CN205050865U - LED circuit board - Google Patents
LED circuit board Download PDFInfo
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- CN205050865U CN205050865U CN201520757677.XU CN201520757677U CN205050865U CN 205050865 U CN205050865 U CN 205050865U CN 201520757677 U CN201520757677 U CN 201520757677U CN 205050865 U CN205050865 U CN 205050865U
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
本实用新型公开了一种LED线路板,包括依次平行设置的电源线、第一热电导线和第二热电导线,还包括设置在所述平行方向的垂直方向的多个加强筋,所述加强筋连接所述电源线、第一热电导线和第二热电导线,所述第一热电导线和第二热电导线在临近的两个加强筋之间的部分设置有散热区和发光区,所述发光区设有LED灯座,所述LED灯座上部设有LED灯杯,所述第一热电导线和第二热电导线穿过所述LED灯座,并位于所述LED灯杯的底部。本实用新型为金属板整体一次成型后注塑成型,整合了导电和导热功能;LED灯可直接成型在线路板上;热电导线的散热区可直接将热量散发出去,也可连接到其它具有散热功能的部件上,散热性能更好。
The utility model discloses an LED circuit board, which comprises a power line, a first thermoelectric wire and a second thermoelectric wire arranged in parallel in turn, and also includes a plurality of reinforcing ribs arranged in the parallel direction and vertical direction, and the reinforcing rib Connect the power line, the first thermoelectric wire and the second thermoelectric wire, the first thermoelectric wire and the second thermoelectric wire are provided with a heat dissipation area and a light emitting area between two adjacent reinforcing ribs, and the light emitting area An LED lamp holder is provided, and an LED lamp cup is arranged on the upper part of the LED lamp holder. The first thermoelectric wire and the second thermoelectric wire pass through the LED lamp holder and are located at the bottom of the LED lamp cup. The utility model is injection molding after the whole metal plate is formed once, which integrates the functions of electric conduction and heat conduction; the LED lamp can be directly formed on the circuit board; the heat dissipation area of the thermoelectric wire can directly dissipate the heat, and can also be connected to other heat dissipation functions. On the components, the heat dissipation performance is better.
Description
技术领域 technical field
本实用新型涉及LED灯制造领域,尤其涉及一种LED线路板。 The utility model relates to the field of LED lamp manufacture, in particular to an LED circuit board.
背景技术 Background technique
LED(LightEmittingDiode),发光二极管,是一种固态的半导体器件,它可以直接把电转化为光。LED的心脏是一个半导体的晶片,晶片的一端附在一个支架上,一端是负极,另一端连接电源的正极,使整个晶片被环氧树脂封装起来。半导体晶片由两部分组成,一部分是P型半导体,在它里面空穴占主导地位,另一端是N型半导体,在这边主要是电子。但这两种半导体连接起来的时候,它们之间就形成一个“P-N结”。当电流通过导线作用于这个晶片的时候,电子就会被推向P区,在P区里电子跟空穴复合,然后就会以光子的形式发出能量,这就是LED发光的原理。而光的波长也就是光的颜色,是由形成P-N结的材料决定的。 LED (Light Emitting Diode), light emitting diode, is a solid-state semiconductor device that can directly convert electricity into light. The heart of LED is the wafer of a semiconductor, and one end of wafer is attached on a bracket, and one end is negative pole, and the other end connects the positive pole of power supply, and whole wafer is encapsulated by epoxy resin. Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and hole occupies an leading position in it, and the other end is N-type semiconductor, and here mainly is electron. But time these two kinds of semiconductors couple together, between them, just form a "P-N junction". When electric current acts on this chip by wire time, electron will be pushed to P district, and in P district, electron is with hole recombination, then will send energy with the form of photon, the principle of LED luminescence that Here it is. And the wavelength of light i.e. the color of light, be determined by the material forming P-N junction.
