CN1635640A - LED chip module - Google Patents
LED chip module Download PDFInfo
- Publication number
- CN1635640A CN1635640A CNA2003101242993A CN200310124299A CN1635640A CN 1635640 A CN1635640 A CN 1635640A CN A2003101242993 A CNA2003101242993 A CN A2003101242993A CN 200310124299 A CN200310124299 A CN 200310124299A CN 1635640 A CN1635640 A CN 1635640A
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- Prior art keywords
- light
- emitting diode
- heat
- backlight unit
- diode chip
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- 239000000084 colloidal system Substances 0.000 claims description 13
- 230000005540 biological transmission Effects 0.000 claims description 11
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000005424 photoluminescence Methods 0.000 description 4
- 230000000994 depressogenic effect Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
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Abstract
A light emitting diode chip module comprises a heat conduction seat, an insulating part, two conductive pins and a light emitting diode chip, wherein the heat conduction seat is provided with a through hole; the insulating part is provided with a base part, the base part is provided with a through hole, the bottom surface of the base part is convexly provided with an insulating column, the insulating column is positioned in the through hole of the heat conducting seat, and the insulating column is provided with an exposed through hole; the two conductive pins are respectively arranged through the through holes of the insulating column in a penetrating way; the light-emitting diode chip is positioned in the through hole of the insulating part and is fixedly arranged on the heat conducting seat, and the anode and the cathode of the light-emitting diode chip are respectively provided with a lead which is electrically connected with two conductive pins; therefore, the heat dissipation efficiency is greatly improved, the luminous stability is ensured, the assembly and the use are easy, the volume is reduced, and the production cost is reduced.
Description
Technical field
The present invention relates to a kind of LED chip module, particularly relate to the high and good LED chip module that dispels the heat of a kind of brightness.
Background technology
As everyone knows, light-emitting diode chip for backlight unit greatly promotes its brightness along with opto-electronics develops rapidly, extensively applies on the display floater.As being example with the advertisement plate, can reach the dynamic demonstration of pattern and literal by the light-emitting diode of dot matrix arrangement, make advertising results more clear eye-catching.And the characteristic of light-emitting diode chip for backlight unit high brightness is accompanied by high temperature, must effectively be dispelled the heat, and just can keep normal for a long time the use.
Known LED chip module, see also shown in Figure 1, comprise light-emitting diode chip for backlight unit 70, first pin 71, second pin 72 and outer cover 73, these first pin, 71 1 ends are provided with depressed part 74, this light-emitting diode chip for backlight unit 70 is arranged in this depressed part 74, the positive pole of light-emitting diode chip for backlight unit 70 and negative pole are electrically connected this first pin 71 and second pin 72 by lead 75 respectively, and be packaged on light-emitting diode chip for backlight unit 70 and the lead 75 with light transmission colloid 76, cover this outer cover 73 again outside light-emitting diode chip for backlight unit 70.
Above-mentioned known LED chip module lacks the structure of dispelling the heat, and therefore, can't satisfy the heat dissipation problem that high-brightness LED chip is derived and come.
Be to solve the heat dissipation problem of light-emitting diode chip for backlight unit, another kind of LED chip module (figure slightly) is that the negative or positive electrode with its light-emitting diode chip for backlight unit is connected on the substrate that has thermal conductivity and conductivity concurrently, to promote its heat dissipation.Then this substrate has not only influenced the stability of photoluminescence of light-emitting diode, when practical application, is subject to its structure Design, and radiating effect is still limited.And with advertisement plate, need the many LED chip modules of assembling, and the high heat of its generation need deal with in addition still, make assembling complicated, bulky, cost increases.
As from the foregoing, above-mentioned known LED chip module on reality is used, obviously has inconvenience and exists with defective, and remain to be improved.
So the present invention proposes a kind of reasonable in design and effectively improve the LED chip module of above-mentioned defective.
Summary of the invention
Main purpose of the present invention is to provide a kind of LED chip module, and its radiating effect is promoted, and with the high brightness characteristic of performance light-emitting diode chip for backlight unit, avoids damaging because of overheated.
Another object of the present invention is to provide a kind of LED chip module, and its assembling is used easily, volume-diminished, and production cost reduces.
In order to achieve the above object, the present invention mainly provides a kind of LED chip module, comprises heat-conducting seat, insulating part, two conductive connecting pins and light-emitting diode chip for backlight unit, and wherein: this heat-conducting seat is provided with perforation; This insulating part has base portion, and base portion is provided with through hole, and the base portion bottom surface is convexly equipped with insulated column, and insulated column is positioned in the perforation of above-mentioned heat-conducting seat, and insulated column is provided with the open-work that exposes; This two conductive connecting pin is arranged in respectively in the open-work of above-mentioned insulated column; And this light-emitting diode chip for backlight unit is arranged in the through hole of above-mentioned insulating part and is fixedly arranged on above-mentioned heat-conducting seat, and the positive pole of light-emitting diode chip for backlight unit and negative pole are respectively equipped with lead and are electrically connected two conductive connecting pins.
The present invention also provides a kind of LED chip module, comprising: heat-conducting seat, and it is provided with perforation; Insulated column, it is positioned in the perforation of above-mentioned heat-conducting seat, and insulated column is provided with the open-work that exposes; Two conductive connecting pins, it is arranged in the open-work of above-mentioned insulated column respectively; And light-emitting diode chip for backlight unit, it is fixedly arranged on the above-mentioned heat-conducting seat, and the positive pole of light-emitting diode chip for backlight unit and negative pole are respectively equipped with lead and are electrically connected two conductive connecting pins.
This light-emitting diode chip for backlight unit is fixedly arranged on the heat-conducting seat, and the positive pole of light-emitting diode chip for backlight unit and negative pole are electrically connected two conductive connecting pins respectively, and radiating efficiency is significantly promoted, and guarantees stability of photoluminescence.The modularization of light-emitting diode (LED) module is produced easily, can be directly connected on the available circuit plate, and assemble when using, and the assembling of heat-conducting seat is easy, makes volume-diminished, and production cost reduces.
Reach technological means and the effect that predetermined purpose is taked for further setting forth the present invention, see also following about detailed description of the present invention and accompanying drawing, believe purpose of the present invention, feature and characteristics, can obtain thus going deep into and concrete understanding, yet accompanying drawing only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Fig. 1 is the floor map of known LED chip module.
Fig. 2 is the three-dimensional exploded view of LED chip module of the present invention.
Fig. 3 is the three-dimensional exploded view of another angle of LED chip module of the present invention.
Fig. 4 is the three-dimensional combination figure of LED chip module of the present invention.
The cross sectional side view of Fig. 5 after for LED chip module of the present invention encapsulation.
Fig. 6 establishes the cross sectional side view of outer cover for LED chip module group of the present invention.
Fig. 7 establishes the cross sectional side view of outer cover for another group of LED chip module of the present invention.
Wherein, description of reference numerals is as follows:
70 light-emitting diode chip for backlight unit, 71 first pins
72 second pins, 73 outer covers
74 depressed parts, 75 leads
76 light transmission colloids
1 heat-conducting seat
10 pedestal portions, 11 carriers
12 holding grooves, 13 projecting ring sections
15 perforation of 14 concave ring parts
2 insulating parts
20 base portions, 21 through holes
22 insulated columns, 23 open-works
24 outer stopper 25 fixing holes
3 conductive connecting pins
4 light-emitting diode chip for backlight unit
40 heat conduction colloids, 41 leads
42 light transmission colloids
5 outer covers
50 projections, 51 eyeglasses
6 outer covers
61 eyeglasses
Embodiment
See also Fig. 2 to shown in Figure 5, the present invention is a kind of LED chip module, comprises heat-conducting seat 1, insulating part 2, two conductive connecting pins 3 and light-emitting diode chip for backlight unit 4, wherein:
Heat-conducting seat 1, it has pedestal portion 10, and these pedestal portion 10 end faces are convexly equipped with carrier 11, and these carrier 11 tops are arranged with holding groove 12.The periphery of these pedestal portion 10 end faces is convexly equipped with projecting ring section 13, forms concave ring part 14 between this projecting ring section 13 and the carrier 11, and this concave ring part 14 is provided with two perforation 15.
Insulating part 2, it has base portion 20, and this base portion 20 is provided with through hole 21.Base portion 20 bottom surfaces are convexly equipped with two insulated columns 22.This base portion 20 is placed in the concave ring part 14 of above-mentioned heat-conducting seat 1, and the through hole 21 of this insulating part 2 is sheathed on the carrier 11 of above-mentioned heat-conducting seat 1, and this two insulated column 22 is positioned respectively in two perforation 15 of above-mentioned heat-conducting seat 1.Insulated column 22 is provided with the open-work 23 that exposes.The periphery of base portion 20 end faces of this insulating part 2 is convexly equipped with outer stopper 24.
Two conductive connecting pins 3, it is arranged in the open-work 23 of above-mentioned two insulated columns 22 respectively.
Light-emitting diode chip for backlight unit 4, the holding groove 12 that it is arranged in the through hole 21 of above-mentioned insulating part 2 and is fixedly arranged on above-mentioned heat-conducting seat 1, this holding groove 12 can be promoted the reflecting condensation effect of light-emitting diode chip for backlight unit 4.Being provided with heat conduction colloid 40 between this light-emitting diode chip for backlight unit 4 and the heat-conducting seat 1 glues together mutually.The positive pole of this light-emitting diode chip for backlight unit 4 and negative pole are respectively equipped with lead 41 and are electrically connected two conductive connecting pins, 3 one ends.By this, the high heat that light-emitting diode chip for backlight unit 4 is produced, directly derive by large-area heat-conducting seat 1, significantly promote radiating efficiency, avoid overheated and burn, thereby the high brightness characteristic of performance light-emitting diode chip for backlight unit 4 extends working time, and the positive pole of light-emitting diode 4 separates with heat-conducting seat 1 with negative pole and is connected, and can guarantee its stability of photoluminescence.Encapsulation light transmission colloid 42 on this light-emitting diode chip for backlight unit 4, lead 41 and conductive connecting pin 3 one ends that are connected lead 41, to guarantee structure reliability, this light transmission colloid 42 is arranged in the outer stopper 24 of this insulating part 2.By the setting of the outer stopper 24 of insulating part 2, make lead 41 be connected in conductive connecting pin 3 after, many one decks outer protection, in the manufacturing process before can avoiding encapsulating, lead 41 disconnects because of collision.When encapsulation, can avoid light transmission colloid 42 excessive spreading out in addition, effectively save light transmission colloid 42 consumptions and promote the encapsulation quality by outer stopper 24.
The modularization of light-emitting diode (LED) module of the present invention is produced easily, can be directly connected on the available circuit plate.When assembling was used, the assembling of heat-conducting seat 1 was easy.With the advertisement plate is example, and insulating part 2 can be provided with a plurality of through holes 21 and a plurality of light-emitting diode chip for backlight unit 4 is set respectively on the heat-conducting seat 1 of further extension, and the radiating efficiency of globality is provided, and makes volume-diminished, and production cost reduces.
See also shown in Figure 6ly, the outer stopper 24 of this insulating part 2 further is provided with fixing hole 25, and this LED chip module further comprises outer cover 5, and these outer cover 5 bottoms are provided with projection 50 and are positioned said fixing hole 25.Outer cover 5 tops are provided with eyeglass 51 corresponding to this light-emitting diode chip for backlight unit 4, to converge light.As shown in Figure 6, this light transmission colloid 40 optionally encapsulates.
See also shown in Figure 7ly, this LED chip module further comprises outer cover 6, and the inner surface of these outer cover 6 bottoms is fixedly arranged on the outer surface of the outer stopper 24 of above-mentioned insulating part 2.Outer cover 6 tops are provided with eyeglass 61 corresponding to this light-emitting diode chip for backlight unit 4, to converge light.
LED chip module of the present invention has following characteristics:
1. this light-emitting diode chip for backlight unit is fixedly arranged on the heat-conducting seat, the positive pole of light-emitting diode chip for backlight unit and negative pole are electrically connected two conductive connecting pins respectively, radiating efficiency is significantly promoted, and can avoid overheated burning, thereby the high brightness characteristic of performance light-emitting diode chip for backlight unit, extend working time, and guarantee stability of photoluminescence.
2. the modularization of this light-emitting diode (LED) module is produced easily, can be directly connected on the available circuit plate, and assemble when using, and the assembling of heat-conducting seat is easy, and the radiating efficiency of globality is provided, and makes volume-diminished, and production cost reduces.
3. the periphery of this insulating part end face is convexly equipped with outer stopper, and lead is protected in processing procedure, can be because of collision does not disconnect, and the encapsulation of light transmission colloid can excessively not spread out.
The above, only being the detailed description and the accompanying drawing of specific embodiments of the invention, is not in order to restriction the present invention and feature of the present invention, all those of ordinary skill in the art, modify or variation according to the equivalence that spirit of the present invention is done, all should be contained in the claim of the present invention.
Claims (9)
1. LED chip module comprises:
Heat-conducting seat, it is provided with perforation;
Insulating part, it has base portion, and base portion is provided with through hole, and the base portion bottom surface is convexly equipped with insulated column, and insulated column is positioned in the perforation of above-mentioned heat-conducting seat, and insulated column is provided with the open-work that exposes;
Two conductive connecting pins, it is arranged in the open-work of above-mentioned insulated column respectively; And
Light-emitting diode chip for backlight unit, it is arranged in the through hole of above-mentioned insulating part and is fixedly arranged on above-mentioned heat-conducting seat, and the positive pole of light-emitting diode chip for backlight unit and negative pole are respectively equipped with lead and are electrically connected two conductive connecting pins.
2. LED chip module as claimed in claim 1, wherein this heat-conducting seat has pedestal portion, and this pedestal portion end face is convexly equipped with carrier, and the through hole of this insulating part is sheathed on this carrier, the carrier top is arranged with holding groove, and this light-emitting diode chip for backlight unit is fixedly arranged in this holding groove.
3. LED chip module as claimed in claim 2, wherein the periphery of the pedestal portion end face of this heat-conducting seat is convexly equipped with projecting ring section, form concave ring part between this projecting ring section and the carrier, this concave ring part is provided with the perforation of above-mentioned heat-conducting seat, and the base portion of this insulating part is placed in this concave ring part.
4. LED chip module as claimed in claim 1 wherein is provided with heat conduction gel phase gummed between this light-emitting diode chip for backlight unit and the heat-conducting seat.
5. LED chip module as claimed in claim 1, wherein the periphery of the top base surface of this insulating part is convexly equipped with outer stopper.
6. LED chip module as claimed in claim 5, wherein this light-emitting diode chip for backlight unit, lead and be connected encapsulation light transmission colloid on conductive connecting pin one end of lead, this light transmission colloid is arranged in this outer stopper.
7. LED chip module as claimed in claim 5, wherein the outer stopper of this insulating part is provided with fixing hole, this LED chip module further comprises outer cover, and this outer cover bottom is provided with projection and is positioned the said fixing hole, and the outer cover top is provided with eyeglass corresponding to this light-emitting diode chip for backlight unit.
8. LED chip module as claimed in claim 5, it further comprises outer cover, and the inner surface of this outer cover bottom is fixedly arranged on the outer surface of the outer stopper of above-mentioned insulating part, and the outer cover top is provided with eyeglass corresponding to this light-emitting diode chip for backlight unit.
9. LED chip module comprises:
Heat-conducting seat, it is provided with perforation;
Insulated column, it is positioned in the perforation of above-mentioned heat-conducting seat, and insulated column is provided with the open-work that exposes;
Two conductive connecting pins, it is arranged in the open-work of above-mentioned insulated column respectively; And
Light-emitting diode chip for backlight unit, it is fixedly arranged on the above-mentioned heat-conducting seat, and the positive pole of light-emitting diode chip for backlight unit and negative pole are respectively equipped with lead and are electrically connected two conductive connecting pins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101242993A CN1635640A (en) | 2003-12-29 | 2003-12-29 | LED chip module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101242993A CN1635640A (en) | 2003-12-29 | 2003-12-29 | LED chip module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1635640A true CN1635640A (en) | 2005-07-06 |
Family
ID=34844992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2003101242993A Pending CN1635640A (en) | 2003-12-29 | 2003-12-29 | LED chip module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1635640A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008043264A1 (en) * | 2006-09-28 | 2008-04-17 | Industrial Technology Research Institute | Light-emitting component package, light-emitting component packaging apparatus, and light source device |
| CN100454595C (en) * | 2005-12-09 | 2009-01-21 | 富准精密工业(深圳)有限公司 | LED Module |
| CN100481545C (en) * | 2006-08-25 | 2009-04-22 | 必奇股份有限公司 | Seat structure of light emitting diode |
| CN100533789C (en) * | 2006-03-29 | 2009-08-26 | 财团法人工业技术研究院 | Light emitting device and method for fabricating the same |
| CN104269492A (en) * | 2014-10-14 | 2015-01-07 | 华南师范大学 | Total-angle light emitting power type LED and manufacturing method of total-angle light emitting power type LED |
-
2003
- 2003-12-29 CN CNA2003101242993A patent/CN1635640A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100454595C (en) * | 2005-12-09 | 2009-01-21 | 富准精密工业(深圳)有限公司 | LED Module |
| CN100533789C (en) * | 2006-03-29 | 2009-08-26 | 财团法人工业技术研究院 | Light emitting device and method for fabricating the same |
| CN100481545C (en) * | 2006-08-25 | 2009-04-22 | 必奇股份有限公司 | Seat structure of light emitting diode |
| WO2008043264A1 (en) * | 2006-09-28 | 2008-04-17 | Industrial Technology Research Institute | Light-emitting component package, light-emitting component packaging apparatus, and light source device |
| CN104269492A (en) * | 2014-10-14 | 2015-01-07 | 华南师范大学 | Total-angle light emitting power type LED and manufacturing method of total-angle light emitting power type LED |
| CN104269492B (en) * | 2014-10-14 | 2017-09-26 | 华南师范大学 | Luminous power-type LED of full angle and preparation method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |