CN1205264C - Epoxy resins and stable aqueous dispersions thereof - Google Patents

Abstract

Epoxy resins comprising low temperature nonionic surfactants with molecular weights below 7000 Daltons, high temperature nonionic surfactants with molecular weights greater than 7000 Daltons, and anionic surfactants can be used to prepare Aqueous dispersion of epoxy resin with long storage stability. The dispersion is preferably prepared using a high internal ratio emulsion.

Description

Epoxy resin and its stable aqueous dispersion

This invention relates to novel epoxy resins and their stable aqueous dispersions. Stable aqueous dispersions of epoxy resins are useful, for example, in paper coating and foam backing applications. These dispersions are useful as crosslinkers for other latexes such as S/B latex and carboxylated S/B latex.

Water-based dispersions of epoxy resins are disclosed, for example, in US Patents 5,118,729, 5,344,856, 5,424,340, and 5,602,193, and Japanese Patent Application Kokai: Hei 3-157445.

One of the problems with the prior art water-based epoxy dispersions is that the storage stability of the dispersions is not long enough. Therefore, it would be advantageous in the art to be able to find a water-based epoxy resin with long (greater than 6 months) storage stability.

In one aspect, the present invention is a composition comprising an epoxy resin in admixture with a low temperature nonionic surfactant, a high temperature nonionic surfactant, and an anionic surfactant, compared to an epoxy resin in the absence of the anionic surfactant When the interfacial tension value of the agent is used, the anionic surfactant can reduce the interfacial tension value of the epoxy resin when the low-temperature surfactant and the high-temperature surfactant are combined; wherein the low-temperature nonionic surfactant is characterized in that the molecular weight is not less than 1000 and not more than 7000, the high-temperature nonionic surfactant is characterized by a molecular weight greater than 7000 and not more than 20000, and meets at least one of the following criteria:

i) The weight ratio of high temperature nonionic surfactant to anionic surfactant is greater than 3:1;

ii) The weight ratio of the sum of the low-temperature nonionic surfactant and the high-temperature nonionic surfactant to the anionic surfactant is greater than 4.5:1;

iii) The total surfactant concentration is 5-20% by weight based on the weight of total surfactant and epoxy resin.

In a second aspect, the present invention is a composition comprising a stable aqueous dispersion of epoxy resin stabilized by a low temperature nonionic surfactant, a high temperature nonionic surfactant, and an anionic surfactant, compared to epoxy Resin does not have the interfacial tension value of this anionic surfactant, and this anionic surfactant can reduce the interfacial tension value of epoxy resin when combining low temperature surfactant and high temperature surfactant; Wherein said low temperature nonionic surfactant is characterized by a molecular weight of not less than 1,000 and not more than 7,000, and the high-temperature nonionic surfactant is characterized by a molecular weight of more than 7,000 and not more than 20,000, and meets at least one of the following criteria:

i) The weight ratio of high temperature nonionic surfactant to anionic surfactant is greater than 3:1;

ii) The weight ratio of the sum of the low-temperature nonionic surfactant and the high-temperature nonionic surfactant to the anionic surfactant is greater than 4.5:1;

iii) The total surfactant concentration is 5-20% by weight based on the weight of total surfactant and epoxy resin.

In a third aspect, the present invention is a stable aqueous dispersion of epoxy resin made through the following steps:

a) in the presence of an emulsified and stabilizing amount of a mixture of surfactants, continuously combining a stream of water at a flow rate _r1 and a flow stream containing epoxy resin at a flow rate _r2 into a disperser;

b) mixing these streams with a sufficient amount of shear to form a high internal phase emulsion; then

c) diluting the emulsion with high internal phase ratio with water to form a stable aqueous dispersion; wherein the surfactant mixture includes a low-temperature nonionic surfactant and a high-temperature nonionic surfactant, wherein the low-temperature nonionic surfactant Characterized by a molecular weight of not less than 1000 and not more than 7000, said high temperature nonionic surfactant is characterized by a molecular weight of more than 7000 and not more than 20000; and wherein the range of r ₂ : _{r 1} is such that the volume average particle diameter of the dispersion is not more than 2 microns.