高性能LED的实用化和商品化,使照明技术面临一场新的革命。由多个超高亮度红、蓝、绿三色LED组成的像素灯不仅可以发出波长连续可调的各种色光,而且还可以发出亮度可达几十到一百烛光的白色光成为照明光源,对于相同发光亮度的白炽灯和LED固体照明灯来说,后者的功耗只占前者的10%-20%。 The practicality and commercialization of high-performance LEDs have brought about a new revolution in lighting technology. The pixel light composed of multiple ultra-high-brightness red, blue, and green LEDs can not only emit various colors of light with continuously adjustable wavelengths, but also emit white light with a brightness of tens to one hundred candlepower as a lighting source. For incandescent lamps and LED solid-state lighting lamps with the same luminance, the power consumption of the latter only accounts for 10%-20% of the former.
当前,白光LED大部分是通过在蓝光LED上覆盖一层淡黄色荧光粉涂层制成的,这种黄色磷光体通常是通过把掺了铈的钇铝石榴石晶体磨成粉末后混合在一种稠密的粘合剂中而制成的。当LED芯片发出蓝光,部分蓝光便会被这种晶体很高效地转换成一个光谱较宽的主要为黄色的光,由于黄光会刺激肉眼中的红光和绿光受体,再混合LED本身的蓝光,使它看起来就像白色光。 Currently, white LEDs are mostly made by coating blue LEDs with a yellowish phosphor coating, usually by grinding cerium-doped yttrium aluminum garnet crystals into powder and mixing them in a made from a dense adhesive. When the LED chip emits blue light, part of the blue light will be efficiently converted into a broad-spectrum mainly yellow light by the crystal, because the yellow light will stimulate the red and green light receptors in the naked eye, and then mix the blue light of the LED itself , making it look like white light.
现有的LED灯的制造工艺流程是压焊、封装和固化。压焊是将LED芯片压焊到电极;LED的封装是将荧光粉和环氧树脂的混合物封装到压焊好的LED芯片上;固化是将环氧树脂和荧光粉的混合物充分固化。LED的封装主要有点胶、灌封、模压三种方法。LED点胶封装对点胶量的控制不易,因为环氧树脂和荧光粉的混合物在使用的过程中会变粘稠,同时白光LED的点胶还存在荧光粉沉淀导致出光色差的问题。LED灌胶封装是将压焊好的LED支架放入到LED成型模腔内,然后在LED成型模腔内注入液态环氧树脂和荧光粉的混合物,最后放入烘箱使得液态环氧树脂和荧光粉的混合物固化,灌胶封装同样存在荧光粉沉淀导致出光色差的问题。LED模压封装是将压焊好的LED支架放入到模具中,然后将上下两副模具用液压机合模并抽真空,将固态环氧树脂和荧光粉的混合物放在注胶道的入口加热,然后用液压顶杆压入模具胶道中,氧树脂和荧光粉的混合物受热融化并顺着胶道进入到各个LED成型槽中并固化。 The existing manufacturing process of LED lamps is pressure welding, encapsulation and curing. Pressure welding is to pressure-weld the LED chip to the electrode; LED packaging is to encapsulate the mixture of phosphor powder and epoxy resin on the bonded LED chip; curing is to fully cure the mixture of epoxy resin and phosphor powder. There are three main methods of LED packaging: dispensing, potting, and molding. It is not easy to control the amount of dispensing in LED dispensing packaging, because the mixture of epoxy resin and phosphor will become viscous during use, and the dispensing of white LEDs also has the problem of phosphor precipitation leading to chromatic aberration. LED potting and encapsulation is to put the pressure-welded LED bracket into the LED molding cavity, then inject the mixture of liquid epoxy resin and phosphor powder into the LED molding cavity, and finally put it into the oven to make the liquid epoxy resin and fluorescent powder The powder mixture is cured, and the encapsulation also has the problem of fluorescent powder precipitation leading to chromatic aberration. LED molded packaging is to put the pressure-welded LED bracket into the mold, then close the upper and lower molds with a hydraulic press and vacuumize, put the mixture of solid epoxy resin and fluorescent powder at the entrance of the injection channel to heat, Then press it into the rubber channel of the mold with a hydraulic ejector pin, and the mixture of epoxy resin and phosphor is melted by heat and enters into each LED molding groove along the rubber channel to be cured.
