CN204374837U - Electronic equipment - Google Patents

Abstract

The utility model relates to an electronic device and relates to the field of electronic devices, the main purpose of which is to save the space inside the electronic device and improve user experience. The technical solution mainly adopted is: electronic equipment, including a first part, a second part, a heating element and a heat conducting element; the first part has an accommodating space; the heating element is arranged in the accommodating space; the second part It is movably connected with the first part, and the second part is provided with a heat dissipation element exposed to the outside; one end of the heat conduction element is in contact with the heating element, and the other end of the heat conduction element is in contact with the heat dissipation element, so as to The heat on the heating element is transferred to the heat dissipation element, and at least part of the heat conducting element is made of flexible material, so that the first part and the second part can move relative to each other. The electronic equipment provided by the embodiment of the utility model is suitable for an integrated computer, a display or a television, and the like.

Description

Electronic equipment

technical field

The utility model relates to the technical field of electronic equipment, in particular to an electronic equipment.

Background technique

As the size of the main body shrinks, computer manufacturers begin to integrate the main body into the display to form an all-in-one, abbreviated as AIO. Compared with traditional desktop computers, AIO has the advantages of fewer connections, smaller size, higher integration, and no significant change in price. It is more moldable, and manufacturers can design highly personalized products. AIO can be said to be an emerging product line alongside notebooks and traditional desktops.

The CPU central processing unit inside the all-in-one computer has a high power consumption, and will emit a large amount of heat during work. In the prior art, the interior of the all-in-one computer generally dissipates heat to the CPU central processing unit by means of blowing fans. However, during implementation, the fan will occupy the accommodation space inside the all-in-one computer, making the all-in-one computer thicker, thus making the user experience unsatisfactory.

Utility model content

In view of this, the utility model provides an electronic device, the main purpose of which is to save the space inside the electronic device and improve user experience.

In order to achieve the above object, the utility model mainly provides the following technical solutions:

Embodiments of the present utility model provide an electronic device, comprising:

The first part has accommodating space;

a heating element arranged in the accommodating space;

The second part is movably connected with the first part, and the second part is provided with a heat sink exposed to the outside;

A heat conduction element, one end of which is in contact with the heating element, and the other end of which is in contact with the heat dissipation element, so as to transfer the heat on the heat generation element to the heat dissipation element, and the heat conduction element is at least partially made of a flexible material, so that the first part and the second part can move relative to each other.

The purpose of the utility model and the solution to its technical problems can also be further realized by adopting the following technical measures.

The aforementioned electronic device, wherein,

The second part includes a bracket, one end of the bracket is rotatably connected to the first part, and the bracket is used to provide support and stability to the first part.

The aforementioned electronic device, wherein,

The heat sink includes a metal base;

The metal base is connected to the other end of the bracket, and the metal base is used to provide support and stability for the bracket and the first part

The aforementioned electronic device, wherein,

The outer shape of the metal base is cylindrical, and the outer diameter of the metal base is 20cm-40cm.

The aforementioned electronic device, wherein,

The first part is provided with a shaft hole;

The bracket is provided with a rotating shaft adapted to the shaft hole, the rotating shaft is provided with a through hole, and the opening of the through hole is opposite to the shaft hole; the bracket is inserted into the shaft hole through the rotating shaft, and Transition fit with the hole wall of the shaft hole;

The heat conducting member passes through the via hole via the shaft hole.

The aforementioned electronic device, wherein,

The inside of the bracket is hollow, and both ends are open, and the via holes communicate with the inside of the bracket;

The heat conducting member passes through the inside of the bracket through the via hole.

The aforementioned electronic device, wherein,

The heat conducting member is a flexible heat pipe.

The aforementioned electronic device, wherein,

The heating element is a CPU central processing unit with power consumption less than 20W.

The foregoing electronic equipment may be a computer, a monitor or a television set.

With the above technical solution, the utility model electronic equipment has at least the following beneficial effects:

In the technical solution provided by the embodiment of the present invention, one end of the heat-conducting element is in contact with the heat-generating element (such as the CPU central processing unit) in the accommodating space, and the other end of the heat-conducting element is in contact with the heat-dissipating element, and the heat-generating element is working. The heat generated during the process can be conducted to the heat sink through the heat conduction part, and because the heat sink is exposed to the outside, for example, the heat sink can be located on the outer surface of the electronic device, the heat sink can fully contact with the outside air and perform heat exchange, so as to achieve The technical effect of the heat dissipation of the heating element; in the technical solution of the utility model embodiment, because the heat dissipation element is exposed to the outside, there is no need to install a fan inside the electronic equipment, thereby saving the space inside the electronic equipment, and the thickness of the electronic equipment can be made thinner , the user experience is better.