The present invention solves one of the problems in the prior art by providing a water-based epoxy resin with a storage stability greater than 6 months.

Surfactant assembly is important for the storage stability of the epoxy dispersions of the invention. At least two surfactants are used, the first being a low temperature nonionic surfactant and the second being a high temperature nonionic surfactant. It is preferred to use a third cosurfactant as the low temperature and high temperature nonionic surfactant.

The low-temperature nonionic surfactant is characterized by a molecular weight of not less than 1000 and not more than 7000. Preferred low temperature nonionic surfactants are as follows:

Formula I

Wherein the sum of n, m and p in structural formula I is such that the molecular weight of formula I is not less than about 1000 daltons, more preferably not less than about 2000 daltons, and not more than about 7000 daltons, more preferably not more than About 5000 Daltons. Commercially available formula I low temperature nonionic surfactants include Hydropalat 3037 nonionic surfactants (available from Henkel, n+m+p=40), Emulgin PRT 100 nonionic surfactants (available from Henkel, n+m+ p=100), and Emulpon EL 42 nonionic surfactant (available from Witco, n+m+p=42);

CH ₃ (CH ₂ ) _x O(CH ₂ CH ₂ O) _y -H

Formula II

wherein x is about 10-18, wherein y is about 30-50, more preferably about 35-45. The commercially available low-temperature nonionic surfactant of formula II is Disponil TA 430 nonionic surfactant (available from Henkel, x=C ₁₁ -C ₁₇ , y=40);

Formula III

wherein R ¹ is oleyl (9-octadecenyl), and R ² is

or

wherein the sum of w and z is not less than about 10, more preferably not less than about 15, and not more than about 30, more preferably not more than about 25. The commercially available formula III low-temperature nonionic surfactant is SorbanoxAO nonionic surfactant (available from Witco), which is a mixture of formula III structures.

High temperature nonionic surfactants are characterized by molecular weights greater than 7,000 and not greater than 20,000. Preferably, the high temperature nonionic surfactant has the following structure:

Wherein e is not less than about 10, preferably not less than about 15, most preferably not less than about 20, and not more than about 50, more preferably not more than 40, most preferably not more than 30; and f is not less than about 100, more Preferably not less than about 200, most preferably not less than about 250, and preferably not more than about 500, more preferably not more than about 400, most preferably not more than about 300. Examples of commercially available high-temperature nonionic surfactants include Atsurf 108 surfactant (available from ICI) and Pluronic F108 surfactant (available from BASF Corporation), each having a molecular weight of about 14000 (e=24; f=255) .

Another preferred high temperature nonionic surfactant has the structure of a nonionic surfactant of formula I, wherein the sum of n, m and p is such that the molecular weight is greater than 7000 and less than 20000 Daltons. An example of a commercially available high temperature nonionic surfactant is Emulgin PRT 200 nonionic surfactant (available from Henkel). Other examples of suitable high temperature nonionic surfactants include ethoxylated mono- or dialkylphenols such as polyethylene glycol nonyl or dinonylphenyl ether. An example of a commercially available ethoxylated dialkylphenyl ether is Igepal DM 970 FLK PEG-150 dinonylphenyl ether (available from Rhone-Poulenc).

The weight ratio of low temperature nonionic surfactant to high temperature nonionic surfactant is preferably not less than about 1:3, more preferably not less than 1:2, most preferably not less than 1.5:1, and preferably not more than 3:1 , more preferably no more than about 2:1, most preferably no more than about 1.5:1.

Since the amount of total nonionic surfactant required to prepare an epoxy dispersion with satisfactory stability tends to be higher without a suitable anionic cosurfactant, it is preferred to add a small amount of anionic cosurfactant to Minimize the total surfactant in the dispersion. The anionic surfactant is selected such that the combination of the nonionic surfactant and the anionic surfactant lowers the interfacial tension of the epoxy resin compared to the interfacial tension of the resin in the absence of the anionic surfactant.

A preferred method of determining the suitability of an anionic surfactant comprises the following steps: a) combining the anionic surfactant with the high temperature nonionic surfactant at a temperature at which the high temperature nonionic surfactant is effective (typically about 40-100°C). agent is combined in an epoxy resin, and the interfacial tension of the resin is measured in the presence of an anionic surfactant and a high temperature nonionic surfactant, compared to the interfacial tension of the resin in the presence of a high temperature nonionic surfactant only; then b ) combine the anionic surfactant with the low temperature nonionic surfactant in an epoxy resin at a temperature at which the low temperature nonionic surfactant is effective (typically ambient temperature) and measure the The interfacial tension of the nonionic surfactant was compared with the interfacial tension of the resin in the presence of the low temperature nonionic surfactant alone.

Preferred anionic surfactants are capable of reducing the interfacial tension of the epoxy resin when combined with a low or high temperature nonionic surfactant, as compared to the interfacial tension of the resin without the anionic surfactant. More preferably, the anionic surfactant is capable of reducing the interfacial tension of the epoxy resin when combined with both low and high temperature nonionic surfactants, as compared to the interfacial tension of the resin without the anionic surfactant. For both low and high temperature nonionic surfactants, the most preferred anionic surfactants are capable of maximizing the reduction of the interfacial tension of the epoxy resin.

For example, Atsurf 108 nonionic surfactant, or its general equivalent, has been found to reduce the interfacial tension of epoxy resins such as D.E.R. 353 resin (available from The Dow Chemical Company) at 80° C. Anionic surfactants include long chain alkyl alkali metal sulfosuccinates such as dioctyl sodium sulfosuccinate (commercially available as Aerosol OT75 anionic surfactant from Cyanamid), sodium lauryl sulfate, and polyethylene glycol 4-sulfosuccinate of alcohol lauryl ether disodium salt (commercially available as Aerosol A 102 anionic surfactant from Cytec), alkyl disulfonated diphenyl ether disodium salts such as mono- and Dialkyl disulfonated diphenyl ether disodium salt (commercially available Dowfax 2A1 anionic surfactant, purchased from Dow Chemical Company), dihexyl sodium sulfosuccinate (commercially available Aerosol MA 80 nonionic surfactant , available from Cyanamid), polyoxy-1,2-ethanediyl-α-tridecyl-ω-hydroxyphosphate (commercially available as Rhodofac RS 610 anionic surfactant, available from Rhone-Poulenc), and Alkyl ether sulfate sodium salt (commercially available as Disponil FES 61 or Disponil FES 993 anionic surfactants from Henkel). More preferred are those surfactants selected from the group consisting of Aerosol OT 75 anionic surfactant, sodium lauryl sulfate, Dowfax 2A1 anionic surfactant, and Rhodofac RS 610 anionic surfactant. Most preferred are those surfactants selected from Aerosol OT 75 anionic surfactant, sodium lauryl sulfate, and Dowfax 2A1 anionic surfactant.

If the high temperature nonionic surfactant Emulgin PRT 200 nonionic surfactant or its general equivalent is selected, anionic surfactants that have been found to reduce the interfacial tension of epoxy resins at 20°C include those selected from Aerosol OT anionic surfactants , Rhodafac RS 610 anionic surfactant, and Dowfax 2A1 anionic surfactant.

If the low temperature nonionic surfactant Hydropalat 3037 nonionic surfactant or its general equivalent is selected, preferred anionic surfactants include those selected from the group consisting of Aerosol OT75 anionic surfactant, sodium lauryl sulfate, Aerosol A 102 anionic surfactant, Those surfactants of Rhodafac RS 610 anionic surfactant, Dowfax 2Al anionic surfactant, Aerosol MA 80 anionic surfactant, Disponil FES 993 anionic surfactant, and Disponil FES 61 anionic surfactant, wherein more preferred anionic The surfactant was selected from Aerosol OT 75 anionic surfactant, sodium lauryl sulfate, Rhodafac RS 610 anionic surfactant, and Dowfax 2A1 anionic surfactant.

