CN120659225A - Electric conduction structure of flexible substrate circuit board - Google Patents
Electric conduction structure of flexible substrate circuit boardInfo
- Publication number
- CN120659225A CN120659225A CN202410300137.2A CN202410300137A CN120659225A CN 120659225 A CN120659225 A CN 120659225A CN 202410300137 A CN202410300137 A CN 202410300137A CN 120659225 A CN120659225 A CN 120659225A
- Authority
- CN
- China
- Prior art keywords
- flexible substrate
- conductive
- circuit board
- ribs
- electrical connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
本发明公开一种柔性基材电路板电性导通结构，其包括一柔性基材、一线路层、至少一焊接结构以及一电性连接结构。柔性基材包括一第一表面、一第二表面、一侧面以及复数个凸肋，第一表面与第二表面是相对设置，侧面连接第一表面与第二表面，凸肋形成于侧面且连接第一表面与第二表面。线路层形成于第一表面，线路层在靠近柔性基材的侧面的位置形成至少一导电结构。焊接结构设置于柔性基材的第二表面。电性连接结构连接导电结构以及焊接结构，电性连接结构经由凸肋从柔性基材的第一表面延伸至第二表面。
The present invention discloses an electrical conduction structure for a flexible substrate circuit board, comprising a flexible substrate, a circuit layer, at least one soldering structure, and an electrical connection structure. The flexible substrate comprises a first surface, a second surface, a side surface, and a plurality of ribs. The first surface and the second surface are disposed opposite each other, the side surface connects the first and second surfaces, and the ribs are formed on the side surface and connect the first and second surfaces. The circuit layer is formed on the first surface, and the circuit layer forms at least one conductive structure near the side surface of the flexible substrate. The soldering structure is disposed on the second surface of the flexible substrate. The electrical connection structure connects the conductive structure and the soldering structure, and the electrical connection structure extends from the first surface of the flexible substrate to the second surface via the ribs.
Description
Technical Field
The present invention relates to the technical field of circuit board structures, and more particularly, to an electrical conductive structure of a flexible substrate circuit board.
Background
The thinning is a design trend of the electronic products, so a plurality of electronic modules of the electronic device must be disposed in a space with a relatively limited size, and thus flexible circuit boards or cable connection between the electronic modules is a necessary choice. The circuit layer of the conventional flexible circuit board is arranged on a single side surface, so that the circuit layer and the welding structure cannot be applied to the design that the circuit layer and the welding structure are arranged on two surfaces. Therefore, how to form a circuit layer and a soldering structure on two surfaces of a flexible substrate and then form conduction is an important development direction of the flexible circuit board at present.
Disclosure of Invention
Accordingly, the present invention is directed to an electrical conductive structure of a flexible substrate circuit board, which solves the problem of how to conduct the circuits on two sides of the flexible substrate circuit board.
The invention provides an electrical conduction structure of a flexible substrate circuit board, which comprises a flexible substrate, a circuit layer, at least one welding structure and an electrical connection structure. The flexible substrate comprises a first surface, a second surface, a side surface and a plurality of convex ribs, wherein the first surface and the second surface are oppositely arranged, the side surface is connected with the first surface and the second surface, and the convex ribs are formed on the side surface and are connected with the first surface and the second surface. The circuit layer is formed on the first surface, and the circuit layer forms at least one conductive structure at a position close to the side surface of the flexible substrate. The welding structure is arranged on the second surface of the flexible substrate. The electric connection structure is connected with the conductive structure and the welding structure and extends from the first surface to the second surface of the flexible substrate through the convex rib.
In another embodiment, the electrical connection structure includes at least one conductor layer formed on an end surface of the rib, and the conductor layer is connected to the conductive structure and the soldering structure.
In another embodiment, the flexible substrate further includes at least one through hole penetrating the flexible substrate and communicating the first surface and the second surface, the electrical connection structure includes a conductor layer formed on a wall of the through hole, and the conductor layer is connected to the conductive structure and the soldering structure.
In another embodiment, the electrical connection structure includes a plurality of conductive layers, and the conductive layers are further formed on an end surface of at least one of the ribs.
In another embodiment, the flexible substrate further includes at least one accommodating recess formed on the first surface, and the conductive structure is disposed in the accommodating recess and is flush with the first surface.
In another embodiment, the conductive structure is a metal bump disposed on the first surface.
In another embodiment, the soldering structure is a metal bump disposed on the second surface.
In another embodiment, the conductive structure is a conductive node disposed on the first surface.
According to the flexible substrate circuit board electrical conduction structure, the convex ribs are formed on the side face of the flexible substrate or/and the through holes are formed in the flexible substrate, and the electrical connection structures for connecting the circuit layers and the welding structures are formed in the convex ribs or/and the through holes, so that the circuit layers and the welding structures arranged on the two surfaces of the flexible substrate are connected.
Drawings
Fig. 1 is a perspective view of a first embodiment of an electrically conductive structure of a flexible substrate circuit board according to the present invention.
Fig. 2 is a perspective view of another view of the flexible substrate circuit board electrically conductive structure of fig. 1.
Fig. 3 is a cross-sectional view taken along line A-A of fig. 1.