The above description is only an overview of the technical solution of the utility model. In order to understand the technical means of the utility model more clearly and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiment of the utility model with accompanying drawings. back.

Description of drawings

Fig. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present invention at a first viewing angle;

Fig. 2 is a schematic structural diagram of an electronic device provided by an embodiment of the present invention at a second viewing angle;

Fig. 3 is a schematic structural diagram of the relative rotation of the first part and the bracket of an electronic device provided by an embodiment of the present invention;

FIG. 4 is a partial cross-sectional structural schematic diagram of an electronic device including a heat conducting element, a rotating shaft and a bracket provided by an embodiment of the present invention.

Detailed ways

The utility model provides an electronic device with a new structure in order to solve the technical problem of poor user experience caused by the thicker electronic device in the prior art. Use experience.

The technical solution of the utility model embodiment is to solve the above-mentioned technical problems, and general train of thought is as follows:

An electronic device provided by the utility model includes:

The first part has accommodating space;

a heating element arranged in the accommodating space;

The second part is movably connected with the first part, and the second part is provided with a heat sink exposed to the outside;

A heat conduction element, one end of which is in contact with the heating element, and the other end of which is in contact with the heat dissipation element, so as to transfer the heat on the heat generation element to the heat dissipation element, and the heat conduction element is at least partially made of a flexible material, so that the first part and the second part can move relative to each other.

In the technical solution provided by the embodiment of the present invention, one end of the heat-conducting element is in contact with the heat-generating element (such as the CPU central processing unit) in the accommodating space, and the other end of the heat-conducting element is in contact with the heat-dissipating element, and the heat-generating element is working. The heat generated during the process can be conducted to the heat sink through the heat conduction part, and because the heat sink is exposed to the outside, for example, the heat sink can be located on the outer surface of the electronic device, the heat sink can fully contact with the outside air and perform heat exchange, so as to achieve The technical effect of the heat dissipation of the heating element; in the technical solution of the utility model embodiment, because the heat dissipation element is exposed to the outside, there is no need to install a fan inside the electronic equipment, thereby saving the space inside the electronic equipment, and the thickness of the electronic equipment can be made thinner , the user experience is better.

In order to further explain the technical means and effects of the utility model to achieve the intended purpose of the utility model, the specific implementation, structure, features and effects of the utility model application are described in detail below in conjunction with the accompanying drawings and preferred embodiments. The description is as follows. In the following description, different "one embodiment" or "embodiment" do not necessarily refer to the same embodiment. Furthermore, the particular features, structures, or characteristics of one or more embodiments may be combined in any suitable manner.

As shown in FIGS. 1 to 3 , an electronic device proposed by an embodiment of the present invention includes a first part 1 , a second part 4 , a heating element 2 and a heat conducting element 3 . The first part 1 has an accommodating space. The heating element 2 is arranged in the accommodating space. The first part 1 and the second part 4 are flexibly connected so that the first part 1 and the second part 4 can move relative to each other. The second part 4 is provided with a heat sink 5 exposed to the outside. The "exposed" here means that when the electronic device of this embodiment is placed on the supporting surface, the user can observe the heat sink 5 from the outside of the electronic device of this embodiment. Specifically, during implementation, the heat sink 5 can be located at the outermost side of the second part 4 of the present embodiment, for example, the heat sink 5 can be arranged on the outer wall of the second part 4, or the heat sink 5 is the outer wall of the second part 4; or , the heat dissipation element 5 is arranged inside the second part 4, but exposed through the through hole on the second part 4, the heat dissipation element 5 can also be arranged at any other position on the second part 4, as long as the heat dissipation element 5 is exposed on the second part The outside of the part 4 is sufficient, so that the heat sink 5 can fully contact with the air outside the electronic device of this embodiment, which is beneficial for heat exchange.