That is, preferred anionic surfactants (or their general equivalents) for use in combinations of Hydropalat 3037 and Atsurf 108 nonionic surfactants include those selected from the group consisting of Aerosol OT75 anionic surfactant, sodium lauryl sulfate, Aerosol A 102 anionic surfactant agent, Rhodafac RS 610 anionic surfactant, Dowfax 2A1 anionic surfactant, Disponil FES 993 anionic surfactant, and Disponil FES 61 anionic surfactant, wherein more preferred anionic surfactants are selected from Aerosol OT 75 anionic surfactant Surfactant, Sodium Lauryl Sulfate, Rhodafac RS 610 Anionic Surfactant, and Dowfax 2A1 Anionic Surfactant.

Preferred anionic surfactants for use in the combination of Hydropalat 3037 and Emulgin PRT 200 nonionic surfactant include Aerosol OT 75 anionic surfactant, Rhodafac RS 610 anionic surfactant, and Dowfax 2A1 anionic surfactant.

If low temperature nonionic surfactant Emulpon EL 42 nonionic surfactant or its general equivalent is used, preferred anionic surfactants include those selected from the group consisting of Aerosol OT 75 anionic surfactant, sodium lauryl sulfate, Aerosol A 102 anionic surfactant agent, Rhodafac RS 610 anionic surfactant, Dowfax 2A1 anionic surfactant, Aerosol MA 80 anionic surfactant, wherein more preferred anionic surfactants are selected from Aerosol OT 75 anionic surfactant and Dowfax 2A1 anionic surfactant.

Preferred anionic surfactants for use in the combination of Emulpon EL 42 and Atsurf 108 nonionic surfactant (or its general equivalent) include those selected from the group consisting of Aerosol OT 75 anionic surfactant, sodium lauryl sulfate, Aerosol A 102 anionic surfactant agent, Rhodafac RS 610 anionic surfactant, Dowfax 2A1 anionic surfactant, wherein more preferred anionic surfactants are selected from Aerosol OT75 anionic surfactant and Dowfax 2A1 anionic surfactant.

Preferred anionic surfactants for the combination of Emulpon EL 42 and Emulgin PRT 200 nonionic surfactant (or its general equivalent) include those selected from the group consisting of Aerosol OT 75 anionic surfactant, Rhodafac RS 610 anionic surfactant, and Dowfax 2A1 Those surfactants of anionic surfactant, wherein more preferred anionic surfactant is selected from Aerosol OT 75 anionic surfactant and Dowfax 2A1 anionic surfactant.

If the low temperature nonionic surfactant Sorbanox AO nonionic surfactant or its general equivalent is selected, preferred anionic surfactants include those selected from the group consisting of Aerosol OT 75 anionic surfactant, sodium lauryl sulfate, Aerosol A 102 anionic surfactant , Rhodafac RS 610 anionic surfactant, Dowfax 2A1 anionic surfactant, Aerosol MA 80 anionic surfactant, wherein more preferred anionic surfactants are selected from the group consisting of Aerosol A 102 anionic surfactant, lauryl sulfate Sodium, Rhodafac RS 610 anionic surfactant, and Dowfax 2A1 anionic surfactant, and the most preferred anionic surfactant is selected from Aerosol A 102 anionic surfactant and Dowfax 2A1 anionic surfactant.

For the combination of Sorbanox AO with Atsurf 108 nonionic surfactant, preferred anionic surfactants include those selected from Aerosol OT 75 anionic surfactant, sodium lauryl sulfate, Aerosol A 102 anionic surfactant, Dowfax 2A1 anionic surfactant , and Rhodafac RS 610 anionic surfactants, wherein more preferred anionic surfactants are selected from Aerosol OT 75 anionic surfactants, sodium lauryl sulfate, Rhodafac RS 610 anionic surfactants, and Dowfax 2A1 anionic surfactants active agent.

For the combination of Sorbanox AO with Emulgin PRT 200 nonionic surfactant, preferred anionic surfactants include those selected from Aerosol OT 75 anionic surfactant, Rhodafac RS 610 anionic surfactant, and Dowfax 2A1 anionic surfactant active agent.

If the low temperature nonionic surfactant Disponil TA 430 nonionic surfactant or its general equivalent is selected, preferred anionic surfactants include those selected from the group consisting of Aerosol OT75 anionic surfactant, sodium lauryl sulfate, and Dowfax 2A1 anionic surfactant of those surfactants. For the combination of Disponil TA 430 and Emulgin PRT 200 or Atsurf 108 nonionic surfactants (or their general equivalents), preferred anionic surfactants include those selected from the group consisting of Aerosol OT 75 anionic surfactant and Dowfax 2A1 anionic surfactant Surfactant.

That is, preferred combinations of low- and high-temperature nonionic surfactants and anionic surfactants are readily determined.

The preferred ratio of high temperature nonionic surfactant to anionic surfactant is greater than 3:2, more preferably greater than about 2:1, most preferably greater than 3:1, and preferably not greater than about 20:1, more preferably not greater than about 12:1 1, most preferably no more than about 5:1. The preferred ratio of the sum of low temperature nonionic surfactant and high temperature nonionic surfactant to anionic surfactant is greater than 3:1, more preferably greater than 4.5:1, most preferably greater than 5:1, and preferably less than 100:1, More preferably less than 25:1, most preferably less than 10:1.

If an anionic surfactant is used, the preferred concentration of the surfactant is not less than 5% by weight, more preferably not less than 8% by weight, most preferably not less than 9% by weight, and preferably not more than 15% by weight, more preferably not more than 12% by weight, most preferably no more than 11% by weight, based on the weight of the epoxy resin.

Polyglycidyl ethers of polyhydric hydrocarbons can be prepared by reacting epihalohydrins with polyhydric or halogenated polyhydric hydrocarbons. These preparations are well known in the art. (See, eg, US Patent 5,118,729, col. 4). A preferred resin is the diglycidyl ether of bisphenol A.

Stable aqueous dispersions of epoxy resins can be prepared by any suitable method, including those described in US Pat. Preferably, stable aqueous dispersions of epoxy resins are prepared by first preparing a concentrated latex or high internal ratio (HIPR) emulsion and then diluting the concentrated latex or HIPR emulsion with water. Stable aqueous dispersions are preferably prepared from HIPR emulsions.

HIPR emulsions of epoxy resins may also be prepared by any suitable method, such as those described in US Pat. Preferably, the HIPR emulsion is prepared by continuously combining a stream of water at flow rate _r and a stream comprising epoxy resin _, low temperature nonionic surfactant, high temperature nonionic surfactant, and anionic surfactant at flow rate r to a disperser and then mix these streams with sufficient shear to form a HIPR emulsion. The ratio of flow rates _r2 : _r1 preferably ranges such that the polydispersity of the HIPR emulsion does not exceed 2, more preferably does not exceed 1.5, most preferably does not exceed 1.3, where polydispersity is defined as the ratio of volume average particle diameter to number average particle diameter (D _v /D _n ); or the volume average particle diameter measured by using a Coulter LS 230 particle size analyzer (Coulter Instrument) is not more than 2 microns, more preferably not more than 1 micron, most preferably not more than 0.5 microns. Preferably, r ₂ :r ₁ is not less than about 4:1, more preferably not less than 5:1, most preferably not less than 9:1, and more preferably not more than 16:1, more preferably not more than 14:1 1, most preferably no more than 12:1.

It has surprisingly been found that aqueous dispersions of epoxy resins having long-term storage stability and exceptionally low concentrations of surfactants can be prepared simply by appropriate selection of low- and high-temperature nonionic and anionic surfactants. This water-based epoxy resin can be blended with another latex such as S/B latex, or used as a crosslinker for carboxylated S/B latex. These blends are useful in paper coating or foam backing applications.

The following examples are for illustration only and are not intended to limit the scope of the invention. All pipe measurements refer to the inside diameter of the pipe.