实用新型内容 Utility model content
为克服现有技术的不足,本实用新型提供一种LED线路板,包括依次平行设置的电源线、第一热电导线和第二热电导线,还包括设置在所述平行方向的垂直方向的多个加强筋,所述加强筋连接所述电源线、第一热电导线、第二热电导线,所述第一热电导线和第二热电导线在临近的两个加强筋之间的部分设置有散热区和发光区,所述发光区设有LED灯座,所述LED灯座上部设有LED灯杯,所述第一热电导线和第二热电导线穿过所述LED灯座,并位于所述LED灯杯的底部。 In order to overcome the deficiencies of the prior art, the utility model provides an LED circuit board, which includes a power line, a first thermoelectric wire and a second thermoelectric wire arranged in parallel in sequence, and also includes a plurality of Reinforcing ribs, the reinforcing ribs are connected to the power line, the first thermoelectric wire, and the second thermoelectric wire, and the part between the first thermoelectric wire and the second thermoelectric wire is provided with a heat dissipation area and The light-emitting area is provided with an LED lamp holder, and an LED lamp cup is arranged on the upper part of the LED lamp holder. The first thermoelectric wire and the second thermoelectric wire pass through the LED lamp holder and are located on the LED lamp bottom of the cup.
作为上述方案的改进,加强筋用于连接所述电源线、第一热电导线、第二热电导线的部分及所述第一热电导线、第二热电导线在临近的两个加强筋之间的部分在特定位置断开。 As an improvement of the above solution, the reinforcing rib is used to connect the power supply wire, the first thermoelectric wire, the part of the second thermoelectric wire and the part between the first thermoelectric wire and the second thermoelectric wire between two adjacent reinforcing ribs Disconnect at a specific location.
作为上述方案的改进,所述LED灯杯的底部为圆形,并向上圆弧状逐渐扩大,其最上端开口为圆形,且开口边缘具有向上的凸起。 As an improvement of the above solution, the bottom of the LED lamp cup is circular and gradually expands upward in an arc shape, the uppermost opening of the cup is circular, and the edge of the opening has an upward protrusion.
作为上述方案的改进,所述第二热电导线旁还平行地设置有一独立电源线,所述独立电源线通过所述加强筋与所述第二热电导线相连。 As an improvement of the above solution, an independent power line is arranged parallel to the second thermoelectric wire, and the independent power line is connected to the second thermoelectric wire through the reinforcing rib.
作为上述方案的改进,所述电源线、加强筋和独立电源线包有电路保护层。 As an improvement of the above solution, the power cord, the reinforcing rib and the independent power cord are covered with a circuit protection layer.
作为上述方案的改进,所述散热区的的第一热电导线和第二热电导线之间由所述电路保护层相同/不同的材料填充。 As an improvement of the above solution, the gap between the first thermoelectric wire and the second thermoelectric wire in the heat dissipation area is filled with the same/different material of the circuit protection layer.
作为上述方案的改进,所述发光区内的第二热电导线为对称设置的倒“L”且所述发光区内的第一热电导线为对称设置的倒“L”型。 As an improvement of the above solution, the second thermoelectric wires in the light emitting area are symmetrically arranged in an inverted "L" shape and the first thermoelectric wires in the light emitting area are symmetrically arranged in an inverted "L" shape.
作为上述方案的改进,所述散热区的第一热电导线具有向下凸出的弧形,且所述散热区的第二热电导线具有向下凸出的弧形。 As an improvement to the above solution, the first thermoelectric wire in the heat dissipation area has a downwardly protruding arc, and the second thermoelectric wire in the heat dissipation area has a downwardly protruding arc.
作为上述方案的改进,所述向下凸出的弧形底部形状为平直状,且所述弧形底部与所述电路保护层的底部在同一个平面上。 As an improvement of the above solution, the shape of the downwardly protruding arc-shaped bottom is straight, and the arc-shaped bottom is on the same plane as the bottom of the circuit protection layer.
与现有技术相比,本实用新型公开的LED灯线路板。 Compared with the prior art, the utility model discloses an LED lamp circuit board.
附图说明 Description of drawings
为了更清楚地说明本实用新型的实施例,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本实用新型的一个实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。 In order to illustrate the embodiments of the present utility model more clearly, the accompanying drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only an embodiment of the present utility model. For Those of ordinary skill in the art can also obtain other drawings based on these drawings without any creative effort.
图1是本实用新型的一个具体实施例的结构示意图; Fig. 1 is the structural representation of a specific embodiment of the present utility model;
图2是图1中的具体实施例中的内部电路图; Fig. 2 is the internal circuit diagram in the specific embodiment among Fig. 1;
图3是图2中具体实施例的内部电路在未冲断前的状态图; Fig. 3 is a state diagram before the internal circuit of the specific embodiment in Fig. 2 is not broken;
图4是图1中的具体实施例安装了LED芯片后的结构透视图; Fig. 4 is a structural perspective view of the specific embodiment in Fig. 1 after LED chips are installed;
图5是图2中的内部电路在安装了LED芯片后的结构示意图; Fig. 5 is a schematic structural diagram of the internal circuit in Fig. 2 after LED chips are installed;
图6是图1中的具体实施例的局部放大图; Fig. 6 is a partial enlarged view of the specific embodiment in Fig. 1;
图中:1-电源线;2-第一热电导线;3-第二热电导线;4-独立电源线;5-加强筋;6-发光区;7-散热区;8-LED灯座;9-LED灯杯;10-LED芯片。 In the figure: 1-power cord; 2-first thermoelectric wire; 3-second thermoelectric wire; 4-independent power cord; - LED light cup; 10 - LED chips.
具体实施方式 detailed description
下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。 The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.
参见图1、图2,本实用新型一种LED线路板,每条LED线路板包括依次平行设置的电源线1、第一热电导线2和第二热电导线3,还包括设置在所述平行方向的垂直方向的多个加强筋5,所述加强筋5连接所述电源线1、第一热电导线2和第二热电导线3,所述第一热电导线2和第二热电导线3在临近的两个加强筋5之间的部分设置有散热区7和发光区6,所述发光区6设有LED灯座8,所述LED灯座上部设有LED灯杯9,所述第一热电导线2和第二热电导线3穿过所述LED灯座8,并位于所述LED灯杯9的底部。 Referring to Fig. 1 and Fig. 2, an LED circuit board of the present invention, each LED circuit board includes a power line 1, a first thermoelectric wire 2 and a second thermoelectric wire 3 arranged in parallel in turn, and also includes a power cord arranged in the parallel direction. A plurality of ribs 5 in the vertical direction, the ribs 5 connect the power line 1, the first thermoelectric wire 2 and the second thermoelectric wire 3, the first thermoelectric wire 2 and the second thermoelectric wire 3 are adjacent The part between the two reinforcing ribs 5 is provided with a heat dissipation area 7 and a light-emitting area 6, the light-emitting area 6 is provided with an LED lamp holder 8, an LED lamp cup 9 is provided on the upper part of the LED lamp holder, and the first thermoelectric wire 2 and the second thermoelectric wire 3 pass through the LED lamp holder 8 and are located at the bottom of the LED lamp cup 9 .
