CN120703919A - A light engine and light module based on silicon photonic chip - Google Patents
A light engine and light module based on silicon photonic chipInfo
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- CN120703919A CN120703919A CN202511032880.5A CN202511032880A CN120703919A CN 120703919 A CN120703919 A CN 120703919A CN 202511032880 A CN202511032880 A CN 202511032880A CN 120703919 A CN120703919 A CN 120703919A
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Abstract
本发明公开了一种基于硅光芯片的光引擎及光模块，该光引擎包括：PCB板；光组件基板，设置于PCB板上；光发射组件，设置于光组件基板上，光发射组件包括沿光路依次设置的COC、发射端硅光芯片和发射端光纤阵列单元，COC用于产生信号光，信号光耦合进入发射端硅光芯片的入光波导，发射端光纤阵列单元与发射端硅光芯片的出光波导相耦合；光接收组件，设置于光组件基板上，光接收组件包括沿光路依次设置的接收端光纤阵列单元和接收端硅光芯片，接收端光纤阵列单元与接收端硅光芯片的入光波导相耦合；连接器，与发射端光纤阵列单元和接收端光纤阵列单元连接。本发明减少了光学元件使用数量，优化了光组件的结构布局，从而有效简化了光组件的工艺流程。
The present invention discloses an optical engine and optical module based on a silicon photonic chip. The optical engine includes: a PCB board; an optical component substrate disposed on the PCB board; an optical transmitting component disposed on the optical component substrate, the optical transmitting component including a COC, a transmitting silicon photonic chip, and a transmitting fiber array unit sequentially arranged along an optical path; the COC is used to generate signal light, the signal light is coupled into the input waveguide of the transmitting silicon photonic chip, and the transmitting fiber array unit is coupled to the output waveguide of the transmitting silicon photonic chip; an optical receiving component disposed on the optical component substrate, the optical receiving component including a receiving fiber array unit and a receiving silicon photonic chip sequentially arranged along the optical path, and the receiving fiber array unit is coupled to the input waveguide of the receiving silicon photonic chip; and a connector connected to the transmitting fiber array unit and the receiving fiber array unit. The present invention reduces the number of optical components used, optimizes the structural layout of the optical component, and thus effectively simplifies the process flow of the optical component.
Description
Technical Field
The invention belongs to the technical field of optical communication, and particularly relates to an optical engine and an optical module based on a silicon optical chip.
Background
As telecommunications, big data, and cloud computing move to high-speed, high-capacity, multi-channel parallel high-speed optical modules are rapidly growing in demand. The current widely applied transmitting end EML (Electro-Absorption Modulated Laser ) parallel multichannel scheme and the receiving end discrete PD scheme occupy large space, have complex coupling process and high device power consumption.
Disclosure of Invention
The invention aims to provide an optical engine and an optical module based on a silicon optical chip, which are used for solving the problems of high material cost, large occupied space of an optical component and complex packaging process flow of an emission end EML parallel multichannel scheme and a receiving end discrete PD scheme.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
in a first aspect, the present invention provides a light engine based on a silicon light chip, the light engine comprising:
A PCB board;
The optical component substrate is arranged on the PCB;
The light emitting assembly is arranged on the light assembly substrate and comprises a COC, an emitting end silicon optical chip and an emitting end optical fiber array unit which are sequentially arranged along a light path, wherein the COC is used for generating signal light, the signal light is coupled into an optical waveguide of the emitting end silicon optical chip, and the emitting end optical fiber array unit is coupled with an optical waveguide of the emitting end silicon optical chip;
The optical receiving assembly is arranged on the optical assembly substrate and comprises a receiving end optical fiber array unit and a receiving end silicon optical chip which are sequentially arranged along an optical path, wherein the receiving end optical fiber array unit is coupled with an optical waveguide of the receiving end silicon optical chip;
And the connector is connected with the transmitting end optical fiber array unit and the receiving end optical fiber array unit.
In some embodiments, the light emitting assembly further includes a first lens and a second lens, which are sequentially disposed on an optical path between the COC and the emitting-side silicon optical chip, for collimating and focusing the signal light so that the signal light is coupled into the light-in waveguide of the emitting-side silicon optical chip.
In some of these embodiments, the light emitting assembly further comprises an isolator disposed between the first stage lens and the second stage lens for isolating the reflected light.
In some embodiments, the light emitting assembly further includes an emitting end first substrate and an emitting end second substrate, the emitting end first substrate and the emitting end second substrate are disposed on the light assembly substrate, the COC, the first lens, the isolator and the second lens are mounted on the emitting end first substrate, and the emitting end silicon optical chip is mounted on the emitting end second substrate.