Fig. 4 is a cross-sectional view of a second embodiment of the flexible substrate circuit board electrical conduction structure of the present invention.
Fig. 5 is a cross-sectional view of a third embodiment of the flexible substrate circuit board electrical conduction structure of the present invention.
Fig. 6 is a cross-sectional view of a fourth embodiment of the flexible substrate circuit board electrical conduction structure of the present invention.
Fig. 7 is a cross-sectional view of a fifth embodiment of the flexible substrate circuit board electrical conduction structure of the present invention.
The reference numerals illustrate 10-flexible substrate, 11-first surface, 12-second surface, 13-side surface, 14-rib, 15-accommodating recess, 16-via, 20-circuit layer, 21-conductive structure, 30-soldering structure, 40-electrical connection structure, 41-conductor layer.
Detailed Description
Referring to fig. 1, 2 and 3, a first embodiment of an electrically conductive structure of a flexible substrate circuit board according to the present invention is shown. The flexible substrate circuit board electrical conduction structure of the present embodiment includes a flexible substrate 10, a circuit layer 20, at least one soldering structure 30 and an electrical connection structure 40. The flexible substrate 10 includes a first surface 11, a second surface 12, a side 13, and a plurality of ribs 14. The first surface 11 and the second surface 12 are disposed opposite to each other, the side surface 13 connects the first surface 11 and the second surface 12, a plurality of ribs 14 are formed on the side surface 13 and connect the first surface 11 and the second surface 12, and the surface of the side surface 13 between the two ribs 14 is formed in an arc shape. The process of forming the ribs 14 may be to drill a plurality of round holes on the flexible substrate 10, then cut the flexible substrate 10 along a straight line passing through the center of the round holes, and form the ribs 14 between two half holes, which are commonly called stamp holes.
The circuit layer 20 is formed on the first surface 11, and the circuit layer 20 forms a conductive structure 21 near the side 13 of the flexible substrate 10. The flexible substrate 10 of the present embodiment further includes a plurality of accommodating recesses 15, where the accommodating recesses 15 are formed on the first surface 11. The accommodating recess 15 of the present embodiment is rectangular and is connected to the rib 14, the conductive structure 21 is disposed in the accommodating recess 15, and the conductive structure 21 is flush with the first surface 11. In other embodiments, the conductive structures 21 may also be metal bumps formed on the first surface 11.
The solder structure 30 is disposed on the second surface 12 of the flexible substrate 10. The soldering structure 30 of the present embodiment is a metal bump formed on the second surface 12, and the soldering structure 30 is connected to the rib 14.
The electrical connection structure 40 connects the conductive structure 21 and the soldering structure 30, the electrical connection structure 40 of the present embodiment includes a conductive layer 41, the conductive layer 41 is formed on an end surface of the rib 14 and extends from the first surface 11 to the second surface 12 of the flexible substrate 10, and the conductive layer 41 is connected to the conductive structure 21 and the soldering structure 30, so that the conductive structure 21 and the soldering structure 30 form an electrical connection.
The circuit layer 20, the soldering structure 30 and the electrical connection structure 40 of the present embodiment are formed on the flexible substrate 10 by an electroplating process. The material of the circuit layer 20, the soldering structure 30 and the electrical connection structure 40 may be copper.
Referring to fig. 4, a second embodiment of the conductive structure of the flexible substrate circuit board of the present invention is shown. The present embodiment has the same structure as the first embodiment, and therefore the same elements are given the same symbols and the description thereof is omitted. The difference between the present embodiment and the first embodiment is that the side 13 of the flexible substrate 10 of the present embodiment is not provided with the ribs 14, the flexible substrate 10 of the present embodiment has the through holes 16, the conductive layer 41 of the electrical connection structure 40 of the present embodiment is formed on the walls of the through holes 16, and the conductive layer 41 is connected to the conductive structure 21 and the soldering structure 30, so that the conductive structure 21 and the soldering structure 30 are electrically connected. The circuit layer 20, the soldering structure 30 and the electrical connection structure 40 of the present embodiment are formed on the flexible substrate 10 by an electroplating process. The material of the circuit layer 20, the soldering structure 30 and the electrical connection structure 40 may be copper.
Referring to fig. 5, a third embodiment of the conductive structure of the flexible substrate circuit board of the present invention is shown. The present embodiment has the same structure as the first embodiment, and therefore the same elements are given the same symbols and the description thereof is omitted. The difference between the present embodiment and the first embodiment is that the flexible substrate 10 of the present embodiment has the through hole 16 in addition to the rib 14 provided on the side 13, the conductive layer 41 of the electrical connection structure 40 of the present embodiment is formed on the end surface of the rib 14 and the wall of the through hole 16, and the conductive layer 41 is connected to the conductive structure 21 and the soldering structure 30, so that the conductive structure 21 and the soldering structure 30 are electrically connected. The circuit layer 20, the soldering structure 30 and the electrical connection structure 40 of the present embodiment are formed on the flexible substrate 10 by an electroplating process. The material of the circuit layer 20, the soldering structure 30 and the electrical connection structure 40 may be copper.
Referring to fig. 6, a fourth embodiment of the conductive structure of the flexible substrate circuit board of the present invention is shown. The present embodiment has the same structure as the first embodiment, and therefore the same elements are given the same symbols and the description thereof is omitted. The difference between the present embodiment and the first embodiment is that the conductive structure 21 of the present embodiment is a conductive node formed on the first surface 11, the conductive layer 41 of the electrical connection structure 40 is formed on the end surface of the rib 14, and the conductive layer 41 is connected to the conductive structure 21 and the soldering structure 30, so that the conductive structure 21 and the soldering structure 30 are electrically connected.
Referring to fig. 7, a fifth embodiment of the conductive structure of the flexible substrate circuit board of the present invention is shown. The present embodiment has the same structure as the second embodiment, and therefore the same elements are given the same symbols and the description thereof is omitted. The difference between the present embodiment and the second embodiment is that the conductive structure 21 of the present embodiment is a conductive node formed on the first surface 11, the conductive layer 41 of the electrical connection structure 40 is formed on the end surface of the rib 14, and the conductive layer 41 is connected to the conductive structure 21 and the soldering structure 30, so that the conductive structure 21 and the soldering structure 30 are electrically connected.
According to the flexible substrate circuit board electrical conduction structure, the convex ribs are formed on the side face of the flexible substrate or/and the through holes are formed in the flexible substrate, and the electrical connection structures for connecting the circuit layers and the welding structures are formed in the convex ribs or/and the through holes, so that the circuit layers and the welding structures arranged on the two surfaces of the flexible substrate are connected. The flexible substrate circuit board electrical conduction structure provided by the invention can obtain the conduction structure of the conduction circuit layer and the welding structure by a simple process, and can be applied to a thinned electronic device without using elements with relatively complex processes such as Flexible Flat Cables (FFCs) and the like.
The foregoing description is only illustrative of the preferred embodiments of the present invention, and is not intended to limit the scope of the invention, i.e., the invention is defined by the appended claims and their equivalents, but rather by the description of the invention. Furthermore, not all of the objects, advantages, or features provided by the invention are required to be achieved by any one embodiment or claim of the invention. Furthermore, the abstract sections and headings are provided for assistance in searching the patent document and are not intended to limit the scope of the invention. Furthermore, references to "first," "second," etc. in the description or in the claims of the present invention are used for naming elements or distinguishing between different embodiments or ranges, and are not intended to limit the upper or lower limit on the number of elements.
Claims (8)
1. A flexible substrate circuit board electrical conduction structure, comprising:
The flexible substrate comprises a first surface, a second surface, a side surface and a plurality of ribs, wherein the first surface and the second surface are oppositely arranged, the side surface is connected with the first surface and the second surface, and the plurality of ribs are formed on the side surface and connected with the first surface and the second surface;
a circuit layer formed on the first surface, wherein the circuit layer forms at least one conductive structure at a position close to the side surface of the flexible substrate;
At least one welding structure arranged on the second surface of the flexible substrate, and
And the electric connection structure is connected with the at least one conductive structure and the at least one welding structure, and extends from the first surface to the second surface through the plurality of convex ribs.
2. The flexible substrate circuit board electrical conduction structure of claim 1, wherein the flexible substrate further comprises at least one through hole penetrating through the flexible substrate and communicating the first surface and the second surface, and the electrical connection structure is formed on a wall of at least one through hole and connected to the at least one conductive structure and the at least one soldering structure.
3. The flexible substrate circuit board electrical conductive structure of claim 1, wherein the electrical connection structure comprises at least one conductive layer formed on an end surface of at least one of the ribs, the at least one conductive layer being connected to the at least one conductive structure and the at least one solder structure.
4. The flexible substrate circuit board electrical conduction structure of claim 3, wherein said electrical connection structure comprises a plurality of said conductive layers, said plurality of said conductive layers being further formed on said end surface of at least one of said ribs.
5. The flexible substrate circuit board electrical conduction structure of claim 1, wherein the flexible substrate further comprises at least one accommodating recess formed in the first surface, the at least one conductive structure is disposed in the at least one accommodating recess and the at least one conductive structure is flush with the first surface.
6. The circuit board electrical conductive structure of claim 1, wherein the at least one conductive structure is a metal bump disposed on the first surface.
7. The flexible substrate circuit board electrical conduction structure of claim 1, wherein the at least one solder structure is a metal bump disposed on the second surface.
8. The flexible substrate circuit board electrical conduction structure of claim 1, wherein the at least one conductive structure is a conductive node disposed on the first surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410300137.2A CN120659225A (en) | 2024-03-15 | 2024-03-15 | Electric conduction structure of flexible substrate circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202410300137.2A CN120659225A (en) | 2024-03-15 | 2024-03-15 | Electric conduction structure of flexible substrate circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN120659225A true CN120659225A (en) | 2025-09-16 |
Family
ID=96998793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410300137.2A Pending CN120659225A (en) | 2024-03-15 | 2024-03-15 | Electric conduction structure of flexible substrate circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN120659225A (en) |
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2024
- 2024-03-15 CN CN202410300137.2A patent/CN120659225A/en active Pending
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