图2显示的是两个LED灯并联后,再与后面的并联的两个LED灯串联的情形。本领域的技术人员也可不需付出创造性的劳动,即可得到多个LED灯并联后再与后面的并联的多个LED灯串联的电路,同样也可以得到多个LED灯串联后再与后面串联的多个LED灯并联的电路。 Figure 2 shows the situation where two LED lamps are connected in parallel and then connected in series with the following two LED lamps connected in parallel. Those skilled in the art can also obtain a circuit in which multiple LED lamps are connected in parallel and then connected in series with multiple LED lamps connected in parallel at the back without having to pay creative labor. Similarly, it is also possible to obtain a circuit in which multiple LED lamps are connected in series and then connected in series with the rear A circuit in which multiple LED lights are connected in parallel.
请参见图4和图5,所述发光区6用来安装LED灯。所述LED灯杯9的底部的第一热电导线2和第三热电导线3之间可以焊接或贴合LED芯片10,然后注入荧光粉和模顶胶混合物成型为LED透镜,LED芯片10、荧光粉和模顶胶的混合物构成了LED灯珠。电源线1、第一热电导线2和第三热电导线3及加强筋5构成了LED线路板,通过控制所述电源线1、第一热电导线2和第三热电导线3及加强筋5在某些位置的通断,即可形成所需的多个LED灯的先串联后并联或先并联后串联的电路。 Please refer to FIG. 4 and FIG. 5 , the light-emitting area 6 is used to install LED lamps. The LED chip 10 can be welded or pasted between the first thermoelectric wire 2 and the third thermoelectric wire 3 at the bottom of the LED lamp cup 9, and then injected into a mixture of fluorescent powder and mold top glue to form an LED lens, LED chip 10, fluorescent The mixture of powder and mold top glue constitutes the LED lamp bead. The power line 1, the first thermoelectric wire 2, the third thermoelectric wire 3 and the rib 5 constitute the LED circuit board, and by controlling the power cord 1, the first thermoelectric wire 2, the third thermoelectric wire 3 and the rib 5 at a certain The on-off of these positions can form the required multiple LED lights in series and then in parallel or first in parallel and then in series.
请参见图6,所述LED灯杯9的底部为圆形,并向上圆弧状逐渐扩大,其最上端开口为圆形,且开口边缘具有向上的凸起。注入荧光粉和模顶胶混合物时,荧光粉和模顶胶混合物在表面张力的作用下成为半球型。 Please refer to FIG. 6 , the bottom of the LED lamp cup 9 is circular, and gradually expands upward in an arc shape, and its uppermost opening is circular, and the edge of the opening has an upward protrusion. When the mixture of phosphor powder and mold top glue is injected, the mixture of phosphor powder and mold top glue becomes hemispherical under the action of surface tension.
在本实用新型的一个实施例中,所述第二热电导线3旁还平行地设置有一独立电源线4,所述独立电源线4通过所述加强筋5与所述第二热电导线3相连。在通过一个电源控制器对所述的LED线路板供电时,如果单端供电,则只需将电源控制器的正负极连接至电源线1和第一热电导线2或第二热电导线3即可;如果双端供电,则需要通过独立电源线4将另一端的电流引至具有电源控制器的一端。 In one embodiment of the present utility model, an independent power line 4 is arranged parallel to the second thermoelectric wire 3 , and the independent power line 4 is connected to the second thermoelectric wire 3 through the reinforcing rib 5 . When a power controller is used to supply power to the LED circuit board, if the power supply is single-ended, it is only necessary to connect the positive and negative poles of the power controller to the power line 1 and the first thermoelectric wire 2 or the second thermoelectric wire 3. Yes; if double-ended power supply is required, the current at the other end needs to be led to the end with the power controller through the independent power line 4.
