to the heat sink 30 to improve the heat dissipation performance of the circuit module 20 and can be used to shield the electromagnetic wave interference generated by the circuit module 20 .

In the first embodiment of the heat dissipation structure of the power supply of the present utility model, the casing 10 is composed of an upper casing 11 and a lower casing 12. After the upper casing 11 and the lower casing 12 are combined, the inner casing is formed An accommodating space for accommodating the circuit module 20 . The upper shell 11 and the lower shell 12 of the shell 10 are respectively made of plastic materials and made by injection molding, and the heat sink 30 is inserted into the upper shell 11 and the lower shell 12 during injection molding. In the forming mold, the upper casing 11 and the lower casing 12 are combined through an insert molding process. Therefore, as shown in FIG. 30 forms an inner material layer 102 on one side facing the circuit module 20, and forms an outer material layer 101 on the side of the heat dissipation plate 30 opposite to the circuit module 20, so that the cross section of the housing 10 forms a sandwich between the heat dissipation plate 30 and A sandwich structure between the outer material layer 101 and the inner material layer 102 .

As shown in Figures 4 and 5, when the upper case 11 and the lower case 12 of the housing 10 are combined, the side of the heat dissipation plate 30 facing the circuit module 20 is covered by the inner material layer 102, so that the heat dissipation plate 30 can pass through The inner material layer 102 of the housing 10 is insulated from the circuit module 20 without additional insulating sheet for isolation.

As shown in Fig. 4 and Fig. 5, in the first embodiment of the present utility model, one heat dissipation plate 30 is respectively arranged in the upper casing 11 and the lower casing 12 of the casing 10, and the flat part 31 of the two heat dissipation plates 30 They are respectively located on the upper side of the upper case 11 and the bottom side of the lower case 12 , and the side plates 32 of the two cooling plates 30 are respectively located on the two sides of the upper case 11 and the lower case 12 .

Therefore, as shown in FIG. 5 , when the upper case 11 and the lower case 12 are relatively combined together, the circuit module 20 is covered on the inner surfaces of the upper case 11 and the lower case 12 , while the two cooling plates 30 The flat plate portion 31 is respectively located on the upper side and the lower side of the circuit module 20 , and the side plate portions 32 of the two heat sinks 30 are respectively located on two sides of the circuit module 20 , thus completely covering the four sides of the circuit module 20 .

As shown in FIG. 5 , the temperature generated by the circuit module 20 can be conducted to the heat dissipation plate 30 through the inner material layer 102 of the housing 10 , and then the temperature of the circuit module 20 can be conducted to the outer material layer 101 through the heat dissipation plate 30 , The temperature is then dissipated into the atmosphere via the outer surface of the housing 10 . Since the heat dissipation plate 30 is a heat conductor, the temperature generated by the circuit assembly 25 on the circuit module 20 can spread to the entire heat dissipation plate 30 through heat conduction, so the heat dissipation area of the circuit module 20 can be increased to improve the heat dissipation of the circuit module 20 efficiency.

In addition, as shown in FIG. 3 , FIG. 4A and FIG. 5 , a power component 23 is disposed on the circuit substrate 21 of the circuit module 20 . Generally speaking, when the circuit module of the power supply is in operation, the power component 23 will generate the most heat, so the temperature of the circuit module 20 will be concentrated at the power component 23 . Therefore, in order to improve the heat dissipation efficiency of the circuit module 20 in the present invention, a notch 13 is provided on the inner material layer 102 of the casing 10 corresponding to the position of the power component 23 on the circuit substrate 21, so that the The heat dissipation plate 30 can be exposed from the notch 13 and is not covered by the lower housing 12, and the power component 23 can be in direct or indirect contact with the surface of the heat dissipation plate 30 in the notch 13, so that the power component 23 The generated heat can be conducted to the heat dissipation plate 30 without being hindered by the housing 10 , thereby improving the heat dissipation efficiency of the circuit module 20 . In this embodiment, the power component 23 is in contact with the heat dissipation plate 30 through a heat conduction component 24 . The heat conduction component 24 can be a heat conduction gasket, or a heat conduction glue. The heat conduction component 24 has good heat conduction capability, so the temperature of the power component 23 can be rapidly transferred to the heat dissipation plate 30 .

The heat dissipation plate 30 of the present invention not only has the function of heat dissipation, but also has the functions of shielding and eliminating electromagnetic wave interference of the circuit module 20 . As shown in Figures 3 and 5, the circuit substrate 21 also has a grounding circuit (not shown), and a contact assembly 22 is provided on the circuit substrate 21, and one end of the contact assembly 22 is connected to the circuit substrate 21. The other end of the contact assembly 22 is electrically connected to the heat sink 30 . The contact assembly 22 is connected to the heat dissipation plate 30 , so that the grounding line of the circuit module 20 is connected to the heat dissipation plate 30 , so that the grounding line of the circuit substrate 21 is electrically connected to the heat dissipation plate 30 .