In some embodiments, the number of channels of the COC is single channel or multi-channel, and the number of channels is selectively set according to the optical port application condition of the emitting end silicon optical chip.
In some embodiments, a prism is disposed in front of the light-entering waveguide of the emitting-end silicon optical chip, and is used for adjusting the incident angle of the signal light so as to match the incident angle of the light-entering waveguide of the emitting-end silicon optical chip.
In some embodiments, the optical receiving assembly further includes a receiving-end first substrate and a receiving-end second substrate, the receiving-end first substrate and the receiving-end second substrate are both disposed on the optical assembly substrate, the receiving-end optical fiber array unit is attached to the receiving-end second substrate, and the receiving-end silicon optical chip is attached to the receiving-end first substrate.
In some embodiments, the coupling end surfaces of the emitting end optical fiber array unit and the light outgoing waveguide of the emitting end silicon optical chip and the coupling end surfaces of the receiving end optical fiber array unit and the light incoming waveguide of the receiving end silicon optical chip are filled with the refractive index matching liquid.
In some embodiments, the PCB is provided with a slot, and the optical component substrate is bonded with the slot of the PCB for accommodating the optical emission component and the optical receiving component.
In a second aspect, the invention provides an optical module based on a silicon optical chip, which comprises the optical engine, an optical module base, an optical module upper cover and an optical module pull ring, wherein the optical engine is packaged by the optical module base and the optical module upper cover, and the optical module pull ring is used for unlocking/locking the optical module.
In general, compared with the prior art, the above technical solution conceived by the present invention can achieve the following beneficial effects:
The invention provides a light engine based on a silicon light chip, wherein a packaging scheme based on the silicon light chip is adopted for a light emitting component and a light receiving component of the light engine, and the light emitting component and the light receiving component are arranged on the same light component substrate, so that the number of optical elements such as COC, lenses, isolators and the like is reduced, the structural layout of the light component is optimized, and the technological processes such as surface mounting, coupling and the like of the light component are effectively simplified.
Further, a prism is arranged in front of the light waveguide of the emitting end silicon optical chip and used for adjusting the incidence angle of the signal light, so that the incidence angle of the signal light can be matched with the incidence angle of the light waveguide of the emitting end silicon optical chip.
Furthermore, the number of the COC channels can be selected in a single-channel or multi-channel mode according to the practical light port application condition of the emitting end silicon optical chip, the isolator arranged between the first-stage lens and the second-stage lens can isolate reflected light to ensure the quality of incident signal light, and the coupling end faces of the emitting end optical fiber array unit and the light emitting waveguide of the emitting end silicon optical chip and the coupling end faces of the receiving end optical fiber array unit and the light entering waveguide of the receiving end silicon optical chip are filled with refractive index matching liquid, so that mode field matching can be improved, and coupling efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of a light engine based on a silicon optical chip according to an embodiment of the present invention;
FIG. 2 is a schematic view of another angle of a light engine based on a silicon optical chip according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of an optical module of an optical engine based on a silicon optical chip according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of another optical component of an optical engine based on a silicon optical chip according to an embodiment of the present invention;
fig. 5 is a schematic package diagram of an optical module based on a silicon optical chip according to an embodiment of the present invention.
In the figure, 10, an optical engine, 20, an optical module upper cover, 30, an optical module base, 40, an optical module pull ring, 100, a PCB (printed circuit board), 110, a connector, 120, an optical module substrate, 200, an optical emission component, 210, COC (chip on chip), 220, a first-stage lens, 230, an isolator, 240, a second-stage lens, 250, an emitting-end silicon optical chip, 260, an emitting-end optical fiber array unit, 270, an emitting-end first substrate, 280, an emitting-end second substrate, 290, a prism, 300, an optical receiving component, 310, a receiving-end silicon optical chip, 320, a receiving-end optical fiber array unit, 330, a receiving-end first substrate, 340 and a receiving-end second substrate.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. All other embodiments, which can be made by a person of ordinary skill in the art based on the embodiments provided by the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
It is apparent that the drawings in the following description are only some examples or embodiments of the present invention, and it is possible for those of ordinary skill in the art to apply the present invention to other similar situations according to these drawings without inventive effort. Moreover, it should be appreciated that while such a development effort might be complex and lengthy, it would nevertheless be a routine undertaking of design, fabrication, or manufacture for those of ordinary skill having the benefit of this disclosure, and thus should not be construed as having the benefit of this disclosure.
Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the invention. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is to be expressly and implicitly understood by those of ordinary skill in the art that the described embodiments of the invention can be combined with other embodiments without conflict.
Unless defined otherwise, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The terms "a," "an," "the," and similar referents in the context of the invention are not to be construed as limiting the quantity, but rather as singular or plural. The terms "comprises," "comprising," "includes," "including," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or modules (elements) is not limited to only those steps or elements but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus. The terms "connected," "coupled," and the like in connection with the present invention are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The term "plurality" as used herein means two or more. "and/or" describes the association relationship of the association object, and indicates that three relationships may exist, for example, "a and/or B" may indicate that a exists alone, a and B exist simultaneously, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship. The terms "first," "second," "third," and the like, as used herein, are merely distinguishing between similar objects and not representing a particular ordering of objects.
The invention provides an optical engine and an optical module based on a silicon optical chip, which adopt an optical module packaging scheme of an all-silicon optical chip, optimize the structural layout of an optical module, simplify the process flow of the optical module, and enable the receiving and emitting modules to adopt the same optical module substrate, so that the consistency of the same process flow is high, and the manufacturing is more convenient.
As shown in fig. 1, fig. 2 and fig. 5, an optical module based on a silicon optical chip provided by an embodiment of the present invention includes an optical engine 10, an optical module upper cover 20, an optical module base 30 and an optical module pull ring 40. The optical engine 10 is a core functional component, and is fixed by packaging an optical module upper cover 20 and an optical module base 30, and an optical module pull ring 40 is disposed at an end of the optical module for unlocking/locking the optical module.
As shown in fig. 1 and 2, the core structure of the light engine 10 includes a PCB board 100, a light assembly substrate 120, a light emitting assembly 200, a light receiving assembly 300, and a connector 110. The PCB board 100 is provided with a slot, and the optical component substrate 120 is adhered in the slot for accommodating the optical emitting component 200 and the optical receiving component 300. The connector 110 is located at an end of the PCB board 100, connected with the light emitting assembly 200 and the light receiving assembly 300, for external transmission of the optical signal.
In some embodiments, the optical emitting assembly 200 is configured to generate and output a modulated optical signal, as shown in fig. 3, and includes a COC 210, a first stage lens 220, an isolator 230, a second stage lens 240, an emitting-side silicon optical chip 250, an emitting-side optical fiber array unit 260, an emitting-side first substrate 270, and an emitting-side second substrate 280. The first substrate 270 and the second substrate 280 are adhered to the optical component substrate 120, and are used for accommodating other components of the optical emission component 200. The COC 210, the first lens 220, the isolator 230 and the second lens 240 are sequentially mounted on a predetermined optical path of the first substrate 270 at the transmitting end, and the silicon optical chip 250 at the transmitting end is mounted on the second substrate 280 at the transmitting end, and the light incident waveguide is aligned with the light emergent direction of the second lens 240.
In this embodiment, COC (Chip on Carrier), mainly comprising a spacer and a laser, is used to generate signal light, a first stage lens 220 (mainly used for collimating the signal light) and a second stage lens 240 (mainly used for focusing the collimated signal light) are used to collimate and focus the signal light, so that the signal light is coupled into the light-entering waveguide of the emitting-end silicon optical Chip 250, and an isolator 230 is disposed between the two stages of lenses in the optical path, for isolating the reflected light. The signal light is emitted from the light-emitting waveguide of the emitting-end silicon optical chip 250 and is directly coupled with the emitting-end optical fiber array unit 260, and the refractive index matching liquid can be added at the end surface to improve the mode field matching and the coupling efficiency.
In this embodiment, the signal light generated by the COC 210 is collimated by the first lens 220, focused by the isolator 230 and focused by the second lens 240, and is incident on the light-incident waveguide of the transmitting end silicon optical chip 250, and after being modulated by the transmitting end silicon optical chip 250, the signal light is emitted from the light-emitting waveguide of the transmitting end silicon optical chip 250, and finally transmitted to the connector 110 through the transmitting end optical fiber array unit 260.
In other embodiments, the angle of the incident light wave entering the emitting end silicon optical chip 250 of the signal light in the light emitting assembly 200 can be adjusted according to the structural design, and a prism 290 with a refraction angle matching the incident angle of the incident light signal is disposed in front of the incident light wave entering the emitting end silicon optical chip 250, preferably a turning prism, as shown in fig. 4, and the incident angle of the signal light is adjusted to match the incident angle of the incident light wave entering the emitting end silicon optical chip 250.
