Detailed Description
In order to make the objects, technical solutions and advantageous effects of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and detailed description. It should be understood that the detailed description is intended to illustrate the application, and not to limit the application.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "plurality" means two or more, unless specifically defined otherwise.
In the description of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, directly connected, indirectly connected via an intermediate medium, or in communication between two elements or in interaction with each other. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.
The backplane connector is applied to communication technology. A pair of backplane connectors are used to mechanically and electrically connect the daughter board and the backplane in an orthogonal manner. The daughter board and the backboard are both circuit boards.
Please refer to fig. 1 and 2. Fig. 1 is a schematic three-dimensional structure of an embodiment of a backplane connector 10 according to the present application. Fig. 2 is a three-dimensional exploded view of the backplane connector 10 shown in fig. 1.
In some embodiments, the backplane connector 10 includes a plurality of signal transmission modules 200, a base 100, and a conductive mount 300.
Each signal transmission module 200 has a mating end 201 and a crimping end 202. The signal transmission module 200 has a signal pin (not shown) at the press-connection end 202, and is press-fitted with the circuit board through the signal pin for electrical connection. The signal transmission module 200 has a conductive spring (not shown) at the plugging end 201, and is plugged and matched with another back board connector through the conductive spring for electrical connection. The signal transmission module 200 is used for transmitting signals.
In one scenario of assembling the backplane connector 10 to a circuit board, the plurality of signal transmission modules 200 are assembled to the base 100, then the conductive mounting members 300 are assembled to the plurality of signal transmission modules 200 to form the backplane connector 10, and then the backplane connector 10 is crimped to the circuit board. Specifically, the crimping direction is the positive direction of the Z-axis.
Crimping is a joining technique whereby two or more objects are firmly joined together by the application of pressure. During crimping, sufficient force is created between the contacting surfaces of two or more objects to establish a connection by applying an appropriate pressure. Crimping can be performed based on different principles and methods, including mechanical compression, thermal crimping, ultrasonic crimping, cold crimping, and the like.
The plurality of signal transmission modules 200 are stacked one on another along the X-axis and mounted on the base 100. In fig. 1 and 2, only two signal transmission modules 200 are shown to make the view more compact. The specific structures of the signal transmission modules 200 may be the same or different.
The base 100 allows the plurality of signal transmission modules 200 to be integrated, thereby facilitating assembly of the plurality of signal transmission modules 200 to a circuit board. The base 100 is provided with a through hole (not shown) at the plugging end 201 corresponding to the signal transmission module 200, so as to avoid the conductive elastic sheet.
The connection structure between the signal transmission module 200 and the base 100 does not relate to the improvement point of the present application, and reference may be made to the related design, which is not described herein. The improvement of the present application is mainly the connection structure between the conductive mount 300 and the signal transmission module 200, which will be described in detail below.
Please refer to fig. 3 and fig. 4 together. Fig. 3 is a front view of the crimp end 202 of the back-plate connector 10 of fig. 1. Fig. 4 is an enlarged view of a partial view a in fig. 3.
The conductive mounting member 300 is disposed at the press-connection end 202 of the signal transmission module 200 and is in limit fit with the signal transmission modules 200 respectively, so as to limit the position of the signal pins 203 of each signal transmission module 200, thereby facilitating the assembly of the signal transmission modules 200 to the circuit board. The conductive mount 300 is also used to electrically connect with a shield in the signal transmission module 200 to increase the return path. The conductive mount 300 is provided with a through hole 302 to avoid the signal pin 203. The conductive mount 300 isolates the plurality of signal pins 203 from each other in each signal transmission module 200, avoiding cross-talk between the signal pins 203.
In some embodiments, the conductive mount 300 is plastic and the outer surface is coated with a metal plating. In other embodiments, the conductive mount 300 is a conductive plastic.
In the related art, the conductive mount 300 is easily detached, affecting the efficiency of crimping the back-plate connector 10 to the circuit board. In the embodiment of the present application, in order to improve the mounting firmness of the conductive mounting member 300, the following improvement is made.
Please refer to fig. 5 to fig. 7. Fig. 5 is a three-dimensional view of a partial structure of the signal transmission module 200 in the backplane connector 10 shown in fig. 1. Fig. 6 is a three-dimensional view of a partial structure of the conductive mount 300 in the back-plane connector 10 shown in fig. 1. Fig. 7 is a sectional view of B-B in fig. 4.
In some embodiments, the signal transmission module 200 includes a carrier body 204 and conductive terminals 205. The conductive terminals 205 are embedded in the carrier body 204, and a portion of the conductive terminals extends out of the carrier body 204 along the first direction Z to form the signal pins 203. The conductive mounting member 300 has a receiving groove 301 and a through hole 302. The accommodating groove 301 is opened in a reverse direction of the first direction Z, and the through hole 302 is disposed at the bottom of the accommodating groove 301 and penetrates the conductive mounting member 300 along the first direction Z. A portion of the carrier body 204 is inserted into the accommodating groove 301 along the first direction Z and abuts against a sidewall surface 303 of the accommodating groove 301 to limit the conductive mounting member 300 from being separated from the carrier body 204, and the signal pins 203 pass through the conductive mounting member 300 through the through holes 302.
Specifically, the accommodating groove 301 includes a bottom wall surface 304 and a side wall surface 303 surrounding the bottom wall surface 304, wherein the through hole 302 is opened in the bottom wall surface 304.
Specifically, the exposed portions of the signal pins 203 that pass through the conductive mount 300 are used for crimping into the circuit board. In some embodiments, as shown in fig. 5, the signal pins 203 are fish eye terminal shaped.
Specifically, a pair of signal pins 203 pass through the conductive mount 300 through the same through-hole 302, and the pair of signal pins 203 can be used to transmit a pair of differential signals. The conductive mount 300 is disposed around the pair of signal pins 203, separating it from the remaining signal pins 203 and forming a shield.
In this technical solution, a portion of the carrying main body 204 is inserted in the accommodating groove 301 along the first direction Z and is abutted to the conductive mounting member 300 in the radial direction of the accommodating groove 301 to form a tight fit, so as to limit the conductive mounting member 300 from separating from the carrying main body 204, thereby increasing the installation firmness of the conductive mounting member 300 and reducing the risk of falling off the conductive mounting member 300. In addition, the carrier body 204 is mated with the conductive mount 300 in a concave-convex manner along the first direction Z, such that the degrees of freedom of both in a plane perpendicular to the first direction Z are limited, thereby limiting the position of the signal pins 203 relative to the conductive mount 300. The positional degree of the plurality of signal pins 203 of the backplane connector 10 can be ensured when each of the signal transmission modules 200 is mated with the conductive mount 300 in the first direction Z.
Please refer to fig. 8. Fig. 8 is a three-dimensional exploded view of the partial structure shown in fig. 5.
In some embodiments, the carrier body 204 includes an insulator 206, a first shield 207, and a second shield 208. The first shielding member 207 is attached to one side surface of the insulating member 206 along the second direction X. The second shielding member 208 is attached to the other side surface of the insulating member 206 along the second direction X. The second direction X is perpendicular to the first direction Z. The conductive terminals 205 are embedded in the insulating member 206, and a portion of the conductive terminals extend out of the insulating member 206 along the first direction Z to form the signal pins 203. The insulating member 206, the first shielding member 207 and the second shielding member 208 extend into the accommodating groove 301, and the side wall surface 303 of the accommodating groove 301 presses the first shielding member 207 and the second shielding member 208 against the insulating member 206.
That is, the conductive mount 300 is clamped to the carrier body 204 in the second direction X, thereby being held to the carrier body 204 by static friction.
In some embodiments, the first shield 207 includes a shield body 209 and a convex hull 210. The shielding body 209 is attached to a side surface of the insulating member 206 along the second direction X. The convex hull 210 is convex on a surface of the shielding main body 209 facing away from the insulating member 206. The convex hull 210 abuts against the sidewall surface 303 of the accommodating groove 301 along the second direction X. The conductive mount 300 is electrically connected to the shield body 209 through the bump 210.
Specifically, the first shield 207 may be a sheet metal member. The convex hull 210 is formed on the shield main body 209 by means of stamping. The convex hull 210 is concave on the side of the shield body 209 facing the insulator 206 and convex on the side of the shield body 209 facing away from the insulator 206.
When the conductive mount 300 is assembled, the end of the shield main body 209 in the first direction Z is inserted into the accommodating groove 301 and does not contact the conductive mount 300, and as the shield main body 209 is inserted into the accommodating groove 301, the convex hull 210 enters the accommodating groove 301 and abuts against the side wall surface 303 of the accommodating groove 301 in the second direction X.
Because of manufacturing or assembly errors, the end of the shield body 209 in the first direction Z is not fully attached to the insulator 206, and there is some degree of tilting, resulting in interference with the assembly of the conductive mount 300. In the embodiment of the present application, by providing the convex hull 210, interference between the shielding main body 209 and the conductive mounting member 300 can be avoided.
In the case where the first shield 207 does not have the convex hull 210, the first shield 207 is in surface contact with the conductive mount 300, and the two cannot be completely attached due to manufacturing errors or assembly errors, thereby causing uncertainty in the contact position. In this embodiment, the first shield 207 contacts the conductive mount 300 through the convex hull 210, ensuring that the contact location is stable and consistent with expectations. In the case where the first shielding member 207 and the conductive mounting member 300 are electrically connected through the contact, the provision of the convex hull 210 can maintain stable electrical connection.
Likewise, the second shield 208 may also be configured similar to the first shield 207, i.e., including a shield body and a convex hull. And will not be described in detail herein.
In some embodiments, the first shielding member 207 further includes a protruding portion 211, where the protruding portion 211 is disposed on the shielding body 209 and protrudes from the insulating member 206 along the third direction Y. The third direction Y is perpendicular to the first direction Z and the second direction X, respectively, and the protruding portion 211 is embedded in the conductive mounting member 300. The conductive mounting member 300 is electrically connected to the shielding main body 209 through the protruding portion 211.
In some embodiments, the number of the protruding portions 211 is at least two (two in the illustrated embodiment), and the two protruding portions 211 are disposed on opposite sides of the first shielding main body 209 along the third direction Y.
Specifically, the shield body 209, the convex hull 210, and the convex thorn 211 are integrally formed by a punching process.
When the conductive mount 300 is assembled, the protruding portion 211 breaks the side wall surface 303 of the accommodating groove 301 as the shield main body 209 is inserted into the accommodating groove 301, and is fitted into the conductive mount 300.
First, by providing the protruding portion 211, the embodiment of the present application can improve the holding force between the conductive mounting member 300 and the first shielding member 207, and further reduce the risk of the conductive mounting member 300 falling off. Next, the protruding portion 211 is embedded in the conductive mounting member 300, so that the effect of electrical connection can be improved. Again, the protruding portion 211 and the protruding portion 210 are located at different positions of the first shielding member 207, respectively, and the protruding portion 211 is provided, so that the conductive contact position between the conductive mounting member 300 and the first shielding member 207 can be increased, and the reflow path is increased.
The second shielding member 208 may also be provided with a protruding portion, which will not be described here.
Please refer to fig. 5 and 6.
In some embodiments, the conductive mount 300 is pressed against the carrier body 204 in a direction opposite to the first direction Z.
Specifically, the insulator 206 in the carrier body 204 has a first abutting portion 212, and the first abutting portion 212 is a plane. The conductive mounting member 300 has a second abutting portion 305, and the second abutting portion 305 is an end surface of the conductive mounting member 300 facing the carrier body 204 along the first direction Z. The accommodating groove 301 is opened on the end surface. In a state where the conductive mount 300 is mounted on the carrier body 204, the first abutting portion 212 and the second abutting portion 305 abut in the first direction Z to limit the relative positions of the conductive mount 300 and the carrier body 204 in the first direction Z. Wherein, the first shielding member 207, the insulating member 206, and the second shielding member 208 protrude from the first abutting portion 212 and are partially inserted into the accommodating groove 301.
Please refer to fig. 5 and 6.
In some embodiments, the first shield 207 forms a ground pin 213 at an end of the first direction Z, the ground pin 213 for crimping to a circuit board. Wherein the ground pins 213 are located between two adjacent pairs of signal pins 203 along the third direction Y.
The conductive mounting member 300 further has a second receiving groove 306 and a second through hole 307. The second accommodating groove 306 is opened in a reverse direction of the first direction Z, and the second through hole 307 is disposed at a bottom of the second accommodating groove 306 and penetrates the conductive mounting member 300 along the first direction Z. The second accommodating groove 306 is located between two adjacent first accommodating grooves 301 along the third direction Y.
The other portion of the carrier body 204 is inserted into the second accommodating groove 306 along the first direction Z and abuts against a sidewall surface of the second accommodating groove 306 to limit the conductive mounting member 300 from being separated from the carrier body 204, and the grounding pin 213 passes through the conductive mounting member 300 through the second through hole 307.
The connection structure between the carrier body 204 and the conductive mounting member 300 at the second accommodating groove 306 may refer to the connection structure at the accommodating groove 301, and will not be described herein.
In order to make the heights of the ground pin 213 and the signal pin 203 uniform in the second direction X, the first shield 207 is provided with a bent structure at the ground pin 213. Due to the provision of the bending structure, when the ground pin 213 is crimped, there are cases where the ground pin 213 is reversely retreated in the first direction Z, and where the position degree of the ground pin 213 is not easily ensured, the following improvement is made to solve the problem.
Please refer to fig. 8 and 9. Fig. 9 is a C-C cross-sectional view of fig. 4.
In some embodiments, the insulator 206 has a first surface 214, a second surface 215, and a third surface 216 connected sequentially along the first direction Z and forming a step. The first shield 207 includes a shield main body 209, a connection portion 218, and a plug portion 219 connected in order along a first direction Z. The shielding main body 209 covers and is fixed on the first surface 214. The connection portion 218 is bent from an edge of the shielding body 209 and disposed opposite to the second surface 215. The plugging portion 219 is bent from the edge of the connecting portion 218 and disposed opposite to the third surface 216. The end of the plug 219 facing away from the connection 218 forms the ground pin 213. The conductive mounting member 300 presses the plugging portion 219 against the third surface 216, and the insulating member 206 of the plugging portion 219 is in concave-convex fit along the normal direction (the second direction X) of the third surface 216.
Specifically, the third surface 216 has a protruding limiting protrusion 217, and the plugging portion 219 has a notch 220 that matches the shape and size of the limiting protrusion 217. The plugging portion 219 is sleeved outside the limiting protrusion 217 through the notch 220, so that a limiting matching structure is formed.
Specifically, the plugging portion 219 has a protruding portion 221 on a side facing away from the third surface 216, and the protruding portion 221 is located at an edge of the notch 220. The conductive mounting member 300 abuts against the protruding portion 221, so as to press the plugging portion 219 against the third surface 216.
Specifically, the insulator 206 is substantially flat plate-shaped, and the first shield 207 and the second shield 208 are provided on both sides in the thickness direction of the insulator 206, respectively. Wherein the thickness of the insulating member 206 at the third surface 216 is reduced relative to the thickness at the first surface 214, such that the plugging portion 219 is offset toward the second shielding member 208 side relative to the shielding main body 209 in the normal direction of the third surface 216, and such that the ground pin 213 is aligned with the height of the signal pin 203 in the second direction X.
Specifically, the plugging portion 219 has two ground pins 213 disposed at intervals along the third direction Y, and the two ground pins 213 penetrate the conductive mount 300 through the second through holes 307, respectively.
Specifically, the first shield 207 is integrally molded by press molding. The shielding main body 209 and the connection portion 218 form a first bending angle, and the connection portion 218 and the plugging portion 219 form a second bending angle. The first bending angle and the second bending angle have manufacturing errors, so that the position accuracy of the plugging portion 219 relative to the shielding main body 209 is low. When the shield main body 209 is fixed to the insulator 206, the positional accuracy of the plugging portion 219 with respect to the insulator 206 is low.
In the embodiment of the present application, the conductive mounting member 300 presses the plugging portion 219 against the third surface 216, so that the freedom of the plugging portion 219 in the normal direction of the third surface 216 is limited. The mating portion 219 is mated with the insulator 206 with a normal relief along the third surface 216 such that the degree of freedom of the mating portion 219 in either direction parallel to the third surface 216 is limited. Thereby, the positional accuracy of the insertion portion 219 can be ensured.
In addition, in the embodiment of the present application, the plugging portion 219 is mated with the insulating member 206 along the normal concave-convex direction of the third surface 216, so that the plugging portion 219 is limited in the first direction Z, and thus the ground pin 213 can be prevented from being retracted during crimping.
The above steps are presented merely to aid in understanding the method, structure, and core concept of the application. It will be apparent to those skilled in the art that various changes and modifications can be made to the present application without departing from the principles of the application, and such changes and modifications are intended to be included within the scope of the appended claims.