CN1224098C - Heat dissipation component for solid-state light emitting device package and manufacturing method thereof - Google Patents

Abstract

A Light Emitting Diode (LED) having a heat dissipation structure and a method of manufacturing the same, characterized in that: an electrically insulating cooling liquid for heat dissipation is filled in a closed chamber where a metal substrate on which at least one LED chip is mounted is located. The heat dissipation structure is formed as a metal wall portion standing on the metal substrate for supporting a transparent lid portion on the closed chamber at a proper position. The vertical wall part is closely surrounded with at least one LED chip, so that the generated Joule heat can be quickly diffused to the vertical wall part through the heat-dissipating electric insulation cooling liquid and then diffused to the metal substrate along the wall part, and the metal substrate is connected to a large external heat sink for heat dissipation through a printed circuit board, so as to avoid the overheating phenomenon of the LED. The invention can also avoid the adverse scattering effect of the bubbles on the light emitted by the LED.

Description

Heat dissipation component for solid-state light emitting device package and manufacturing method thereof

technical field

The present invention relates to a heat dissipation member for light emitting diodes (LEDs), especially LEDs that can be operated at extremely high driving currents, so that in applications that require extremely high brightness, the required brightness can be stably emitted.

Background technique

A light-emitting diode (LED), as it literally means, is a light-emitting device composed of semiconductor p-n junction diodes. Recently, LEDs have been applied only as instrument indicators or display signals thereof whose low brightness does not cause adverse effects. For example, it is used in applications such as power On/Off indicators in television (TV) systems, or digital display signals on clocks and electronic panels, where the brightness is only for the naked eye to distinguish at a very short distance. And its power consumption is extremely small, and its heat dissipation effect does not need to be considered.

However, due to recent advances in LED technology, LEDs have also become brighter and have more colors, including deep blue to beyond visible light and so on. Therefore, the application of visible light LEDs has far exceeded the scope of previous expectations, such as outdoor color displays, traffic lights, car lights and so on. In these applications, clustered LED bulbs are used to obtain sufficient brightness. However, the structure of the cluster not only requires extremely labor-intensive assembly, but also produces a very large package, which leads to problems related to optical design and heat dissipation.

Therefore, currently, an LED assembly having a chip or an array of chips embedded in a dense structure and capable of emitting high-brightness light is the key to related industries.

Contents of the invention

Therefore, an object of the present invention is to provide a heat dissipation component of a light emitting device, which prevents the light emitting device with the heat dissipation component from temperature rise, and is suitable for applications with high brightness, high current, and small size.

Another object of the present invention is to provide a package for a light emitting device. According to the structure of the package, the emitted light can be concentrated into a beam suitable for a specific application, and the heat generated therein can be dissipated extremely easily.

According to one embodiment of the present invention, there is provided a heat dissipation component for a light-emitting device package, comprising: a metal substrate having an upper surface and a lower surface, the upper surface is formed as a cup-shaped portion, and a lower surface opposite to the upper surface having a metal solder layer formed thereon, wherein the cup-shaped portion has an inner surface and an outer surface, and the outer surface has a metal oxide layer formed thereon, the metal oxide layer and the inner surface of the cup-shaped portion both have an electrode layer is formed thereon, and the electrode layer has two separate electrodes, one electrode is formed on the inner surface of the cup and the other electrode is formed on the outer surface of the cup; an electrically insulating cooling liquid, filled in the cup-shaped part, and is limited by the inner surface of the cup-shaped part; and a transparent cover part, which is tightly connected to the metal substrate, and seals the electrically insulating cooling liquid filled in the cup-shaped part in the cup Among the shaped parts, the transparent cover part has an inner surface formed as a convex surface facing the light emitting device.

Preferably, the metal substrate is made of a heat-conducting material.

Preferably, the metal oxide layer is composed of an oxide of the thermally conductive material.

Moreover, the heat dissipation component of the light-emitting device package also includes a printed circuit board, wherein the printed circuit board is at least composed of the heat-conducting material; at least one electrode is formed on one surface of the printed circuit board; and at least one electrode is bonded to the metal solder layer , and bonding another at least one electrode to another electrode at the bottom of the outer surface of each cup, so that the light emitting device package is electrically connected to the printed circuit board.

Preferably, the electrode layer is made of a reflective metal.

Preferably, the transparent cover has an outer surface formed as another convex surface opposite to the convex surface of its inner surface.

According to another embodiment of the present invention, there is provided a method for manufacturing a heat dissipation member of a light-emitting device package, which includes the following steps: a preparation step, preparing a metal substrate, wherein the metal substrate will have an upper surface on which and form There are a plurality of cup-shaped parts, and the upper surface is subjected to a surface polishing treatment; an electroplating step, a metal solder layer is electroplated on the lower surface of the metal substrate; an ink filling step, an insulating ink is filled into a plurality of In the cup-shaped portion, so that an upper edge of the insulating ink is substantially flush with an upper edge of each cup-shaped portion; an anodizing step, on the upper surface of the metal substrate except the inner surface of each cup-shaped portion A metal oxide layer is formed on it, and the inner surface of each cup-shaped portion is protected by insulating ink from forming a metal oxide layer; an ink removal step, removing the insulating ink; an electroplating step, on the metal oxide layer and An electrode layer is electroplated on the inner surface of each cup-shaped part; an electrode separation step removes the inner side of the upper edge of each cup-shaped part, and simultaneously removes the local metal oxide layer on the inner side of the upper edge of each cup-shaped part And the electrode layer, thereby the electrode layer is divided into an electrode located on the inner surface of each cup-shaped part, and another electrode located on the outer surface of each cup-shaped part; a mounting step, an electrode of the light-emitting device Installed on the electrode on the bottom side of the inner surface of each cup-shaped portion, and using a wire bonding method to connect another electrode of the light-emitting device to another electrode on the outer surface of each cup-shaped portion; a filling step , filling an electrically insulating cooling liquid into a plurality of cup-shaped parts, so that an upper edge of the cooling liquid is substantially aligned with an upper edge of each cup-shaped part; a coating step, a glue material Coating on the periphery of the bottom of the outer surface of each cup-shaped portion; a covering step, covering each cup-shaped portion with a transparent cover, and using the glue to make the front peripheral edge of the transparent cover and The periphery of the bottom of the outer surface of each cup-shaped part is closely connected together; and a cutting step, cutting the metal substrate to form the light emitting device package.

Preferably, in the preparation step, the metal substrate is made of a heat-conducting material.

Preferably, in the anodizing step, the metal oxide layer is formed of an oxide of the thermally conductive material.

Moreover, the manufacturing method of the heat dissipation member of the light-emitting device package further includes the following steps: an installation step, installing the light-emitting device package on a printed circuit board, wherein the printed circuit board is at least composed of the heat-conducting material; the printed circuit board At least one electrode is formed on one surface of the circuit board; and the light-emitting device is packaged by bonding the at least one electrode to the metal solder layer, and bonding another at least one electrode to the bottom of the outer surface of each cup-shaped portion. Electrically connect to the printed circuit board.

Preferably, during the electroplating step of electroplating the electrode layer over the metal oxide layer and the inner surface of each cup-shaped portion, the electrode layer consists of a light-reflecting metal.

Preferably, in the covering step, an inner surface of the transparent cover is formed as a convex surface, and an outer surface of the transparent cover is formed as another convex surface opposite to the convex surface.

Description of drawings

1 is a configuration diagram of an LED package with a heat dissipation member according to a first embodiment of the present invention, wherein the package has been mounted on an external substrate.

2A to 2L are schematic diagrams of a manufacturing method of a heat dissipation member of a light emitting device package according to a second embodiment of the present invention.

Fig. 3 is a configuration diagram of a variation of the first embodiment according to the present invention.

Fig. 4 is a configuration diagram of another variation of the first embodiment according to the present invention.

Detailed ways

In the description of the following preferred embodiments, referring to FIG. 1 , a solid-state light emitting device package 1 with a heat dissipation member according to a first embodiment of the present invention is described.

The solid state light emitting device package 1 includes a metal substrate 10 , at least one LED chip 20 , an electrically insulating cooling liquid 30 , a transparent cover 40 , and a printed circuit board (PCB) 50 .

The metal substrate 10, which is preferably made of a material having excellent thermal conductivity such as aluminum, copper, etc., is formed with an upstanding wall portion 16 on one surface thereof, so that the surface of the metal substrate 10 will be formed as a cup-shaped portion 11. . Moreover, on the other surface of the metal substrate 10 opposite to the cup-shaped portion 11, there is a metal solder layer 12 such as copper, silver, or gold for connecting to the electrode 51 of the PCB 50, and preferably, the PCB 50 is Aluminum based PCB. For example, the metal solder layer 12 may be electrically connected to the electrode 51 using surface mount technology (SMT). Also, a metal oxide layer 14 which functions as an insulating layer and is preferably an aluminum oxide layer (aluminum oxide) is first formed on the outer surface of the cup-shaped portion 11, but not formed on the inner surface of the cup-shaped portion 11. above. Next, an electrode layer 15, preferably a reflective metal such as silver, gold, or aluminum, is formed over both the aluminum oxide layer 14 and the inner surface of the cup 11 so as to cover them.

In detail, the electrode layer 15 is formed over the aluminum oxide layer 14 and the entire inner surface of the cup portion 11 . In this case, with appropriate processing, the inner side of the upper edge of the cup-shaped portion 11 is removed, and at the same time, the upper local aluminum oxide layer 14 and the local electrode layer 15 on the outer side of the upper edge of the cup-shaped portion can be removed, so that the The electrode layer 15 is divided into two parts, one is called the electrode 15b, which is located on the inner surface of the cup and is substantially connected to the metal substrate 10, and the other is called the electrode 15a, which is located on the outer surface of the cup and has an insulating function. The aluminum oxide layer 14 is used as an individual external electrode of the metal substrate 10 . Preferably, appropriate processing is adopted for forming the electrodes 15a and 15b, such as mechanical grinding.

When the metal substrate 10 has the above-mentioned structure, at least one LED chip 20 is mounted on an area of the electrode 15b, and this area is located at the bottom side of the inner surface of the cup-shaped portion 11, so that the at least one LED chip 20 can be mounted on the electrode 15b. One side of the chip 20 is electrically connected to the electrode 15b. Moreover, the other side of the at least one LED chip 20 is electrically connected to at least one area of the electrode 15 a, and at least one area of the electrode 15 a is located on the upper edge of the outer surface of the cup-shaped portion 11 . In this case, the electrically insulating cooling liquid 30 confined in the cup-shaped portion 11, preferably, an electrically insulating fluid such as pure water, liquid silicone resin, etc., is filled to a predetermined height of the cup-shaped portion 11, and then The transparent cover 40 whose inner surface and the outer surface of the cup-shaped part 11 are in a tight fit state uses glue to make the front peripheral edge of the transparent cover 40 and the part of the opposite metal substrate 10 close together, so that the The cover portion 40 is fixed on the cup portion 11 . In order to avoid residual air bubbles 31 remaining in the cup-shaped portion 11 due to insufficient filling, causing the light emitted by the LED chip 20 to pass through the residual air bubbles 31 and causing unfavorable scattering phenomena, the cooling liquid that is electrically insulated The inner surface of the transparent cover 40 that 30 touches is designed as a convex surface, preferably, it is designed as a nipple-shaped surface, so that the buoyancy effect can be used to prevent residual bubbles 31 from remaining in the path through which the light emitted by the LED chip 20 passes. superior.

After the electrode 15a is properly electrically connected to the electrode 52 of the PCB 50, the solid-state light-emitting device package 1 with a heat dissipation member provided according to the first embodiment of the present invention can be mounted on the external substrate 60, which inherently has functions as Great external heatsink feature. Therefore, according to the heat dissipation member of the present invention, the Joule heat generated by at least one LED chip 20 that emits light can quickly spread to the upright cup-shaped portion 11 through the heat-dissipating electrically insulating cooling liquid 30 , and along the cup-shaped portion 11 And diffuse down to the metal substrate 10 , and the metal substrate 10 is bonded to the external substrate 60 for heat dissipation through the PCB 50 , so that the temperature of the LED chip 20 that emits light can be avoided from rising.

Moreover, the electrically insulating cooling liquid 30 and the transparent cover 40 can be selected whose individual refractive indices are very close, so that the refraction effect caused by the two constituent materials can be minimized. In addition, the outer surface of the transparent cover portion 40 can be selectively shaped into an optical profile, so that the light emitted by the at least one LED can be concentrated to form a beam of light for a specific purpose.

Referring to FIG. 2A to FIG. 2L , the manufacturing method of the heat dissipation member of the solid-state light emitting device package 1 according to the second embodiment of the present invention will be described.

First, as shown in FIG. 2A , a metal substrate 10 is prepared, wherein a plurality of cup-shaped portions 11 are formed on a surface of the metal substrate 10 , and a surface polishing treatment is applied to the surface.

Next, as shown in FIG. 2B , a metal solder layer 12 is electroplated on the other surface of the metal substrate. Preferably, the metal solder layer 12 is made of copper, silver, or gold.

Next, as shown in FIG. 2C , an insulating ink 13 is filled into the plurality of cup-shaped portions 11 , so that the upper edge of the insulating ink 13 is substantially aligned with the upper edge of each cup-shaped portion 11 .

Next, as shown in FIG. 2D, anodizing is performed to form a metal oxide layer 14 on the surface of the metal substrate 10 except the inner surface of each cup-shaped portion 11, and each cup-shaped portion 11 The inner surface is then protected by insulating ink 13 from the formation of metal oxide layer 14 . Preferably, the metal oxide layer 14 is an aluminum oxide layer (aluminum oxide).

Next, as shown in FIG. 2E, the insulating ink 13 is removed.

Next, as shown in FIG. 2F, an electrode layer 15 is electroplated on the inner surface of the metal oxide layer 14 and each cup-shaped portion 11. Preferably, the electrode layer 15 is a reflective metal such as silver, gold, or aluminum. constituted.

Then, as shown in FIG. 2G , remove the inner side of the upper edge of each cup-shaped portion 11 with a rotating drill 17, and simultaneously remove the upper local metal oxide layer 14 and electrode layer 15 on the outer side of the upper edge of each cup-shaped portion 11. , so that the electrode layer 15 can be divided into an electrode 15b located on the inner surface of each cup-shaped portion 11, and another electrode 15a located on the outer surface of each cup-shaped portion.

Next, as shown in FIG. 2H , install an electrode of at least one LED chip 20 on the electrode 15b on the bottom side of the inner surface of each cup-shaped portion 11, and use a wire bonding method to bond the other electrode of at least one LED chip 20. One electrode is connected to the other electrode 15a on the outer surface of each cup.

Next, as shown in FIG. 2I , an electrically insulating cooling liquid 30 is filled into the plurality of cup-shaped portions 11 , so that an upper edge of the cooling liquid 30 is substantially aligned with an upper edge of each cup-shaped portion 11 . Preferably, the cooling liquid 30 is an electrically insulating fluid such as pure water or liquid silicone resin.

Next, as shown in FIG. 2J , an adhesive material 41 is coated on the periphery of the bottom of the outer surface of each cup-shaped portion 11 . Preferably, the adhesive material 41 is an adhesive material cured by ultraviolet light.

Then, as shown in FIG. 2K , use a transparent cover 40 to cover and cover each cup-shaped portion 11, and use adhesive material 41 to make the front peripheral edge of the transparent cover 40 and the bottom of the outer surface of each cup-shaped portion 11 The peripheral edges are closely connected together, wherein the inner surface of the transparent cover part 40 and the outer surface of the cup-shaped part 11 are in a tight fit state.

Finally, as shown in FIG. 2L , the metal substrate 10 is cut to form the light emitting device package 1 .

The above description is only for the convenience of describing the preferred embodiment of the present invention, and does not limit the present invention to the preferred embodiment in a narrow sense. For example, as an array of solid-state light emitting device packages 1 ( FIG. 3 ), It is filled with any desired electrically insulating cooling fluid 30 .

Furthermore, the above description is only for the convenience of describing the preferred embodiment of the present invention, and does not limit the present invention to the preferred embodiment in a narrow sense. For example, a laser diode (LD) package 1'( FIG. 4 ), which is filled with any electrically insulating cooling fluid 30 . And when the heat dissipation member of the present invention is applied to the package 1' of the LD, its heat dissipation effect will be more significant, because no matter the low power or high power LD is concerned, compared with LED, it is a device that is easily affected by temperature rise . Instead, the heat sink of the present invention will cool the operating laser diode, thereby improving optical magnification performance, reliability, and more importantly, wavelength stability in some cases.

Also, the above description is only for the convenience of describing the preferred embodiment of the present invention, and does not limit the present invention to the preferred embodiment in a narrow sense, for example, such as organic light emitting diode (OLED) package, wherein Fill with any desired electrically insulating cooling fluid 30 .

The above description is only for the convenience of describing the preferred embodiment of the present invention, and does not limit the present invention to the preferred embodiment in a narrow sense. All changes made according to the present invention belong to the scope of patent protection of the present invention.

Claims (12)

1. the radiating component of light-emitting device encapsulation is characterized in that comprising:

One metal substrate, have a upper surface and a lower surface, upper surface forms a cupule, be formed with a metal welding bed of material on the lower surface with respect to upper surface, wherein cupule has an inner surface and an outer surface, all be formed with an electrode layer on the inner surface with cupule and electrode layer has two electrodes that separate and be formed with on the outer surface on a metal oxide layer, the metal oxide layer, an electrode is formed on the inner surface of cupule, and another electrode is formed on the outer surface of cupule;

The cooling fluid of one electric insulation is filled among the cupule, and is limited to by the inner surface of cupule; And

One transparent cap connects airtight in metal substrate, and this transparent cap has an inner surface, and it forms the convex surface towards light-emitting device.

2. the radiating component of light-emitting device encapsulation as claimed in claim 1, it is characterized in that: metal substrate is made of a Heat Conduction Material.

3. the radiating component of light-emitting device encapsulation as claimed in claim 2, it is characterized in that: metal oxide layer is made of the oxide of this Heat Conduction Material.

4. the radiating component of light-emitting device encapsulation as claimed in claim 2 is characterized in that: also comprise a printed circuit board (PCB), wherein

Printed circuit board (PCB) is made of Heat Conduction Material at least;

Be formed with at least one electrode on one surface of printed circuit board (PCB); And

By with the electrode engagement on this printed circuit surface to this metal welding bed of material, and with another electrode engagement on this printed circuit surface another electrode, to realize being electrically connected of light-emitting device encapsulation and printed circuit board (PCB) to the outer surface of this cupule bottom.

5. the radiating component of light-emitting device encapsulation as claimed in claim 1, it is characterized in that: electrode layer is made of a reflective metal.

6. the radiating component of light-emitting device encapsulation as claimed in claim 1, it is characterized in that: transparent cap has an outer surface, and this outer surface forms another convex surface relative with the convex surface of its inner surface.

7. the manufacture method of the radiating component of light-emitting device encapsulation is characterized in that comprising following steps:

One preparation process prepares a metal substrate, and wherein, this metal substrate has upper surface, also is formed with a plurality of cupules on it, and this upper surface is handled through a surface finish;

One plating step is electroplated a metal welding bed of material on the lower surface of this metal substrate;

One fills black step, and a dielectric ink is fills up among a plurality of cupules, and the upper limb of this dielectric ink and the upper limb of each cupule are trimmed in fact;

One anodic oxidation step forms a metal oxide layer on the upper surface of the metal substrate except the inner surface of each cupule, and the inner surface of each cupule then avoids forming metal oxide layer by this dielectric ink protection;

One ink removing step is removed this dielectric ink;

One plating step is electroplated an electrode layer on the inner surface of this metal oxide layer and each cupule;

One electrode separation step, remove the inboard of the upper limb of each cupule, also remove simultaneously each cupule the upper limb outside go up local metal oxide layer and electrode layer, electrode layer is distinguished into the electrode on the inner surface that is positioned at each cupule and is positioned at another electrode on the outer surface of each cupule;

One installation steps are mounted to an electrode of light-emitting device on the electrode of bottom side of inner surface of each cupule, and another electrode of this light-emitting device are connected to another electrode on the outer surface of each cupule with a routing bonding method;

One filling step is filled to the cooling fluid of an electric insulation among a plurality of cupules, and a upper limb of this cooling fluid and a upper limb of each cupule are trimmed in fact;

One application step is coated on a glue material on one periphery of bottom of outer surface of each cupule;

One covers step, covers each cupule with a transparent cap, and the periphery of bottom of the outer surface of the preceding periphery of this transparent cap and each cupule is connected airtight together; And

One cutting step is cut this metal substrate, forms this light-emitting device encapsulation.

8. the manufacture method of the radiating component of light-emitting device encapsulation as claimed in claim 7, it is characterized in that: among preparation process, metal substrate is made of a Heat Conduction Material.

9. the manufacture method of the radiating component of light-emitting device encapsulation as claimed in claim 8, it is characterized in that: among the anodic oxidation step, metal oxide layer is made of the oxide of this Heat Conduction Material.

10. the manufacture method of the radiating component of light-emitting device encapsulation as claimed in claim 8 is characterized in that: also comprise following steps:

One installation steps are mounted to the light-emitting device encapsulation on one printed circuit board (PCB), wherein,

Printed circuit board (PCB) is made of Heat Conduction Material at least;

Be formed with at least one electrode on one surface of printed circuit board (PCB); And

To this metal welding bed of material, and with another at least one electrode engagement this another electrode, and the light-emitting device encapsulation is electrically connected to printed circuit board (PCB) this at least one electrode engagement to the bottom of the outer surface of each cupule.

11. the manufacture method of the radiating component of light-emitting device encapsulation as claimed in claim 7, it is characterized in that: among the plating step on the inner surface of metal oxide layer and each cupule, electrode layer is made of a reflective metal at the electroplated electrode layer.

12. the manufacture method of the radiating component of light-emitting device encapsulation as claimed in claim 7, it is characterized in that: among the covering step, the inner surface that contacts with described cooling fluid of transparent cap forms a convex surface, and an outer surface of the cap that this is transparent then forms another convex surface relative with this convex surface.

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