CN1208204C - Hot-stripping film patternizing method - Google Patents

Abstract

The invention belongs to a thermal stripping patterning processing method. The method of transfer micro-molding is used to pre-cure to form an epoxy resin template; the medium to be patterned is formed into a film on a flat substrate; the pre-cured epoxy resin template is pressed from top to bottom on the surface of the film to be patterned, and Keep the pressure of 0.1-0.5MPa, then deepen the curing at 80-120°C for 5-15 minutes, finally, peel off the epoxy resin template, and the film with the same pattern as the protrusion on the surface of the epoxy resin peels off with the epoxy resin template. Thereby forming a pattern on the film. The method of the invention has the characteristics of simple processing equipment and process, high pattern forming precision, low processing cost, high efficiency and the like.

Description

Patterning processing method of thermal peeling film

technical field

The invention belongs to a heat-peeling film patterning processing method.

Background technique

With the development of the microelectronics industry, especially the development of organic electronics, there is an urgent need for a technology that can perform high-precision patterning of organic thin films and metal thin films covering the surface of organic thin films without damaging organic materials. . Photolithography is commonly used to generate patterns in traditional patterning of organic semiconductors. US Patent 6,528,816 describes a method of patterning an organic semiconductor layer of an organic thin film transistor by photolithography, and US Patents 6,340,626 and 5,242,543 respectively describe a processing method of patterning a metal thin film by photolithography. However, photolithography requires expensive equipment, and the processing technology is complicated. At the same time, due to the process, the properties of the organic thin film will be damaged, which directly affects the performance of the processed device. There is also a method of using a metal mask as a drain plate to directly form a pattern in the process of organic small molecule or metal evaporation film formation. US Patent 6,384,529 describes a method for direct patterning of organic transistors using a metal mask as the patterning means. However, the processing precision of the metal mask process is low, and the highest can only reach the micron level. In 1999, Duffy D.C et al. published a method of dry stripping using silicone rubber as a patterned medium on Advanced Material. In 2002, Chou et al. published a method of nanoimprinting on metal electrodes of organic thin film transistors on Applied Physics Letters. Patterned processing method, in 2002, Kymissis I. et al. published in Journal of Vacuum Science and Technology B that a double-layer photolithography process was used to solve the possible damage to the organic layer caused by the photolithography process in the processing of organic thin films. However, the above methods all have the disadvantages of complicated processing technology and high patterning cost.

Contents of the invention

The object of the present invention is to provide a method for patterning a thermal peeling film.

A viscous epoxy resin is used as a template for patterning during processing. First, the patterning method of transfer micro-molding is adopted to pre-cure the epoxy resin to form a hard epoxy resin template for patterning. Then, under heating conditions, the epoxy resin hard template that has been pre-cured is matched with the surface of the film that needs to be patterned. The film in the same area of the protruding part is bonded to the epoxy resin template and peeled off together with the epoxy resin template, thereby achieving the purpose of one-time patterning of the film.

The invention preparation process is as follows:

1. After mixing the epoxy resin prepolymer and its crosslinking agent according to the volume ratio of 2:1 to 3:1 and stirring evenly, transfer the mixed liquid to the flat substrate by transfer micromolding , curing at room temperature for 6-12 hours, and then peeling off the soft stamp from the substrate to obtain an epoxy resin template.

2. The medium to be patterned is formed into a film on a flat substrate. The patterned medium is copper phthalocyanine, free phthalocyanine or aluminum 8-hydroxyquinoline for organic materials, and gold, silver or aluminum for metal materials.

3. Press the pre-cured epoxy resin template on the surface of the film to be patterned from top to bottom, and maintain a pressure of 0.1 to 0.5 MPa to make full contact between the epoxy resin template and the film to be patterned, and then Deepen the curing at 80-120°C for 5-15 minutes to make sufficient bonding between the epoxy resin template and the film to be patterned; finally, the epoxy resin template is peeled off, and the pattern is the same as the protrusion on the surface of the epoxy resin The thin film is peeled off with the epoxy template to form a pattern on the film.

Description of drawings

Accompanying drawing 1 is the schematic diagram of thermal stripping patterning method. Among them, 1 is the epoxy resin template, and 2 is the film that needs to be patterned.

Accompanying drawing 2 is the optical photograph of the copper phthalocyanine organic thin film pattern that heat stripping patterning method processes.

Accompanying drawing 3 is the optical photograph of the copper phthalocyanine organic thin film pattern that heat stripping patterning method processes.

Accompanying drawing 4 is the optical photo of the free phthalocyanine organic thin film figure that the thermal stripping patterning method processes and obtains.

Accompanying drawing 5 is the optical photo of the 8-hydroxyquinoline aluminum organic thin film pattern that the thermal stripping patterning method processes and obtains.

Accompanying drawing 6 is the optical photo of the gold thin film figure processed by thermal stripping patterning method.

Accompanying drawing 7 is the optical photograph of the silver thin film figure that heat stripping patterning process obtains.

Accompanying drawing 8 is the optical photo of the pattern of aluminum thin film processed by thermal peeling patterning method.

The thermal lift-off patterning method does not need to use a solvent in the processing of the film, thus avoiding the fatal damage to the organic semiconductor film caused by the action of the solvent in the patterning process of the photolithography process. At the same time, the method of the present invention has very high precision, which can reach the submicron level, and the precision is improved by more than an order of magnitude compared with the method of using bushing plate for processing. The method of the invention is applicable to any surface that can be bonded with the epoxy resin template, so the range of processing objects is wide. Compared with the previous patterning method, the method of the present invention has the characteristics of simple processing equipment and process, high pattern forming precision, low processing cost, high efficiency and the like.

Detailed ways

Example 1: After mixing the epoxy resin prepolymer and its crosslinking agent according to the volume ratio of 2:1 and stirring evenly, the epoxy resin was patterned by transfer micro-molding, and cured at room temperature for 6 Hours, the soft stamp was peeled from the substrate to obtain an epoxy template. Press the epoxy resin template from top to bottom on the surface of the copper phthalocyanine organic film to be patterned, and maintain a pressure of 0.5 MPa, and deepen the curing at 80°C for 15 minutes. The epoxy resin template is peeled off, and the copper phthalocyanine organic film with the same pattern as the protrusion on the surface of the epoxy resin is peeled off with the epoxy resin template, thereby forming a pattern on the copper phthalocyanine organic film, as shown in Figure 2.

Example 2: After mixing the epoxy resin prepolymer and its crosslinking agent according to the volume ratio of 2:1 and stirring evenly, the epoxy resin was patterned by transfer micro-molding and cured at room temperature for 8 Hours, the soft stamp was peeled from the substrate to obtain an epoxy template. Press the epoxy resin template from top to bottom on the surface of the copper phthalocyanine organic film to be patterned, and maintain a pressure of 0.3 MPa, and deepen the curing at 100 ° C for 10 minutes. The epoxy resin template is peeled off, and the copper phthalocyanine organic film with the same pattern as the protrusion on the surface of the epoxy resin is peeled off with the epoxy resin template, thereby forming a pattern on the copper phthalocyanine organic film, as shown in Figure 3.

Example 3: After mixing the epoxy resin prepolymer and its crosslinking agent according to the volume ratio of 3:1 and stirring evenly, the epoxy resin was patterned by transfer micro-molding, and cured at room temperature for 12 Hours, the soft stamp was peeled from the substrate to obtain an epoxy template. Press the epoxy resin template from top to bottom on the surface of the free phthalocyanine organic film that needs to be patterned, and maintain a pressure of 0.1 MPa, and deepen the curing at 120 ° C for 5 minutes. The epoxy resin template is peeled off, and the free phthalocyanine organic film with the same pattern as the protrusion on the surface of the epoxy resin is peeled off with the epoxy resin template, thereby forming a pattern on the free phthalocyanine organic film, as shown in Figure 4.

Example 4: After mixing the epoxy resin prepolymer and its crosslinking agent according to the volume ratio of 12:5 and stirring evenly, the epoxy resin was patterned by transfer micro-molding, and cured at room temperature for 10 Hours, the soft stamp was peeled from the substrate to obtain an epoxy template. Press the epoxy resin template from top to bottom on the surface of the 8-hydroxyquinoline aluminum organic film that needs to be patterned, and maintain a pressure of 0.5 MPa, and deepen the curing at 80 ° C for 15 minutes. The epoxy resin template is peeled off, and the 8-hydroxyquinoline aluminum organic film with the same pattern as the surface protrusion of the epoxy resin is peeled off with the epoxy resin template, thereby forming a pattern on the 8-hydroxyquinoline aluminum organic film, as shown in Figure 5 shown.

Example 5: After mixing the epoxy resin prepolymer and its crosslinking agent according to the volume ratio of 3:1 and stirring evenly, the epoxy resin was patterned by transfer micro-molding, and cured at room temperature for 12 Hours, the soft stamp was peeled from the substrate to obtain an epoxy template. Press the epoxy resin template from top to bottom on the surface of the gold film to be patterned, and maintain a pressure of 0.3MPa, and deepen the curing at 100°C for 10 minutes. The epoxy resin template is peeled off, and the gold film with the same pattern as the protrusion on the surface of the epoxy resin is peeled off with the epoxy resin template, thereby forming a pattern on the gold film, as shown in Figure 6.

Example 6: After mixing the epoxy resin prepolymer and its crosslinking agent according to the volume ratio of 3:1 and stirring evenly, the epoxy resin was patterned by transfer micro-molding, and cured at room temperature for 12 Hours, the soft stamp was peeled from the substrate to obtain an epoxy template. Press the epoxy resin template from top to bottom on the surface of the silver film to be patterned, and maintain a pressure of 0.3MPa, and deepen the curing at 100°C for 10 minutes. The epoxy resin template is peeled off, and the silver film with the same pattern as the protrusion on the surface of the epoxy resin is peeled off with the epoxy resin template, thereby forming a pattern on the silver film, as shown in Figure 7.

Example 7: After mixing the epoxy resin prepolymer and its crosslinking agent according to the volume ratio of 3:1 and stirring evenly, the epoxy resin was patterned by transfer micro-molding and cured at room temperature for 12 Hours, the soft stamp was peeled from the substrate to obtain an epoxy template. Press the epoxy resin template from top to bottom on the surface of the aluminum film to be patterned, and maintain a pressure of 0.3 MPa, and deepen the curing at 100°C for 10 minutes. The epoxy resin template is peeled off, and the aluminum film with the same pattern as the protrusion on the surface of the epoxy resin is peeled off with the epoxy resin template, thereby forming a pattern on the aluminum film, as shown in Figure 8.

Claims (3)

1. A heat-peelable film patterned processing method, adopting the method pre-curing of transfer micro-molding to form an epoxy resin template, it is characterized in that, on the flat substrate, process one layer of organic film or metal film that needs to be patterned, and the surface Press the epoxy resin template with graphics on the surface of the film to be patterned, apply a pressure of 0.1-0.5MPa, and keep it at a temperature of 80-120°C for 5-15 minutes, then peel off the epoxy resin template to obtain the pattern Thin organic or metal films. 2. The thermal peeling patterning processing method according to claim 1, characterized in that said organic thin film is copper phthalocyanine, free phthalocyanine or 8-hydroxyquinoline aluminum. 3. The thermal peeling patterning processing method according to claim 1, characterized in that said metal thin film is gold, silver or aluminum.

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