CN1393678A - Loop type heat pipe heat exchange assembly - Google Patents

Abstract

A loop type heat pipe heat exchange assembly. In order to provide a heat exchanger component with good heat transfer performance, good temperature uniformity, low manufacturing cost and long service life, the invention provides a heat exchanger component, which comprises a loop with an evaporation part and a condensation part at two ends; the loop is a closed loop which is sequentially connected with the evaporation part, the steam channel, the condensation part and the fluid return channel in series; the loop is filled with liquid; the fluid return channel and the steam channel are independent pipelines; the flow resistance of the fluid in the fluid return channel is greater than the flow resistance of the fluid in the vapor channel.

Description

Loop type heat pipe heat exchange assembly

The invention belongs to radiator components, in particular to a loop type heat pipe heat exchange assembly.

The known heat pipe heat exchanging assembly has been widely used in the heat dissipation assembly of electronic components due to its good heat transfer performance. The heat pipe type cooling assembly includes a heat pipe 1 and a heat conduction block 11 connected to the heat pipe 1 and arranged at the end of the electronic component. The other end of the heat pipe 1 is connected to the radiator through another heat conducting block. Alternatively, as shown in FIG. 1 , the other end of the heat pipe 1 is directly interposed with a heat dissipation fin type heat pipe with several fins 12 .

In the heat pipe manufacturing process, a relatively high part of the cost is used for the cleaning and degassing steps of the pipeline, that is, in the manufacturing steps of pipeline cleaning and vacuuming, the higher the degree of cleanliness and vacuum, the higher the heat that can be achieved. The better the conduction effect is, the more stable the heat conduction can be ensured. However, there is still a small amount of non-condensing gas in the pipeline. The non-condensing gas will accumulate in the heat pipe circuit. The temperature difference between the accumulated area and the evaporation part of the heating end is large, which will affect the operation of the circuit. fluency. Among them, non-condensable gas is easy to accumulate at the end of the condenser pipe, so that its temperature uniformity and heat transfer function are greatly reduced.

Since the diameter of the heat pipe 1 is not large, it provides steam flow at the evaporating end of the hot zone of the heat conduction block 11, so that the steam flow flows along the pipeline toward the condensing end of the cold zone at the other end, and then makes the steam flow at the pipeline in the cold zone. The flow condenses to form a condensed liquid flow, and then quickly guides the condensed liquid flow from the cold area to the hot area by means of the capillary structure 13 in the pipeline to supplement the part of the liquid evaporated into gas at the evaporation end to form a circulating flow .

When one end of the heat pipe 1 is heated and the liquid in the heat pipe evaporates, the vapor flows toward the condensation end and condenses into a liquid, and the liquid returns to the evaporation part through the capillary tissue. Since the circuit of the heat pipe heat exchange component is set in the same pipeline, the flow directions of the vapor flow and the liquid liquid will conflict with each other in the pipeline, thereby reducing the heat transfer and the residual non-condensable gas in the pipeline It accumulates at the condensing end, forming an area with a large temperature difference, which reduces the uniformity of temperature, and the heat transfer performance is also greatly reduced. Therefore, traditionally, strict requirements are imposed on the manufacturing conditions and storage of heat pipes, which greatly increases the cost and increases the selling price. Very uneconomical.

The object of the present invention is to provide a loop type heat pipe heat exchange assembly with good heat transfer performance, good temperature uniformity, low manufacturing cost and long service life.

The present invention includes a circuit with two ends being an evaporating part and a condensing part; the circuit is a closed circuit in which the evaporating part, the vapor channel, the condensing part and the fluid return channel are connected in series; the circuit is filled with liquid; the fluid return channel and the vapor channel are independent The pipeline; the flow resistance of the fluid in the fluid return channel is greater than the flow resistance of the fluid in the vapor channel.

in:

The evaporating part and/or the condensing part are pipelines.

The evaporating part is assembled with a heat transfer block provided with a channel; the heat transfer block connects the steam channel and the fluid return channel through the connecting channel.

The evaporating part is connected with the heat exchanging device to dissipate heat, which can be the heat transfer block of the heat source, the heat receiving fin group, the hot water jacket or the condensing part of another circuit.

The steam channel is a parallel steam channel formed by more than two pipelines.

The condensing part is assembled with a connection block provided with a connection channel; the connection block connects the steam channel and the fluid return channel through the connection channel.

The condensing part is connected with the heat exchanging device, and the heat exchanging device is a cooling fin group, a radiator, a cooling water tower or an evaporating part of another circuit.

The fluid return channel forms a liquid seal with the liquid.

The fluid return channel is a fluid return channel in which more than two pipelines are connected in parallel.