Example - Preparation of stable aqueous dispersions of epoxy resins stabilized by Atsurf 108, Disponil TA 430 and Aerosol OT 75

I. Preparation of epoxy resin

Bisphenol A (2075 g) and D.E.R. TM 330 resin (trademark of The Dow Chemical Company, 6848 g) were charged to a 10 liter stainless steel reactor purged with anhydrous nitrogen. The reagents were mechanically stirred and the reactor temperature was raised to 130°C at a rate of 0.8°C/min. After the bisphenol A was dissolved, the Al catalyst (500 ppm ethyltriphenylphosphonium acetate based on bisphenol A and D.E.R. 330 resin, 70% active in methanol) was added. The reactor temperature was raised to 150°C at a rate of 0.8°C/min and an exotherm began. The reactor was maintained under adiabatic conditions to reach a peak exotherm temperature of 150-180°C for 30 minutes and then cooled to 120°C. When the temperature reached 130° C., the following ingredients were added: methyl p-toluenesulfonate (280 ppm, based on bisphenol A and D.E.R. 330 resin), Atsurf 108 nonionic surfactant (420 grams, obtained from Imperial Chemical Co., Ltd.), and Disponil TA 430 nonionic surfactant (510 grams, ex Henkel). When the temperature reached 120°C, Aerosol OT 75 ionic surfactant (140 grams, 75% active, purchased from Cyanamid) was added. Stirring was continued at 120°C for 30 minutes, at which point the epoxy became homogeneous.

II. Preparation of Epoxy Dispersion

The mixture of epoxy resin and surfactant described in the previous section (I) was kept molten in a stainless steel tank at 95°C. The molten dispersed phase was continuously pumped through a heated arm (80° C.) fitted to a 0.5 inch (1.2 cm) stainless steel tube at a rate of 34 g/min. Simultaneously, water (continuous phase) was pumped through an arm of 0.125 inch (0.3 cm) stainless steel tubing fitted to T at a constant rate of 10-7.5 g/min. The two streams were combined and mixed together under shear conditions using a water jacketed 4 inch (10 cm) centrifugal pump head connected to a T using 0.5 inch (1.2 cm) stainless steel tubing. on, and operate at 660rpm. Useful HIPR emulsions are formed in which the ratio of the dispersed phase to the continuous phase is from about 6:1 to about 11:1. The HIPR emulsion leaving the head of the centrifugal pump then flows through another arm of heated (80°C) 0.5 inch (1.2 cm) stainless steel tubing fitted to the T so that the 0.5 inch (1.2 cm) stainless steel tubing is connected to the second band Inlet for the 4 inch (10 cm) centrifugal pump head of the water jacket. Simultaneously, at a constant rate sufficient to dilute the solids content of the dispersion to 50-60% solids, hot dilution water (85°C) was drawn through an arm of 0.25 inch (0.6 cm) stainless steel tubing fitted to the T superior. Volume average particle size and polydispersity were determined using a Coulter LS 230 light scattering particle size analyzer. The particle size was found to be 0.368 microns and the polydispersity (D _v /D _n ) was found to be 1.19.

Claims (5)

1. composition, it comprises the mixture of Resins, epoxy and low temperature nonionic surfactant, high temperature nonionic surfactant and anion surfactant, compared with the interfacial tension value of Resins, epoxy when this anion surfactant not, this anion surfactant can reduce the interfacial tension value of Resins, epoxy in conjunction with low-temperature surface promoting agent and pyrometer surface-active agent the time; Wherein said low temperature nonionic surfactant is characterised in that molecular weight is not less than 1000 and be no more than 7000, and described high temperature nonionic surfactant is characterised in that molecular weight greater than 7000 and be no more than 20000, and satisfies following each standard:

I) high temperature nonionic surfactant to the weight ratio of anion surfactant greater than 3: 1;

Ii) the summation of low temperature nonionic surfactant and high temperature nonionic surfactant to the weight ratio of anion surfactant greater than 4.5: 1; And

Iii) total surfactant concentration is that the weight with total surfactant and Resins, epoxy is the 5-20% weight of benchmark.

2. according to the composition of claim 1, wherein:

A) low temperature nonionic surfactant is characterised in that any following structure:

Formula I

Or

CH ₃(CH ₂) _xO(CH ₂CH ₂O) _y-H

Formula II

Or

Formula III

Wherein the summation of n, m and p makes the molecular weight of formula I be not less than 1000 dalton and is no more than 7000 dalton; Wherein x is 10-18, and wherein y is 30-50; R wherein ¹Be oil base (9-octadecylene-yl), and R ²For

Or

Wherein the summation of w and z is not less than 10 and be no more than 30; And

B) high temperature nonionic surfactant is an ethoxylated phenol, or it is characterized in that following structure:

Wherein e is not less than 10 and be no more than 50 respectively independently, and f is not less than 100 and be no more than 500; Or have the compound of formula I, wherein the summation of n, m and p makes the molecular weight of I greater than 7000 dalton and be lower than 20000 dalton.

3. composition, it comprises the stable aqueous dispersion by the Resins, epoxy of low temperature nonionic surfactant, high temperature nonionic surfactant and anion surfactant stabilization, compared with the interfacial tension value of Resins, epoxy when this anion surfactant not, this anion surfactant can reduce the interfacial tension value of Resins, epoxy in conjunction with low-temperature surface promoting agent and pyrometer surface-active agent the time; Wherein said low temperature nonionic surfactant is characterised in that molecular weight is not less than 1000 and be no more than 7000, and described high temperature nonionic surfactant is characterised in that molecular weight greater than 7000 and be no more than 20000, and satisfies following each standard:

I) high temperature nonionic surfactant to the weight ratio of anion surfactant greater than 3: 1;

Ii) the summation of low temperature nonionic surfactant and high temperature nonionic surfactant to the weight ratio of anion surfactant greater than 4.5: 1; And

Iii) total surfactant concentration is that the weight with total surfactant and Resins, epoxy is the 5-20% weight of benchmark.

4. according to the composition of claim 3, wherein:

A) low temperature nonionic surfactant is characterised in that any following structure:

Formula I

Or

CH ₃(CH ₂) _xO(CH ₂CH ₂O) _y-H

Formula II

Or

Formula III

Wherein the summation of n, m and p makes the molecular weight of formula I be not less than 1000 dalton and is no more than 7000 dalton; Wherein x is 10-18, and wherein y is 30-50; R wherein ¹Be oil base (9-octadecylene-yl), and R ²For

Or

Wherein the summation of w and z is not less than 10 and be no more than 30; And

B) high temperature nonionic surfactant is an ethoxylated phenol, or is characterised in that following structure:

Wherein e is not less than 10 and be no more than 50 respectively independently, and f is not less than 100 and be no more than 500; Or have the compound of formula I, wherein the summation of n, m and p makes the molecular weight of I greater than 7000 dalton and be lower than 20000 dalton.

5. method for preparing the stable aqueous dispersion of Resins, epoxy, it may further comprise the steps:

A) in the presence of the surfactant mixture of emulsification and stable quantity, be r with flow velocity ₁Current and flow velocity be r ₂The flow stream that contains Resins, epoxy merge in the decollator continuously;

B), form the emulsion of high internal phase ratio with these logistics of shear-mixed of q.s; Then

C) emulsion of dilute with water high internal phase ratio forms stable water dispersion;

Wherein said surfactant mixture comprises low temperature nonionic surfactant and high temperature nonionic surfactant, wherein said low temperature nonionic surfactant is characterised in that molecular weight is not less than 1000 and be no more than 7000, and described high temperature nonionic surfactant is characterised in that molecular weight is greater than 7000 and be no more than 20000; R wherein ₂: r ₁Scope make the volume average particle size of this dispersion be no more than 2 microns, and this r ₂: r ₁Scope for being not less than 4: 1 and be no more than 16: 1;

Wherein said surfactant mixture also comprises a kind of anion surfactant, compared with the interfacial tension value of Resins, epoxy when this anion surfactant not, this anion surfactant can reduce the interfacial tension value of Resins, epoxy in conjunction with low-temperature surface promoting agent and pyrometer surface-active agent the time; And satisfy following each standard:

I) high temperature nonionic surfactant to the weight ratio of anion surfactant greater than 3: 1;

Ii) the summation of low temperature nonionic surfactant and high temperature nonionic surfactant to the weight ratio of anion surfactant greater than 4.5: 1;

Iii) total surfactant concentration is that the weight with total surfactant and Resins, epoxy is the 5-20% weight of benchmark.