所述电源线1、第一热电导线2、第二热电导线3、独立电源线4和加强筋5的结构为金属板整体一次成型,加工的方式可以是冲压,也可以是轮毂辊压。金属板的材质为任意导电的金属或其合金。整体冲压或轮毂辊压成型再注塑成型后,所述加强筋5用于连接所述独立电源线4的部分被冲断,以保持所述独立电源线的独立性。 The structure of the power cord 1 , the first thermoelectric wire 2 , the second thermoelectric wire 3 , the independent power cord 4 and the reinforcing rib 5 is a metal plate integrally formed at one time, and the processing method can be stamping or hub rolling. The material of the metal plate is any conductive metal or its alloy. After integral stamping or hub roll forming followed by injection molding, the part of the reinforcing rib 5 used for connecting the independent power cord 4 is punched off, so as to maintain the independence of the independent power cord.
请参见图1,所述电源线1、加强筋5和独立电源线4包有电路保护层。所述电路保护层的材质可以与所述LED灯座8及LED灯杯9的材质相同,然后在冲压或轮毂辊压的金属板的基础上一次注塑成型。散热区7内的第一热电导线2和第二热电导线3之间也可由所述电路保护层相同的材料填充,也可以是之间相互分开而无填充。电源线1和独立电源线4及加强筋5外侧的电路保护层进一步加强了LED线路板的刚性,同时也能防止电路短路。 Please refer to FIG. 1 , the power cord 1 , the rib 5 and the independent power cord 4 are covered with a circuit protection layer. The material of the circuit protection layer can be the same as that of the LED lamp holder 8 and the LED lamp cup 9 , and then one-time injection molding is performed on the basis of a stamped or wheel-rolled metal plate. The space between the first thermoelectric wire 2 and the second thermoelectric wire 3 in the heat dissipation area 7 may also be filled with the same material as the circuit protection layer, or they may be separated from each other without filling. The circuit protection layer on the outside of the power line 1, the independent power line 4 and the reinforcing rib 5 further strengthens the rigidity of the LED circuit board and can also prevent the circuit from short circuiting.
请参见图2和图3,所述发光区内的第二热电导线和第一热电导线平行设置,通常二者之间的间隔比较大,将来在所述的发光区的第二热电导线和第一热电导线之间会安装有LED芯片,而LED芯片通常比较小,为了更好地焊接/贴合LED芯片,通常将所述发光区6内第二热电导线3设置为对称设置的倒“L”型,即凸出一部分以更接近第一热电导线2。同时也可以是所述发光区6内的第一热电导线2为对称设置的倒“L”型,或发光区6内的第一热电导线2和第二热电导线3同时为对称设置的倒“L”型。 Please refer to Fig. 2 and Fig. 3, the second thermoelectric wire and the first thermoelectric wire in the light-emitting area are arranged in parallel, and the interval between the two is usually relatively large. There will be LED chips installed between the thermoelectric wires, and the LED chips are usually relatively small. In order to better weld/bond the LED chips, the second thermoelectric wires 3 in the light-emitting area 6 are usually arranged as symmetrically arranged inverted "L" ” type, that is, protruding a part to be closer to the first thermoelectric wire 2. At the same time, the first thermoelectric wire 2 in the light emitting area 6 may be symmetrically arranged in an inverted "L" shape, or the first thermoelectric wire 2 and the second thermoelectric wire 3 in the light emitting area 6 may be symmetrically arranged in an inverted "L" shape. L" type.