The flow resistance of the fluid return channel is greater than the flow resistance of the vapor channel is that the cross-sectional area of the fluid return channel is smaller than or the length is greater than the cross-sectional area or length of the vapor channel;

The fluid return channel is provided with a capillary structure that forms a large flow resistance and guides the condensed liquid back to the evaporation part.

The liquid filling volume refers to the volume from filling the capillary tissue to filling 90% of the circuit.

The capillary expands to the evaporating part alone or to the condensing part alone or to the evaporating and condensing part at the same time; the capillary is ceramic, sintered powder, foamed metal, woven mesh, sintered mesh, grooved plate, fiber bundle or spiral Wire.

Because the present invention comprises the loop that two ends are evaporating part and condensing part; The circuit is the closed loop of evaporating part, steam channel, condensing part, fluid return channel connected in series; Liquid is filled in the circuit; Fluid return channel and steam channel are respectively Independent pipeline; the flow resistance of the fluid in the fluid return channel is greater than the flow resistance of the fluid in the vapor channel. The present invention uses a branched structure with unequal flow resistance between the steam channel and the fluid return channel to form an asymmetric structure of the flow in the circuit, so it can generate a pressure difference phenomenon, so that the steam formed by the evaporation part can easily and naturally and stably flow in one direction Flow towards the condensation part, and condense in the condensation part to form a condensed liquid flow, so that the condensed liquid flow, non-condensable gas and non-condensed vapor flow, under the action of the circuit pressure difference and the guiding structure, all move towards the fluid return channel stably It flows in one direction and flows back to the evaporation part through the fluid return channel, forming a rapid one-way circulation flow. Make all the fluids in the circuit flow in the same direction without conflict, and all fluids can pass through any pipeline in the system at any time, so the heat transfer is good, the heat transfer is large, and the temperature difference is small. During the production process, Even without the degassing process, the heat transfer can be operated, so that the manufacturing process is simple and the cost is low, that is, not only good heat transfer and temperature uniformity, but also low manufacturing cost and long service life, so as to achieve the purpose of the present invention.

Fig. 1 is a schematic sectional view of a conventional heat pipe structure.

Fig. 2 is a schematic sectional view of the structure of the present invention.

Fig. 3 is a partially enlarged view of part A in Fig. 2 .

Fig. 4 is a schematic side sectional view of the structure of the present invention.

The present invention will be further elaborated below in conjunction with the accompanying drawings.

As shown in Fig. 2, Fig. 3, Fig. 4, the present invention comprises a closed circuit 2, an evaporation part 21, a steam channel 22, a condensation part 23, a fluid return channel 24, a heat transfer block 3 and Connect block 4.

An appropriate amount of liquid is filled in the closed circuit 2, and the filling amount of the liquid refers to the volume from filling the capillary tissue to filling the circuit to 90%.

The fluid return channel 24 and the steam channel 22 are pipelines that are not shared, that is, the steam channel 22 and the fluid return channel 24 are independent pipelines.

The flow resistance of the fluid in the fluid return channel 24 is greater than the flow resistance of the fluid in the steam channel 22, resulting in an unbalanced heat flow in the circuit 2 to form an asymmetric flow structure in the circuit, so a pressure difference phenomenon can be generated, making the evaporation part The vapor formed by 21 easily and naturally flows toward the condensing part 23 in one direction, and condenses in the condensing part 23 to form a condensed liquid flow, so that the condensed liquid flow, non-condensable gas and non-condensed vapor flow, in the loop pressure difference Under the action of the guide structure, they all flow toward the fluid return channel 24 stably in one direction, and flow back to the evaporation part 21 through the fluid return channel 24 .

The evaporator 21 of the present invention is a pipeline at the heated position of the circuit 2 . In order to have better heat transfer, in addition to directly connecting the pipeline of the steam channel 22 that flows out of the fluid with the pipeline of the fluid return channel 24 that flows back into the fluid, it is also possible to use a heat transfer block 3 connected. A connection channel 31 is provided in the heat spreader 3, and the steam channel 22 and the fluid return channel 24 are connected by the connection channel 31; It is connected with the heat transfer element, so as to connect with the heat source through the heat transfer element. Heat sources are heat-prone surfaces of electronic components such as CPUs. Therefore, the evaporating part 21 is connected with the heat exchange device to dissipate heat. The heat exchange device to dissipate heat can be a heat transfer block of a heat source, a heat receiving fin group, a hot water jacket or a condensing part of another group of circuits, wherein the other group The loop refers to the serial connection type of the two loops of the present invention.

The condensing part 23 of the present invention is the pipeline of the heat dissipation position of the circuit 2, and this part is the main heat dissipation area. Of course, the pipeline itself of the circuit 2 is also a good heat dissipation structure. The condensing part 23 is provided with a connecting block 4, and in the connecting block 4 A connection channel 41 is provided to connect the steam channel 22 and the fluid return channel 24 with the connection channel 41; the pipeline of the condensing part 23 can also be connected with the integrated radiator or the heat sink group 25 through the connection block 4, and finally It is better to be the heat sink group 25, so the connection block 4 is shown in the pipeline type, but with corner type connection pieces. That is, the condensing part 23 is in contact with a heat exchanging device for heat dissipation, and the heat exchanging device is a heat dissipation fin group, a radiator, a cooling water tower or an evaporating part of another circuit.

As shown in Figure 2, the steam channel 22 is a pair of pipelines, that is to say, a single pipeline or more than two pipelines can be provided to form a parallel steam channel 22, and the total flow resistance of each steam channel 22 is less than that of the fluid return channel. twenty four. That is, the cross-sectional area of the fluid return channel 24 is smaller than or longer than the cross-sectional area or length of the steam channel 22; The steam channel 22 forms a state of small flow resistance and high flow velocity, while the fluid return channel 24 forms a state of large flow resistance and low flow velocity, so as to generate asymmetrical heat flow intentionally formed in the circuit 2 and promote the formation of a definite flow direction. The fluid return channel 24 is only provided with a single pipeline in the figure, and it can also be provided with two to form a parallel fluid return channel 24, as long as it meets the aforementioned condition that the flow resistance is greater than the flow resistance of the vapor channel 22, and the condensed liquid It can only return to the evaporation area 21 through the fluid return channel 24, and the guided flow of the circuit 2 is naturally generated. This flow phenomenon is a stable unidirectional flow, and it is deliberately restricted to only flow in the designed direction, and no violation of the design will occur. Flow freely. Or let the fluid return channel 24 be filled with liquid to form a liquid seal, which can completely fill the capillary tissue in the flow return channel 24 to form a liquid seal, and can also reduce the space through which the gas passes to form a liquid seal, so as to increase the asymmetry of the flow resistance Therefore, the fluid circulation is more stable and flows toward the design direction, but at this time, the liquid return channel 24 will affect the passage of non-condensable gas, resulting in poor temperature uniformity. Therefore, the degassing procedure of loop 2 can be used to eliminate non-condensable gases and improve temperature uniformity.

Since the circuit 2 has been set up in series, and a sequential unidirectional circulation flow is formed, the non-condensable gas in the circuit 2 has no space and time to accumulate and stay, and can only flow along the vapor flow or the condensed liquid flow. Flow in circuit 2, so, the present invention can form the gas that contains most of vapor flow in circuit 2 in circuit 2, the liquid and the non-condensable gas of liquid flow after the small part condensation; Fluid return channel 24 spaces contain Most of them are condensed liquid flow, a small part of vapor flow gas and non-condensable gas, forming a rapid unidirectional circulation flow. Make all the fluids in the circuit 2 flow in the same direction without conflict, and all the fluids can pass through any pipeline in the system at any time, so the heat transfer is good, the heat transfer is large, and the temperature difference is small.

When the present invention is made, if pipelines with the same outer diameter are used, different inner diameters need to be formed. The method of forming different inner diameters is to set the capillary structure 26 on the fluid return channel 24 to form a larger flow resistance and guide the condensed liquid to return to the evaporation part 21, so that the inner diameter of the passage becomes smaller, the flow resistance becomes larger, and its length is only As far as the length of the fluid return channel 24 where the condensed liquid flow is located, it either extends to the evaporating part 21 alone, or extends to the condensing part 23 alone, or extends to both the evaporating part 21 and the condensing part 23. Capillary tissue can also be arranged in the steam channel 22 , but it must meet the condition that the flow resistance of the steam channel 22 is smaller than the flow resistance of the fluid return channel 23 .

The capillary structure 26 is ceramic, sintered powder, foamed metal, woven mesh, sintered mesh, grooved plate, fiber bundle or helical wire.

Wherein the fluid return channel 24 needs to be provided with a space that allows steam and non-condensable gas to pass through.

To sum up, the present invention utilizes the split-pipe structure with unequal flow resistance between the steam channel 22 and the fluid return channel 24, and cooperates with the principles of pressure difference, heat flow imbalance, capillary phenomenon, etc., to form a serial sequential unidirectional fluid flow cycle structure, and the steam channel 22 and the fluid return channel 24 can also form a parallel pipeline structure respectively, as long as the flow resistance in the fluid return channel 24 is greater than the flow resistance in the steam channel 22, and the heat transfer block 3 and The setting of the connection block 4 can generate the connected annular loop 2 . In this way, the pipeline of the present invention can operate heat transfer even without degassing process during the manufacturing process. After the degassing process, the thermal conductivity is better and the operating temperature range is wider. In this way, the circuit 2 is easier to form. Compared with the conventional heat pipe in actual use, its heat conduction flow rate is faster than that of the conventional heat pipe, with high heat uniformity, good heat transfer, and greater heat transfer. faster. Therefore, the present invention does not need a degassing process, and is not important to the cleaning process, so that the process is simple, the cost is low, and the price can also be reduced. It has better economy, better functionality, and good usability.

The present invention forms a multi-pipe structure, which connects the evaporation part 21, the steam channel 22, the condensation part 23, and the fluid return channel 24 in series on the closed circuit 2, and the steam channel 22 is a pair of pipelines, that is to say, it can be provided with A single pipeline or more than two pipelines form a parallel steam channel; the fluid return channel 24 is only provided with a single pipeline, but two fluid return channels can also be arranged to form a parallel connection to form a series-parallel structure, which can be suitable for generating The more efficient heat transfer and exchange device utilizes the guiding effect of the flow resistance of the circuit 2, so that the circuit 2 of the present invention will hardly have a dry phenomenon, so it can produce good heat transfer performance in a limited space. and large heat transfer; using the phenomenon of heat flow asymmetry in the loop 2 and the guide loop 2, the present invention becomes a circular pipeline, that is, the non-condensable gas existing in the present invention can be continuously passed along the loop 2 Circulating flow greatly improves the temperature uniformity of the present invention, so even if there is non-condensable gas in the loop 2, it has little effect on the functional characteristics of the present invention, and can prolong the service life of the present invention.

Claims (13)

1, a kind of heat exchange assembly for looped heat pipe, it comprises that two ends are the loop of evaporation part and condensation part; It is characterized in that described loop is the loop of cascade evaporation portion, steam channel, condensation part, fluid Return Channel in regular turn; Be filled with liquid in the loop; Fluid Return Channel and steam channel are pipeline independently separately; The flow resistance of fluid in the fluid Return Channel is greater than the flow resistance of fluid in the steam channel.

2, heat exchange assembly for looped heat pipe according to claim 1 is characterized in that described evaporation part and/or condensation part are pipeline.

3, heat exchange assembly for looped heat pipe according to claim 1 is characterized in that the winding of described evaporation part is provided with the heat biography piece of channel; Heat passes piece and connects steam channel and fluid Return Channel with connecting channel.

4, heat exchange assembly for looped heat pipe according to claim 1, the heat-exchange device that it is characterized in that the heat radiation of described evaporation part and desire joins, and the heat-exchange device of desire heat radiation can be the condensation part in the heat transfer block of thermal source, the fins group of being heated, heating water sleeve or another group loop.

5, heat exchange assembly for looped heat pipe according to claim 1 is characterized in that described steam channel is the above steam channels that form parallel connection of two pipelines.

6, heat exchange assembly for looped heat pipe according to claim 1 is characterized in that the winding of described condensation part is provided with the contiguous block of connecting channel; Contiguous block is connected steam channel and fluid Return Channel with connecting channel.

7, heat exchange assembly for looped heat pipe according to claim 1 is characterized in that described condensation part and heat-exchange device join, and heat-exchange device is the evaporation part in radiating fin group, radiator, cooling tower or another group loop.

8, heat exchange assembly for looped heat pipe according to claim 1 is characterized in that described fluid Return Channel forms fluid-tight with liquid.

9, heat exchange assembly for looped heat pipe according to claim 1 is characterized in that described fluid Return Channel is the above fluid Return Channels that form parallel connection of two pipelines.

10, heat exchange assembly for looped heat pipe according to claim 1, the flow resistance that it is characterized in that described fluid Return Channel greater than the flow resistance of steam channel be fluid Return Channel sectional area less than or length greater than steam channel sectional area or length; Also can be fluid Return Channel sectional area less than reaching length greater than steam channel sectional area and length.

11, heat exchange assembly for looped heat pipe according to claim 1 is characterized in that being provided with in the described fluid Return Channel the big flow resistance of formation and guides the capillary structure that condensed fluid returns the evaporation part.

12, heat exchange assembly for looped heat pipe according to claim 11 is characterized in that described liquid-filled amount means by filling up capillary structure to the volume that fills up loop 90%.

13, heat exchange assembly for looped heat pipe according to claim 11 is characterized in that described capillary structure extends to the evaporation part separately or extends to the condensation part separately or extend to evaporation part and condensation part simultaneously; Capillary structure is pottery, sintered powder, foaming metal, mesh grid, sintering net, channel form plate, fibre bundle or helix.

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