In this embodiment, the signal light generated by the COC 210 is sequentially collimated by the first lens 220, focused by the isolator 230 and the second lens 240, and angle-adjusted by the prism 290, and then is incident on the light-incident waveguide of the transmitting-end silicon optical chip 250, modulated by the transmitting-end silicon optical chip 250, and then exits from the light-emergent waveguide of the transmitting-end silicon optical chip 250, and finally is transmitted to the connector 110 through the transmitting-end optical fiber array unit 260.
It should be noted that the number of channels of the COC 210 may be selected in a single-channel or multi-channel manner according to the optical port application condition of the actual silicon optical chip. Fig. 3 and fig. 4 are schematic diagrams of a multi-channel parallel optical engine and an optical module according to an embodiment of the present invention.
In some embodiments, the light receiving component 300 is configured to receive an external light signal and convert the external light signal into an electrical signal, and as shown in fig. 3 and 4, includes a receiving-end optical fiber array unit 320, a receiving-end silicon optical chip 310, a receiving-end first substrate 330, and a receiving-end second substrate 340. Wherein the receiving-end first substrate 330 and the receiving-end second substrate 340 are bonded to the optical component substrate 120. The receiving-end optical fiber array unit 320 is mounted on the receiving-end second substrate 340, and the input end thereof is connected to the connector 110. The receiving-end silicon optical chip 310 is mounted on the receiving-end first substrate 330, and its incident optical waveguide is aligned with the output end of the receiving-end optical fiber array unit 320. The received signal light is directly coupled into the light waveguide of the receiving-end silicon optical chip 310 from the receiving-end optical fiber array unit 320, and an index matching liquid can be added at the end surface to improve mode field matching and increase coupling efficiency. The receiving-side silicon photochip 310 may integrate PD, TIA (TRANSIMPEDANCE AMPLIFIER ) and other components.
In this embodiment, the external optical signal is transmitted to the receiving-end optical fiber array unit 320 through the connector 110, and the optical signal is distributed to the optical waveguide of the receiving-end silicon optical chip 310 through the optical fiber array.
In the present invention, the optical module substrate 120 is generally made of metal, the portion of the optical module substrate 120 accommodating the optical module 200 is bonded to the first substrate 270 and the second substrate 280, and the portion of the optical module substrate 120 accommodating the optical module 300 is bonded to the first substrate 330 and the second substrate 340. The four substrates are mounted on the optical module substrate 120, and are used for mounting various optical elements, typically ceramic materials, for supporting and elevating the optical elements, ensuring the optical axis height of the optical path to be consistent, and also for assisting heat dissipation.
In summary, the invention provides a light engine and a light module based on a silicon light chip, wherein the light module comprises a light engine, a light module upper cover, a light module base and a light module pull ring. The optical engine comprises a PCB board, an optical component substrate, an optical emission component, an optical receiving component and a connector. The light emitting assembly may include an emitting end first substrate, an emitting end second substrate, a COC, a first stage lens, an isolator, a second stage lens, an emitting end silicon optical chip, a prism, an emitting end optical fiber array unit, and the like. The light receiving component may include a receiving-end first substrate, a receiving-end second substrate, a receiving-end optical fiber array unit, a receiving-end silicon optical chip, and the like.
The invention adopts the packaging scheme based on the silicon optical chip in the light emitting component and the light receiving component, and sets the light receiving and emitting components on the same optical component substrate, thereby reducing the use quantity of COC, lenses, isolators and other optical elements, optimizing the structural layout of the optical components, effectively simplifying the technological processes of surface mounting, coupling and the like of the optical components, and attaching a prism at the position of the light receiving waveguide of the silicon optical chip at the emitting end, so that different light entering angles can be adapted.
It should be noted that each step/component described in the present invention may be split into more steps/components, or two or more steps/components or part of operations of the steps/components may be combined into new steps/components, according to the implementation needs, to achieve the object of the present invention.
It will be readily appreciated by those skilled in the art that the foregoing is merely a preferred embodiment of the invention and is not intended to limit the invention, but any modifications, equivalents, improvements or alternatives falling within the spirit and principles of the invention are intended to be included within the scope of the invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202511032880.5A CN120703919A (en) | 2025-07-25 | 2025-07-25 | A light engine and light module based on silicon photonic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202511032880.5A CN120703919A (en) | 2025-07-25 | 2025-07-25 | A light engine and light module based on silicon photonic chip |
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| Publication Number | Publication Date |
|---|---|
| CN120703919A true CN120703919A (en) | 2025-09-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202511032880.5A Pending CN120703919A (en) | 2025-07-25 | 2025-07-25 | A light engine and light module based on silicon photonic chip |
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| Country | Link |
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| CN (1) | CN120703919A (en) |
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2025
- 2025-07-25 CN CN202511032880.5A patent/CN120703919A/en active Pending
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