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CN1697104A - Electrical contact material containing organic heterojunction and device thereof - Google Patents

Electrical contact material containing organic heterojunction and device thereof Download PDF

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CN1697104A
CN1697104A CNA2005100167212A CN200510016721A CN1697104A CN 1697104 A CN1697104 A CN 1697104A CN A2005100167212 A CNA2005100167212 A CN A2005100167212A CN 200510016721 A CN200510016721 A CN 200510016721A CN 1697104 A CN1697104 A CN 1697104A
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organic
contact material
heterojunction
contacts
buffer layer
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CN100466125C (en
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闫东航
王海波
王军
代继光
姜晓霞
严铉俊
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Changchun Flexible Display Technology Co ltd
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Changchun Institute of Applied Chemistry of CAS
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/484Insulated gate field-effect transistors [IGFETs] characterised by the channel regions
    • H10K10/486Insulated gate field-effect transistors [IGFETs] characterised by the channel regions the channel region comprising two or more active layers, e.g. forming pn heterojunctions
    • HELECTRICITY
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    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/20Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising organic-organic junctions, e.g. donor-acceptor junctions
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    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/30Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains
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    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
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    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
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    • H10K85/111Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • HELECTRICITY
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    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
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    • H10K85/311Phthalocyanine
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    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
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    • H10K85/00Organic materials used in the body or electrodes of devices covered by this subclass
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Abstract

Located between organic semiconductor and metal electrode and containing hetero junction, the electric contact material is composed of organic semiconductors in electron type and in cavity type as well as hetero junction built from organic semiconductors in electron type and in cavity type. The invention also is related to organic diode, organic field effect transistor and organic photovoltaic device, which use the electric contact material of containing organic hetero junction as buffer layer.

Description

含有有机异质结的电接触材料及其器件Electrical contact material containing organic heterojunction and device thereof

技术领域technical field

本发明涉及采用有机半导体异质结(organic heterojunction)的电接触材料,实现金属电极与有机半导体的有效接触。本发明还涉及采用含有有机异质结的电接触材料作为缓冲层的有机场效应晶体管器件和有机光伏器件。The invention relates to an electrical contact material using an organic heterojunction (organic heterojunction) to realize effective contact between a metal electrode and an organic semiconductor. The invention also relates to an organic field effect transistor device and an organic photovoltaic device using an electrical contact material containing an organic heterojunction as a buffer layer.

背景技术Background technique

近年来,有关有机半导体材料的研究异常活跃,在信息显示和光伏电池等方面显示出广阔的应用前景。中国专利02129458.5公开了一种夹心型的有机场效应晶体管,提供了采用二种或二种以上有机半导体材料构成新型半导体的方法,采用这种方法可以有效提高有机场效应晶体管的综合性能,特别是可以有效降低阈值电压。中国专利03102064.x公开了一种采用有机半导体异质结实现双极型有机场效应晶体管的方法,并利用有机半导体的异质结的导电性质还实现了常开型场效应晶体管的方法。在化学物理快报(Chemical Physics Letters)的2005年第407卷87页,王军等人报道了有机异质结界面具有高电导性,并利用有机异质结实现了常开型和双极型场效应晶体管。因此,采用两种有机半导体复合做为活性层的有机半导体器件表现出了与单一材料不同的器件性能。中国专利200410010768.3公开了一种采用非反应活性缓冲层来实现金属电极与半导体的有效接触的方法,该方法是采用高电导性材料作为器件的缓冲层,提高了有机场效应晶体管中的载流子注入效率。In recent years, the research on organic semiconductor materials has been extremely active, showing broad application prospects in information display and photovoltaic cells. Chinese patent 02129458.5 discloses a sandwich-type organic field effect transistor, which provides a method of using two or more organic semiconductor materials to form a new type of semiconductor. This method can effectively improve the overall performance of organic field effect transistors, especially can effectively lower the threshold voltage. Chinese patent 03102064.x discloses a method of realizing a bipolar organic field effect transistor by using an organic semiconductor heterojunction, and a method of realizing a normally-on field effect transistor by utilizing the conductive properties of the organic semiconductor heterojunction. In Chemical Physics Letters (Chemical Physics Letters), Vol. 407, page 87, 2005, Wang Jun et al. reported that the organic heterojunction interface has high conductivity, and used the organic heterojunction to realize the normally open and bipolar field effect transistor. Therefore, the organic semiconductor device using two organic semiconductor composites as the active layer exhibits different device performance from that of a single material. Chinese patent 200410010768.3 discloses a method of using a non-reactive buffer layer to achieve effective contact between metal electrodes and semiconductors. This method uses high-conductivity materials as the buffer layer of the device to increase the carrier in the organic field effect transistor. injection efficiency.

发明内容Contents of the invention

本发明的目的之一是提供一种含有有机异质结的电接触材料;One of the objects of the present invention is to provide an electrical contact material comprising an organic heterojunction;

本发明的另一目的是提供一种采用含有有机异质结的电接触材料作为缓冲层的有机场效应晶体管器件;Another object of the present invention is to provide an organic field effect transistor device using an electrical contact material containing an organic heterojunction as a buffer layer;

本发明的第三个目的是提供一种采用含有有机异质结的电接触材料作为缓冲层的有机光伏器件。The third object of the present invention is to provide an organic photovoltaic device using an electrical contact material containing an organic heterojunction as a buffer layer.

本发明利用有机半导体异质结的界面具有高导电性质,克服金属和有机半导体界面偶极作用和能级失配对电荷注入和导出的限制。有机半导体异质结界面的高导电性来源于有机半导体接触后所产生界面偶极,这种界面偶极会形成很强的偶极电场,其诱导载流子在界面处累积,导致界面处形成高电导区域。这一高电导区域有效的降低了电荷的注入势垒,增强了电荷从金属电极到有机半导体的隧穿几率。因此,采用有机半导体异质结作为电接触材料能够显著的提高电荷注入和导出性质。The invention utilizes the high conductivity of the interface of the heterojunction of the organic semiconductor, and overcomes the limitations of the dipole action and energy level mismatch on the interface of the metal and the organic semiconductor to charge injection and derivation. The high conductivity of the organic semiconductor heterojunction interface comes from the interface dipole generated after the contact of the organic semiconductor. This interface dipole will form a strong dipole electric field, which induces carriers to accumulate at the interface, resulting in the formation of regions of high conductance. This high-conductivity region effectively reduces the charge injection barrier and enhances the tunneling probability of charges from the metal electrode to the organic semiconductor. Therefore, the use of organic semiconductor heterojunctions as electrical contact materials can significantly improve the charge injection and derivation properties.

本发明采用两种或两种以上有机半导体材料所构成的有机异质结作为电接触材料,并且在有机场效应晶体管器件和有机光伏器件中采用这种含有有机异质结的电接触材料作为缓冲层实现了金属电极与有机半导体的有效接触。The present invention uses an organic heterojunction composed of two or more organic semiconductor materials as an electrical contact material, and uses this electrical contact material containing an organic heterojunction as a buffer in an organic field effect transistor device and an organic photovoltaic device The layer realizes effective contact between the metal electrode and the organic semiconductor.