One end of the heat conducting element 3 is in contact with the heating element 2 , and the other end of the heat conducting element 3 is in contact with the heat dissipation element 5 . The heat dissipated by the heating element 2 during operation can be transferred to the heat dissipation element 5 through the heat conducting element 3 . The heat conducting member 3 is at least partly made of flexible material, so that the first part 1 and the second part 4 can move relative to each other. Among them, the heat conducting element 3 is used to connect the heating element 2 and the heat dissipation element 5, the heating element 2 is located in the first part 1, the heat dissipation element 5 is located in the second part 4, and the first part 1 and the second part 4 can move relative to each other, so the heating element 2 and the heat sink 5 can also move relative to each other. In order to ensure relative movement between the heating element 2 and the heat dissipation element 5, the heat conduction element 3 connecting the heat generation element 2 and the heat dissipation element 5 needs to be deformed, and the deformed part of the heat conduction element 3 is made of a flexible material, with auxiliary The technical effect of the relative movement of both the first part 1 and the second part 4.

Among them, the technical solution provided by the embodiment of the utility model is through the heat dissipation element 5 provided, one end of the heat conduction element 3 is in contact with the heating element 2 (such as CPU central processing unit) in the accommodation space, and the other end of the heat conduction element 3 is in contact with the heat dissipation element 5 contacts, the heat generated by the heating element 2 during operation can be conducted to the heat dissipation element 5 via the heat conduction element 3, and because the heat dissipation element 5 is exposed to the outside, for example, the heat dissipation element 5 can be located on the outer surface of the electronic device, and the heat dissipation element 5 can fully Contact with the outside air and perform heat exchange, so as to achieve the technical effect of heat dissipation to the heating element 2; in the technical solution of the utility model embodiment, because the heat dissipation element 5 is exposed to the outside, the inside of the electronic device may not install a fan, thereby saving The space inside the electronic device, the thickness of the electronic device can be made thinner, and the user experience is better.

What needs to be added here is that the aforementioned heat conduction member 3 can be made of flexible material as a whole, so as to ensure sufficient space for relative movement between the first part 1 and the second part 4 .

Specifically, during implementation, in order to realize the technical effect of the flexible connection of the first part 1 and the second part 4, as shown in FIG. The first part 1 is rotatably connected so that the angle between the bracket and the first part 1 can be adjusted. In this embodiment, the bracket can provide support and stability for the first part 1 . For example, when the electronic device of this embodiment is integrated into a computer, the electronic device of this embodiment is placed on a support surface, and the bracket can provide support for the first part 1, so that the electronic device of this embodiment can stand stably on the support face. Moreover, since the user has different angle requirements for the all-in-one computer when standing or sitting down, in this embodiment, the angle of the first part 1 can be adjusted by the bracket so that the user's line of sight is aligned with the direction of the display screen of the all-in-one computer. Vertical, which can bring users the best experience.

Of course, in order to achieve the technical effect of the flexible connection between the first part 1 and the second part 4 , in an alternative embodiment, the aforementioned bracket may not be rotationally connected with the first part 1 . In this alternative embodiment, the aforementioned bracket can slide on the first part 1 . Specifically, during implementation, the aforementioned first part 1 may be provided with a chute (not shown in the figure), and one end of the bracket is inserted into the chute, and can slide along the inner wall of the chute. After one end of the bracket slides to a set position along the chute, in order to keep the bracket and the first part 1 relatively fixed, one end of the bracket can transition fit with the inner wall of the chute.

From the above description, in practice, as shown in FIGS. 1 to 3 , the aforementioned heat sink 5 may include a metal base. The metal base is connected with the other end of the bracket, and the metal base is used to provide support and stability for the bracket and the first part 1 . In this embodiment, one end of the bracket is connected to the first part 1, and the other end of the bracket is connected to the metal base. When the electronic device of this embodiment is placed on the support surface, the metal base is in contact with the support surface, and provides support for the first part 1 together with the bracket, so that the electronic device of this embodiment can be stably placed on the support surface . In this embodiment, the metal base has dual functions. On the one hand, the metal base can be used as a heat sink 5, and dissipate the heat transferred from the heat conducting member 3 into the surrounding air, reducing the temperature on the heating element 2; On the one hand, the metal base can also provide support for the bracket and the first part 1 . Further, the metal base and the bracket can be integrally formed, so that the connection between the metal base and the bracket is more stable and not easy to loosen.

From the above description, the aforementioned metal base can be made of aluminum-magnesium alloy material. The main element of aluminum-magnesium alloy is aluminum, and a small amount of magnesium or other metal materials are added to strengthen its hardness. The aluminum alloy with Mg as the main additive element is also called anti-rust aluminum alloy because of its good corrosion resistance. Because it is a metal itself, its thermal conductivity and strength are particularly prominent. Aluminum-magnesium alloy is light in weight, low in density, good in heat dissipation, and strong in pressure resistance, which can fully meet the requirements of high integration, lightness, miniaturization, impact resistance, electromagnetic shielding and heat dissipation of 3C products. It is several times stiffer than traditional plastic cases, yet only one-third the weight. The silver-white aluminum-magnesium alloy metal base can make the product more luxurious and beautiful, and is easy to color. It can be turned into personalized powder blue and pink through the surface treatment process, which adds a lot of color to the electronic equipment of this embodiment. It is unmatched by engineering plastics and carbon fiber.

In this embodiment, the metal base can be made of aluminum-magnesium alloy material or steel material, and the aluminum-magnesium alloy material and steel material are only examples of materials for making the metal base, and are not used to limit the specific material of the metal base, wherein , the specific material of the metal base can be set according to the actual needs of users.

From the above description, in order to make the metal base have a better heat dissipation effect, as shown in FIG. 1 , the outer shape of the metal base can be cylindrical, and the outer diameter D of the metal base can be 30cm. In this way, the metal base has a large surface area, can fully contact with the surrounding air, and has a better heat dissipation effect. In this embodiment, in order to enhance the heat dissipation performance of the metal base, wavy stripes may be provided on the metal base to increase the surface area of the metal base in contact with the surrounding air, thereby enhancing the heat dissipation capability. Of course, in an alternative embodiment, the outer diameter D of the metal base can also be 20cm, 25cm, 35cm, 40cm and other values between 20cm and 40cm, so that it can fully contact with the surrounding air and dissipate heat. technical effect. In this embodiment, the specific value of the outer diameter D of the metal base can be set according to the actual needs of the user.

It should be noted here that: in an alternative embodiment, the outer shape of the aforementioned metal base is not limited to a cylindrical shape. In this alternative embodiment, the shape of the cross-section of the aforementioned metal base can be rectangular, elliptical, etc., which can be specifically set according to the actual needs of users.

From the above description, in order to achieve the technical effect of rotationally connecting one end of the bracket to the first part 1, FIG. 4 shows a partial cross-sectional structural schematic diagram of the heat conduction member passing through the shaft hole 11 through the through hole 411 of the rotating shaft 41 and the inside of the bracket. As shown in FIG. 4 , the aforementioned first part 1 may be provided with a shaft hole 11 , and the bracket is provided with a rotating shaft 41 adapted to the shaft hole 11 . The bracket is inserted into the shaft hole 11 through the shaft 41 , and transitionally fits with the wall of the shaft hole 11 , so that the shaft 41 can rotate relative to the shaft hole 11 , and thus the bracket can rotate relative to the first part 1 . In this embodiment, the rotating shaft 41 is provided with a through hole 411 , and the opening of the through hole 411 is opposite to the shaft hole 11 , and the “opposing” here means that the through hole 411 and the shaft hole 11 are arranged mouth to mouth. The heat conducting member 3 passes through the through hole 411 on the rotating shaft 41 via the shaft hole 11 . In this embodiment, the heat conduction element 3 connecting the heating element 2 and the heat dissipation element 5 is routed inside the rotating shaft 41 to make the electronic device of this embodiment look more beautiful in appearance.

From the above description, further, as shown in FIG. 4 , the aforementioned bracket is hollow inside and has openings at both ends. The aforementioned via hole 411 communicates with the inside of the bracket. The heat conducting element 3 passes through the inside of the bracket through the via hole 411 . In this embodiment, one end of the heat conducting element 3 is connected to the heating element 2 in the accommodating space, and the other end of the heat conducting element 3 passes through the shaft hole 11 on the first part 1 from the accommodating space, and passes through the shaft hole 11 The through hole 411 on the rotating shaft 41 passes through the inside of the bracket to connect with the metal base. Wherein, the heat conduction member 3 is routed from the inside as a whole, and is not exposed to the outside, so that the appearance of the electronic device of this embodiment is more concise and more beautiful.

Specifically, during implementation, the aforementioned heat conduction member 3 may be a flexible heat pipe. A heat pipe is a passive heat transfer element with extremely high thermal conductivity. The heat pipe uses the principle of phase change and capillary action, so that its heat transfer efficiency is hundreds to thousands of times higher than that of pure copper of the same material. There is a liquid-absorbing core structure on the wall of the heat pipe. Relying on the capillary force generated by the liquid-absorbing core, the condensed liquid returns from the condensing end to the evaporating end. Because after the inside of the heat pipe is evacuated, liquid is injected before sealing, so the pressure inside the heat pipe is determined by the vapor pressure after the working liquid evaporates. As long as the surface of the heat pipe is heated, the working liquid will evaporate. The temperature and pressure of the steam at the evaporating end are slightly higher than the rest of the heat pipe, so a pressure difference is created in the heat pipe that forces the steam to flow to the cooler end of the heat pipe. When the steam condenses on the wall of the heat pipe, the steam releases the latent heat of vaporization, thus transferring the heat to the condensing end. Afterwards, the wick structure of the heat pipe makes the condensed liquid return to the evaporating end. As long as the heating element 2 is heated, this process will be carried out in a cycle. Wherein, the specific structure of the flexible heat pipe is a commonly used technology in the prior art, which can be selected from the prior art according to needs, and will not be repeated here. However, in an alternative embodiment, the aforementioned heat conduction member 3 may not be a heat pipe, and in this alternative embodiment, the heat conduction member 3 may be a thermally conductive foam or a metal member with better flexibility, such as copper, silver, etc. or aluminum etc.

Specifically, during implementation, the aforementioned heating element 2 may be a CPU central processing unit with power consumption less than 20W. The CPU central processing unit can dissipate a large amount of heat when it is working. In this embodiment, the heat generated by the CPU central processing unit is conducted through the heat conduction member 3, so that the CPU central processing unit can work within a set temperature range. , thereby improving the service life of the CPU central processing unit.

The electronic equipment provided by the embodiment of the present utility model can be an integrated computer, display or television. Those skilled in the art should understand that the integrated computer, display or television is only an example and is not intended to limit the technical solution of this embodiment. Other types of electronic devices are also suitable.

According to the above embodiments, the electronic equipment of the present invention has at least the following advantages:

In the technical solution provided by the embodiment of the utility model, one end of the heat conduction member 3 is in contact with the heat generating member 2 (such as the CPU central processing unit) in the accommodation space through the heat dissipation member 5 provided, and the other end of the heat conduction member 3 is in contact with the heat dissipation member 5 , the heat generated by the heating element 2 during operation can be conducted to the heat dissipation element 5 via the heat conduction element 3, and because the heat dissipation element 5 is exposed to the outside, such as the heat dissipation element 5 can be located on the outer surface of the electronic device, the heat dissipation element 5 can be fully connected to the outside The air contacting and exchanging heat, so as to achieve the technical effect of heat dissipation of the heating element 2; in the technical solution of the utility model embodiment, because the heat dissipation element 5 is exposed to the outside, the inside of the electronic equipment can not install a fan, thereby saving the electronic equipment. In the internal space, the thickness of the electronic equipment can be made thinner, and the user experience is better.

The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the utility model are all valid. Still belong to the scope of the technical solution of the utility model.

Claims (9)

1. An electronic device, characterized in that, comprising: The first part has accommodating space; a heating element arranged in the accommodating space; The second part is movably connected with the first part, and the second part is provided with a heat sink exposed to the outside; A heat conduction element, one end of which is in contact with the heating element, and the other end of which is in contact with the heat dissipation element, so as to transfer the heat on the heat generation element to the heat dissipation element; the heat conduction element is at least partially made of a flexible material, so that the first part and the second part can move relative to each other. 2. The electronic device of claim 1, wherein The second part includes a bracket, one end of the bracket is rotatably connected to the first part, and the bracket is used to provide support and stability to the first part. 3. The electronic device of claim 2, wherein The heat sink includes a metal base; The metal base is connected to the other end of the bracket, and the metal base is used to support and stabilize the bracket and the first part. 4. The electronic device of claim 3, wherein The outer shape of the metal base is cylindrical, and the outer diameter of the metal base is 20cm-40cm. 5. The electronic device according to any one of claims 2 to 4, characterized in that, The first part is provided with a shaft hole; The bracket is provided with a rotating shaft adapted to the shaft hole, the rotating shaft is provided with a through hole, and the opening of the through hole is opposite to the shaft hole; the bracket is inserted into the shaft hole through the rotating shaft, and Transition fit with the hole wall of the shaft hole; The heat conducting member passes through the via hole via the shaft hole. 6. The electronic device of claim 5, wherein The inside of the bracket is hollow, and both ends are open, and the via holes communicate with the inside of the bracket; The heat conducting member passes through the inside of the bracket through the via hole. 7. The electronic device according to any one of claims 1 to 4, wherein the heat conducting member is a flexible heat pipe. 8. The electronic device according to any one of claims 1 to 4, wherein the heating element is a CPU central processing unit with power consumption less than 20W. 9. The electronic device according to any one of claims 1 to 4, wherein the electronic device is integrated with a computer, a display or a television.