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CN1301479A - 用于电子元件特别是声学表面波元件的多路应用以及在多路应用上构造针脚焊点,焊接架,隔片等的方法 - Google Patents

用于电子元件特别是声学表面波元件的多路应用以及在多路应用上构造针脚焊点,焊接架,隔片等的方法 Download PDF

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CN1301479A
CN1301479A CN99806410A CN99806410A CN1301479A CN 1301479 A CN1301479 A CN 1301479A CN 99806410 A CN99806410 A CN 99806410A CN 99806410 A CN99806410 A CN 99806410A CN 1301479 A CN1301479 A CN 1301479A
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metal
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CN1192692C (zh
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A·斯特兹尔
H·克吕格尔
K·维德纳
M·沃斯勒
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SnapTrack Inc
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Abstract

多路应用(1),可分隔成用于电子元件(3),特别是声学表面波元件的单路应用(2),表面波元件适用于在单路应用(2)上采用倒装法技术的芯片触点接通和采用SMD技术的单路应用与外部联接的触点接通。多路应用(1)对每个单路应用(2)具有金属涂覆表面(5),它位于一个集成在多路应用内的并导向联接极点(8)的电路上。通过金属在金属涂覆表面(5)上的电镀沉积构造成针脚焊点(13)。

Description

用于电子元件特别是声学表面波元件的多路应用 以及在多路应用上构造针脚焊点， 焊接架，隔片等的方法
本发明涉及可分隔成用于电子元件特别是声学表面波元件的单路应用的多路应用，表面波元件适用于在单路应用上采用倒装法技术(Flip-Chip-Technik)的芯片的触点接通和采用SMD技术的单路应用与外部联接的触点接通。另外，本发明涉及在多路应用上构造针脚焊点，焊接架，隔片等等的方法。
构造采用倒装法技术的芯片触点接触所必要的针脚焊点，也称作焊珠，以及用于固定芯片-金属壳所需要的在陶瓷-和印刷的线路板-多路应用焊接架，迄今为止需借助丝漆印刷或模板印刷得到。
以此种印刷方式得到的针脚焊点和焊接架的联接是昂贵的，每个电子元件型式有不同的模板并由此需要与型式有关的特殊工作装置用于模板的制作。
对于模板印刷，还存在由于基质材料，例如多路应用和单路应用的陶瓷的变形的问题，因为在所有的情况下，希望得到在单路应用上针脚焊点精确的几何次序是不可能的。对于焊接架及为了在芯片和单路应用及基质间确保必要距离而可能存在的隔片也存在同样问题，尽管损害作用很小。
因此本发明的任务在于，实现一种开头所述的可分离成单路应用的多路应用，它避免了前面述及的缺点，即花费较少，并且构造针脚焊点和焊接架及必要的话还有间距保持器等等的方法，都可以实现，这不取决于应用的基质材料，却总是精确地确保针脚焊点，焊接架等等的通常方式的与型式关联的几何尺寸。
为实现此任务，对于符合权利要求1前序部分所述的多路应用，本发明建议，多路应用对每个单路应用针对于针脚焊点的触点接通，具有金属涂覆的表面，针脚焊点位于集成在多路应用内的电路上，电路导向一个联接极点。
其它用于构造芯片也可能是间距保持器的金属盖焊接架的金属涂覆表面和其他必要的元件都位于一个附加的、集成在多路应用内的线路上，此线路导向相应的其它联接极点。
反之，在所有的导电表面不被电镀的情况下，例如，应设置有针脚焊点的情况，省去集成的电路和它与此相应的在联接极点处的电联接。
借助多路应用，用于针脚焊点、焊接架等等所希望的金属薄层，例如锡铅层，能够以电镀方法沉积在金属涂覆表面，其中单独电路的联接极点在同一时间间隔内动态地一起构成或分别构成，要视针脚焊点、焊接架等等是否要求同样或不同的金属层以及层的组分和层厚度而定。
层厚通过电荷量，即电流强度和时间的乘积，非常精确地被调整。模板印刷方式涉及到的变形问题不会出现。对此，模板和对应于生产的与类型有关的特殊工作装置同样可以取消。
本发明的其他特征在从属权利要求和图示中说明。图示为：
图1．一个符合本发明的以俯视图显示的多路应用，并且部分截断显示；
图2．同样以截断方式显示一个通过一个图1中的单路应用的横截面，单路应用带有一个根据本发明的采用倒装法技术的方法与单路应用触点接通并且配备金属盖的电子元件，特别是OFW-元件；
图3．至5用截面和部分截断的方式显示一个应用实例，以显示符合本发明所述方法的针脚焊点的结构。
在图中同样的电子元件用同样的图示符号表示。
根据图1，多路应用1，例如一个陶瓷或印刷的线路板，被分成多个设置成列和行的单路应用2，每个单路应用沿着一个用虚线表示的分隔线7被区分。对每个所希望的、取决于元件形式的焊接架15和针脚焊点13精确的几何位置-见图2-单路应用分别具有涂覆金属的表面5，6，涂覆金属表面部分地-见用于焊接架15的表面6-用丝漆印刷技术得到，部分端面由贯穿触点接触20得到。
多路应用1本身，-见图2-，由两层10,11，例如陶瓷或印刷线路板组成。优选地在层的边界表面之间的范围内，设置了一个或多个彼此分离的电路部分，一方面它们分别导向联接极点8或9，另一方面导向用于针脚焊点的涂覆金属表面5和用于焊接架的涂覆金属表面6。
对于多路应用1沿着分隔线7区分成单路应用2，单路应用在针脚焊点13、焊接架15电镀构成之后，并接下来在最终产品3完成之后，根据图2，同样地分成通常结构的、并由此在图中观察方向的背面未显示的电路，并且隔断每个单路应用2单独的涂覆金属表面5之间的首先说明的联接。
如图1和图2所示，分隔线7优越地如此述及，即对于多路应用1区分成单路应用2，贯穿联接触点20，利用涂覆金属表面5和被电镀涂覆的针脚焊点13联接SMD-联接元件21，在多路应用1的层11的范围内，分成两个贯穿联接触点，分别设置在单路应用2的旁边。
有助于后面说明的方法的完成的最终产品3，具有-如在图2中显示的－一个芯片12，例如是一个压电基质，它借助动态电结构的针脚焊点13与SMD-接触元件接触。芯片12本身由金属盖16保护，金属盖焊在用电镀涂覆的焊接架15上。进一步在芯片12和单路应用之间设有一个标称为PROTEC的覆盖层或保护层17，并且在覆盖层17和金属盖16之间空的空间内，充满了例如环氧树脂18。
根据本发明提出的，用于将金属薄层沉积在为此而设置的需涂覆金属的表面5,6的电镀方法的应用，显示出多个优点。
例如层的厚度通过电量，即通过精确控制的电流强度和时间的乘积来调整。按照层的构成和层的组分，也就是说，例如按照针对焊接架15和针脚焊点13所希望同样或不同的层组分，电路可以通过它的联接极点8,9在一定时间里一起构成或分别构成。
最后，例如对于用于焊接架15的金属层的电镀沉积，推荐例如在金属涂覆表面6上采用锡铅层，因为对于焊接架15的锡铅层，要求一个比在针脚焊点13上的层的熔点高的熔化温度。
所述及的方法因此使不同的金属例如锡铅上下叠置电镀沉积成为可能，彼此成一组，这在所有情况下都是优越的，对此，层不可作为合金而沉积，而是在涂覆的金属熔化时得到的。
如果为接触针脚焊点13而设置的、并且穿过贯穿触点联接20的小宽度而在多路应用1的层10内设置的涂覆金属表面5，不适合所要求的针脚焊点大小，推荐优先采用在图3至5中显示的步骤。首先通过层组23的涂覆，例如它由一个部分采用丝漆印刷技术、电镀方法或无电方法沉积的钨镍金层组组成，涂覆金属的表面5被扩大。紧接着为构成针脚焊点所要求的金属层24用电镀沉积并且加热到其熔化温度，它导致比在图5中显示的针脚焊点珠25还大的直径。