所述散热区7的第一热电导线2和第二热电导线3用来散热,LED灯在发光的过程中会产生大量的热量,热量通过第一热电导线2和第二热电导线3在散热区7中的部分散发出去。而仅仅通过散热区7将热量散发到空气中或与其接触的其它介质中往往是不够的,有时需要将散热区7连接到其它散热部件上,以更快地散发热量。这时,散热区7内的第一热电导线2和/或第二热电导线3可设有具有向下凸出的弧形,以贴合到所述的其它散热部件上。同时,由于第一热电导线2和第二热电导线3的材质为金属,其导热性能较好,并且可以直接焊接到其它散热部件上,而不需要通过绝缘层贴合到其它散热部件上。 The first thermoelectric wire 2 and the second thermoelectric wire 3 of the heat dissipation area 7 are used to dissipate heat, and the LED lamp will generate a large amount of heat in the process of emitting light, and the heat passes through the first thermoelectric wire 2 and the second thermoelectric wire 3 in the heat dissipation area. Part of 7 goes out. However, it is often not enough to dissipate heat into the air or other media in contact with it through the heat dissipation area 7 , and sometimes it is necessary to connect the heat dissipation area 7 to other heat dissipation components to dissipate heat faster. At this time, the first thermoelectric wire 2 and/or the second thermoelectric wire 3 in the heat dissipation area 7 may be provided with a downwardly protruding arc, so as to attach to the other heat dissipation components. At the same time, since the first thermoelectric wire 2 and the second thermoelectric wire 3 are made of metal, their thermal conductivity is better, and they can be directly welded to other heat dissipation components without being bonded to other heat dissipation components through an insulating layer.
在本实用新型的另一个优选的实施例中,上述散热区7内的第一热电导线2和/或第二热电导线3的向下凸出的弧形底部形状被设置为平直状,且与所述电路保护层的底部处于同一平面上。设置为平直状的散热区7内的第一热电导线2和/或第二热电导线3的向下凸出的弧形焊接或贴合到其它散热部件上时其接触面积更大,导热效果更好,同时不仅能通过其它散热部件散热,其本身也可直接将热量散发到空气中或与其接触的其它介质中。 In another preferred embodiment of the present utility model, the downwardly protruding arc-shaped bottom shape of the first thermoelectric wire 2 and/or the second thermoelectric wire 3 in the heat dissipation area 7 is set to be straight, and It is on the same plane as the bottom of the circuit protection layer. When the downward protruding arc-shaped welding of the first thermoelectric wire 2 and/or the second thermoelectric wire 3 in the straight heat dissipation area 7 is welded or attached to other heat dissipation components, its contact area is larger, and the heat conduction effect is greater. Even better, it can not only dissipate heat through other heat dissipation components, but also directly dissipate heat into the air or other media in contact with it.
在本实用新型的另一个优选的实施例中,所述平直状的向下凸出的弧形底部与所述电源线1、加强筋5和独立电源线4的电路保护层及所述LED灯座8的底部平齐,这样LED电路板整体贴合或焊接到其它散热部件上时,整个底部刚好与散热部件平齐。 In another preferred embodiment of the present utility model, the straight downwardly protruding arc-shaped bottom and the circuit protection layer of the power cord 1, the reinforcing rib 5 and the independent power cord 4 and the LED The bottom of the lamp holder 8 is flush, so that when the LED circuit board is integrally bonded or welded to other heat dissipation components, the entire bottom is just flush with the heat dissipation components.
以上所述是本实用新型的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本实用新型原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本实用新型的保护范围。 The above is a preferred embodiment of the present utility model, it should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present utility model, some improvements and modifications can also be made, these improvements and modifications It is also regarded as the protection scope of the present utility model.
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| CN201520757677.XU CN205050865U (en) | 2015-09-25 | 2015-09-25 | LED circuit board |
| PCT/CN2015/091604 WO2017049669A1 (en) | 2015-09-25 | 2015-10-10 | Led circuit board |
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| KR101823506B1 (en) * | 2011-06-29 | 2018-01-30 | 엘지이노텍 주식회사 | Light emitting device and light unit having thereof |
| CN104930388A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | LED (light emitting diode) substrate stripe |
| CN104930372A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | LED (light-emitting diode) bulb with arched lens |
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| CN110762402A (en) * | 2019-10-18 | 2020-02-07 | 吴少健 | Manufacturing method of matrix type LED lamp source |
| CN110762402B (en) * | 2019-10-18 | 2021-03-30 | 华南半导体(广东)有限公司 | Manufacturing method of matrix type LED lamp source |
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