In this embodiment, the contact component 22 is a round rod-shaped metal rod, and the cooling plate 30 is provided with a socket 33 corresponding to the position of the contact component 22 . In this embodiment, the outer shape of the socket 33 is roughly square, and a socket 331 is arranged in the center of the top surface of the socket 33, and a plurality of slots 332 are arranged around the socket 331, so that the socket 33 can be inserted The material around the hole 331 has room for bending and deformation so that the diameter of the insertion hole 331 can be elastically changed. The receptacle 33 is welded on the heat dissipation plate 30 and exposed to the inner material layer 102, and the center position of the jack 331 corresponds to the contact assembly 22 of the circuit module 20, and the diameter of the jack 331 and the diameter of the contact assembly 22 The outer diameters cooperate with each other, so when the circuit module 20 is assembled inside the housing 10, the contact assembly 22 can be aligned with the socket 331 of the socket 33, and the contact assembly 22 and the socket 331 are in contact with each other, so that the grounding circuit of the circuit substrate 21 It is electrically connected with the heat sink 30 .

It must be noted here that the structure of the contact assembly 22 on the circuit module 20 is not limited to that disclosed in the above-mentioned embodiments, and any technical means that can achieve electrical connection between the ground line of the circuit module 20 and the heat sink 30 is acceptable. Can be applied to the utility model. For example, in the embodiment shown in Figure 8, the contact assembly 22a is a shrapnel. In addition, the contact assembly 22a can be further replaced with other types of conductive components, such as springs, wires, conductive sponges, etc., which can be used as a circuit The substrate 21 and the heat dissipation plate 30 are electrically connected to the used contact assembly.

As shown in FIG. 5 , in the first embodiment, the edges of the side plate portions 32 of the heat sink 30 in the upper case 11 and the lower case 12 are partially exposed on both sides of the upper case 11 and the lower case 12 respectively. and when the upper case 11 and the lower case 12 are combined together, the edges of the two side plate parts 32 of the heat dissipation plate 30 in the upper case 11 and the lower case 12 can overlap each other , so that the heat sinks 30 in the upper and lower casings 11, 12 can be electrically connected to each other, thus forming a conductor completely covering the outside of the circuit module 20, and effectively shielding the electromagnetic waves of the circuit module 20.

Compared with the heat dissipation structure of the existing power supply, the utility model has the main feature that the heat dissipation plate 30 is directly installed inside the casing 10 by embedded injection molding, so that the heat dissipation plate 30 and the casing 10 are integrated into one Components can effectively reduce the number of parts. In addition, the inner material layer 102 of the housing 10 is spaced between the inner surface of the heat dissipation plate 30 and the circuit module 20, so that an insulating state is naturally formed between the heat dissipation plate 30 and the circuit module 20, and no additional insulating sheet is required. . Therefore, when assembling the heat dissipation structure of the power supply of the present invention, it is only necessary to simply combine the upper case 11 and the lower case 12 of the housing 10 on the outside of the circuit module 20 to complete the assembly of the power supply. And compared with the existing power supply assembly procedure, the assembling procedure of the present utility model can omit the procedure of covering the insulating sheet and the heat dissipation plate on the outside of the circuit module, and also omits the application of adhesive on the outside of the heat dissipation plate and then The process of adhering the cooling plate to the inner surface of the shell greatly simplifies the assembly process of the present invention, thereby achieving the purpose of reducing the manufacturing cost.

In addition, in terms of heat dissipation efficiency, the heat dissipation plate 30 of the present invention is directly insulated from the circuit module 20 through the inner material layer 102 of the casing 10, so that no additional insulating sheet is required between the heat dissipation plate 30 and the circuit module 20, and the heat dissipation plate 30 and the housing 10 do not need to be bonded with an adhesive, so that the heat dissipation path of the circuit module 20 reduces the obstruction of the insulating sheet and the adhesive, thereby improving the heat dissipation efficiency.

[Second Embodiment]

As shown in Figure 6, in the second embodiment of the present invention, the casing 10 is also composed of an upper casing 11 and a lower casing 12, but in the second embodiment only a cooling plate 30 is arranged inside the lower casing 12, and the upper casing The body 11 is not provided with a cooling plate 30 . In this embodiment, the flat portion 31 of the cooling plate 30 is accommodated on the bottom side of the lower case 12 , and the two side plate portions 3 are respectively located on two sides of the lower case 12 . Therefore, when the circuit module 20 is assembled inside the casing 10 , the bottom surface of the circuit substrate 21 is adjacent to the flat portion 31 of the heat sink 30 , and the flat portion 31 is parallel to the bottom surface of the circuit substrate 21 .

In this embodiment, the flat plate portion 31 and the two side plate portions 32 of the heat dissipation plate 30 are sandwiched between the outer material layer 101 and the inner material layer 102 of the housing 10, and the inner material layer 102 of the housing 10 corresponds to the circuit module 20 The position of the power assembly 23 is provided with a notch 12, so that the heat dissipation plate 30 is exposed from the notch 13, and the power assembly 23 can contact the surface of the heat dissipation plate 30 at the position of the notch 13 through the heat conduction assembly 24, or directly Contacts the cooling plate 30 , thereby enabling the temperature of the power assembly 23 to be conducted to the cooling plate 30 .

[Third Embodiment]

As shown in FIG. 7 , in the third embodiment of the present invention, the housing 10 has a transverse U-shaped section, and one side of the housing 10 has an opening, and a cover 14 is disposed at the opening of the housing. When the shell 10 and the cover 14 are combined, a covering shell can be formed to accommodate the circuit module 20 inside the shell 10 and the cover 14 . In this embodiment, the heat dissipation plate 30 is embedded in the interior of the housing 10 by means of embedded injection molding, and the flat plate portion 31 of the heat dissipation plate 30 is covered on the side of the housing 10, and the two side plate portions 32 of the heat dissipation plate 30 Then it is covered on the upper side and the lower side of the housing 10, so that the heat dissipation plate 30 forms a flat plate portion 31 covering one side of the circuit module 20, while two side plate portions 32 cover the upper side and the lower side of the circuit module 20 status.

In this embodiment, the cooling plate 30 is also covered by the outer material layer 101 and the inner material layer 102 of the housing 10, and the inner material layer 102 of the housing 10 is provided with a notch corresponding to the position of the power component 23 of the circuit module 20 13 , the heat dissipation plate 30 is exposed from the notch 13 , and the power component 23 is in contact with the heat dissipation plate 30 through the heat conduction component 24 .

[Possible efficacy of the embodiment]

In summary, the utility model integrates the cooling plate 30 into the structure of the housing 10 by using the plastic embedded injection molding method, so there is no need to use an insulating sheet to isolate the cooling plate 30 from the circuit module 20, so as to improve the performance of the power supply. The effect of heat dissipation efficiency greatly simplifies the assembly procedure of the circuit module 20 and the housing 10 of the power supply, omitting the procedures of assembling the spacer, the heat dissipation plate and applying the adhesive, thus greatly reducing the assembly man-hours and reducing the cost the goal of.

The above descriptions are only preferred feasible embodiments of the present utility model, and are not intended to limit the patent scope of the present utility model. Therefore, all equivalent technical changes made by using the description of the utility model and the contents of the accompanying drawings are included in the utility model. within the scope of protection.

Claims (7)

1. a kind of power supply unit radiator structure, the power supply unit has a shell, and one is contained in the shell Circuit module, wherein the circuit module have a circuit substrate, it is characterised in that the power supply unit radiator structure bag Include：

An at least heat sink, the heat sink is to be embedded to the inside that injection molding method is arranged at the shell, the heat sink With an at least flat part and it is connected to the both sides plate portion of the side of flat part two, side plate described in the flat part and two At least one is adjacent to the circuit substrate and parallel with the circuit substrate；

The shell forms material layer in one in the one side of the heat sink towards the circuit module, and in the heat sink Relative to the circuit module one side formation one outer material layer, the heat sink clamping in the outer material layer with it is described interior Between material layer, and the interior material layer of the shell is located between heat sink and the circuit module；

There is a (PCC) power, and the position of the interior material layer correspondence (PCC) power of the shell on the circuit substrate Install a notch part so that the heat sink exposes from the notch part, and the (PCC) power can be direct or indirect Ground is contacted by the notch part and the heat sink so that the temperature conduction that the (PCC) power is produced to the heat sink.

2. power supply unit radiator structure as claimed in claim 1, it is characterised in that wherein described (PCC) power is a power A heat-conductive assembly, institute are provided between the surface of chip, the (PCC) power and the heat sink at the notch part Heat-conductive assembly is stated for heat-conducting pad or heat-conducting glue.

3. power supply unit radiator structure as claimed in claim 2, it is characterised in that wherein described circuit substrate connects provided with one Touch component, a ground path of one end of the contact assembly and the circuit substrate is electrically connected with, the contact assembly it is another One end and the heat sink are electrically connected with.

4. power supply unit radiator structure as claimed in claim 3, it is characterised in that wherein described contact assembly is a metal The body of rod, and the position of the heat sink correspondence contact assembly sets a plug socket, the plug socket is electrically connected at described Heat sink, and the position of the top surface correspondence contact assembly of the plug socket sets a jack, and it is multiple positioned at described slotting The diametric fit of joint-cutting around hole, the diameter of the jack and the contact assembly, and the contact assembly be inserted into In the jack so that the contact assembly can be electrically connected with by the plug socket and the heat sink.

5. power supply unit radiator structure as claimed in claim 3, it is characterised in that wherein described contact assembly may be selected from down One of row conductive component：Electroconductive elastic sheet, power spring, wire, conductive sponge.

6. the power supply unit radiator structure as described in claim 1 to 5 any of which, it is characterised in that wherein described shell Including a upper shell and a lower house, the heat sink is arranged separately in the lower house.

7. the power supply unit radiator structure as described in claim 1 to 5 any of which, it is characterised in that wherein described shell Including a upper shell and a lower house, wherein heat sink described in one is set respectively inside the upper shell and the lower house, and After the upper shell and the lower house are combined, in the upper shell and the lower house two described in heat sink it is mutual Electric connection is reached in contact.