Claims (14)

1．可分隔成用于电子元件特别是声学表面波元件的单路应用的多路应用，表面波元件适用于在单路应用上采用倒装法技术的芯片触点接通和采用SMD技术的单路应用与外部联接的触点接通，
其特征在于，
多路应用(1)对每个单路应用(2)具有金属涂覆表面(5)，用于与针脚焊点(13)的触点联接，所述针脚焊点位于集成在多路应用内的电路上，该电路导向一个联接极点(8)。
2．如权利要求1所述的多路应用，其特征在于，
多路应用(1)对每个单路应用(2)具有用于构造芯片(12)的金属盖(16)焊接架(15)的金属涂覆表面(6)，芯片位于集成在多路应用内的第二个电路上，该电路导向另一个联接极点(9)。
3．如权利要求1所述的多路应用，其特征在于，
多路应用(1)对每一个单路应用(2)具有其它用于构造附加的元件，特别是在多路应用和芯片(12)之间的间距保持器的金属涂覆表面，芯片位于集成在多路应用内的另一个电路上，此电路导向另一个联接极点。
4．如权利要求1至3所述的多路应用，其特征在于，
电路的联接极点(8,9)位于多路应用(1)的正面。
5．如权利要求1至4所述的多路应用，其特征在于，
联接极点(8,9)彼此之间是可以相接触的。
6．如权利要求1至5所述的多路应用，其特征在于，
多路应用(1)是一个多层的，特别是两层的陶瓷的-或印刷的电路板多路应用，带有部分地位于层(10,11)之间分离表面内的电路。
7．如权利要求1所述的多路应用，其特征在于，
用于针脚焊点(13)的单独的联接表面(5)，附加地为了与电路相联，分别通过在多路应用(1)内的贯穿联接(20)，与相应的SMD-元件(21)相联。
8．在如权利要求1至7所述的多路应用的用于针脚焊点、焊接架、间距保持器等的金属涂覆表面上的金属层涂覆方法，其特征在于，
金属层用电镀方法沉积在金属涂覆表面(5,6)上。
9．如权利要求8所述的方法，其特征在于，
在金属涂覆表面(5,6)上的金属层的电镀沉积，对于用于针脚焊点(13)、焊接架(15)和间距保持器的不同的层组成成分，在时间顺序上分别得到。
10．如权利要求8所述的方法，其特征在于，
在金属涂覆表面(5,6)上的金属层的电镀沉积，对于用于针脚焊点(13)、焊接架(15)和间距保持器的相同的层组成成分，在同一时间得到。
11．如权利要求8至10所述的方法，其特征在于，
在多路应用(1)的金属涂覆表面(5,6)上用电镀方法沉积锡铅合金。
12．如权利要求8至11所述的方法，其特征在于，
为构造针脚焊点(13)，金属层，特别是锡铅金属层，在为与针脚焊点(13)触点接通而设置的多路应用(1)的金属涂覆表面(5)上，用电镀方法沉积并且紧接着加热到其熔化温度。
13．如权利要求12所述的方法，其特征在于，
为针脚焊点(13)的触点接通而设置的并且穿过在多路应用(1)内的贯穿联接(20)的小宽度给出的多路应用金属涂覆表面(5)，由于金属层组(23)的涂覆被增大，并且紧接着为构造针脚焊点的结构所需的金属层用电镀方法沉积，并且加热到其熔化温度。
14．如权利要求13所述的方法，其特征在于，
一个钨-镍-金金属层组(23)部分地用丝漆印刷技术、电镀方法或无电的方法沉积。
CNB998064106A 1998-05-20 1999-05-03 用于电子元件特别是声学表面波元件的多路印刷线路板以及在多路印刷板上构造针脚焊点,焊接架,隔片等的方法 Expired - Lifetime CN1192692C (zh)

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