CN1313555C - Aldehyde-free adhesives for artificial board - Google Patents
Aldehyde-free adhesives for artificial board Download PDFInfo
- Publication number
- CN1313555C CN1313555C CNB2004100140751A CN200410014075A CN1313555C CN 1313555 C CN1313555 C CN 1313555C CN B2004100140751 A CNB2004100140751 A CN B2004100140751A CN 200410014075 A CN200410014075 A CN 200410014075A CN 1313555 C CN1313555 C CN 1313555C
- Authority
- CN
- China
- Prior art keywords
- aldehyde
- deionized water
- wood
- cross
- acrylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000853 adhesive Substances 0.000 title abstract description 8
- 230000001070 adhesive effect Effects 0.000 title abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000008367 deionised water Substances 0.000 claims abstract description 18
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 18
- 239000003112 inhibitor Substances 0.000 claims abstract description 18
- 229920002521 macromolecule Polymers 0.000 claims abstract description 18
- 238000002360 preparation method Methods 0.000 claims abstract 2
- 239000004593 Epoxy Substances 0.000 claims description 23
- 239000004568 cement Substances 0.000 claims description 22
- 238000003756 stirring Methods 0.000 claims description 22
- QOSMNYMQXIVWKY-UHFFFAOYSA-N Propyl levulinate Chemical compound CCCOC(=O)CCC(C)=O QOSMNYMQXIVWKY-UHFFFAOYSA-N 0.000 claims description 18
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- 239000002023 wood Substances 0.000 claims description 17
- 238000006116 polymerization reaction Methods 0.000 claims description 15
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 14
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 14
- 239000003995 emulsifying agent Substances 0.000 claims description 13
- 239000000178 monomer Substances 0.000 claims description 13
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 12
- 229920001577 copolymer Polymers 0.000 claims description 12
- 239000000839 emulsion Substances 0.000 claims description 12
- 239000003999 initiator Substances 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 11
- 239000000945 filler Substances 0.000 claims description 11
- 235000019422 polyvinyl alcohol Nutrition 0.000 claims description 11
- HCJLVWUMMKIQIM-UHFFFAOYSA-M sodium;2,3,4,5,6-pentachlorophenolate Chemical group [Na+].[O-]C1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl HCJLVWUMMKIQIM-UHFFFAOYSA-M 0.000 claims description 11
- 239000004159 Potassium persulphate Substances 0.000 claims description 9
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical group [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims description 9
- 235000019394 potassium persulphate Nutrition 0.000 claims description 9
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 8
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 8
- 239000004141 Sodium laurylsulphate Substances 0.000 claims description 8
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 235000019333 sodium laurylsulphate Nutrition 0.000 claims description 8
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 7
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical group NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 7
- IVKNZCBNXPYYKL-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-[2-[2-[2-[4-(2,4,4-trimethylpentan-2-yl)phenoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethanol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO)C=C1 IVKNZCBNXPYYKL-UHFFFAOYSA-N 0.000 claims description 6
- 238000009835 boiling Methods 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 239000002612 dispersion medium Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000010992 reflux Methods 0.000 claims description 2
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims 4
- ACYXOHNDKRVKLH-UHFFFAOYSA-N 5-phenylpenta-2,4-dienenitrile prop-2-enoic acid Chemical compound OC(=O)C=C.N#CC=CC=CC1=CC=CC=C1 ACYXOHNDKRVKLH-UHFFFAOYSA-N 0.000 claims 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 27
- 239000003292 glue Substances 0.000 abstract description 14
- 229920001807 Urea-formaldehyde Polymers 0.000 abstract description 11
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000000463 material Substances 0.000 abstract description 3
- 239000003431 cross linking reagent Substances 0.000 abstract 1
- 150000001299 aldehydes Chemical class 0.000 description 12
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 9
- 239000002904 solvent Substances 0.000 description 8
- 238000007711 solidification Methods 0.000 description 6
- 230000008023 solidification Effects 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 150000002148 esters Chemical class 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- -1 phenol organic compound Chemical class 0.000 description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 4
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical class CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 3
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 3
- 229960001124 trientine Drugs 0.000 description 3
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical group NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical group C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical class [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- 239000004160 Ammonium persulphate Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000005639 Lauric acid Substances 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229940048053 acrylate Drugs 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
- 235000019395 ammonium persulphate Nutrition 0.000 description 2
- 239000012874 anionic emulsifier Substances 0.000 description 2
- QMKYBPDZANOJGF-UHFFFAOYSA-N benzene-1,3,5-tricarboxylic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 230000036541 health Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 239000012875 nonionic emulsifier Substances 0.000 description 2
- 239000012934 organic peroxide initiator Substances 0.000 description 2
- 150000002898 organic sulfur compounds Chemical class 0.000 description 2
- 230000033116 oxidation-reduction process Effects 0.000 description 2
- IZUPBVBPLAPZRR-UHFFFAOYSA-N pentachlorophenol Chemical compound OC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl IZUPBVBPLAPZRR-UHFFFAOYSA-N 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920001228 polyisocyanate Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 2
- 150000003606 tin compounds Chemical class 0.000 description 2
- PIILXFBHQILWPS-UHFFFAOYSA-N tributyltin Chemical compound CCCC[Sn](CCCC)CCCC PIILXFBHQILWPS-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- MEIRRNXMZYDVDW-MQQKCMAXSA-N (2E,4E)-2,4-hexadien-1-ol Chemical compound C\C=C\C=C\CO MEIRRNXMZYDVDW-MQQKCMAXSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- LDVVTQMJQSCDMK-UHFFFAOYSA-N 1,3-dihydroxypropan-2-yl formate Chemical compound OCC(CO)OC=O LDVVTQMJQSCDMK-UHFFFAOYSA-N 0.000 description 1
- FRASJONUBLZVQX-UHFFFAOYSA-N 1,4-naphthoquinone Chemical compound C1=CC=C2C(=O)C=CC(=O)C2=C1 FRASJONUBLZVQX-UHFFFAOYSA-N 0.000 description 1
- PQUXFUBNSYCQAL-UHFFFAOYSA-N 1-(2,3-difluorophenyl)ethanone Chemical group CC(=O)C1=CC=CC(F)=C1F PQUXFUBNSYCQAL-UHFFFAOYSA-N 0.000 description 1
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- ZMARGGQEAJXRFP-UHFFFAOYSA-N 1-hydroxypropan-2-yl 2-methylprop-2-enoate Chemical compound OCC(C)OC(=O)C(C)=C ZMARGGQEAJXRFP-UHFFFAOYSA-N 0.000 description 1
- LFSYUSUFCBOHGU-UHFFFAOYSA-N 1-isocyanato-2-[(4-isocyanatophenyl)methyl]benzene Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=CC=C1N=C=O LFSYUSUFCBOHGU-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- CCJAYIGMMRQRAO-UHFFFAOYSA-N 2-[4-[(2-hydroxyphenyl)methylideneamino]butyliminomethyl]phenol Chemical compound OC1=CC=CC=C1C=NCCCCN=CC1=CC=CC=C1O CCJAYIGMMRQRAO-UHFFFAOYSA-N 0.000 description 1
- QLIBJPGWWSHWBF-UHFFFAOYSA-N 2-aminoethyl methacrylate Chemical compound CC(=C)C(=O)OCCN QLIBJPGWWSHWBF-UHFFFAOYSA-N 0.000 description 1
- UGIJCMNGQCUTPI-UHFFFAOYSA-N 2-aminoethyl prop-2-enoate Chemical compound NCCOC(=O)C=C UGIJCMNGQCUTPI-UHFFFAOYSA-N 0.000 description 1
- SWZVJOLLQTWFCW-UHFFFAOYSA-N 2-chlorobenzene-1,3-diol Chemical compound OC1=CC=CC(O)=C1Cl SWZVJOLLQTWFCW-UHFFFAOYSA-N 0.000 description 1
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- MYCQSOCJLZBPAT-UHFFFAOYSA-N 2-methylprop-2-enoic acid;potassium Chemical compound [K].CC(=C)C(O)=O MYCQSOCJLZBPAT-UHFFFAOYSA-N 0.000 description 1
- VAPQAGMSICPBKJ-UHFFFAOYSA-N 2-nitroacridine Chemical compound C1=CC=CC2=CC3=CC([N+](=O)[O-])=CC=C3N=C21 VAPQAGMSICPBKJ-UHFFFAOYSA-N 0.000 description 1
- GIUBHMDTOCBOPA-UHFFFAOYSA-N 3h-1,3-benzothiazole-2-thione;zinc Chemical compound [Zn].C1=CC=C2SC(S)=NC2=C1 GIUBHMDTOCBOPA-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- NQSLZEHVGKWKAY-UHFFFAOYSA-N 6-methylheptyl 2-methylprop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C(C)=C NQSLZEHVGKWKAY-UHFFFAOYSA-N 0.000 description 1
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical group CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- LQPUCRPHHIWEMI-UHFFFAOYSA-N C(CCCCCCCCCCC)C(C#N)(C)N.[Na] Chemical compound C(CCCCCCCCCCC)C(C#N)(C)N.[Na] LQPUCRPHHIWEMI-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- IEPRKVQEAMIZSS-UHFFFAOYSA-N Di-Et ester-Fumaric acid Natural products CCOC(=O)C=CC(=O)OCC IEPRKVQEAMIZSS-UHFFFAOYSA-N 0.000 description 1
- IEPRKVQEAMIZSS-WAYWQWQTSA-N Diethyl maleate Chemical compound CCOC(=O)\C=C/C(=O)OCC IEPRKVQEAMIZSS-WAYWQWQTSA-N 0.000 description 1
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 229930091371 Fructose Natural products 0.000 description 1
- 239000005715 Fructose Substances 0.000 description 1
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 description 1
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical group C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- FEWJPZIEWOKRBE-JCYAYHJZSA-L L-tartrate(2-) Chemical compound [O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O FEWJPZIEWOKRBE-JCYAYHJZSA-L 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- KWIUHFFTVRNATP-UHFFFAOYSA-O N,N,N-trimethylglycinium Chemical compound C[N+](C)(C)CC(O)=O KWIUHFFTVRNATP-UHFFFAOYSA-O 0.000 description 1
- CMEWLCATCRTSGF-UHFFFAOYSA-N N,N-dimethyl-4-nitrosoaniline Chemical compound CN(C)C1=CC=C(N=O)C=C1 CMEWLCATCRTSGF-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 240000005373 Panax quinquefolius Species 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- VBIIFPGSPJYLRR-UHFFFAOYSA-M Stearyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C VBIIFPGSPJYLRR-UHFFFAOYSA-M 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical group CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 239000005870 Ziram Substances 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- WPKYZIPODULRBM-UHFFFAOYSA-N azane;prop-2-enoic acid Chemical compound N.OC(=O)C=C WPKYZIPODULRBM-UHFFFAOYSA-N 0.000 description 1
- DZGUJOWBVDZNNF-UHFFFAOYSA-N azanium;2-methylprop-2-enoate Chemical compound [NH4+].CC(=C)C([O-])=O DZGUJOWBVDZNNF-UHFFFAOYSA-N 0.000 description 1
- JBIROUFYLSSYDX-UHFFFAOYSA-M benzododecinium chloride Chemical compound [Cl-].CCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 JBIROUFYLSSYDX-UHFFFAOYSA-M 0.000 description 1
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 1
- 229960003237 betaine Drugs 0.000 description 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 description 1
- NEPKLUNSRVEBIX-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,4-dicarboxylate Chemical compound C=1C=C(C(=O)OCC2OC2)C=CC=1C(=O)OCC1CO1 NEPKLUNSRVEBIX-UHFFFAOYSA-N 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- QVYARBLCAHCSFJ-UHFFFAOYSA-N butane-1,1-diamine Chemical compound CCCC(N)N QVYARBLCAHCSFJ-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- QDYLMAYUEZBUFO-UHFFFAOYSA-N cetalkonium chloride Chemical compound CCCCCCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 QDYLMAYUEZBUFO-UHFFFAOYSA-N 0.000 description 1
- 229960000228 cetalkonium chloride Drugs 0.000 description 1
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- CRQQGFGUEAVUIL-UHFFFAOYSA-N chlorothalonil Chemical compound ClC1=C(Cl)C(C#N)=C(Cl)C(C#N)=C1Cl CRQQGFGUEAVUIL-UHFFFAOYSA-N 0.000 description 1
- 229940120693 copper naphthenate Drugs 0.000 description 1
- LABRFZDGWLJDJS-UHFFFAOYSA-N copper;2,3,4,5,6-pentachlorophenol Chemical compound [Cu].OC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl LABRFZDGWLJDJS-UHFFFAOYSA-N 0.000 description 1
- SEVNKWFHTNVOLD-UHFFFAOYSA-L copper;3-(4-ethylcyclohexyl)propanoate;3-(3-ethylcyclopentyl)propanoate Chemical compound [Cu+2].CCC1CCC(CCC([O-])=O)C1.CCC1CCC(CCC([O-])=O)CC1 SEVNKWFHTNVOLD-UHFFFAOYSA-L 0.000 description 1
- SPTHWAJJMLCAQF-UHFFFAOYSA-M ctk4f8481 Chemical compound [O-]O.CC(C)C1=CC=CC=C1C(C)C SPTHWAJJMLCAQF-UHFFFAOYSA-M 0.000 description 1
- YQHLDYVWEZKEOX-UHFFFAOYSA-N cumene hydroperoxide Chemical compound OOC(C)(C)C1=CC=CC=C1 YQHLDYVWEZKEOX-UHFFFAOYSA-N 0.000 description 1
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- JBSLOWBPDRZSMB-FPLPWBNLSA-N dibutyl (z)-but-2-enedioate Chemical compound CCCCOC(=O)\C=C/C(=O)OCCCC JBSLOWBPDRZSMB-FPLPWBNLSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- ULEHTWQQRCPTGU-UHFFFAOYSA-N dodecanoic acid;2,3,4,5,6-pentachlorophenol Chemical compound OC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl.CCCCCCCCCCCC(O)=O ULEHTWQQRCPTGU-UHFFFAOYSA-N 0.000 description 1
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 description 1
- DDXLVDQZPFLQMZ-UHFFFAOYSA-M dodecyl(trimethyl)azanium;chloride Chemical group [Cl-].CCCCCCCCCCCC[N+](C)(C)C DDXLVDQZPFLQMZ-UHFFFAOYSA-M 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- HCPOCMMGKBZWSJ-UHFFFAOYSA-N ethyl 3-hydrazinyl-3-oxopropanoate Chemical compound CCOC(=O)CC(=O)NN HCPOCMMGKBZWSJ-UHFFFAOYSA-N 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- WHDGWKAJBYRJJL-UHFFFAOYSA-K ferbam Chemical compound [Fe+3].CN(C)C([S-])=S.CN(C)C([S-])=S.CN(C)C([S-])=S WHDGWKAJBYRJJL-UHFFFAOYSA-K 0.000 description 1
- 239000011790 ferrous sulphate Substances 0.000 description 1
- 235000003891 ferrous sulphate Nutrition 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000008103 glucose Substances 0.000 description 1
- SYECJBOWSGTPLU-UHFFFAOYSA-N hexane-1,1-diamine Chemical compound CCCCCC(N)N SYECJBOWSGTPLU-UHFFFAOYSA-N 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 238000007037 hydroformylation reaction Methods 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical group [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 230000004630 mental health Effects 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- VLCAYQIMSMPEBW-UHFFFAOYSA-N methyl 3-hydroxy-2-methylidenebutanoate Chemical compound COC(=O)C(=C)C(C)O VLCAYQIMSMPEBW-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical compound CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000010434 nepheline Substances 0.000 description 1
- 229910052664 nepheline Inorganic materials 0.000 description 1
- 235000010292 orthophenyl phenol Nutrition 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229940059574 pentaerithrityl Drugs 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229940051841 polyoxyethylene ether Drugs 0.000 description 1
- 229920000056 polyoxyethylene ether Polymers 0.000 description 1
- 229920001592 potato starch Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- VVWRJUBEIPHGQF-UHFFFAOYSA-N propan-2-yl n-propan-2-yloxycarbonyliminocarbamate Chemical group CC(C)OC(=O)N=NC(=O)OC(C)C VVWRJUBEIPHGQF-UHFFFAOYSA-N 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229940047670 sodium acrylate Drugs 0.000 description 1
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 description 1
- GEHJYWRUCIMESM-UHFFFAOYSA-L sodium sulfite Chemical compound [Na+].[Na+].[O-]S([O-])=O GEHJYWRUCIMESM-UHFFFAOYSA-L 0.000 description 1
- KZOJQMWTKJDSQJ-UHFFFAOYSA-M sodium;2,3-dibutylnaphthalene-1-sulfonate Chemical compound [Na+].C1=CC=C2C(S([O-])(=O)=O)=C(CCCC)C(CCCC)=CC2=C1 KZOJQMWTKJDSQJ-UHFFFAOYSA-M 0.000 description 1
- SONHXMAHPHADTF-UHFFFAOYSA-M sodium;2-methylprop-2-enoate Chemical group [Na+].CC(=C)C([O-])=O SONHXMAHPHADTF-UHFFFAOYSA-M 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- SFVFIFLLYFPGHH-UHFFFAOYSA-M stearalkonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 SFVFIFLLYFPGHH-UHFFFAOYSA-M 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- FDDDEECHVMSUSB-UHFFFAOYSA-N sulfanilamide Chemical compound NC1=CC=C(S(N)(=O)=O)C=C1 FDDDEECHVMSUSB-UHFFFAOYSA-N 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 229940095064 tartrate Drugs 0.000 description 1
- KUAZQDVKQLNFPE-UHFFFAOYSA-N thiram Chemical group CN(C)C(=S)SSC(=S)N(C)C KUAZQDVKQLNFPE-UHFFFAOYSA-N 0.000 description 1
- 229960002447 thiram Drugs 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- DUBNHZYBDBBJHD-UHFFFAOYSA-L ziram Chemical compound [Zn+2].CN(C)C([S-])=S.CN(C)C([S-])=S DUBNHZYBDBBJHD-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Curing Cements, Concrete, And Artificial Stone (AREA)
Abstract
The present invention relates to aldehyde-free adhesive for artificial plates, which belongs to the field of adhesive. The present invention also provides a preparation method of the aldehyde-free adhesive for artificial plates. The present invention is characterized in that the aldehyde-free adhesive for artificial plates is essentially prepared from aldehyde-free macromolecular compounds capable of being cross-linked and solidified, cross-linking agents, mildew inhibitors, filling materials and deionized water. When used for replacing urea-formaldehyde glue for the production of the artificial plates, the aldehyde-free adhesive can essentially eliminate the pollution and the harm of free formaldehyde in artificial plate industry.
Description
Technical field
The present invention relates to a kind of aldehyde-free cement for wood-based panel, belong to adhesive area.
Background technology
Urea-formaldehyde glue is higher because of Joint strength, and cold-resistant water-based is better, and the chemically-resistant medicament corrodes, and makes easyly, and cost is low and used in a large number, and in wood-based panel industry, the usage quantity of urea-formaldehyde glue accounts for about 70% of the total consumption of the various glue of whole wood-based panel industry.But it is crisp easily aging that the shortcoming of urea-formaldehyde glue is a property, even more serious is to have a large amount of formaldehyde in the production process to discharge, contaminate environment, harm direct labor's health, and the finished product sheet material of producing with urea-formaldehyde glue in use, can constantly discharge free formaldehyde for a long time, harm user's physical and mental health.Along with the continuous reinforcement of health of people consciousness and environmental consciousness, the harm of urea-formaldehyde glue is subjected to people's attention day by day.
Carried out much about of the research of low toxicity glued board for addressing this problem both at home and abroad with urea-formaldehyde glue.But all be to improve aspect the production technique of urea-formaldehyde glue, as changing feed ratio, means such as employing batch charging reduce formaldehyde total consumption in glue or the like, and the urea-formaldehyde glue of Sheng Chaning can make free formaldehyde release decrease really like this.Also there are at present many investigators to adopt the method for adding formaldehyde-trapping agent to reduce the burst size of free formaldehyde.But aforesaid method does not all fundamentally solve formaldehyde pollution and harm problem.
China is on Wood-based Panel Production scale and wood-based plate ultimate production, it is Wood-based Panel Production big country, because the urea-formaldehyde glue of domestic production is of poor quality, the finished product sheet material free formaldehyde release of the production of using has had a strong impact on the foreign exchange earning of China's wood-based plate than the external product height.Therefore, how China's wood-based panel industry that always has been described as evergreen industry since the reform and opening-up breaks away from the puzzlement of glue, allows product really go abroad, and seeks bigger more permanent development, is the important topic of pendulum in face of the Study on Adhesive worker.
Summary of the invention
For fundamentally solving formaldehyde pollution and harm problem in the wood-based panel industry, we utilize macromolecular compound, linking agent, mould inhibitor, filler and deionized water to be mixed with aldehyde-free cement for wood-based panel, and available replacement urea-formaldehyde glue is used for the production of wood-based plate.This makes wood-based plate really become Green Product and has crucial meaning promoting the no hydroformylation of adhesion agent for artificial board.Produce market has a extensive future, and economic benefit and social benefit are all very good, and will produce good ecological benefits, have important and practical meanings.
The artificial plate aldehyde-free cement of the present invention is characterized in that it being that the no aldehyde macromolecular compound (0.1%～60%), linking agent (0.1%～60%), mould inhibitor (0.1%～20%), filler (0.1%～60%) and the deionized water (1%～90%) that utilize cross-linkable solidifying is formulated in essence.
The artificial plate aldehyde-free cement of the present invention, the no aldehyde macromolecular compound of used 0.1%～60% cross-linkable solidifying are to utilize unsaturated monomer (1%～95%), initiator (0.001%～15%), emulsifying agent (0.001%～15%) and solvent (1%～95%) or dispersion medium (1%～95%) to be polymerized with certain method at a certain temperature.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～60% linking agent are one or more in multi-functional epoxy compound or Resins, epoxy, polycarboxylic acid, polyamine, polyvalent alcohol, the polyisocyanates.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～20% mould inhibitor are one or more in phenol organic compound mould inhibitor, organosulfur compounds mould inhibitor, organic tin compound mould inhibitor, quaternary ammonium salt organic compound mould inhibitor, other mould inhibitor.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～60% filler are mineral-type filler and organic class filler.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～60% linking agent is one or more in the following linking agent:
(1) multi-functional epoxy compound is terephthalic acid diglycidyl ester, o-phthalic acid diglycidyl ester, m-phthalic acid 2-glycidyl ester, hexanodioic acid 2-glycidyl ester, P-hydroxybenzoic acid 2-glycidyl ether-ether, resorcinol diglycidyl ether, ethylene glycol diglycidylether, trihydroxymethylpropanyltri diglycidyl ether, 1,4-butanediol diglycidyl ether, glycerol triglycidyl ether, or Resins, epoxy is bisphenol A type epoxy resin (bisphenol A diglycidyl ether, oxirane value=0.1～0.8).
(2) polycarboxylic acid is terephthalic acid, phthalic acid, m-phthalic acid, maleic acid, FUMARIC ACID TECH GRADE, citric acid, tartrate, propanedioic acid, Succinic Acid, hexanodioic acid, benzene-1, trimellitic acid, trimesic acid.
(3) polyamine is quadrol, propylene diamine, butanediamine, hexanediamine, diethylenetriamine, triethylene tetramine, tetraethylene pentamine, hydroxyethylethylene diamine, Ursol D, O-Phenylene Diamine, mphenylenediamine.
(4) polyvalent alcohol is ethylene glycol, propylene glycol, butyleneglycol, hexylene glycol, neopentyl glycol, glycerol, TriMethylolPropane(TMP), tetramethylolmethane, glucose, fructose, Diethylene Glycol, triethylene glycol, Resorcinol, pyrocatechol, Resorcinol.
(5) polyisocyanates is a 2,4 toluene diisocyanate, 2,6-tolylene diisocyanate, 4,4 '-diphenylmethanediisocyanate, 2,4 '-diphenylmethanediisocyanate, 2,2 '-diphenylmethanediisocyanate, xylylene diisocyanate, naphthalene-1, the 5-vulcabond.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～20% mould inhibitor is one or more in the following mould inhibitor:
(1) phenol organic compound mould inhibitor be pentachlorophenol, sodium pentachlorophenol, pentachlorophenol copper, orthoxenol, lauric acid pentachlorophenol, to chloro resorcinol
(2) organosulfur compounds mould inhibitor is tetramethyl-thiuram disulfide, ferric dimethyl dithiocarbamate, ziram, 2-mercaptobenzothiazole zinc.
(3) organic tin compound mould inhibitor is two tributyltin oxides, dibutyl tin laurate, FUMARIC ACID TECH GRADE tributyl tin.
(4) the quaternary ammonium salt organic compound mould inhibitor is Dodecyl trimethyl ammonium chloride, palmityl trimethyl ammonium chloride, octadecyl trimethyl ammonium chloride, dodecyl benzyl dimethyl ammonium chloride, cetalkonium chloride, stearyl dimethyl benzyl ammonium chloride.
(5) other mould inhibitor is 2,3,5,6-tetrachloro-4-(methyl sulfanilamide (SN)) pyridine, copper naphthenate, tetrachloro isophthalonitrile.
The artificial plate aldehyde-free cement of the present invention, used 0.1%～60% filler is one or more in the following filler:
(1) the mineral-type filler is Paris white (100～1200 order), kaolin (100～1200 order), Feldspar Powder (100～1200 order), nepheline powder (100～1200 order), silicon dioxide powder (100～1200 order), talcum powder (100～1200 order), aluminum oxide (100～1200 order), magnesium oxide (100～1200 order), titanium dioxide (100～1200 order), zinc oxide (100～1200 order), diatomite (100～1200 order), mica powder (100～1200 order), wollastonite powder (100～1200 order).
(2) organic class filler is W-Gum (100～1200 order) and potato starch (100～1200 order).
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 1%～95% used unsaturated monomer of polymerization are one or more in acrylate, methacrylate, vinylformic acid and ester class thereof, methacrylic acid and ester class, vinyl cyanide, acrylamide and derivative thereof, vinylbenzene, MALEIC ANHYDRIDE and derivative thereof, the vinyl acetate.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 0.001%～15% used initiator of polymerization are one or more in azo-initiator, organic peroxide initiator, inorganic peroxide class initiator and the oxidation-reduction class initiator.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 1%～95% used solvent of polymerization are one or more in mineral-type solvent and the organic kind solvent, or 1%～95% used dispersion medium of polymerization is a water.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 0.001%～15% used emulsifying agent of polymerization are one or more in anionic emulsifier, amphoteric ion type emulsifying agent and the nonionic emulsifier.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 1%～95% used unsaturated monomer of polymerization are one or more in the following unsaturated monomer:
(1) acrylate is sodium acrylate, potassium acrylate, ammonium acrylate.
(2) methacrylate is sodium methacrylate, methacrylic acid potassium, ammonium methacrylate.
(3) vinylformic acid and ester class thereof are vinylformic acid, methyl acrylate, ethyl propenoate, butyl acrylate, Isooctyl acrylate monomer, acrylic acid epoxy propyl ester, Hydroxyethyl acrylate, Propylene glycol monoacrylate, vinylformic acid aminoethyl ester.
(4) methacrylic acid and ester class thereof are methacrylic acid, methyl methacrylate, Jia Jibingxisuanyizhi, butyl methacrylate, Isooctyl methacrylate, glytidyl methacrylate, hydroxyethyl methylacrylate, Rocryl 410, methacrylic acid aminoethyl ester.
(5) MALEIC ANHYDRIDE and derivative thereof are MALEIC ANHYDRIDE, dimethyl maleate, diethyl maleate, dibutyl maleate, maleimide.
(6) acrylamide and derivative thereof are acrylamide, N methacrylamide, N hydroxymethyl acrylamide.
(7) other unsaturated monomer is: vinyl cyanide, vinylbenzene, vinyl acetate.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 0.001%～15% used initiator of polymerization are one or more in the following initiator:
(1) azo-initiator is Diisopropyl azodicarboxylate, 2,2'-Azobis(2,4-dimethylvaleronitrile).
(2) organic peroxide initiator is dicumyl peroxide, di-tert-butyl peroxide, dibenzoyl peroxide.
(3) inorganic peroxide class initiator is Sodium Persulfate, Potassium Persulphate, ammonium persulphate.
(4) oxidation-reduction class initiator is made up of Oxidizing and Reducing Agents, wherein oxygenant is Sodium Persulfate, Potassium Persulphate, ammonium persulphate, hydrogen peroxide, tertbutyl peroxide, diisopropylbenzenehydroperoxide, isopropyl benzene hydroperoxide, dicumyl peroxide, di-tert-butyl peroxide, dibenzoyl peroxide, reductive agent is ferrous sulfate, S-WAT, oxalic acid, cobalt naphthenate, N, accelerine.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 0.001%～15% used emulsifying agent of polymerization are one or more in the following emulsifying agent:
(1) anionic emulsifier is sodium soap R
1COONa (R
1=C
11-17), sodium lauryl sulphate, Sodium dodecylbenzene sulfonate, sodium dibutyl naphthalene sulfonate.
