CN1529329A - Polymer PTC thermistor and manufacturing method thereof - Google Patents
Polymer PTC thermistor and manufacturing method thereof Download PDFInfo
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- CN1529329A CN1529329A CNA2003101078081A CN200310107808A CN1529329A CN 1529329 A CN1529329 A CN 1529329A CN A2003101078081 A CNA2003101078081 A CN A2003101078081A CN 200310107808 A CN200310107808 A CN 200310107808A CN 1529329 A CN1529329 A CN 1529329A
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- high molecular
- temperature coefficient
- positive temperature
- thermal sensitive
- tinsel
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 229920000642 polymer Polymers 0.000 title claims abstract description 11
- 239000011162 core material Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 14
- 239000006229 carbon black Substances 0.000 claims abstract description 12
- 239000002131 composite material Substances 0.000 claims abstract description 12
- 239000006057 Non-nutritive feed additive Substances 0.000 claims abstract description 6
- 239000011256 inorganic filler Substances 0.000 claims abstract description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 6
- 238000000605 extraction Methods 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 239000002003 electrode paste Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 238000005530 etching Methods 0.000 abstract description 5
- 238000004132 cross linking Methods 0.000 abstract description 3
- 239000000470 constituent Substances 0.000 abstract 1
- 238000005520 cutting process Methods 0.000 abstract 1
- 230000005251 gamma ray Effects 0.000 abstract 1
- 238000003801 milling Methods 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 239000011889 copper foil Substances 0.000 description 11
- 235000019241 carbon black Nutrition 0.000 description 10
- 239000000306 component Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 230000011218 segmentation Effects 0.000 description 5
- 239000007822 coupling agent Substances 0.000 description 4
- 229920001903 high density polyethylene Polymers 0.000 description 4
- 239000004700 high-density polyethylene Substances 0.000 description 4
- -1 polyethylene Polymers 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 2
- VFBJXXJYHWLXRM-UHFFFAOYSA-N 2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylsulfanyl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCSCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 VFBJXXJYHWLXRM-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000005041 Mylar™ Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 230000003078 antioxidant effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000002530 phenolic antioxidant Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000001311 chemical methods and process Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
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Abstract
High molecular posistor comprises high molecular PTC core material and metal foil electrode. The said metal foil electrodes are adhibited on same face of core material. Method for manufacturing posistor includes following steps: (1) milling each constituent of core material including high polymer, carbon black, inorganic filler and processing aid in 100-200deg.C; (2) composite sheet with metal foil being adhibited on its one face is pressed out; (3) irradiation crosslinking the composite sheet by gamma ray (Co60) or electrons; cutting the sheet to small pieces in certain size; etching out parting line with designed shape and width on metal foil electrode so as to divide up the said metal foil electrode into two not connected parts. Thus, high molecular posistor is prepared.
Description
Technical field
High molecular positive temperature coefficient thermal sensitive resistor of the present invention and manufacture method thereof, relating to a kind of is the high molecular PTC thermistor and the manufacture method thereof of primary raw material with conducting high polymers thing composite material.
Background technology
The crystallization of filled conductive particle or partially crystallizable polymer composite can show PTC (positive temperature coefficient positive temperature coefficient) phenomenon.That is to say that in certain temperature range, the resistivity of self can increase with the rising of temperature.These class conduction private savings with ptc characteristics are made thermistor, are applied to the overcurrent protection of circuit.High molecular positive temperature coefficient thermal sensitive resistor has been widely applied in the various fields such as communication, computer, automobile, Industry Control, household electrical appliance at present.
Usually the core of high molecular PTC thermistor is so-called " sandwich " structure, i.e. double layer of metal paillon foil electrode holder one deck high molecular PTC material chip.Since this " sandwich " structures shape its have certain electric capacity, therefore, easily produce the high-frequency signal distortion when in HF link, using.
Summary of the invention
Purpose of the present invention is exactly high molecular positive temperature coefficient thermal sensitive resistor and the manufacturing process thereof that provides a kind of suitable HF link overcurrent protection to use for the defective that overcomes above-mentioned technology existence.
The object of the invention is achieved through the following technical solutions: a kind of high molecular positive temperature coefficient thermal sensitive resistor, by the chip that high molecular PTC core and tinsel electrode constitute, wherein, the tinsel electrode paste is overlying on the same side of described core.
On the technique scheme basis, on tinsel electrode outer surface, weld extraction electrode.
On the technique scheme basis, at chip outside coated insulation layer.
The manufacture method of high molecular positive temperature coefficient thermal sensitive resistor of the present invention has following step: the first step, and respectively that each component high molecular polymer of core, carbon black, inorganic filler and processing aid is mixing under 100～200 ℃ of temperature; In second step, make the composite sheet that one side pastes tinsel with drawing method; The 3rd step is again with this composite sheet gamma-rays (Co
60) or electron irradiation crosslinked, then sheet material is cut into the small pieces of certain size, be covered on etch on the tinsel electrode of core have certain geometrical shape, the cut-off rule of certain width, with above-mentioned tinsel dividing electrodes two parts, promptly make high molecular positive temperature coefficient thermal sensitive resistor for not being connected.
A kind of high molecular positive temperature coefficient thermal sensitive resistor and manufacture method thereof, this high molecular positive temperature coefficient thermal sensitive resistor, its chip is made of high molecular PTC core and the tinsel electrode that is covered on above-mentioned core same side, chip can be directly uses as high molecular positive temperature coefficient thermal sensitive resistor, also can weld extraction electrode and coated insulation layer outside on tinsel electrode outer surface.
Described core material is mixed by high molecular polymer, carbon black, inorganic filler and other processing aid.
High molecular polymer can be the blend of a kind of polymer or two or more polymer in the above-mentioned core material component, mainly contains: the copolymer of one or more materials in polyethylene, polypropylene, Kynoar, the poly-trichloroethylene.
Processing aid is carbon black dispersant, antioxidant, crosslinking accelerator, coupling agent in the above-mentioned core material component, wherein the carbon black dispersion can be paraffin, oxidic polyethylene, antioxidant can be phenols or aminated compounds, as phenolic antioxidant ANOX70, crosslinking accelerator can be the polyfunctional group unsaturated compound, as triallyl isocyanurate (TAIC), coupling agent can be silane or titanate ester organic compound, as titanium coupling agent TCF.
Carbon black is meant various conductive carbon blacks, colour black and reinforcement carbon black, preferably conductive carbon black in the above-mentioned core material component.
Inorganic filler is meant magnesium hydroxide, aluminium hydroxide, magnesium oxide, aluminium oxide, calcium carbonate, silicon dioxide in the above-mentioned core material component.
Compared with prior art, therefore tinsel electrode of the present invention has reduced product electric capacity from structure in the core same side, is fit to the high molecular positive temperature coefficient thermal sensitive resistor that the HF link overcurrent protection is used thereby make.
Description of drawings:
Accompanying drawing 1 high molecular positive temperature coefficient thermal sensitive resistor structure chart.Nickel plating Copper Foil 2 is pressed on high molecular PTC core 3.Paste nickel-clad copper foil electrode face correspondence in composite sheet and etch away nickel plating Copper Foil formation slot segmentation 1.
Accompanying drawing 2 high molecular positive temperature coefficient thermal sensitive resistor vertical views.The nickel-clad copper foil electrode forms slot segmentation 1 after etching.
Embodiment
A kind of high molecular positive temperature coefficient thermal sensitive resistor, by the chip 2 that high molecular PTC core 1 and tinsel electrode constitute, wherein, the tinsel electrode paste is overlying on the same side of described core.Shown in accompanying drawing 1 high molecular positive temperature coefficient thermal sensitive resistor structure chart and Fig. 2 high molecular positive temperature coefficient thermal sensitive resistor vertical view, nickel-clad copper foil electrode 2 is pressed on the high molecular PTC core 3, paste nickel-clad copper foil electrode face correspondence in composite sheet and etch away nickel plating Copper Foil formation slot segmentation 1, the nickel-clad copper foil electrode forms slot segmentation 1 after etching.
A kind of manufacture method of high molecular positive temperature coefficient thermal sensitive resistor, respectively that core component high molecular polymer, carbon black, inorganic filler and processing aid is mixing under 100～200 ℃ of temperature, make the composite sheet that one side pastes tinsel with mould pressing method; Again with this composite sheet gamma-rays (Co
60) or electron irradiation crosslinked, then sheet material is cut into the small pieces of certain size, utilize chemistry or mechanical method, be covered on etch on the tinsel electrode of core have certain geometrical shape, the cut-off rule of certain width, with above-mentioned tinsel dividing electrodes two parts 21,22, can make high molecular positive temperature coefficient thermal sensitive resistor for not being connected.Also can be respectively in the tinsel electrode welding that above-mentioned two parts are not connected extraction electrode, and coated insulation layer outside.
Table 1 unit: g
| High density polyethylene (HDPE) | Carbon black | Magnesium hydroxide | Phenolic antioxidant ANOX70 | Titanium coupling agent TCF |
| ????345 | ????320 | ????160 | ????16 | ????8 |
Annotate: high density polyethylene (HDPE): the BHB5502 of Philips Petroleum Co.
Carbon black: the VULCAN 9A32 of Cabot Co.,Ltd
Each component in the table 1 is mixing even in banbury under 190 ℃ of temperature, through cooling, after pulverizing abrasive dust, obtain particle diameter 80 purpose powder, get above-mentioned powder 30 grams, it is clipped between one deck nickel plating Copper Foil and one deck mylar, be put in the pressing mold, pressure 5Mpa is pressed into area 200cm under 180 ℃ of conditions of temperature
2, thick 2.0mm sheet material mylar is taken off, and nickel plating Copper Foil and high molecular PTC core is bonded together.80 ℃ of heat treatments are after 16 hours, with gamma-rays (Co in vacuum drying oven
60) irradiation, dosage is 20Mrad, and then becomes the small pieces of 10mm*10mm size with the punch press punching out, uses the ferric trichloride etching solution at its electrode one side etching slot segmentation then, and (as shown in Figure 1) cuts apart groove width 1.5mm, and the degree of depth is removed the nickel plating Copper Foil just.Weld the zinc-plated circular copper wire of φ 0.6mm on its two electrode respectively, epoxy resin enclosed then, sub-positive temperature coefficient thermistor promptly secures satisfactory grades.
Gained high molecular positive temperature coefficient thermal sensitive resistor zero-power resistance 6-10 ohm is used for the adsl line overcurrent protection, for the not influence of circuit high frequency signals transmitted.
Claims (6)
1 one kinds of high molecular positive temperature coefficient thermal sensitive resistors, the chip by high molecular PTC core and tinsel electrode constitute is characterized in that: the tinsel electrode paste is overlying on the same side of described core.
2 high molecular positive temperature coefficient thermal sensitive resistors according to claim 1 is characterized in that welding extraction electrode on tinsel electrode outer surface
3 according to claim 1,2 described high molecular positive temperature coefficient thermal sensitive resistors, it is characterized in that at chip outside coated insulation layer.
The manufacture method of 4 high molecular positive temperature coefficient thermal sensitive resistors according to claim 1, the first step, respectively that each component high molecular polymer of core, carbon black, inorganic filler and processing aid is mixing under 100～200 ℃ of temperature; In second step, make the composite sheet that one side pastes tinsel with drawing method; The 3rd step is again with this composite sheet gamma-rays (Co
60) or electron irradiation crosslinked, then sheet material is cut into the small pieces of certain size, be covered on etch on the tinsel electrode of core have certain geometrical shape, the cut-off rule of certain width, with above-mentioned tinsel dividing electrodes two parts, promptly make high molecular positive temperature coefficient thermal sensitive resistor for not being connected.
The manufacture method of 5 high molecular positive temperature coefficient thermal sensitive resistors according to claim 4 is characterized in that welding extraction electrode on the tinsel electrode that above-mentioned two parts are not connected.
6 manufacture methods according to claim 4 or 5 described high molecular positive temperature coefficient thermal sensitive resistors is characterized in that at chip outside coated insulation layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101078081A CN1529329A (en) | 2003-10-01 | 2003-10-01 | Polymer PTC thermistor and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2003101078081A CN1529329A (en) | 2003-10-01 | 2003-10-01 | Polymer PTC thermistor and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1529329A true CN1529329A (en) | 2004-09-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2003101078081A Pending CN1529329A (en) | 2003-10-01 | 2003-10-01 | Polymer PTC thermistor and manufacturing method thereof |
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| Country | Link |
|---|---|
| CN (1) | CN1529329A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100426424C (en) * | 2004-12-21 | 2008-10-15 | 上海长园维安电子线路保护股份有限公司 | Method for manufacturing high-temp PTC thermosensitive resistor |
| CN102176358A (en) * | 2011-01-26 | 2011-09-07 | 上海长园维安电子线路保护股份有限公司 | Low-temperature rapid over-current protection (OCP) component and manufacturing method thereof |
| CN102511066A (en) * | 2009-09-29 | 2012-06-20 | 整合公司 | Positive temperature coefficient heating elements and their manufacturing |
| CN103594213A (en) * | 2012-08-14 | 2014-02-19 | 聚鼎科技股份有限公司 | overcurrent protection element |
| CN105280316A (en) * | 2015-09-26 | 2016-01-27 | 广东百圳君耀电子有限公司 | Components and manufacturing process of intelligent protection |
-
2003
- 2003-10-01 CN CNA2003101078081A patent/CN1529329A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100426424C (en) * | 2004-12-21 | 2008-10-15 | 上海长园维安电子线路保护股份有限公司 | Method for manufacturing high-temp PTC thermosensitive resistor |
| CN102511066A (en) * | 2009-09-29 | 2012-06-20 | 整合公司 | Positive temperature coefficient heating elements and their manufacturing |
| US20120175362A1 (en) * | 2009-09-29 | 2012-07-12 | Erik Mikkelsen | Positive Temperature Coefficient Heating Elements and Their Manufacturing |
| US9392645B2 (en) | 2009-09-29 | 2016-07-12 | Conflux Ab | Positive temperature coefficient heating elements and their manufacturing |
| CN102176358A (en) * | 2011-01-26 | 2011-09-07 | 上海长园维安电子线路保护股份有限公司 | Low-temperature rapid over-current protection (OCP) component and manufacturing method thereof |
| CN103594213A (en) * | 2012-08-14 | 2014-02-19 | 聚鼎科技股份有限公司 | overcurrent protection element |
| CN105280316A (en) * | 2015-09-26 | 2016-01-27 | 广东百圳君耀电子有限公司 | Components and manufacturing process of intelligent protection |
| CN105280316B (en) * | 2015-09-26 | 2018-05-11 | 广东百圳君耀电子有限公司 | Components and manufacturing process of intelligent protection |
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