含有有机异质结的电接触材料是由电子型和空穴型有机半导体及其构成的异质结组成。这里的空穴型半导体层分别由酞菁铜、酞菁镍、酞菁锌、酞菁钴、酞菁铂、自由酞菁、四聚噻吩、五聚噻吩、六聚噻吩、二(联苯-4,4’)-2,2’-二噻吩之一或至少两种材料构成,电子型半导体层分别由氟代酞菁铜、氟代酞菁锌、氟代酞菁铁、氟代酞菁钴和氟代六聚噻吩之一或至少两种材料构成。含有有机异质结的电接触材料的制备均采用真空分子气相沉积方法,总体厚度为零到五十纳米。Electrical contact materials containing organic heterojunctions are composed of electronic and hole organic semiconductors and their heterojunctions. The hole-type semiconductor layers here are made of copper phthalocyanine, nickel phthalocyanine, zinc phthalocyanine, cobalt phthalocyanine, platinum phthalocyanine, free phthalocyanine, tetrathiophene, pentathiophene, hexathiophene, bis(biphenyl- 4,4')-2,2'-dithiophene or at least two materials, the electronic semiconductor layer is respectively made of fluorophthalocyanine copper, fluorophthalocyanine zinc, fluorophthalocyanine iron, fluorophthalocyanine One or at least two materials of cobalt and fluorinated hexathiophene. The electrical contact materials containing organic heterojunctions are all prepared by vacuum molecular vapor deposition method, and the overall thickness is zero to fifty nanometers.

采用含有有机异质结的电接触材料作为缓冲层能够有效改善金属电极和有机半导体的接触效应。金属电极的特征是功函大于4.3电子伏特、小于5.7电子伏特,包括氧化铟锡(ITO)、镁(Mg)、铝(Al)、银(Ag)、钽(Ta)、铬(Cr)、钼(Mo)、铜(Cu)、金(Au)和铂(Pt)中的一种或其中两种以上的金属合金。采用含有有机异质结的电接触材料作为缓冲层的晶体管的接触电阻被显著的降低,从而增强了电荷注入效率,晶体管的器件性能被明显提高。采用含有有机异质结的电接触材料作为缓冲层的有机光伏器件,实现了电荷的有效导出,器件性能被大幅度地提高。Using an electrical contact material containing an organic heterojunction as a buffer layer can effectively improve the contact effect between the metal electrode and the organic semiconductor. Metal electrodes are characterized by a work function greater than 4.3 eV and less than 5.7 eV, including indium tin oxide (ITO), magnesium (Mg), aluminum (Al), silver (Ag), tantalum (Ta), chromium (Cr), One of molybdenum (Mo), copper (Cu), gold (Au) and platinum (Pt) or a metal alloy of two or more of them. The contact resistance of the transistor using the electrical contact material containing the organic heterojunction as the buffer layer is significantly reduced, thereby enhancing the charge injection efficiency, and the device performance of the transistor is obviously improved. An organic photovoltaic device using an electrical contact material containing an organic heterojunction as a buffer layer realizes the effective derivation of charges, and the performance of the device is greatly improved.

附图说明Description of drawings

图1a是本发明采用含有有机异质结的电接触材料作为缓冲层的二极管结构示意图。其中,1是基板,2和5是电极,3是有机半导体活性层,4是含有有机异质结的电接触材料所构成的缓冲层。Fig. 1a is a schematic diagram of a diode structure using an electrical contact material containing an organic heterojunction as a buffer layer according to the present invention. Wherein, 1 is a substrate, 2 and 5 are electrodes, 3 is an organic semiconductor active layer, and 4 is a buffer layer composed of an electrical contact material containing an organic heterojunction.

图1b是不含缓冲层的二极管结构示意图。其中,1是基板,2和4是电极,3是有机半导体活性层。Figure 1b is a schematic diagram of a diode structure without a buffer layer. Wherein, 1 is a substrate, 2 and 4 are electrodes, and 3 is an organic semiconductor active layer.

图1c是本发明实施例1含有含有有机异质结的电接触材料作为缓冲层的二极管结构在暗态(曲线(b))和光照(曲线(c))条件下的电流-电压曲线,以及不含缓冲层的二极管结构在暗态(曲线(a))下的电流-电压曲线。Fig. 1c is the electric current-voltage curve under dark state (curve (b)) and illumination (curve (c)) condition of the diode structure that contains the electric contact material that contains organic heterojunction as buffer layer in embodiment 1 of the present invention, and Current-voltage curves of the diode structure without buffer layer in the dark state (curve (a)).

图2a采用含有有机异质结的电接触材料作为缓冲层的有机场效应晶体管器件结构示意图。其中,1是基板,2是栅电极,3是绝缘层,4是有机半导体活性层,5是含有有机异质结的电接触材料所构成的缓冲层。6是源/漏电极。图2a也是说明书摘要附图。Fig. 2a is a schematic diagram of the device structure of an organic field effect transistor using an electrical contact material containing an organic heterojunction as a buffer layer. Wherein, 1 is a substrate, 2 is a gate electrode, 3 is an insulating layer, 4 is an organic semiconductor active layer, and 5 is a buffer layer composed of an electrical contact material containing an organic heterojunction. 6 is a source/drain electrode. Figure 2a is also a drawing of the abstract of the specification.

图2b是本发明实施例2的输出特性曲线。Fig. 2b is an output characteristic curve of Embodiment 2 of the present invention.

图2c是本发明实施例2的转移特性曲线。Fig. 2c is the transfer characteristic curve of Example 2 of the present invention.

图3a采用含有有机异质结的电接触材料作为缓冲层的有机光伏器件结构示意图。其中,1是基板,2和6是电极,3是含有有机异质结的电接触材料所构成的缓冲层,4和5是有机半导体活性层。Fig. 3a is a schematic diagram of the structure of an organic photovoltaic device using an electrical contact material containing an organic heterojunction as a buffer layer. Wherein, 1 is a substrate, 2 and 6 are electrodes, 3 is a buffer layer composed of an electrical contact material containing an organic heterojunction, and 4 and 5 are organic semiconductor active layers.

图3b是本发明实施例3中不含缓冲层有机光伏器件在暗态(曲线(a))和光照下(曲线(b))和含有缓冲层的有机光伏器件在暗态(曲线(c))和光照下(曲线(d))的电流-电压曲线。Fig. 3 b is the organic photovoltaic device without buffer layer in the embodiment 3 of the present invention in dark state (curve (a)) and under light (curve (b)) and the organic photovoltaic device containing buffer layer in dark state (curve (c) ) and the current-voltage curves under light (curve (d)).

具体实施方式Detailed ways

下面结合附图描述本发明。Describe the present invention below in conjunction with accompanying drawing.

图1a是采用含有有机异质结的电接触材料作为缓冲层的二极管结构示意图。将导电材料设置于基板1上构成电极2,空穴型和(或)电子型半导体材料设置于电极2上形成有机活性层3,空穴型和(或)电子型半导体材料设置于有机活性层3上形成含有有机异质结的电接触材料,构成缓冲层4,电极5设置于缓冲层4上。Figure 1a is a schematic diagram of a diode structure using an electrical contact material containing an organic heterojunction as a buffer layer. A conductive material is arranged on the substrate 1 to form an electrode 2, a hole-type and (or) electron-type semiconductor material is arranged on the electrode 2 to form an organic active layer 3, and a hole-type and (or) electron-type semiconductor material is arranged on the organic active layer An electrical contact material containing an organic heterojunction is formed on the buffer layer 4 to form a buffer layer 4, and the electrode 5 is arranged on the buffer layer 4.

图2a采用含有有机异质结的电接触材料作为缓冲层的有机场效应晶体管器件结构示意图。将导电材料层设置于衬底1上构成栅电极2,绝缘材料设置于栅电极2上构成绝缘层3,电子型和(或)空穴型半导体材料设置于绝缘层3上构成半导体层活性层4,空穴型和(或)电子型半导体材料设置于半导体活性层4上形成含有有机异质结的电接触材料,构成缓冲层5,源漏电极6设置于缓冲层5上。Fig. 2a is a schematic diagram of the device structure of an organic field effect transistor using an electrical contact material containing an organic heterojunction as a buffer layer. The conductive material layer is arranged on the substrate 1 to form the gate electrode 2, the insulating material is arranged on the gate electrode 2 to form the insulating layer 3, and the electronic type and (or) hole type semiconductor material is arranged on the insulating layer 3 to form the active layer of the semiconductor layer 4. Hole-type and (or) electron-type semiconductor materials are arranged on the semiconductor active layer 4 to form an electrical contact material containing an organic heterojunction to form a buffer layer 5 , and the source and drain electrodes 6 are arranged on the buffer layer 5 .

图3a采用含有有机异质结的电接触材料作为缓冲层的有机光伏器件结构示意图。将导电材料设置于基板1上构成电极2,空穴型和(或)电子型半导体材料设置于电极2上形成含有有机异质结的电接触材料,构成缓冲层3,半导体活性层4设置于缓冲层3上,半导体活性层5设置于半导体活性层4上,在半导体活性层5上形成电极6。Fig. 3a is a schematic diagram of the structure of an organic photovoltaic device using an electrical contact material containing an organic heterojunction as a buffer layer. A conductive material is placed on the substrate 1 to form an electrode 2, a hole-type and (or) electron-type semiconductor material is placed on the electrode 2 to form an electrical contact material containing an organic heterojunction, and a buffer layer 3 is formed, and the semiconductor active layer 4 is placed on the On the buffer layer 3 , a semiconductor active layer 5 is disposed on the semiconductor active layer 4 , and an electrode 6 is formed on the semiconductor active layer 5 .

下面通过实施例进一步描述本发明。The present invention is further described below by way of examples.

实施例1:Example 1:

所用酞箐铜(CuPc)、酞箐锌(ZnPc)、酞箐镍(NiPc)、酞箐钴(CoPc)、自由酞箐(H2Pc)、酞箐铂(PtPc)、氟代酞菁铜(F16CuPc)、氟代酞菁锌(F16ZnPc)氟代酞菁铁(F16FePc)和氟代酞菁钴(F16CoPc)是商业产品,经过升华纯化后使用。四聚噻吩(4T)、五聚噻吩(5T)、六聚噻吩(6T)、二(联苯-4,4’)-2,2’-二噻吩(BP2T)和氟代六聚噻吩(DFH-6T)是合成材料,经过升华纯化后使用。导电薄膜氧化铟锡(ITO)做为电极2覆盖在玻璃基板1上,含有导电薄膜的玻璃整体是商业产品。Copper phthalocyanine (CuPc), zinc phthalocyanine (ZnPc), nickel phthalocyanine (NiPc), cobalt phthalocyanine (CoPc), free phthalocyanine (H 2 Pc), platinum phthalocyanine (PtPc), fluorinated copper phthalocyanine (F 16 CuPc), Zinc Fluorophthalocyanine (F 16 ZnPc), Iron Fluorophthalocyanine (F 16 FePc) and Cobalt Fluorophthalocyanine (F 16 CoPc) are commercial products and used after sublimation purification. Tetrathiophene (4T), pentathiophene (5T), hexathiophene (6T), bis(biphenyl-4,4')-2,2'-dithiophene (BP2T) and fluorinated hexathiophene (DFH -6T) is a synthetic material that is used after sublimation purification. The conductive thin film indium tin oxide (ITO) is used as the electrode 2 to cover the glass substrate 1, and the whole glass containing the conductive thin film is a commercial product.

含有有机异质结的电接触材料作为缓冲层的二极管结构见图1a。所有有机层的制备均采用真空分子气相沉积方法,其真空度为10-5帕。玻璃基板1上的ITO电极作为阳极,构成电极2。首先,在ITO电极2上采用真空分子气相沉积方法沉积40纳米酞菁锌,构成有机半导体活性层3。然后,在有机半导体活性层3上采用真空分子气相沉积方法沉积含有有机异质结的电接触材料构成缓冲层4。这里的电接触材料是由电子型和空穴型有机半导体及其构成的异质结组成,其中空穴型半导体层分别由酞菁铜、酞菁镍、酞菁锌、酞菁钴、酞菁铂、自由酞菁、四聚噻吩(4T)、五聚噻吩(5T)、六聚噻吩(6T)、二(联苯-4,4’)-2,2’-二噻吩(BP2T)之一或至少两种材料构成,电子型半导体层分别由氟代酞菁铜、氟代酞菁锌、氟代酞菁铁、氟代酞菁钴和氟代六聚噻吩之一或至少两种材料构成。缓冲层4的制作方法是先采用真空分子气相沉积方法沉积一种类型的有机半导体,基底温度为150摄氏度,厚度为2纳米,形成分立的晶粒,然后在同样条件下采用与上述同样的方法再沉积另一种有机半导体,厚度为2纳米,它们共同形成有机异质结互穿网络结构,构成含有有机异质结的电接触材料,作为缓冲层。最后,采用真空热蒸镀的方法在缓冲层4上沉积不同的金属形成电极5,作为阴极,热蒸镀时的真空为10-4帕。The diode structure containing the electrical contact material of the organic heterojunction as the buffer layer is shown in Fig. 1a. All organic layers are prepared by vacuum molecular vapor deposition method, and the vacuum degree is 10 -5 Pa. The ITO electrode on the glass substrate 1 serves as an anode and constitutes the electrode 2 . First, 40 nanometers of zinc phthalocyanine is deposited on the ITO electrode 2 by vacuum molecular vapor deposition to form an organic semiconductor active layer 3 . Then, the buffer layer 4 is formed by depositing an electrical contact material containing an organic heterojunction on the organic semiconductor active layer 3 by using a vacuum molecular vapor deposition method. The electrical contact material here is composed of electron-type and hole-type organic semiconductors and their heterojunctions. The hole-type semiconductor layers are composed of copper phthalocyanine, nickel phthalocyanine, zinc phthalocyanine, cobalt phthalocyanine, and phthalocyanine. One of platinum, free phthalocyanine, tetrathiophene (4T), pentathiophene (5T), hexathiophene (6T), bis(biphenyl-4,4')-2,2'-dithiophene (BP2T) or at least two kinds of materials, and the electronic semiconductor layer is composed of one or at least two materials of fluorophthalocyanine copper, fluorophthalocyanine zinc, fluorophthalocyanine iron, fluorophthalocyanine cobalt and fluorinated hexathiophene . The manufacturing method of the buffer layer 4 is to first deposit a type of organic semiconductor by vacuum molecular vapor deposition method, the substrate temperature is 150 degrees Celsius, and the thickness is 2 nanometers to form discrete crystal grains, and then adopt the same method as above under the same conditions Deposit another organic semiconductor with a thickness of 2 nanometers, and they together form an organic heterojunction interpenetrating network structure, constituting an electrical contact material containing an organic heterojunction as a buffer layer. Finally, different metals are deposited on the buffer layer 4 by vacuum thermal evaporation to form an electrode 5, which is used as a cathode, and the vacuum during thermal evaporation is 10 −4 Pa.

为了对比缓冲层对电接触性能的改善效果,制作了不含缓冲层的器件,其器件结构见图1b。有机层的制备均采用真空分子气相沉积方法,其真空度为10-5Pa。玻璃基板1上的ITO电极作为阳极,构成电极2。首先,在电极2上采用真空分子气相沉积方法沉积40纳米酞菁锌,构成有机半导体活性层3。然后,采用真空热蒸镀的方法在有机半导体活性层3上沉积不同的金属形成电极4,作为阴极,热蒸镀时的真空为10-4帕。In order to compare the improvement effect of the buffer layer on the electrical contact performance, a device without a buffer layer was fabricated, and the device structure is shown in Figure 1b. The preparation of the organic layers all adopts the vacuum molecular vapor deposition method, and the vacuum degree is 10 -5 Pa. The ITO electrode on the glass substrate 1 serves as an anode and constitutes the electrode 2 . First, 40 nanometers of zinc phthalocyanine is deposited on the electrode 2 by using a vacuum molecular vapor deposition method to form an organic semiconductor active layer 3 . Then, different metals are deposited on the organic semiconductor active layer 3 by vacuum thermal evaporation to form an electrode 4, which is used as a cathode, and the vacuum during thermal evaporation is 10 −4 Pa.

表1列出了对于低功函金属电极的图1a和图1b所述两种结构器件的电导率。表中电导率为在阳极正1伏的情况下测得,eV代表电子伏特,S/cm代表西门子每厘米。对于低功函的金属电极,镁(Mg)和铝(Al),无论含有缓冲层还是不含有缓冲层的器件均表现出肖特基接触,但对比于不含有缓冲层的器件,相应的含有缓冲层器件的电导率均有所提高。Table 1 lists the conductivities of the devices with the two structures described in Fig. 1a and Fig. 1b for low work function metal electrodes. The conductivity in the table is measured at the positive 1 volt of the anode, eV stands for electron volts, and S/cm stands for Siemens per centimeter. For metal electrodes with low work function, magnesium (Mg) and aluminum (Al), devices with or without a buffer layer exhibit Schottky contacts, but compared to devices without a buffer layer, the corresponding The conductivity of the buffer layer devices has been improved.

表1 缓冲层 阴极   阴极功函(eV)   电导率(S/cm)(不含缓冲层)   电导率(S/cm)(含缓冲层) 接触特性   ZnPc/F16CuPc   Mg   2.87   1.1×10-8   2.5×10-8   肖特基接触   ZnPc/F16CuPc   Al   4.28   0.8×10-8   1.6×10-8   肖特基接触   CuPc/F16CuPc   Al   4.28   1.0×10-8   3.1×10-8   肖特基接触   6T/DFH-6T   Al   4.28   6.1×10-8   1.2×10-7   肖特基接触   6T/CuPc/F16CuPc   Al   4.28   4.4×10-8   8.3×10-8   肖特基接触   BP2T/F16CuPc   Al   4.28   5.4×10-8   2.1×10-7   肖特基接触 Table 1 The buffer layer cathode Cathode work function (eV) Conductivity (S/cm) (excluding buffer layer) Conductivity (S/cm) (including buffer layer) contact characteristics ZnPc/F 16 CuPc Mg 2.87 1.1×10 -8 2.5×10 -8 schottky contact ZnPc/F 16 CuPc Al 4.28 0.8×10 -8 1.6×10 -8 schottky contact CuPc/F 16 CuPc Al 4.28 1.0×10 -8 3.1×10 -8 schottky contact 6T/DFH-6T al 4.28 6.1×10 -8 1.2×10 -7 schottky contact 6T/CuPc/F 16 CuPc al 4.28 4.4×10 -8 8.3×10 -8 schottky contact BP2T/F 16 CuPc al 4.28 5.4×10 -8 2.1×10 -7 schottky contact

表2列出了对于高功函金属电极的图1a和图1b所述两种结构器件的电导率。对于电极功函在4.3eV到5.1eV,银(Ag),钽(Ta),铬(Cr),钼(Mo),铜(Cu),含有缓冲层器件的电导率均高于不含缓冲层器件电导率的2到3倍,并且全部表现为欧姆传输。对于更高功函的金属电极,金(Au)和铂(Pt),所有器件的电学特性均表现为欧姆传输,含有缓冲层器件的电导率略有提高。因此,采用含有有机异质结的电接触材料所构成的缓冲层,能够有效改善金属电极与有机半导体之间的接触,其适用范围为所有功函大于4.3eV、小于5.7eV的电极材料。Table 2 lists the conductivities of the devices with the two structures described in Fig. 1a and Fig. 1b for high work function metal electrodes. For the electrode work function of 4.3eV to 5.1eV, silver (Ag), tantalum (Ta), chromium (Cr), molybdenum (Mo), copper (Cu), the conductivity of the device containing the buffer layer is higher than that without the buffer layer 2 to 3 times the device conductivity, and all exhibit ohmic transmission. For higher work function metal electrodes, gold (Au) and platinum (Pt), the electrical properties of all devices exhibited ohmic transport, and the conductivity of the device containing the buffer layer was slightly improved. Therefore, using a buffer layer composed of an electrical contact material containing an organic heterojunction can effectively improve the contact between the metal electrode and the organic semiconductor, and its scope of application is all electrode materials with a work function greater than 4.3eV and less than 5.7eV.

表2 缓冲层 阴极 阴极功函(eV)   电导率(S/cm)(不含缓冲层)   电导率(S/cm)(含缓冲层) 接触特性   ZnPc/F16CuPc   Ag   4.26   5.2×10-10   1.6×10-9   欧姆接触   CuPc/F16CuPc   Ag   4.26   2.7×10-9   3.8×10-8   欧姆接触   PtPc/F16ZnPc   Ag   4.26   4.1×10-10   1.1×10-9   欧姆接触   5T/F16CuPc   Ag   4.26   3.6×10-9   6.9×10-9   欧姆接触   4T/DFH-6T   Ag   4.26   8.9×10-8   7.2×10-7   欧姆接触   BP2T/F16ZnPc   Ag   4.26   1.3×10-7   8.8×10-7   欧姆接触   NiPc/F16CoPc   Ag   4.26   2.1×10-9   5.8×10-8   欧姆接触   ZnPc/CuPc/F16CuPc Ag 4.26 4.2×10-9 6.9×10-8 欧姆接触   4T/5T/DFH-6T Ag 4.26 9.1×10-8 8.0×10-7 欧姆接触   CuPc/F16CuPc/F16ZnPc Ag 4.26 6.2×10-9 7.5×10-8 欧姆接触   ZnPc/F16CuPc   Ta   4.25   2.1×10-9   6.2×10-9   欧姆接触   CuPc/F16FePc   Ta   4.25   1.0×10-9   3.1×10-9   欧姆接触   H2Pc/F16FePc   Ta   4.25   7.0×10-10   1.5×10-9   欧姆接触   NiPc/CuPc/   Ta   4.25   6.8×10-9   9.1×10-9   欧姆接触   F16CuPc   ZnPc/F16CuPc   Cr   4.5   2.9×10-8   8.4×10-8   欧姆接触   CoPc/F16ZnPc   Cr   4.5   1.1×10-8   7.3×10-8   欧姆接触   4T/DFH-6T   Cr   4.5   9.1×10-8   8.7×10-7   欧姆接触   ZnPc/F16CuPc   Mo   4.6   2.8×10-8   9.1×10-8   欧姆接触   PtPc/F16CuPc   Mo   4.6   3.3×10-8   1.3×10-7   欧姆接触   5T/DFH-6T   Mo   4.6   5.3×10-7   7.7×10-6   欧姆接触   ZnPc/F16CuPc   Cu   4.65   5.3×10-8   1.3×10-7   欧姆接触   H2Pc/F16ZnPc   Cu   4.65   4.1×10-8   8.6×10-8   欧姆接触   CuPc/F16FePc   Cu   4.65   3.0×10-8   7.5×10-8   欧姆接触   CoPc/F16CuPc   Cu   4.65   4.9×10-8   1.3×10-7   欧姆接触   BP2T/F16CuPc   Cu   4.65   7.5×10-8   3.1×10-7   欧姆接触   NiPc/CuPc/F16ZnPc Cu 4.65 4.5×10-8 8.1×10-8 欧姆接触   CoPc/ZnPc/F16ZnPc Cu 4.65 6.2×10-8 9.8×10-8 欧姆接触   ZnPc/F16ZnPc/DFH-6T Cu 4.65 8.5×10-7 9.4×10-6 欧姆接触   ZnPc/F16CuPc   Au   5.1   1.0×10-7   1.1×10-7   欧姆接触   CuPc/F16CuPc   Au   5.1   1.2×10-7   1.4×10-7   欧姆接触   CoPc/F16CoPc   Au   5.1   9.4×10-8   1.1×10-7   欧姆接触   CuPc/F16ZnPc   Au   5.1   1.1×10-7   1.1×10-7   欧姆接触   6T/F16CuPc   Au   5.1   2.9×10-7   3.1×10-7   欧姆接触   6T/F16ZnPc   Au   5.1   2.8×10-7   3.3×10-7   欧姆接触   6T/DFH-6T   Au   5.1   8.2×10-7   9.2×10-7   欧姆接触   BP2T/F16CuPc   Au   5.1   2.2×10-7   2.5×10-7   欧姆接触   6T/CuPc/F16CuPc Au 5.1 2.6×10-7 3.1×10-7 欧姆接触   CoPc/CuPc/F16CuPc Au 5.1 2.0×10-7 2.2×10-7 欧姆接触   CuPc/F16CuPc/F16CoPc Au 5.1 2.1×10-7 2.4×10-7 欧姆接触   ZnPc/F16CuPc   Pt   5.65   1.2×10-7   1.2×10-7   欧姆接触   ZnPc/F16ZnPc   Pt   5.65   1.1×10-7   1.1×10-7   欧姆接触   CoPc/F16FePc   Pt   5.65   1.0×10-7   9.7×10-8   欧姆接触   CuPc/F16CuPc   Pt   5.65   2.1×10-7   2.5×10-7   欧姆接触   NiPc/F16ZnPc   Pt   5.65   8.0×10-8   8.1×10-8   欧姆接触   6T/DFH-6T   Pt   5.65   1.1×10-6   1.3×10-6   欧姆接触   CoPc/CuPc/F16CuPc Pt 5.65 1.4×10-7 1.5×10-7 欧姆接触   H2Pc/CuPc/F16CuPc Pt 5.65 1.3×10-7 1.4×10-7 欧姆接触 Table 2 The buffer layer cathode Cathode work function (eV) Conductivity (S/cm) (excluding buffer layer) Conductivity (S/cm) (including buffer layer) contact characteristics ZnPc/F 16 CuPc Ag 4.26 5.2× 10-10 1.6×10 -9 ohmic contact CuPc/F 16 CuPc Ag 4.26 2.7×10 -9 3.8×10 -8 ohmic contact PtPc/F 16 ZnPc Ag 4.26 4.1× 10-10 1.1×10 -9 ohmic contact 5T/F 16 CuPc Ag 4.26 3.6× 10-9 6.9× 10-9 ohmic contact 4T/DFH-6T Ag 4.26 8.9×10 -8 7.2×10 -7 ohmic contact BP2T/F 16 ZnPc Ag 4.26 1.3×10 -7 8.8×10 -7 ohmic contact NiPc/F 16 CoPc Ag 4.26 2.1×10 -9 5.8×10 -8 ohmic contact ZnPc/CuPc/F 16 CuPc Ag 4.26 4.2× 10-9 6.9×10 -8 ohmic contact 4T/5T/DFH-6T Ag 4.26 9.1×10 -8 8.0×10 -7 ohmic contact CuPc/F 16 CuPc/F 16 ZnPc Ag 4.26 6.2× 10-9 7.5×10 -8 ohmic contact ZnPc/F 16 CuPc Ta 4.25 2.1×10 -9 6.2× 10-9 ohmic contact CuPc/F 16 FePc Ta 4.25 1.0×10 -9 3.1×10 -9 ohmic contact H 2 Pc/F 16 FePc Ta 4.25 7.0×10 -10 1.5×10 -9 ohmic contact NiPc/CuPc/ Ta 4.25 6.8× 10-9 9.1×10 -9 ohmic contact F 16 CuPc ZnPc/F 16 CuPc Cr 4.5 2.9×10 -8 8.4×10 -8 ohmic contact CoPc/F 16 ZnPc Cr 4.5 1.1×10 -8 7.3×10 -8 ohmic contact 4T/DFH-6T Cr 4.5 9.1×10 -8 8.7×10 -7 ohmic contact ZnPc/F 16 CuPc Mo 4.6 2.8×10 -8 9.1×10 -8 ohmic contact PtPc/F 16 CuPc Mo 4.6 3.3×10 -8 1.3×10 -7 ohmic contact 5T/DFH-6T Mo 4.6 5.3×10 -7 7.7×10 -6 ohmic contact ZnPc/F 16 CuPc Cu 4.65 5.3×10 -8 1.3×10 -7 ohmic contact H2Pc/F 16 ZnPc Cu 4.65 4.1×10 -8 8.6×10 -8 ohmic contact CuPc/F 16 FePc Cu 4.65 3.0×10 -8 7.5×10 -8 ohmic contact CoPc/F 16 CuPc Cu 4.65 4.9×10 -8 1.3×10 -7 ohmic contact BP2T/F 16 CuPc Cu 4.65 7.5×10 -8 3.1×10 -7 ohmic contact NiPc/CuPc/F 16 ZnPc Cu 4.65 4.5×10 -8 8.1×10 -8 ohmic contact CoPc/ZnPc/F 16 ZnPc Cu 4.65 6.2×10 -8 9.8×10 -8 ohmic contact ZnPc/F 16 ZnPc/DFH-6T Cu 4.65 8.5×10 -7 9.4×10 -6 ohmic contact ZnPc/F 16 CuPc Au 5.1 1.0×10 -7 1.1×10 -7 ohmic contact CuPc/F 16 CuPc Au 5.1 1.2×10 -7 1.4×10 -7 ohmic contact CoPc/F 16 CoPc Au 5.1 9.4×10 -8 1.1×10 -7 ohmic contact CuPc/F 16 ZnPc Au 5.1 1.1×10 -7 1.1×10 -7 ohmic contact 6T/F 16 CuPc Au 5.1 2.9×10 -7 3.1×10 -7 ohmic contact 6T/F 16 ZnPc Au 5.1 2.8×10 -7 3.3×10 -7 ohmic contact 6T/DFH-6T Au 5.1 8.2×10 -7 9.2×10 -7 ohmic contact BP2T/F 16 CuPc Au 5.1 2.2×10 -7 2.5×10 -7 ohmic contact 6T/CuPc/F 16 CuPc Au 5.1 2.6×10 -7 3.1×10 -7 ohmic contact CoPc/CuPc/F 16 CuPc Au 5.1 2.0×10 -7 2.2×10 -7 ohmic contact CuPc/F 16 CuPc/F 16 CoPc Au 5.1 2.1×10 -7 2.4×10 -7 ohmic contact ZnPc/F 16 CuPc Pt 5.65 1.2×10 -7 1.2×10 -7 ohmic contact ZnPc/F 16 ZnPc Pt 5.65 1.1×10 -7 1.1×10 -7 ohmic contact CoPc/F 16 FePc Pt 5.65 1.0×10 -7 9.7×10 -8 ohmic contact CuPc/F 16 CuPc Pt 5.65 2.1×10 -7 2.5×10 -7 ohmic contact NiPc/F 16 ZnPc Pt 5.65 8.0×10 -8 8.1×10 -8 ohmic contact 6T/DFH-6T Pt 5.65 1.1×10 -6 1.3×10 -6 ohmic contact CoPc/CuPc/F 16 CuPc Pt 5.65 1.4×10 -7 1.5×10 -7 ohmic contact H 2 Pc/CuPc/F 16 CuPc Pt 5.65 1.3×10 -7 1.4×10 -7 ohmic contact

图1c表现了图1a、图1b所示的两种器件结构的电流-电压曲线。对于图1a所示的器件结构,采用ITO作为电极2,作为阳极,酞菁锌作为有机半导体活性层3,酞菁锌和氟代酞菁铜构成缓冲层4,电极5为银电极。对于图1b所示的器件结构,采用ITO作为电极2,有机半导体活性层3为酞菁锌,电极4为银电极,作为阴极。电流随电压的增加而线性增加,表明其接触为欧姆接触。在暗态情况下,含有缓冲层的器件电导率明显大于不含缓冲层的器件电导率。在光照情况下,含有缓冲层器件的电流-电压曲线几乎与暗态情况下的电流-电压曲线重合,表明其对光照并不敏感。对光照的不敏感性使其适合使用在有机光伏器件中。Fig. 1c shows the current-voltage curves of the two device structures shown in Fig. 1a and Fig. 1b. For the device structure shown in Figure 1a, ITO is used as the electrode 2, as the anode, zinc phthalocyanine as the organic semiconductor active layer 3, zinc phthalocyanine and copper fluorophthalocyanine constitute the buffer layer 4, and the electrode 5 is a silver electrode. For the device structure shown in Figure 1b, ITO is used as the electrode 2, the organic semiconductor active layer 3 is zinc phthalocyanine, and the electrode 4 is a silver electrode as the cathode. The current increases linearly with voltage, indicating that the contacts are ohmic. In the dark state, the conductivity of the device containing the buffer layer is significantly higher than that of the device without the buffer layer. Under the condition of light, the current-voltage curve of the device containing the buffer layer almost coincides with the current-voltage curve of the dark state, indicating that it is not sensitive to light. The insensitivity to light makes it suitable for use in organic photovoltaic devices.

实施例2:Example 2:

所用酞菁铜(CuPc)和氟代酞菁铜(F16CuPc)是商业产品,经过升华纯化后使用。Copper phthalocyanine (CuPc) and fluorocopper phthalocyanine (F 16 CuPc) used are commercial products, which are used after sublimation purification.

含有有机异质结的电接触材料作为缓冲层的有机场效应晶体管器件结构见图2a。在7059玻璃衬底1上用射频磁控溅射方法镀上一层Ta金属膜,溅射的条件为:本底真空2×10-3Pa,Ar气气压1Pa,射频功率500W,并光刻成栅极2。在栅极2上面用直流磁控溅射方法连续溅射一层300纳米的Ta2O5反应溅射:本底真空2×10-3Pa,O2气压0.9Pa,直流功率500W,作为绝缘层3。然后采用分子气相沉积方法在绝缘层3上沉积厚度约30纳米的酞菁铜,真空度为10-4帕,形成有机半导体活性层4;在有机半导体活性层4上通过掩模版连续沉积厚度约2纳米的氟代酞菁铜薄膜形成有机异质结互穿网络结构,沉积方法和条件与上述相同,形成含有有机异质结的电接触材料所构成的缓冲层5;最后采用真空热蒸镀的方法在缓冲层5上沉积60纳米Au并形成源漏电极6,热蒸镀时的真空为10-4帕。The device structure of an organic field effect transistor containing an electrical contact material of an organic heterojunction as a buffer layer is shown in Figure 2a. A layer of Ta metal film was coated on the 7059 glass substrate 1 by radio frequency magnetron sputtering method, the sputtering conditions were: background vacuum 2×10 -3 Pa, Ar gas pressure 1Pa, radio frequency power 500W, into grid 2. Continuously sputter a layer of 300nm Ta 2 O 5 on the gate 2 by DC magnetron sputtering method Reactive sputtering: background vacuum 2×10 -3 Pa, O 2 pressure 0.9Pa, DC power 500W, as insulation Layer 3. Then adopt the molecular vapor deposition method to deposit copper phthalocyanine with a thickness of about 30 nanometers on the insulating layer 3, and the vacuum degree is 10 -4 Pa to form the organic semiconductor active layer 4; 2nm copper fluorinated phthalocyanine thin film forms an organic heterojunction interpenetrating network structure, the deposition method and conditions are the same as above, and a buffer layer 5 composed of an electrical contact material containing an organic heterojunction is formed; finally vacuum thermal evaporation is used 60nm Au was deposited on the buffer layer 5 and the source-drain electrodes 6 were formed using the method described above, and the vacuum during thermal evaporation was 10 -4 Pa.

采用含有有机异质结的电接触材料作为缓冲层的有机场效应晶体管和不含缓冲层的晶体管输出特性曲线见图2b,其中(A)环内的两条曲线为不含缓冲层的器件,(B)环内的两条曲线为含有缓冲层的器件。在低的漏电压下,电流表现为线性增长。当栅源电压分别(VG)在30伏和50伏时,比较两个曲线可以看见在10伏的漏源电压(VD)范围内采用含有有机异质结的电接触材料作为缓冲层的晶体管显示出更高的漏源电流(ID)。同时从图2b中也能看出含有有机异质结的电接触材料作为缓冲层的晶体管的电阻被显著的降低。相应的有机场效应晶体管器件的转移特性曲线见图2c,ID显著的依赖于VG。采用含有有机异质结的电接触材料作为缓冲层的有机场效应晶体管器件的电学参数是根据图2c所示曲线计算出的。其饱和区的空穴载流子迁移率为0.014cm2V-1s-1,开关电流比为4×103The output characteristic curves of organic field effect transistors using electrical contact materials containing organic heterojunctions as buffer layers and transistors without buffer layers are shown in Figure 2b, where the two curves in (A) ring are devices without buffer layers, (B) The two curves inside the circle are devices with a buffer layer. At low drain voltages, the current increases linearly. When the gate-source voltage (V G ) is 30 volts and 50 volts, comparing the two curves, it can be seen that the use of an electrical contact material containing an organic heterojunction as a buffer layer in the range of a drain-source voltage (V D ) of 10 volts Transistors exhibit higher drain-source current (I D ). At the same time, it can also be seen from FIG. 2b that the resistance of the transistor containing the electrical contact material of the organic heterojunction as the buffer layer is significantly reduced. The transfer characteristic curve of the corresponding organic field effect transistor device is shown in Fig. 2c, and ID depends significantly on V G . The electrical parameters of the organic field effect transistor device using the electrical contact material containing the organic heterojunction as the buffer layer are calculated according to the curve shown in Fig. 2c. The hole carrier mobility in the saturation region is 0.014cm 2 V -1 s -1 , and the on-off current ratio is 4×10 3 .

实施例3:Example 3:

所用氟代酞菁铜(F16CuPc),酞菁锌(ZnPc)和富勒烯(C60)是商业产品,经过升华纯化后使用。导电薄膜ITO做为电极2覆盖在玻璃基板1上,含有导电薄膜的玻璃整体是商业产品。The fluorocopper phthalocyanine (F 16 CuPc), zinc phthalocyanine (ZnPc) and fullerene (C 60 ) used are commercial products, which are used after purification by sublimation. The conductive film ITO is used as the electrode 2 to cover the glass substrate 1, and the whole glass containing the conductive film is a commercial product.

含有有机异质结的电接触材料作为缓冲层的有机光伏器件的结构见图3a。所有有机层的制备均采用真空分子气相沉积方法,其真空度为10-5帕。首先,在ITO电极2上制备厚度为4纳米的缓冲层3,缓冲层3由有机半导体材料氟代酞菁铜和酞菁锌构成,先采用真空分子气相沉积方法沉积氟代酞菁铜,基底温度为150摄氏度,厚度为2纳米,形成分立的晶粒,然后再采用与上述同样的方法和条件沉积酞菁锌,厚度为2纳米,它们共同形成有机异质结互穿网络结构,构成含有有机异质结的电接触材料,作为缓冲层3。然后,在缓冲层3上采用与上述同样的方法和条件沉积酞菁锌形成有机半导体层活性层4。在有机半导体活性层4上采用与上述同样的方法和条件沉积C60形成有机半导体活性层5。最后,在有机半导体活性层5上,采用真空热蒸镀的方法沉积金属电极铝形成电极6,真空度为10-4帕。The structure of an organic photovoltaic device containing an electrical contact material of an organic heterojunction as a buffer layer is shown in Figure 3a. All organic layers are prepared by vacuum molecular vapor deposition method, and the vacuum degree is 10 -5 Pa. First, a buffer layer 3 with a thickness of 4 nanometers is prepared on the ITO electrode 2. The buffer layer 3 is composed of organic semiconductor materials fluorophthalocyanine copper and phthalocyanine zinc. First, the vacuum molecular vapor deposition method is used to deposit fluorophthalocyanine copper. The temperature is 150 degrees Celsius, the thickness is 2 nanometers, and discrete crystal grains are formed, and then the zinc phthalocyanine is deposited by the same method and conditions as above, and the thickness is 2 nanometers. Together, they form an organic heterojunction interpenetrating network structure, forming a structure containing The electrical contact material of the organic heterojunction serves as the buffer layer 3 . Then, zinc phthalocyanine was deposited on the buffer layer 3 using the same method and conditions as above to form the active layer 4 of the organic semiconductor layer. The organic semiconductor active layer 5 is formed by depositing C60 on the organic semiconductor active layer 4 using the same method and conditions as above. Finally, on the organic semiconductor active layer 5, the metal electrode aluminum is deposited by vacuum thermal evaporation to form the electrode 6, and the vacuum degree is 10 −4 Pa.

采用异质结有机半导体作为缓冲层和不含缓冲层的有机光伏器件在暗态和光照条件下的电流-电压曲线见图3b。光照条件为模拟太阳光AM1.5,光照强度为100毫瓦每平方厘米。含有缓冲层的光伏器件在暗态无光照条件下,负向偏压时电流很小,而在正向电压下电流随电压的增加急剧增加,表现出很好的二极管整流特性,见图3b中的曲线(c)。在光照条件下,器件表现出光伏特性,见图3b中的曲线(d)。图3b中的曲线(a)和(b)为不含缓冲层的有机光伏器件在暗态和光照条件下的电流-电压曲线。含有缓冲层和不含缓冲层的有机光伏器件的性能参数见表2。The current-voltage curves of organic photovoltaic devices using heterojunction organic semiconductors as buffer layers and without buffer layers under dark and light conditions are shown in Figure 3b. The light conditions were simulated sunlight AM1.5, and the light intensity was 100 milliwatts per square centimeter. Under the condition of dark state and no light, the photovoltaic device with buffer layer has a small current when it is negatively biased, but the current increases sharply with the increase of voltage under forward voltage, showing good diode rectification characteristics, as shown in Figure 3b curve (c). Under light conditions, the device exhibits photovoltaic properties, see curve (d) in Figure 3b. Curves (a) and (b) in FIG. 3b are the current-voltage curves of the organic photovoltaic device without buffer layer under dark and light conditions. The performance parameters of organic photovoltaic devices with buffer layer and without buffer layer are shown in Table 2.

表2含有缓冲层和不含缓冲层的有机光伏器件的性能参数   性能参数   不含缓冲层   含有缓冲层   Voc(伏)   0.44   0.42   Isc(毫安每平方厘米)   1.87   2.22   FF   0.31   0.38   η(%)   0.25   0.35   Rs(欧姆每平方厘米)   185   45   Rsh(欧姆每平方厘米)   500   667 Table 2 contains the performance parameters of buffer layer and organic photovoltaic device without buffer layer performance parameters Without buffer layer Contains buffer layer V oc (volt) 0.44 0.42 I sc (milliamps per square centimeter) 1.87 2.22 FF 0.31 0.38 η(%) 0.25 0.35 R s (ohms per square centimeter) 185 45 R sh (ohms per square centimeter) 500 667

本发明不限于上述实施例。一般来说,本专利所公开的异质结有机半导体缓冲层可以用于其他有机半导体器件中,是形成二维和三维的集成器件中的器件。这些集成器件可能应用在柔性集成电路、有源矩阵显示和光伏电池方面。使用基于本发明的电子器件可以实现低温加工。The present invention is not limited to the above-described embodiments. Generally speaking, the heterojunction organic semiconductor buffer layer disclosed in this patent can be used in other organic semiconductor devices, and is a device in two-dimensional and three-dimensional integrated devices. These integrated devices may be used in flexible integrated circuits, active matrix displays and photovoltaic cells. Low temperature processing can be achieved using electronic devices based on the present invention.

Claims (8)

1, a kind of contact material that contains organic heterojunction is characterized in that the described contact material that contains organic heterojunction is made up of electron type and cavity type organic semiconductor and the heterojunction that constitutes thereof.
2,, it is characterized in that described electron type and cavity type organic semiconductor belong to same analog derivative by the described contact material that contains organic heterojunction of claim 1.
3, by the described contact material that contains organic heterojunction of claim 2, it is characterized in that described P-type semiconductor layer is made of one of CuPc, phthalocyanine nickel, Phthalocyanine Zinc, phthalocyanine cobalt, phthalocyanine platinum, free base phthalocyanine or two kinds of materials respectively at least, the N-type semiconductor layer is made of one of fluoro CuPc, fluoro Phthalocyanine Zinc, fluoro FePC and fluoro phthalocyanine cobalt or two kinds of materials respectively at least.
4, by the described contact material that contains organic heterojunction of claim 2, it is characterized in that described P-type semiconductor layer is respectively by thiophene oligomers, polythiophene, two (biphenyl-4,4 ')-2, one of 2 '-two thiophene or at least two kinds of materials constitute, and the N-type semiconductor layer is made of the fluoro Uniformpoly thiophene.
5, by the described metal electrode of claim 1, it is characterized in that work content greater than 4.3 electron-volts, less than 5.7 electron-volts.
6, by the described metal electrode of claim 5, it is characterized in that a kind of or wherein two or more metal alloy among ITO, Al, Mg, Ag, Ta, Cr, Mo, Cu, Au, the Pt.
7, a kind of employing contains the organic field effect tube of the contact material of organic heterojunction as resilient coating, comprise, substrate (1), the gate electrode (2) that contacts with substrate (1), the insulated gate (3) that contacts with gate electrode (2), the organic semiconductor active layer (4) that contacts with insulated gate (3), the resilient coating that contact material constituted (5) that contains organic heterojunction that contacts with organic semiconductor active layer (4), the source/drain electrode (6) that contacts with resilient coating (5).
8, a kind of employing contains the organic film photovoltaic cell of the contact material of organic heterojunction as resilient coating, comprise, substrate (1), the transparency electrode (2) that contacts with substrate (1), the resilient coating that contact material constituted (3) that contains organic heterojunction that contacts with transparency electrode (2), the organic semiconductor active layer (4) that contacts with resilient coating (3), the organic semiconductor active layer (5) that contacts with organic semiconductor active layer (4), the metal electrode (6) that contacts with organic semiconductor active layer (5).
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CN101842917B (en) * 2007-10-31 2012-10-03 巴斯夫欧洲公司 Use of halogenated phthalocyanines
US8871628B2 (en) * 2009-01-21 2014-10-28 Veeco Ald Inc. Electrode structure, device comprising the same and method for forming electrode structure
US8963135B2 (en) * 2012-11-30 2015-02-24 Intel Corporation Integrated circuits and systems and methods for producing the same
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Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120536A (en) * 1991-02-04 1994-04-28 Ricoh Co Ltd Photovoltaic element
JP3224829B2 (en) * 1991-08-15 2001-11-05 株式会社東芝 Organic field effect device
US6278127B1 (en) * 1994-12-09 2001-08-21 Agere Systems Guardian Corp. Article comprising an organic thin film transistor adapted for biasing to form a N-type or a P-type transistor
TW293172B (en) * 1994-12-09 1996-12-11 At & T Corp
WO1997020355A1 (en) * 1995-11-28 1997-06-05 International Business Machines Corporation Organic/inorganic alloys used to improve organic electroluminescent devices
EP1051762A1 (en) * 1998-02-02 2000-11-15 Uniax Corporation X-y addressable electric microswitch arrays and sensor matrices employing them
JP2001007366A (en) * 1999-06-25 2001-01-12 Sony Corp Charge transfer heterojunction structure and method of manufacturing the same
GB2397944B (en) * 2002-01-29 2004-12-22 Univ Sheffield Hallam Thin film photovoltaic devices and methods of making the same
JP4012957B2 (en) * 2002-06-07 2007-11-28 本田技研工業株式会社 Method for producing compound thin film solar cell
CN100364108C (en) * 2002-08-28 2008-01-23 中国科学院长春应用化学研究所 Sandwich type field effect transistor containing organic semiconductor and manufacturing method
JP2004103905A (en) * 2002-09-11 2004-04-02 Pioneer Electronic Corp Organic semiconductor device
CN1282260C (en) * 2003-01-30 2006-10-25 中国科学院长春应用化学研究所 Heterojunction-type organic semiconductor field effect transistor containing grid insulating layer and its manufacturing method
US6995445B2 (en) * 2003-03-14 2006-02-07 The Trustees Of Princeton University Thin film organic position sensitive detectors
JP4243237B2 (en) * 2003-11-10 2009-03-25 淳二 城戸 Organic element, organic EL element, organic solar cell, organic FET structure, and organic element manufacturing method
US8357849B2 (en) * 2004-09-22 2013-01-22 The Trustees Of Princeton University Organic photosensitive devices

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