CN1627993A - 喷嘴装置及具有喷嘴装置的基板处理装置 - Google Patents
喷嘴装置及具有喷嘴装置的基板处理装置 Download PDFInfo
- Publication number
- CN1627993A CN1627993A CN02829087.9A CN02829087A CN1627993A CN 1627993 A CN1627993 A CN 1627993A CN 02829087 A CN02829087 A CN 02829087A CN 1627993 A CN1627993 A CN 1627993A
- Authority
- CN
- China
- Prior art keywords
- liquid
- substrate
- treatment fluid
- outlet
- spray nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/027—Coating heads with several outlets, e.g. aligned transversally to the moving direction of a web to be coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
- B05B1/20—Perforated pipes or troughs, e.g. spray booms; Outlet elements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
- Coating Apparatus (AREA)
- Nozzles (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2002/005567 WO2003103845A1 (ja) | 2002-06-05 | 2002-06-05 | ノズル装置及びこれを備えた基板処理装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1627993A true CN1627993A (zh) | 2005-06-15 |
Family
ID=29727316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN02829087.9A Pending CN1627993A (zh) | 2002-06-05 | 2002-06-05 | 喷嘴装置及具有喷嘴装置的基板处理装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2003103845A1 (ja) |
| CN (1) | CN1627993A (ja) |
| TW (1) | TW561071B (ja) |
| WO (1) | WO2003103845A1 (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102931119A (zh) * | 2011-08-09 | 2013-02-13 | 株式会社Mm科技 | 用于处理衬底表面的叶片模块 |
| CN105298531A (zh) * | 2015-10-24 | 2016-02-03 | 山西晋城无烟煤矿业集团有限责任公司 | 掘锚机用喷雾装置 |
| CN106111587A (zh) * | 2016-06-23 | 2016-11-16 | 武汉华星光电技术有限公司 | 液刀 |
| CN113942860A (zh) * | 2020-07-17 | 2022-01-18 | 台郡科技股份有限公司 | 水平式输送基板的传动机构 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6178185B2 (ja) * | 2013-09-24 | 2017-08-09 | 積水化学工業株式会社 | スリットノズル |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3458313B2 (ja) * | 1992-12-31 | 2003-10-20 | 株式会社サンツール | カーテンファイバー状接着剤のスプレー塗布装置 |
| JPH06210228A (ja) * | 1993-01-16 | 1994-08-02 | San Tool:Kk | カーテンファイバー状スプレー塗布装置 |
| JPH1157573A (ja) * | 1997-08-13 | 1999-03-02 | Sun Tool:Kk | 外装被覆商品の製造方法および外装被覆商品の製造装置 |
-
2002
- 2002-06-05 TW TW091111940A patent/TW561071B/zh not_active IP Right Cessation
- 2002-06-05 JP JP2004510958A patent/JPWO2003103845A1/ja active Pending
- 2002-06-05 CN CN02829087.9A patent/CN1627993A/zh active Pending
- 2002-06-05 WO PCT/JP2002/005567 patent/WO2003103845A1/ja not_active Ceased
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102931119A (zh) * | 2011-08-09 | 2013-02-13 | 株式会社Mm科技 | 用于处理衬底表面的叶片模块 |
| CN105298531A (zh) * | 2015-10-24 | 2016-02-03 | 山西晋城无烟煤矿业集团有限责任公司 | 掘锚机用喷雾装置 |
| CN106111587A (zh) * | 2016-06-23 | 2016-11-16 | 武汉华星光电技术有限公司 | 液刀 |
| CN106111587B (zh) * | 2016-06-23 | 2018-09-11 | 武汉华星光电技术有限公司 | 液刀 |
| CN113942860A (zh) * | 2020-07-17 | 2022-01-18 | 台郡科技股份有限公司 | 水平式输送基板的传动机构 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2003103845A1 (ja) | 2005-10-06 |
| WO2003103845A1 (ja) | 2003-12-18 |
| TW561071B (en) | 2003-11-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |