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CN1364251A - cooling device for electronic components - Google Patents

cooling device for electronic components Download PDF

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Publication number
CN1364251A
CN1364251A CN01800534.9A CN01800534A CN1364251A CN 1364251 A CN1364251 A CN 1364251A CN 01800534 A CN01800534 A CN 01800534A CN 1364251 A CN1364251 A CN 1364251A
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heat transfer
mentioned
transfer medium
heat
cooling
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乌尔里希·菲舍尔
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EKL AG
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EKL AG
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a cooling device for electronic components, in particular microprocessors. The inventive device has at least one passive heat-transferring cooling element (12). At least a portion of the passive cooling element (12) is connected to at least one solid-state-accumulating heat transfer medium (20), the heat transfer medium (20) being a Phase Change Material (PCM) having a heat absorption capacity many times greater than that of water and being designed as a PCM device. The heat transfer medium (20) stores heat generated by the loading of the electronic component and which cannot be absorbed and released by the passive cooling component (18) any more, thereby retaining its solid state of aggregation. When the load of the electronic component is small, the medium releases the heat.

Description

电子元件的冷却装置cooling device for electronic components

本发明涉及一种电子元件，尤其是微处理器的冷却装置，该装置具有至少一个被动传热冷却部件。The invention relates to a cooling device for electronic components, in particular a microprocessor, having at least one passive heat transfer cooling component.

在现有技术中已经知道有许多种上述类型的电子元件冷却装置。这些装置尤其包括被动传热冷却部件，这些被动传热冷却部件尤其是由铝制成并安装在电子元件上，由此来有效地与该电子元件相互接触。该冷却部件利用粘接剂或特定支承的方式来附着在上述电子元件上。通常还要有附加的风扇形式的主动冷却部件放置在上述被动冷却部件上或者结合在该被动冷却部件内。A large number of cooling devices for electronic components of the above-mentioned type are known in the prior art. These devices include in particular passive heat transfer cooling components made in particular of aluminum and mounted on the electronic component so as to be in effective mutual contact with the electronic component. The cooling component is attached to the above-mentioned electronic component by means of an adhesive or a specific support. Usually there is also an additional active cooling component in the form of a fan placed on or integrated within the above passive cooling component.

现有技术中的这些系统全都是基于通过蒸发、冷凝、对流和耗散的传热原则，或者它们的特征在于通过不同材料组合和具有不同传热能力和/或热阻的表面结构进行冷却。These systems of the prior art are all based on the principle of heat transfer by evaporation, condensation, convection and dissipation, or they are characterized by cooling by different material combinations and surface structures with different heat transfer capacities and/or thermal resistances.

然而，这些现有技术中系统的缺点是在应用到功率更强的电子元件时，特别是由于越来越高的微处理器时钟频率，所产生的热量会急剧增加。然而，由于这些电子元件仅在一定温度范围内合适地工作，过高的温度会使它们发生故障或者丧失相当多的功率，因此，对相应冷却装置的要求也逐渐提高。现有技术中的上述冷却器已不再能实现理想及所需的冷却程度。However, a disadvantage of these prior art systems is that the heat generated increases dramatically when applied to more powerful electronic components, especially due to increasingly higher clock frequencies of microprocessors. However, since these electronic components only work properly within a certain temperature range, excessive temperatures can cause them to malfunction or lose a considerable amount of power, and therefore, the requirements for corresponding cooling devices are gradually increasing. The aforementioned coolers of the prior art are no longer able to achieve the desired and required degree of cooling.

因此，本发明的目的是提供一种用于冷却电子元件、尤其是微处理器的冷却装置，该装置具有至少一个被动传热冷却部件，并且能在即使有大量的热量集聚时确保对电子元件进行充分的冷却。It is therefore an object of the present invention to provide a cooling device for cooling electronic components, in particular microprocessors, which has at least one passive heat transfer cooling component and which ensures the cooling of the electronic components even when there is a substantial heat build-up. Allow to cool sufficiently.

上述目的是通过一种具有如权利要求1所述特征的冷却装置而实现的。The above object is achieved by a cooling device having the features of claim 1 .

在从属权利要求中描述了有利的实施例。Advantageous embodiments are described in the dependent claims.

本发明的电子元件冷却装置包括至少一个被动传热冷却部件，该被动冷却部件的至少一部分与至少一个处于集聚固态的传热介质相接触。该传热介质在该实施例中是一个热容量例如比水高许多的相变材料(PCM)。另外，该传热介质已经被设计成一个潜在的蓄热器，以便在保持住其集聚固态的同时，储存电子元件上负载所产生的同时又不能再被被动冷却部件吸收和释放的热量，上述电子元件上的负载较小时，该传热介质再释放出上述热量。这样就确保了在即使有大量的热量集聚时也能对电子元件、尤其是微处理器进行充分的冷却。同时，传热介质能够吸收暂时产生的额外热量并在负载回复正常时，也就是电子元件再次产生正常热量时，释放该热量。由此就能避免出现热负载的峰值，在使用传统冷却装置时，这种热负载峰值通常会很明显地减小电子元件尤其是微处理器的功率。结果，本发明的冷却装置同样允许增加冷却部件的功率。利用本发明的冷却装置进行冷却时，由于避免了热负载峰值的损害，因而电子元件的工作寿命和操作性会进一步提高。由于用作传热介质的相变材料将在吸收热量的同时也保持住其集聚固态，因此有利地避免由于相变材料膨胀而产生的问题，这就与已知材料的情况相反。The electronic component cooling device of the present invention includes at least one passive heat transfer cooling component, at least a portion of which is in contact with at least one heat transfer medium in a concentrated solid state. The heat transfer medium is in this embodiment a phase change material (PCM) having a heat capacity much higher than water, for example. Additionally, the heat transfer medium has been designed as a potential heat accumulator to store heat generated by loads on electronic components that can no longer be absorbed and dissipated by passively cooled components while maintaining its concentrated solid state, as described above When the load on the electronic components is low, the heat transfer medium releases the above-mentioned heat again. This ensures adequate cooling of the electronic components, especially the microprocessor, even with a substantial heat build-up. At the same time, the heat transfer medium is able to absorb the temporarily generated extra heat and release it when the load returns to normal, that is, when the electronic components generate normal heat again. This avoids thermal load peaks which, when conventional cooling devices are used, usually significantly reduce the power of the electronic components, especially the microprocessor. As a result, the cooling device of the invention also allows increasing the power of the cooling components. When the cooling device of the present invention is used for cooling, the working life and operability of the electronic components will be further improved due to the avoidance of heat load peak damage. Since a phase change material used as a heat transfer medium will absorb heat while retaining its concentrated solid state, problems due to expansion of the phase change material are advantageously avoided, as is the case with known materials.

在本发明冷却装置的一个最佳实施例中，上述传热介质包括盐或富含有机物质的盐混合物，以及包括精细金属粉末形状的物质，用于提高传热能力。通常，传热介质的有机成分是石蜡。这种传热介质同样在吸收热量的同时保持住其集聚固态，这样可以以小块或小球的形状和/或作为一个固体主体安装在上述冷却部件的内部和/或者上方。这样就使得一方面能经济地生产该冷却装置，另一方面又确保了该冷却装置保持在较小的尺寸。另外，根据本发明，同样可能单个地将传热介质调整到冷却电子元件的所需操作温度。这种调整是通过改变传热介质的成分种类和数量而实现的。特别是，同样可能调整由传热介质所缓冲的热量。另外，该传热介质的另一优点在于无毒、可重复利用。In a preferred embodiment of the cooling device of the present invention, the above-mentioned heat transfer medium comprises salt or a salt mixture rich in organic substances, as well as substances in the form of fine metal powders for enhancing the heat transfer capability. Typically, the organic component of the heat transfer medium is paraffin. This heat transfer medium also retains its concentrated solid state while absorbing heat, so that it can be mounted in and/or above the aforementioned cooling element in the form of pellets or pellets and/or as a solid body. This enables economical production of the cooling device on the one hand and ensures that the cooling device remains small in size on the other hand. Furthermore, according to the invention it is likewise possible individually to adjust the heat transfer medium to the desired operating temperature for cooling the electronic components. This adjustment is achieved by changing the type and quantity of the components of the heat transfer medium. In particular, it is likewise possible to adjust the amount of heat buffered by the heat transfer medium. In addition, another advantage of the heat transfer medium is that it is non-toxic and reusable.

在本发明冷却装置的一个最佳实施例中，上述被动冷却部件包括至少一个主动的冷却部件，有时是一个风扇。这将能有利地确保进一步提高该冷却装置的冷却能力。In a preferred embodiment of the cooling device according to the invention, said passive cooling means comprises at least one active cooling means, sometimes a fan. This will advantageously ensure a further increase in the cooling capacity of the cooling device.

在本发明冷却装置的另一个最佳实施例中，上述传热介质容纳在一个由传热材料制成的容器内，该容器与上述被动冷却部件相接触。将传热介质放置在一个容器内使得能在上述被动冷却部件内部或者上方很容易替换单个传热部件。In another preferred embodiment of the cooling device of the present invention, the above-mentioned heat transfer medium is accommodated in a container made of heat transfer material, and the container is in contact with the above-mentioned passive cooling component. Placing the heat transfer medium in a container allows for easy replacement of individual heat transfer components within or above the aforementioned passive cooling components.

在本发明冷却装置的另一个最佳实施例中，在上述被动冷却部件的接触面和电子元件的一个相应接触面之间设置有一个传热箔片。这个措施通过使最佳热量从电子元件传导到被动冷却部件，从而确保了进一步提高本冷却装置所得到的整体冷却能力。In another preferred embodiment of the cooling device according to the invention, a heat transfer foil is arranged between the contact surface of the above-mentioned passive cooling component and a corresponding contact surface of the electronic component. This measure ensures a further increase in the resulting overall cooling capacity of the cooling device by allowing optimum heat conduction from the electronic components to the passively cooled components.

本发明还涉及一种具有处理器插座和至少一个安装在其上的冷却装置的处理器，其中上述冷却装置包括至少一个被动传热冷却部件，该被动冷却部件的至少一部分与至少一个处于集聚固态的传热介质相接触。该传热介质在该实施例中是一个吸热能力例如比水高许多的相变材料(PCM)。另外，该传热介质已经被设计成一个潜在的蓄热器，以便保持住其集聚固态的同时，储存住处理器上负载所产生的同时又不能再被被动冷却部件吸收和释放的热量，在上述处理器上的负载较小时，该传热介质再释放出上述热量。The invention also relates to a processor having a processor socket and at least one cooling device mounted thereon, wherein said cooling device comprises at least one passive heat transfer cooling component, at least a part of which is in a concentrated solid state with at least one contact with the heat transfer medium. The heat transfer medium is in this embodiment a phase change material (PCM) with a much higher heat absorbing capacity than water, for example. In addition, the heat transfer medium has been designed to act as a potential heat accumulator in order to maintain its accumulated solid state while storing the heat generated by the load on the processor that can no longer be absorbed and dissipated by passively cooled components. When the load on the processor is small, the heat transfer medium releases the heat.

本发明还涉及一种传热介质的用途，该传热介质为集聚固态，用于冷却微处理器，该传热介质是一个吸热能力例如比水大许多的相变材料(PCM)并且已经被设计成一个潜在的蓄热器。该传热介质将在保持住其集聚固态的同时，储存住微处理器上负载所产生的热量，在上述微处理器上的负载较小时，该传热介质再释放出上述热量。The present invention also relates to the use of a heat transfer medium in the form of a concentrated solid state for cooling a microprocessor, the heat transfer medium being a phase change material (PCM) with a heat absorbing capacity much greater than, for example, water and which has been is designed as a potential heat accumulator. The heat transfer medium will store the heat generated by the load on the microprocessor while maintaining its accumulated solid state, and release the heat again when the load on the microprocessor is light.

本发明进一步的细节、特征以及有益效果可以从附图所示的实施例中得出。Further details, features and advantages of the invention can be derived from the embodiments shown in the drawings.

图1是本发明冷却装置的示意性截面图；Fig. 1 is a schematic cross-sectional view of a cooling device of the present invention;

图2是图1所示本发明冷却装置的示意性俯视图；和Fig. 2 is a schematic top view of the cooling device of the present invention shown in Fig. 1; and

图3是图1所示本发明冷却装置的示意性侧视图。Fig. 3 is a schematic side view of the cooling device of the present invention shown in Fig. 1 .

图1是用于冷却电子元件、尤其是微处理器的冷却装置10的示意性截面图，该装置包括一个被动传热冷却部件12，该冷却部件12包括若干冷却肋或叶片14。这些冷却肋或者叶片14安装在该冷却部件12的底部部件16上。在冷却肋或叶片14的相反侧，上述底部部件16形成有一个可与需要被冷却的电子元件相接触的表面。1 is a schematic cross-sectional view of a cooling device 10 for cooling electronic components, in particular microprocessors, comprising a passive heat transfer cooling element 12 comprising cooling ribs or fins 14 . The cooling ribs or vanes 14 are mounted on the bottom part 16 of the cooling part 12 . On the opposite side of the cooling ribs or vanes 14, the bottom part 16 is formed with a surface which can come into contact with the electronic components to be cooled.

被动冷却部件12由铝或铝合金制成，并且通常为单件式部件。在图中可看出，在该冷却部件12内的冷却肋或叶片14之间设置有若干传热介质20。传热介质处于集聚固态，并分别与冷却肋或叶片14、底部部件16或者冷却部件12形成传热接触。在本实施例中，该传热介质是一个吸热能力例如比水高许多的相变材料PCM。由于该传热介质为集聚的固态，并且在吸热的同时能保持住该集聚固态，因此不必使传热介质20或冷却部件12具有密封的性质。将单个传热介质20制成在上述冷却部件12内部就已足够。该传热介质另外被设计成一个PCM装置的形式，以便在保持住其集聚固态的同时，储存电子元件上负载所产生的同时又不能再被被动冷却部件吸收和释放的热量，上述电子元件上的负载较小时，该传热介质再释放出上述热量。Passive cooling component 12 is made of aluminum or an aluminum alloy and is typically a one-piece component. It can be seen in the figure that a number of heat transfer media 20 are arranged between the cooling ribs or vanes 14 in the cooling part 12 . The heat transfer medium is in a concentrated solid state and is in heat transfer contact with the cooling ribs or vanes 14, the bottom part 16 or the cooling part 12, respectively. In this embodiment, the heat transfer medium is a phase change material PCM with a much higher heat absorption capacity than water, for example. Since the heat transfer medium is an aggregated solid state and can retain the aggregated solid state while absorbing heat, it is not necessary for the heat transfer medium 20 or the cooling member 12 to have sealing properties. It is sufficient to make a single heat transfer medium 20 inside the above-mentioned cooling member 12 . The heat transfer medium is additionally designed in the form of a PCM device in order to store the heat generated by the load on the electronic components which can no longer be absorbed and dissipated by the passive cooling components while maintaining its accumulated solid state. When the load is small, the heat transfer medium releases the above heat again.

图2是图1中冷却装置10的示意性俯视图。该图示出单个传热介质20在冷却部件12的冷却肋或叶片14之间的设置。FIG. 2 is a schematic top view of the cooling device 10 in FIG. 1 . The figure shows the arrangement of a single heat transfer medium 20 between the cooling ribs or vanes 14 of the cooling component 12 .

图3是图1中冷却装置10的示意性侧视图。该图示出冷却部件12在底部部件16区域并且在其两侧处包括连接装置22，用于将冷却装置10与需被冷却的电子元件连接在一起。另外，可以看到，在所示实施例中，传热介质20设置成盘形形状。然而，该传热介质20的尺寸和形状可以任意选择。该传热介质20的尺寸和形状尤其将允许调节单个需被冷却的电子元件的所需操作温度。FIG. 3 is a schematic side view of the cooling device 10 in FIG. 1 . The figure shows that the cooling part 12 comprises, in the region of the bottom part 16 and on both sides thereof, connection means 22 for connecting the cooling device 10 with the electronic components to be cooled. Additionally, it can be seen that in the illustrated embodiment, the heat transfer medium 20 is provided in the shape of a disc. However, the size and shape of the heat transfer medium 20 can be selected arbitrarily. The size and shape of the heat transfer medium 20 will in particular allow adjustment of the desired operating temperature of the individual electronic components to be cooled.

Claims (13)

1. the cooling device of an electronic component, especially microprocessor, this device has at least one passive heat transfer cooling-part (12), it is characterized in that,
At least a portion of this passive cooling-part (12) is with at least one and gathers solid-state heat transfer medium (20) and contact, this heat transfer medium (20) is that a heat absorption capacity is than the big many phase-change materials (PCM) of water and be designed to a potential thermofor, this heat transfer medium (20) is storing electronic component is being loaded and the heat that can not be absorbed and discharge by passive cooling-part (18) again when producing, maintaining it thus gathers solid-state, in the load of above-mentioned electronic component hour, above-mentioned medium discharges above-mentioned heat again.
2. cooling device as claimed in claim 1 is characterized in that, above-mentioned heat transfer medium (20) comprises inorganic salts or is rich in the salt mixture of organic substance, and the material that comprises the fine metal powder shape, is used to improve heat-transfer capability.
3. cooling device as claimed in claim 2 is characterized in that, the organic principle of above-mentioned heat transfer medium (20) is a paraffin.
4. as any one described cooling device in the above-mentioned claim, it is characterized in that above-mentioned heat transfer medium (20) can be adjusted to required operating temperature.
5. any one described cooling device as in the above-mentioned claim is characterized in that, above-mentioned heat transfer medium (20) is with the shape of fritter or bead and/or be installed in the inside and/or the top of above-mentioned cooling-part (12) as a solid body.
6. any one described cooling device as in the above-mentioned claim is characterized in that above-mentioned heat transfer medium (20) is nontoxic and can reuse.
7. as any one described cooling device in the above-mentioned claim, it is characterized in that above-mentioned passive cooling-part (12) is made by aluminum or aluminum alloy.
8. as any one described cooling device in the above-mentioned claim, it is characterized in that, be provided with the cooling-part of an active on the above-mentioned passive cooling-part (12) at least.
9. cooling device as claimed in claim 8 is characterized in that, the cooling-part of above-mentioned active is a fan.
10. any one described cooling device as in the above-mentioned claim is characterized in that above-mentioned heat transfer medium (20) is contained in the container of being made by heat-transfer matcrial, and this container contacts with above-mentioned passive cooling-part (12).
11. as any one described cooling device in the above-mentioned claim, it is characterized in that, between a corresponding contact face of the surface of contact (18) of above-mentioned passive cooling-part (12) and electronic component, be provided with a heat transfer paillon foil.
12. one kind has processor socket and is installed in the processor of the cooling device on this processor with at least one, it is characterized in that, above-mentioned cooling device (10) comprises at least one passive heat transfer cooling-part (12), at least a portion of this passive cooling-part (12) is in at least one to be gathered solid-state heat transfer medium (20) and contacts, this heat transfer medium (20) is heat absorption capacity phase-change material (PCM) more much higher than water and has been designed to a potential thermofor, this heat transfer medium (20) maintain its gather solid-state in, store the heat that can not be absorbed and discharge by passive cooling-part (18) more again when load produces on the processor, load on above-mentioned processor hour, this heat transfer medium discharges above-mentioned heat again.
13. the purposes of a heat transfer medium, this heat transfer medium is for gathering solid-state and being used to cool off microprocessor, this heat transfer medium is that a heat absorption capacity is than the big many phase-change materials (PCM) of water and be designed to a potential thermofor, this heat transfer medium will maintain its gather solid-state in, store the heat that load produced on the microprocessor, load on above-mentioned microprocessor hour, this heat transfer medium discharges above-mentioned heat again.
CN01800534.9A 2000-03-16 2001-03-08 cooling device for electronic components Pending CN1364251A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10012990A DE10012990A1 (en) 2000-03-16 2000-03-16 Cooling device for electronic components
DE10012990.0 2000-03-16

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CN1364251A true CN1364251A (en) 2002-08-14

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EP (1) EP1198745A1 (en)
JP (1) JP2003527753A (en)
CN (1) CN1364251A (en)
CA (1) CA2374008A1 (en)
DE (1) DE10012990A1 (en)
TW (1) TW499749B (en)
WO (1) WO2001069360A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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CN102548355A (en) * 2010-12-31 2012-07-04 联想(北京)有限公司 Electronic equipment

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US7184265B2 (en) 2003-05-29 2007-02-27 Lg Electronics Inc. Cooling system for a portable computer
US7188484B2 (en) 2003-06-09 2007-03-13 Lg Electronics Inc. Heat dissipating structure for mobile device
CN100407097C (en) * 2003-06-09 2008-07-30 Lg电子株式会社 Heat Dissipation Structure of Mobile Devices
CN102548355A (en) * 2010-12-31 2012-07-04 联想(北京)有限公司 Electronic equipment
CN102548355B (en) * 2010-12-31 2015-04-29 联想(北京)有限公司 Electronic equipment

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