(2) the amphoteric ion type emulsifying agent is Varion CDG-K, octadecyl dimethyl betaine, sodium dodecyl aminopropionitrile.
(3) nonionic emulsifier is a fatty alcohol-polyoxyethylene ether
(R
2=C
11-17, n
1=8-15), alkylphenol polyoxyethylene
(R
3=C
6-12, n
2=5-15), lauric monoglyceride, sorbyl alcohol lauric acid monoesters, anhydrous sorbitol lauric acid monoesters.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, 1%～95% used dispersion medium of polymerization is a water, or 1%～95% used solvent of polymerization is in the following solvent one or more:
(1) the mineral-type solvent is a water.
(2) organic kind solvent is benzene,toluene,xylene, ethanol, acetone, methylethylketone, hexanaphthene, pimelinketone, dimethyl formamide, dimethyl sulfoxide (DMSO).
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, used polymerization process can be any in mass polymerization, suspension polymerization, solution polymerization process and the emulsion polymerization.
The no aldehyde macromolecular compound of cross-linkable solidifying among the present invention, polymeric reaction temperature is 0 ℃～180 ℃ during polymerization.
Embodiment
Below by embodiment the artificial plate of the present invention is described in further detail with aldehyde-free cement, but these embodiment limit scope of the present invention.
Embodiment 1 vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion
Vinylbenzene 200g
Acrylic acid epoxy propyl ester 80g
Vinyl cyanide 80g
Butyl acrylate 40g
Emulsifying agent (OP-10) 15g
Sodium lauryl sulphate 5g
Polyvinyl alcohol (PVA) 40g
Deionized water 536g
Potassium Persulphate 4g
Thermometer is being housed, stirring rod, the cocurrent flow prolong, in the 2L four-hole boiling flask of constant pressure funnel and well heater, add 40g polyvinyl alcohol (PVA) and 536g water, heating also is controlled under 75 ℃ the temperature, after being stirred to polyvinyl alcohol and dissolving fully, add the 4g Potassium Persulphate again, 5g sodium lauryl sulphate and 15g emulsifying agent (OP-10), stirring and dissolving is even, add 200g vinylbenzene again, 80g acrylic acid epoxy propyl ester, / 3rd of 80g vinyl cyanide and a 40g Butyl Acrylate Monomer mixture, temperature control is added dropwise to other 2/3rds monomer mixtures continuously in the above-mentioned 2L four-hole boiling flask by constant pressure funnel in 1.5h and carries out polyreaction under 75 ℃.Behind reinforced the finishing, continue polymerization 9h under 75 ℃ temperature, promptly obtain vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion.
Embodiment 2 vinyl acetates (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion
Vinyl acetate 290g
Acrylic acid epoxy propyl ester 80g
Butyl acrylate 30g
Emulsifying agent (OP-10) 15g
Sodium lauryl sulphate 5g
Polyvinyl alcohol (PVA) 40g
Deionized water 536g
Potassium Persulphate 4g
Thermometer is being housed, stirring rod, reflux condensing tube, in the 2L four-hole boiling flask of constant pressure funnel and well heater, add 40g polyvinyl alcohol (PVA) and 536g water, heating also is controlled under 75 ℃ the temperature, after being stirred to polyvinyl alcohol and dissolving fully, add the 4g Potassium Persulphate again, 5g sodium lauryl sulphate and 15g emulsifying agent (OP-10), stirring and dissolving is even, add the 290g vinyl acetate again, / 3rd of 80g acrylic acid epoxy propyl ester and a 30g Butyl Acrylate Monomer mixture, temperature control is added dropwise to other 2/3rds monomer mixtures continuously in the above-mentioned 2L four-hole boiling flask by constant pressure funnel in 1.5h and carries out polyreaction under 75 ℃.Behind reinforced the finishing, continue polymerization 9h under 75 ℃ temperature, promptly obtain vinyl acetate (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion.
Embodiment 3
A.40% vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion
800g
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 80g
E. diethylenetriamine 30g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 4
A.40% vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion
800g
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 85g
E. triethylene tetramine 25g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 5
A.40% vinylbenzene (20%)-acrylic acid epoxy propyl ester (8%)-vinyl cyanide (8%)-butyl acrylate (4%) copolymer emulsion
800g
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 90g
E. tetraethylene pentamine 20g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 6
A.40% vinyl acetate (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion
80％
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 80g
E. diethylenetriamine 30g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 7
A.40% vinyl acetate (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 85g
E. triethylene tetramine 25g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Embodiment 8
A.40% vinyl acetate (29%)-acrylic acid epoxy propyl ester (8%)-butyl acrylate (3%) copolymer emulsion
B. W-Gum 80g
C. sodium pentachlorophenol 10g
D. deionized water 90g
E. tetraethylene pentamine 20g
After a, b, c and d mixing and stirring, face with preceding adding solidifying agent e and stir and to use.The artificial plate of the present invention is 50 ℃～180 ℃ with the solidification value of aldehyde-free cement.
Claims (2)
1. an aldehyde-free cement for wood-based panel is characterized in that utilizing no aldehyde macromolecular compound, linking agent, mould inhibitor, filler and the deionized water of cross-linkable solidifying formulated; Wherein the no aldehyde macromolecular compound of cross-linkable solidifying is to utilize unsaturated monomer, initiator, emulsifying agent and dispersion medium are polymerized, wherein unsaturated monomer is by butyl acrylate, the acrylic acid epoxy propyl ester, vinylbenzene and vinyl cyanide are formed, initiator is a Potassium Persulphate, emulsifying agent is by OP-10, sodium lauryl sulphate and polyvinyl alcohol are formed, dispersion medium is a deionized water, wherein butyl acrylate, the acrylic acid epoxy propyl ester, vinylbenzene, vinyl cyanide, OP-10, sodium lauryl sulphate, polyvinyl alcohol, Potassium Persulphate, the quality proportioning of deionized water is: 40: 80: 200: 80: 15: 5: 40: 4: 536; Filler is a W-Gum; Mould inhibitor is a sodium pentachlorophenol; Linking agent is a diethylenetriamine; The quality proportioning of the no aldehyde macromolecular compound of cross-linkable solidifying, W-Gum, sodium pentachlorophenol, deionized water, diethylenetriamine is: 800: 80: 10: 80: 30, after no aldehyde macromolecular compound, W-Gum, sodium pentachlorophenol and the deionized water mixing and stirring with cross-linkable solidifying, the adding diethylenetriamine stirs and promptly obtains aldehyde-free cement for wood-based panel.
2. the preparation method of aldehyde-free cement for wood-based panel according to claim 1, it is characterized in that thermometer is being housed, stirring rod, reflux condensing tube, in the 2L four-hole boiling flask of constant pressure funnel and well heater, add 40g polyvinyl alcohol and 536g deionized water, heating also is controlled under 75 ℃, after being stirred to polyvinyl alcohol and dissolving fully, add the 4g Potassium Persulphate again, 5g sodium lauryl sulphate and 15g emulsifier op-10, stirring and dissolving is even, add 200g vinylbenzene again, the 80g vinyl cyanide, / 3rd of 80g acrylic acid epoxy propyl ester and a 40g Butyl Acrylate Monomer mixture, temperature control is under 75 ℃, in 1.5h, other 2/3rds monomer mixtures are added drop-wise in the above-mentioned 2L four-hole boiling flask continuously by constant pressure funnel and carry out polyreaction, behind reinforced the finishing, continuation is polymerization 9h under 75 ℃ temperature, promptly get styrene-acrylonitrile-acrylic acid epoxy propyl ester-butyl acrylate copolymer emulsion, with copolymer emulsion, W-Gum, sodium pentachlorophenol, after the deionized water mixing and stirring, adding linking agent diethylenetriamine stirs and promptly obtains aldehyde-free cement for wood-based panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100140751A CN1313555C (en) | 2004-02-17 | 2004-02-17 | Aldehyde-free adhesives for artificial board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100140751A CN1313555C (en) | 2004-02-17 | 2004-02-17 | Aldehyde-free adhesives for artificial board |
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| CN1560165A CN1560165A (en) | 2005-01-05 |
| CN1313555C true CN1313555C (en) | 2007-05-02 |
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|---|---|---|---|
| CNB2004100140751A Expired - Fee Related CN1313555C (en) | 2004-02-17 | 2004-02-17 | Aldehyde-free adhesives for artificial board |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998177A (en) * | 1982-11-26 | 1984-06-06 | Nitto Electric Ind Co Ltd | Emulsion-type pressure-sensitive adhesive |
| CN86210169U (en) * | 1986-12-15 | 1987-12-12 | 上海市房屋设备工程公司电梯电器工程处 | Plastic protective groove for electric wire |
| CN1120060A (en) * | 1994-10-07 | 1996-04-10 | 福州市建筑科学研究所 | Adhesive for building and its production method |
| CN1135512A (en) * | 1995-05-12 | 1996-11-13 | 四川联合大学 | Water emulsion paper-plastic composite adhesive |
-
2004
- 2004-02-17 CN CNB2004100140751A patent/CN1313555C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5998177A (en) * | 1982-11-26 | 1984-06-06 | Nitto Electric Ind Co Ltd | Emulsion-type pressure-sensitive adhesive |
| CN86210169U (en) * | 1986-12-15 | 1987-12-12 | 上海市房屋设备工程公司电梯电器工程处 | Plastic protective groove for electric wire |
| CN1120060A (en) * | 1994-10-07 | 1996-04-10 | 福州市建筑科学研究所 | Adhesive for building and its production method |
| CN1135512A (en) * | 1995-05-12 | 1996-11-13 | 四川联合大学 | Water emulsion paper-plastic composite adhesive |
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