[go: up one dir, main page]

CN120198629A - Data processing method for line scanning laser 3D camera - Google Patents

Data processing method for line scanning laser 3D camera Download PDF

Info

Publication number
CN120198629A
CN120198629A CN202510261933.4A CN202510261933A CN120198629A CN 120198629 A CN120198629 A CN 120198629A CN 202510261933 A CN202510261933 A CN 202510261933A CN 120198629 A CN120198629 A CN 120198629A
Authority
CN
China
Prior art keywords
measured object
camera
height
scanning laser
line scanning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202510261933.4A
Other languages
Chinese (zh)
Inventor
周春东
刘建
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Xinge Intelligent Technology Co ltd
Original Assignee
Shanghai Xinge Intelligent Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Xinge Intelligent Technology Co ltd filed Critical Shanghai Xinge Intelligent Technology Co ltd
Priority to CN202510261933.4A priority Critical patent/CN120198629A/en
Publication of CN120198629A publication Critical patent/CN120198629A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/02Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608Height gauges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/24Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/10Image acquisition
    • G06V10/12Details of acquisition arrangements; Constructional details thereof

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

本发明揭示了一种线扫描激光3D相机数据处理方法,用以测量电路板上PIN针等细小且具有一定高度的物体,其中所述方法包括如下步骤:以扫描宽度为X方向,以测量高度为Z方向建立X‑Z坐标系;以被测物体主要基面的成像光斑为基础,离被测物体主要基面的成像光斑的设定距离处设置预定大小的优先采集区域;利用线扫描激光3D相机采集被测物体的图像;根据采集的被测物体的图像数据,在扫描宽度方向上,如果在X方向同一列像素在测量高度Z方向只有一个光斑,则使用此光斑进行相应的算法取点;如果存在二个或以上光斑,则使用上述优先采集区域内的光斑进行相应的算法取点。

The present invention discloses a data processing method for a line scanning laser 3D camera, which is used to measure small objects with a certain height, such as PIN needles on a circuit board, wherein the method comprises the following steps: establishing an X-Z coordinate system with a scanning width as an X direction and a measuring height as a Z direction; setting a priority acquisition area of a predetermined size at a set distance from the imaging spot of the main base surface of the measured object based on an imaging spot of the main base surface of the measured object; using a line scanning laser 3D camera to acquire an image of the measured object; according to the acquired image data of the measured object, in the scanning width direction, if there is only one spot in the measuring height Z direction in the same column of pixels in the X direction, using this spot to perform corresponding algorithm point selection; if there are two or more spots, using the spots in the above-mentioned priority acquisition area to perform corresponding algorithm point selection.

Description

Line scanning laser 3D camera data processing method
[ Field of technology ]
The invention relates to the technical field of measurement, in particular to a data processing method of a line scanning laser 3D camera.
[ Background Art ]
For a measured object with a small PIN needle and the like and a certain height on a circuit board, when the line laser 3D contour camera is used for scanning, the area of an imaging light spot is small or the brightness is very dark after the measured object is small or the surface (or the inclined plane) at the top end is reflected, and reflection light spots are easily formed right above or right below the small light spot due to multiple reflections caused by the laser reflected by other objects around the measured object, and when the line laser 3D contour camera is used for contour line point taking, all or part of the reflection light spots are easily adopted for point taking, so that the real light spot (corresponding pixel) of the measured object to be measured is not fully acquired (namely, part or all of the pixel which is really required to be acquired is missing), and the corresponding measurement size of the measured object is failed or wrong.
In view of this problem, the industry also has to mask the reflected light spot to remove noise, but the small measured objects are usually numerous and have small spacing, so that the method is not suitable for setting many masking areas, and other areas needing to be measured are easily masked to cause that imaging cannot be performed, so that the measurement is affected.
[ Invention ]
The invention aims to provide a line scanning laser 3D camera data processing method, which is used for solving the problems that in the prior art, an object which is tiny and has a certain height is measured by using a line scanning laser 3D camera, and a plurality of light spots exist due to multiple reflection, so that measurement errors are caused, or a plurality of shielding areas are not easy to set, so that the influence of reflected light is eliminated.
In order to achieve the above object, the line scanning laser 3D camera data processing method of the present invention is implemented to measure fine objects with a certain height, such as PIN needles, on a circuit board, and the method includes the following steps:
Establishing an X-Z coordinate system by taking the scanning width as the X direction and the measuring height as the Z direction;
setting a preferential acquisition area with a preset size at a set distance from an imaging light spot of a main base surface of a measured object based on the imaging light spot of the main base surface of the measured object;
Acquiring an image of a measured object by using a line scanning laser 3D camera;
According to the collected image data of the measured object, if the same column of pixels in the X direction has only one light spot in the Z direction of the measured height, the light spot is used for carrying out corresponding algorithm point taking, and if two or more light spots exist, the light spot in the preferential collecting area is used for carrying out corresponding algorithm point taking.
Preferably, the preferential collection area is provided with a plurality of preferential collection areas according to different heights of the measured object.
Preferably, the width of the preferential collection area in the X direction is determined according to the distribution position of the measured object to be measured, and the height in the Z direction is determined according to the variation range of the height of the measured object.
Compared with the prior art, the line scanning laser 3D camera data processing method has the advantages that the priority acquisition area is set in the X-Z coordinate system recommended in the X direction by taking the scanning width and the Z direction by taking the measuring height as the Z direction in advance, after the image of the measured object is acquired by using the line scanning laser 3D camera, the corresponding algorithm point taking is carried out by using the light spot if only one light spot exists in the Z direction of the measuring height of the same column of pixels in the X direction in the scanning width direction through judgment, and if two or more light spots exist, the corresponding algorithm point taking is carried out by using the light spot in the priority acquisition area, so that the real data of the measured object can be acquired to the greatest extent, the problem that multiple light spots exist to cause measurement errors is solved, and the problem that multiple shielding areas are not easy to be set when the PIN needle and other small objects with certain heights are measured on a circuit board is solved by the method, so that the influence of reflected light is eliminated.
[ Description of the drawings ]
Fig. 1 is a flow chart of a line scanning laser 3D camera data processing method embodying the present invention.
FIG. 2 is a schematic diagram of an image of an object under test acquired by the method of the present invention.
[ Detailed description ] of the invention
Fig. 1 is a flow chart of a line scanning laser 3D camera data processing method according to the present invention. The line scanning laser 3D camera data processing method is used for measuring tiny objects with a certain height, such as PIN needles and the like, on a circuit board, and comprises the following steps:
Establishing an X-Z coordinate system by taking the scanning width as the X direction and the measuring height as the Z direction;
setting a preferential acquisition area with a preset size at a set distance from an imaging light spot of a main base surface of a measured object based on the imaging light spot of the main base surface of the measured object;
Acquiring an image of a measured object by using a line scanning laser 3D camera;
According to the collected image data of the measured object, in the scanning width direction, if the same column of pixels in the X direction has only one light spot in the measuring height Z direction, the light spot is used for carrying out corresponding algorithm point taking, and if two or more light spots exist, the light spots in the preferential collecting area are used for carrying out corresponding algorithm point taking (for example, corresponding measuring points are selected when the height measurement is carried out).
In a specific implementation, the preferential collection areas are provided with a plurality of preferential collection areas according to different heights of the measured object, for example, when a plurality of electronic elements with PIN needles of different heights exist on the measured object (such as a whole circuit board), the preferential collection areas can be provided corresponding to the PIN needles of different heights, and the light spots corresponding to the preferential collection areas can be preferentially selected according to the method when the light spots are selected for the PIN needles of different heights.
In addition, in the implementation, the width of the preferential collection area in the X direction is determined according to the distribution position of the measured object to be measured, so as to cover the width of the electronic element with the PIN in the X direction, and the height in the Z direction is determined according to the variation range of the height of the measured object, but is not excessively large, so as to avoid light spots formed by unnecessary multiple reflections. And when collecting the light spot of the preferential collection area, whether the light spot is larger or smaller than the light spot outside the preferential collection area is not required to be considered, namely, the traditional mode of comparing and collecting the light spot with larger brightness by utilizing the light spot brightness is not required to be adopted.
Fig. 2 is a schematic diagram showing an image of an object to be measured acquired by the method of the present invention. In fig. 2, an X-Z coordinate system is established with a scanning width being an X direction and a measuring height being a Z direction, after an image of a measured object is acquired by using a line scanning laser 3D camera, a spot image in the height Z direction is generated with each column of pixels on the scanning width, at this time, a spot in the height Z direction formed by multiple reflection exists, wherein the spot is different in height from a spot of the measured object actually required to be acquired in the height Z direction, so that a spot formed by multiple reflection light rays in the height Z direction can be eliminated by presetting a preferential acquisition area, wherein the preferential acquisition area is set at a set distance from an imaging spot of a main base surface of the measured object, and in actual implementation, an imaging spot of the main base surface of the measured object can be acquired first (this is described in detail in the prior art), then a preferential acquisition area is set, according to the acquired image data of the measured object, if the pixel in the same column in the X direction is in the height Z direction, the spot is acquired in the corresponding algorithm is performed, and if the spot is acquired in the corresponding area, and the algorithm is performed by using the two spots. Therefore, the light spots formed by multiple reflection outside the preferential collection area can be eliminated to a great extent, and the light spots with the maximum brightness can be selected only by comparing the brightness of the light spots according to the traditional mode if the light spots formed by multiple reflection are also inside the preferential collection area, but the probability is smaller, so that the influence of the light spots formed by multiple reflection can be reduced as a whole.
In the above steps, when the line scanning laser 3D camera is used to collect the image of the object to be measured and then generate a spot image in the height Z direction with each column of pixels on the scan width, the line scanning laser 3D camera is used to collect the image of the object to be measured and then acquire the height information corresponding to each pixel by using a method such as triangulation, then generate a spot image in the height Z direction with each column of pixels on the scan width, and the spot image usually does not include only one pixel, but may include multiple pixels depending on the accuracy of the pixel, and the multiple pixels form the spot image, which is not described in detail in the prior art.
Compared with the prior art, the line scanning laser 3D camera data processing method has the advantages that the priority acquisition area is set in the X-Z coordinate system recommended in the X direction by taking the scanning width as the X direction and taking the measuring height as the Z direction in advance, after the image of the measured object is acquired by using the line scanning laser 3D camera, if only one light spot exists in the Z direction of the measuring height of the same column of pixels in the X direction of the scanning width, the light spot is used for carrying out corresponding algorithm point taking, if two or more light spots exist, the light spot in the priority acquisition area is used for carrying out corresponding algorithm point taking, so that real data of the measured object can be acquired to the greatest extent, the problem that multiple reflection causes measurement errors due to a plurality of light spots is avoided, and the method can also solve the problem that a plurality of shielding areas are difficult to set when the PIN needle and other fine objects with certain heights are measured on a measuring circuit board, so that the influence of reflected light is eliminated.
It will be understood that equivalents and modifications will occur to those skilled in the art in light of the present invention and their spirit, and all such modifications and substitutions are intended to be included within the scope of the present invention as defined in the following claims.

Claims (3)

1.一种线扫描激光3D相机数据处理方法,用以测量电路板上PIN针等细小且具有一定高度的物体,其特征在于所述方法包括如下步骤:1. A line scanning laser 3D camera data processing method for measuring small objects with a certain height such as PIN needles on a circuit board, characterized in that the method comprises the following steps: 以扫描宽度为X方向,以测量高度为Z方向建立X-Z坐标系;An X-Z coordinate system is established with the scanning width as the X direction and the measuring height as the Z direction; 以被测物体主要基面的成像光斑为基础,离被测物体主要基面的成像光斑的设定距离处设置预定大小的优先采集区域;Based on the imaging light spot of the main base surface of the measured object, a priority acquisition area of a predetermined size is set at a set distance from the imaging light spot of the main base surface of the measured object; 利用线扫描激光3D相机采集被测物体的图像;Use a line scanning laser 3D camera to capture images of the object being measured; 根据采集的被测物体的图像数据,在扫描宽度方向上,如果在X方向同一列像素在测量高度Z方向只有一个光斑,则使用此光斑进行相应的算法取点;如果存在二个或以上光斑,则使用上述优先采集区域内的光斑进行相应的算法取点。According to the collected image data of the measured object, in the scanning width direction, if there is only one light spot in the same column of pixels in the X direction in the measuring height Z direction, this light spot is used to perform the corresponding algorithm point selection; if there are two or more light spots, the light spots in the above-mentioned priority acquisition area are used to perform the corresponding algorithm point selection. 2.如权利要求1所述的线扫描激光3D相机数据处理方法,其特征在于:所述优先采集区域根据被测物体不同的高度设有多个。2. The line scanning laser 3D camera data processing method according to claim 1 is characterized in that: the priority acquisition area is set in multiple according to the different heights of the object to be measured. 3.如权利要求1所述的线扫描激光3D相机数据处理方法,其特征在于:所述优先采集区域在X方向的宽度根据需要测量的被测物体的分布位置确定,而在Z方向的高度则依据被测物体高度的变化范围确定。3. The data processing method of a line scanning laser 3D camera as claimed in claim 1, characterized in that: the width of the priority acquisition area in the X direction is determined according to the distribution position of the measured object to be measured, and the height in the Z direction is determined according to the variation range of the height of the measured object.
CN202510261933.4A 2025-03-06 2025-03-06 Data processing method for line scanning laser 3D camera Pending CN120198629A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202510261933.4A CN120198629A (en) 2025-03-06 2025-03-06 Data processing method for line scanning laser 3D camera

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202510261933.4A CN120198629A (en) 2025-03-06 2025-03-06 Data processing method for line scanning laser 3D camera

Publications (1)

Publication Number Publication Date
CN120198629A true CN120198629A (en) 2025-06-24

Family

ID=96070945

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202510261933.4A Pending CN120198629A (en) 2025-03-06 2025-03-06 Data processing method for line scanning laser 3D camera

Country Status (1)

Country Link
CN (1) CN120198629A (en)

Similar Documents

Publication Publication Date Title
JP3522280B2 (en) Method and apparatus for a ball bond inspection system
US7026832B2 (en) Probe mark reading device and probe mark reading method
JP4901903B2 (en) 3D inspection system
US8233041B2 (en) Image processing device and image processing method for performing three dimensional measurements
US5943551A (en) Apparatus and method for detecting defects on silicon dies on a silicon wafer
JP2870142B2 (en) Coplanarity measuring method and apparatus
JPH11148807A (en) Bump height measuring method and bump height measuring device
CN110473165A (en) A kind of welding quality of circuit board detection method and device
CN115035031A (en) Defect detection method and device for PIN (personal identification number) PIN, electronic equipment and storage medium
US7139421B1 (en) Methods and apparatuses for detecting similar features within an image
US20030156750A1 (en) PICA system detector calibration
US6614926B1 (en) Methods and apparatuses for generating from an image a model of an object
CN118641558A (en) A double-sided AOI inspection mechanism for PCB circuit boards
CN120198629A (en) Data processing method for line scanning laser 3D camera
JP3945638B2 (en) Inspection method and inspection apparatus
GB2297379A (en) Inspection of semiconductor device for defective leads
JP3857668B2 (en) Pattern alignment method
JP3039704B2 (en) Printing evaluation method and printing evaluation device
JP2850807B2 (en) Inspection data creation device
JPH07104136B2 (en) Terminal tilt detection method
JPH06347232A (en) Visual inspection apparatus for printed board
JPH05272945A (en) Apparatus for inspecting bent part of lead
JP3621222B2 (en) Pattern arrangement recognition method for semiconductor substrate
JP3283866B2 (en) Circuit pattern defect inspection method and apparatus
JPH0372203A (en) Checking method of outer appearance of soldering part

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination