CN120118577A - A thermal insulation coating for construction on high-temperature surface and preparation method thereof - Google Patents
A thermal insulation coating for construction on high-temperature surface and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D147/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Coating compositions based on derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
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- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
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- C09D7/61—Additives non-macromolecular inorganic
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Abstract
本发明提出了一种在高温表面施工的隔热涂料及其制备方法，涉及隔热保温涂料领域。所述在高温表面施工的隔热涂料通过有机硅树脂、聚丁二烯、催化剂、E51环氧树脂、卡斯特催化剂、溶剂1、溶剂2、隔热功能填料、SiO2气凝胶、钛白粉和附着力促进剂组分制备得到。本申请利用环氧改性有机硅树脂和两种高沸点有机溶剂组合解决了传统涂料体系无法在高温表面直接施工的难题，本申请制备的高温表面施工隔热涂层材料能够在160℃高温的基材表面直接喷涂施工，且不影响正常的生产活动。
The present invention proposes a thermal insulation coating for construction on high-temperature surfaces and a preparation method thereof, and relates to the field of thermal insulation coatings. The thermal insulation coating for construction on high-temperature surfaces is prepared by silicone resin, polybutadiene, catalyst, E51 epoxy resin, Custer catalyst, solvent 1, solvent 2, thermal insulation functional filler, SiO2 aerogel, titanium dioxide and adhesion promoter components. The present application utilizes a combination of epoxy-modified silicone resin and two high-boiling point organic solvents to solve the problem that traditional coating systems cannot be directly constructed on high-temperature surfaces. The thermal insulation coating material for high-temperature surface construction prepared by the present application can be directly sprayed on the surface of a substrate at a high temperature of 160°C without affecting normal production activities.
Description
Technical Field
The invention relates to the technical field of heat-insulating paint, in particular to heat-insulating paint for high-temperature surface construction and a preparation method thereof.
Background
High temperature reaction furnaces, smelting furnaces and the like used in industrial mass production can release heat to the surroundings in the use process, the surface temperature of the furnace body is high, the risk is high, and a large amount of energy sources are required to be consumed in order to maintain the temperature in the furnace. Therefore, spraying a layer of coating with heat preservation and heat insulation effects on the surface of the furnace body is a simple and effective solution. However, the adoption of the conventional heat preservation and heat insulation coating material requires the shutdown of the furnace body, and the construction can be performed after the temperature is reduced, which can affect the normal production progress of enterprises.
At present, when the existing coating system is directly sprayed on a high-temperature surface, the normal film forming process of the coating system is damaged, the solvent volatilization process is rapidly shortened, the resin curing rate is greatly accelerated, and the problems such as foaming, orange peel, cracking, pulverization, poor adhesive force and the like occur, so that film cannot be formed, and therefore, the coating system cannot be directly constructed on the high-temperature surface. Therefore, a thermal insulation coating material capable of being spray-applied on a high temperature surface is required.
Disclosure of Invention
In view of the above, the application utilizes the combination of the epoxy modified organic silicon resin and the two high boiling point organic solvents to solve the problem that the traditional coating system cannot be directly constructed on the high temperature surface, and prepares the thermal insulation coating material capable of being constructed on the high temperature surface.
The technical scheme of the invention is realized in such a way that the invention provides the heat insulation coating for construction on the high-temperature surface, which comprises the following initial raw materials in parts by weight:
on the basis of the above technical solutions, preferably, the solvent 1 is at least one selected from DBE, cyclohexanone, amyl acetate.
On the basis of the above technical solutions, preferably, the solvent 2 is selected from DPNB and/or ethyl benzoate.
On the basis of the technical scheme, preferably, the catalyst is Pt.
According to another aspect of the application, the preparation method of the heat insulation coating for construction on the high-temperature surface is provided, and the raw materials are weighed according to parts by mass and comprise the following steps:
Step a, stirring a mixture containing epoxy modified organic silicon resin, a solvent 1 and a solvent 2 to obtain an epoxy modified organic silicon resin solution;
and b, sequentially adding the heat-insulating functional filler, siO 2 aerogel and titanium pigment into the epoxy modified organic silicon resin solution, stirring 2, adding the adhesion promoter, and stirring 3 to obtain the heat-insulating coating for high-temperature surface construction.
On the basis of the above technical solutions, preferably, in the step a, the boiling point of the solvent 1 is lower than the boiling point of the solvent 2.
On the basis of the above technical solution, preferably, in the step a, the preparation method of the epoxy modified silicone resin includes the following steps:
step S1, reacting a mixture of organic silicon resin, polybutadiene, pt and toluene to obtain modified organic silicon resin;
And S2, reacting the mixture containing the modified organic silicon resin, the E51 epoxy resin, the Karster catalyst and the xylene with the reaction product 2 to obtain the epoxy modified organic silicon resin.
On the basis of the above technical solution, preferably, in the step S1, the Pt is added in an amount of 80mg of Pt per kg of the total mass of the silicone resin and the polybutadiene.
On the basis of the above technical solution, preferably, in step S1, the silicone resin is a one-component room temperature curing type silicone resin.
Based on the above technical solution, preferably, in the step S1, the polybutadiene is 1, 2-polybutadiene, and the double bond has high reactivity on the side chain, and may be purchased from Merck company, CRAY VALLY company, guangdong Weng Jiang chemical reagent limited company, shanghai Jizhui biochemical technology limited company, and xianzhue biological technology limited company, and the structural formula is as follows:
on the basis of the above technical solution, preferably, in the step S1, the reaction 1 is:
On the basis of the above technical scheme, preferably, in the step S2, the reaction 2 means that the silicone resin continuously reacts with polybutadiene under the action of a cassitter catalyst to obtain the modified silicone resin.
On the basis of the above technical solution, preferably, in the step S2, the epoxy modified silicone resin is obtained by blending and modifying an epoxy resin and a modified silicone resin.
On the basis of the above technical solution, preferably, in the step S2, the amount of the cassiterite catalyst added is 50 mg/kg of the silicone resin based on the mass of the silicone resin.
Based on the above technical solution, it is preferable that in the step S1, the water existing in the polybutadiene is removed in advance when the polybutadiene is used.
Based on the above technical scheme, preferably, in the step S1, the temperature of the reaction 1 is 70 to 90 ℃, and the time of the reaction 1 is 4 to 8 hours.
On the basis of the above technical scheme, preferably, in the step S1, the temperature of the reaction 1 is independently selected from any value of 70 ℃, 75 ℃, 80 ℃, 85 ℃, 90 ℃ or a range value between any two of the above.
On the basis of the above technical solution, preferably, in the step S1, the time of the reaction 1 is independently selected from any value of 4h, 5h, 6h, 7h, 8h or a range value between any two of the above.
On the basis of the above technical scheme, preferably, in the step S2, the temperature of the reaction 2 is 90-100 ℃, and the time of the reaction 2 is 6-12 hours.
On the basis of the above technical solution, preferably, in the step S2, the temperature of the reaction 2 is independently selected from any value of 90 ℃, 92 ℃, 95 ℃, 98 ℃ and 100 ℃ or a range value between any two of the above.
On the basis of the above technical solution, preferably, in the step S2, the time of the reaction 2 is independently selected from any value of 6h, 7h, 8h, 9h, 10h, 11h, 12h or a range value between any two of the above.
On the basis of the technical scheme, preferably, the rotating speed of the stirring 1 is 500-1000 rpm, and the stirring 1 time is 20-40 min.
On the basis of the above technical solution, preferably, the rotation speed of the stirring 1 is independently selected from any value of 500rpm, 600rpm, 700rpm, 800rpm, 900rpm, 1000rpm or a range value between any two of the above.
On the basis of the above technical solution, preferably, the stirring time 1 is independently selected from any value of 20min, 25min, 30min, 35min, 40min or a range value between any two of the above.
On the basis of the technical scheme, preferably, the rotating speed of the stirring 2 is 300-600 rpm, and the stirring 2 time is 30-60 min.
On the basis of the above technical solution, preferably, the rotation speed of the stirring 2 is independently selected from any value of 300rpm, 350rpm, 400rpm, 450rpm, 500rpm, 550rpm, 600rpm or a range value between any two of the above.
On the basis of the above technical solution, preferably, the stirring time of the stirring 2 is independently selected from any value of 30min, 35min, 40min, 45min, 50min, 55min, 60min or a range value between any two of the above.
On the basis of the technical scheme, preferably, the rotating speed of the stirring 3 is 500-1000 rpm, and the stirring 3 time is 30-60 min.
On the basis of the above technical solution, preferably, the rotation speed of the stirring 3 is independently selected from any value of 500rpm, 600rpm, 700rpm, 800rpm, 900rpm, 1000rpm or a range value between any two of the above.
On the basis of the above technical solution, preferably, the stirring time 3 is independently selected from any value of 30min, 35min, 40min, 45min, 50min, 55min, 60min or a range value between any two of the above.
On the basis of the technical scheme, preferably, the heat insulation functional filler is at least one selected from hollow glass beads, alumina hollow spheres and vitrified micro bubbles.
As an alternative embodiment, the present application is implemented by the following technical scheme:
firstly, weighing organic silicon resin, polybutadiene and Pt according to mass, adding the organic silicon resin, the polybutadiene and the Pt into a toluene solution, refluxing and heating at 70-90 ℃, stirring for 6 hours, distilling under reduced pressure, and removing the solvent to obtain modified organic silicon resin;
adding the modified organic silicon resin obtained in the first step, E51 epoxy resin and a Karster catalyst into a xylene solution, heating at 90-100 ℃ in a reflux way, stirring for 8 hours, and reacting to obtain epoxy modified organic silicon resin;
Step three, adding the epoxy modified organic silicon resin obtained in the step two, the solvent 1 and the solvent 2 into a dispersing machine, and stirring until the epoxy modified organic silicon resin is uniformly dispersed to obtain an epoxy modified organic silicon resin solution;
sequentially adding the heat-insulating functional filler, the SiO 2 aerogel and the titanium dioxide into the mixed solution obtained in the step three, and stirring until the mixed solution is uniformly dispersed to obtain a mixed solution;
And fifthly, adding the adhesion promoter into the mixed solution obtained in the step four, and stirring until the adhesion promoter is uniformly dispersed, thus obtaining the heat-insulating coating capable of being constructed on the high-temperature surface.
Based on the technical scheme, preferably, the molecular chain of the modified organic silicon resin is prolonged, the curing rate is reduced, the epoxy resin and the modified organic silicon resin are physically blended, and the toughness and adhesive force performance of the modified organic silicon resin on the high-temperature surface are improved by utilizing the excellent performance of the epoxy resin.
On the basis of the technical scheme, preferably, when the boiling point of the solvent 1 is lower than that of the solvent 2, the solvent 1 can volatilize rapidly on the surface of the substrate to enable the paint to be formed into a film primarily and attached to the surface of the substrate, and when the boiling point of the solvent 2 is higher than that of the solvent 1, the volatilization rate of the solvent 2 on the surface of the substrate is slower to enable the paint to keep fluidity for a certain time, so that the paint film on the surface of the substrate can be leveled.
The heat-insulating coating prepared by using the combination of the epoxy modified organic silicon resin, the solvent 1 and the solvent 2 has good film forming property on the high-temperature surface. The epoxy modified organic silicon resin has the advantages that the curing rate of the epoxy modified organic silicon resin is moderate, when the boiling point of the solvent 1 is lower than that of the solvent 2, the solvent 1 can be volatilized rapidly on the high-temperature surface, and the solvent cannot be volatilized completely in the process that paint mist does not fall on the high-temperature surface, so that the paint can be formed into a film primarily on the high-temperature surface, wherein the boiling point of the solvent 2 is higher, the volatilization rate of the solvent 2 on the high-temperature surface is relatively slower, the paint can maintain the fluidity of the paint on the high-temperature surface for a certain time, and a paint film can be leveled. Therefore, when the proper ratio between the solvent 1 and the solvent 2 is ensured, the spray quality of the thermal insulation coating on the substrate surface can be ensured.
Compared with the prior art, the heat-insulating coating material capable of being constructed on the high-temperature surface has the following beneficial effects:
(1) The heat-insulating coating capable of being constructed on the high-temperature surface can effectively reduce the temperature of the outer surface of high-temperature objects such as a high-temperature reaction furnace, a smelting furnace and the like, improve the safety, reduce the occurrence rate of accident injury caused by high temperature, reduce the energy consumption, prevent the production and construction from stopping, and reduce the shutdown loss.
(2) The heat-insulating coating capable of being constructed on the high-temperature surface can be directly sprayed on the surface of a substrate at 160 ℃ and does not influence normal production activities.
(3) The epoxy modified organic silicon resin provided by the application prolongs the organic silicon side chain, reduces the curing rate of organic silicon on the high-temperature surface, and simultaneously maintains the advantages of high adhesive force and good toughness of the epoxy resin.
(4) The heat-insulating coating capable of being constructed on the high-temperature surface has good thickness up to 1000 mu m in one-time film forming, good heat-insulating effect, and can effectively reduce the surface temperature of a substrate, and the heat-insulating temperature difference of the substrate surface under the condition of 160 ℃ reaches 45 ℃ plus or minus 5 ℃.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic illustration of a thermal barrier coating film that can be applied to a high temperature surface in accordance with an embodiment of the present invention;
FIG. 2 is a graph of a coating film of the coating material prepared in comparative example 1 of the present invention without modification of the silicone resin;
FIG. 3 is a graph showing a coating film of the coating material prepared in comparative example 2 in which the amount of the solvent 2 used was small;
FIG. 4 is a graph showing a coating film of the coating material prepared in comparative example 3 in which the amount of the solvent 1 used was small;
FIG. 5 is a graph of a coating film of the coating material prepared in comparative example 4 of the present invention using other solvents.
Detailed Description
The following description of the embodiments of the present invention will clearly and fully describe the technical aspects of the embodiments of the present invention, and it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, are intended to fall within the scope of the present invention.
In the examples of the present application, "DBE" refers to dibasic esters and "DPNB" refers to "dipropylene glycol butyl ether".
Example 1
Firstly, weighing 45g of organic silicon resin, 85g of polybutadiene and 0.010gPt g of toluene solution according to mass, adding the mixture into 1000mL of toluene solution, heating at 70 ℃ in a reflux way, stirring for 8 hours, distilling under reduced pressure, and removing toluene solvent to obtain modified organic silicon resin;
Step two, adding the modified organic silicon resin obtained in the step one, 1.5g of E51 epoxy resin and 0.002g of Kadster catalyst into 500mL of xylene solution, heating at 90 ℃ in a reflux way, stirring for 12 hours, and reacting to obtain epoxy modified organic silicon resin;
step three, adding the epoxy modified organic silicon resin obtained in the step two, 15g of DBE solvent 1 and 5g of DPNB solvent 2 into a dispersing machine, and stirring at 500rpm for 40min until the epoxy modified organic silicon resin is uniformly dispersed to obtain an epoxy modified organic silicon resin solution;
Sequentially adding 15g of hollow glass bead heat insulation functional filler, 1g of SiO 2 aerogel and 1.5g of titanium dioxide into the mixed solution obtained in the step three, and stirring at 300rpm for 60min until the mixed solution is uniformly dispersed to obtain a mixed solution;
And step five, adding 0.5g of adhesion promoter into the mixed solution obtained in the step four, and stirring at 500rpm for 60min until the mixture is uniformly dispersed, thus obtaining the heat-insulating coating capable of being constructed on the high-temperature surface.
Example 2
Firstly, 58g of organic silicon resin, 110g of polybutadiene and 0.013gPt of toluene solution are weighed according to mass, added into 1000mL of toluene solution, heated at 90 ℃ in a reflux way, stirred for 4 hours, distilled under reduced pressure, and toluene solvent is removed to obtain modified organic silicon resin;
Step two, adding the modified organic silicon resin obtained in the step one, 2.5g E51 epoxy resin and 0.003g Kadset catalyst into 500mL xylene solution, heating at 100 ℃ in a reflux way, stirring for 6 hours, and reacting to obtain epoxy modified organic silicon resin;
step three, adding the epoxy modified organic silicon resin obtained in the step two, 25g of cyclohexanone solvent 1 and 8g of ethyl benzoate solvent 2 into a dispersing machine, and stirring at 1000rpm for 20min until the mixture is uniformly dispersed to obtain an epoxy modified organic silicon resin solution;
Sequentially adding 25g of hollow glass bead heat insulation functional filler, 3g of SiO 2 aerogel and 2.5g of titanium dioxide into the mixed solution obtained in the step three, and stirring at 600rpm for 30min until the mixed solution is uniformly dispersed to obtain a mixed solution;
And step five, adding 1.5g of adhesion promoter into the mixed solution obtained in the step four, and stirring at 1000rpm for 30min until the mixture is uniformly dispersed, thus obtaining the heat-insulating coating capable of being constructed on the high-temperature surface.
Example 3
Firstly, weighing 50g of organic silicon resin, 100g of polybutadiene and 0.012gPt by mass, adding into 1000mL of toluene solution, heating at 80 ℃ in a reflux way, stirring for 6 hours, distilling under reduced pressure, and removing toluene solvent to obtain modified organic silicon resin;
Step two, adding the modified organic silicon resin obtained in the step one, 2g of E51 epoxy resin and 0.0025g of Kadset catalyst into 500mL of xylene solution, heating at 95 ℃ in a reflux way, stirring for 8 hours, and reacting to obtain epoxy modified organic silicon resin;
Step three, adding the epoxy modified organic silicon resin obtained in the step two, 20g of DBE solvent 1 and 6.5g of DPNB solvent 2 into a dispersing machine, and stirring at 700rpm for 30min until the epoxy modified organic silicon resin is uniformly dispersed to obtain an epoxy modified organic silicon resin solution;
sequentially adding 20g of alumina hollow sphere heat insulation functional filler, 2g of SiO 2 aerogel and 2g of titanium dioxide into the mixed solution obtained in the step three, and stirring at 450rpm for 45min until the mixed solution is uniformly dispersed to obtain a mixed solution;
and step five, adding 1g of adhesion promoter into the mixed solution obtained in the step four, and stirring at 700rpm for 45min until the mixture is uniformly dispersed, thus obtaining the heat-insulating coating capable of being constructed on the high-temperature surface.
Example 4
Firstly, weighing 45g of organic silicon resin, 85g of polybutadiene and 0.010gPt g of toluene solution according to mass, adding the mixture into 1000mL of toluene solution, heating at 70 ℃ in a reflux way, stirring for 8 hours, distilling under reduced pressure, and removing toluene solvent to obtain modified organic silicon resin;
Step two, adding the modified organic silicon resin obtained in the step one, 1.5g of E51 epoxy resin and 0.002g of Kadster catalyst into 500mL of xylene solution, heating at 90 ℃ in a reflux way, stirring for 12 hours, and reacting to obtain epoxy modified organic silicon resin;
Step three, adding the epoxy modified organic silicon resin obtained in the step two, 15g of amyl acetate solvent 1 and 5gDPNB solvent 2 into a dispersing machine, and stirring at 500rpm for 40min until the epoxy modified organic silicon resin is uniformly dispersed to obtain an epoxy modified organic silicon resin solution;
Sequentially adding 15g of hollow glass microsphere heat insulation functional filler, 1g of SiO 2 aerogel and 1.5g of titanium dioxide into the mixed solution obtained in the step three, and stirring at 300rpm for 60min until the mixed solution is uniformly dispersed to obtain a mixed solution;
And step five, adding 0.5g of adhesion promoter into the mixed solution obtained in the step four, and stirring at 500rpm for 60 to uniformly disperse to obtain the heat-insulating coating capable of being constructed on the high-temperature surface.
Example 5
Firstly, weighing 52g of organic silicon resin, 105g of polybutadiene and 0.012gPt g of toluene solution according to mass, adding into 1000mL of toluene solution, heating at 80 ℃ in a reflux way, stirring for 6 hours, distilling under reduced pressure, and removing toluene solvent to obtain modified organic silicon resin;
Step two, adding the modified organic silicon resin obtained in the step one, 2.2g of E51 epoxy resin and 0.0025g of Karster catalyst into 500mL of xylene solution, heating at 95 ℃ in a reflux way, and stirring for 8 hours to react to obtain epoxy modified organic silicon resin;
Step three, adding the epoxy modified organic silicon resin obtained in the step two, 18g of DBE solvent 1 and 6g of DPNB solvent 2 into a dispersing machine, and stirring at 750rpm for 30min until the epoxy modified organic silicon resin is uniformly dispersed to obtain an epoxy modified organic silicon resin solution;
Sequentially adding 22g of vitrified microbead heat-insulating functional filler, 2g of SiO 2 aerogel and 2g of titanium dioxide into the mixed solution obtained in the step three, and stirring at 500rpm for 42min until the mixed solution is uniformly dispersed to obtain a mixed solution;
And step five, adding 1g of adhesion promoter into the mixed solution obtained in the step four, and stirring at 750rpm for 43min until the adhesion promoter is uniformly dispersed, thus obtaining the heat-insulating coating capable of being constructed on the high-temperature surface.
The heat-insulating paint which can be constructed on the high-temperature surface and is prepared in the embodiment 1-5 is sprayed on the surface of the substrate at 160 ℃ and tested for heat-insulating temperature difference, and the tested heat-insulating temperature difference reaches 45+/-5 ℃, as shown in the figure 1, the heat-insulating paint film drawing which can be constructed on the high-temperature surface in the embodiment 1-5 is adopted, the heat-insulating paint is leveled on the surface of the substrate to form a film, no cracks exist, and the energy consumption can be effectively reduced after spraying.
Comparative example 1
Step one and step two in example 1 were omitted, 45g of silicone resin was directly added to step three, and the remaining preparation conditions were the same as those in example 1, to obtain a heat-insulating coating material. As shown in fig. 2, the heat-insulating coating material prepared in comparative example 1 was sprayed on the surface of the substrate, and the surface of the paint film was cracked, and it was impossible to form a film, and it was impossible to directly spray-coat the heat-insulating coating material on the surface of the high-temperature substrate.
Comparative example 2
The remaining procedure was kept the same as in example 1 except that 5g of DPNB solvent 2 in step three of example 1 was replaced with 4g of DPNB solvent 2, to obtain a heat-insulating coating material. As shown in fig. 3, after the heat-insulating coating material prepared in comparative example 2 was sprayed on the surface of the substrate, the surface of the paint film was cracked, the paint film could not be leveled, the surface was uneven, and film formation could not be performed. Therefore, when the amount of the solvent 2 is not within the composition range of the heat-insulating coating material that can be applied on a high-temperature surface, the paint film on the surface of the base material after spraying cannot be leveled, uneven surfaces appear, and a film cannot be formed.
Comparative example 3
15G of DBE solvent 1 in step three of example 1 was replaced with 12g of DBE solvent 1, and the remaining steps remained the same as in example 1, yielding a thermal barrier coating. As shown in fig. 4, the heat-insulating coating prepared in comparative example 3 was sprayed on the surface of the substrate, and the surface of the paint film had cracks, and the surface was uneven, resulting in poor film-forming effect. Therefore, when the amount of the solvent 1 is not within the composition range of the heat-insulating coating material that can be applied on the high-temperature surface, the solvent 1 is volatilized to be depleted in the process that the paint mist does not completely fall on the high-temperature surface, so that the effect of forming the film on the high-temperature surface of the coating material is poor.
Comparative example 4
15G of DBE solvent 1 in step three of example 1 was replaced with 15g of xylene as solvent 1, and the remaining steps remained the same as in example 1 to obtain a heat-insulating coating. As shown in fig. 5, the heat-insulating coating material prepared in comparative example 4 was sprayed on the surface of the substrate, and then, the film could not be formed, and the surface was agglomerated into powder. Therefore, when the solvent 1 is other solvents, the xylene solvent is volatilized to be depleted when the paint mist does not fall to the high temperature surface, so that the paint is agglomerated to powder on the high temperature surface.
In the application, when the thermal-insulating coating material capable of being constructed on the high-temperature surface is adopted for spraying and forming a film on the surface of a base material under the condition of 160 ℃, when the thermal-insulating coating material capable of being constructed on the high-temperature surface is prepared without adding epoxy modified organic silicon resin, a paint film on the surface of the base material cannot form a film and the surface of the film is cracked, and when the use amount of the solvent 1 and the solvent 2 is not in the range of a raw material formula, the prepared thermal-insulating coating material has the problems that the paint film cannot be leveled and the paint film has cracks after being sprayed, therefore, the application solves the problem that the traditional paint system cannot be directly constructed on the high-temperature surface by utilizing the synergistic effect between the epoxy modified organic silicon resin and the solvent 1 and the solvent 2.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the invention.
Claims (10)
1. The heat-insulating coating for high-temperature surface construction is characterized by comprising the following initial raw materials in parts by mass:
2. The heat-insulating coating for high-temperature surface construction according to claim 1, wherein the solvent 1 is at least one selected from DBE, cyclohexanone, amyl acetate;
The solvent 2 is selected from DPNB and/or ethyl benzoate;
The catalyst is Pt.
3. The method for preparing the heat-insulating coating for high-temperature surface construction according to claim 1 or 2, wherein the raw materials are weighed according to parts by mass, and the method comprises the following steps:
Step a, stirring a mixture containing epoxy modified organic silicon resin, a solvent 1 and a solvent 2 to obtain an epoxy modified organic silicon resin solution;
and b, sequentially adding the heat-insulating functional filler, siO 2 aerogel and titanium pigment into the epoxy modified organic silicon resin solution, stirring 2, adding the adhesion promoter, and stirring 3 to obtain the heat-insulating coating for high-temperature surface construction.
4. A process according to claim 3, wherein in step a, the boiling point of solvent 1 is lower than the boiling point of solvent 2.
5. The method of preparing the epoxy-modified silicone resin according to claim 3, wherein the method of preparing the epoxy-modified silicone resin in the step a comprises the steps of:
step S1, reacting a mixture of organic silicon resin, polybutadiene, pt and toluene to obtain modified organic silicon resin;
And S2, reacting the mixture containing the modified organic silicon resin, the E51 epoxy resin, the Karster catalyst and the xylene with the reaction product 2 to obtain the epoxy modified organic silicon resin.
6. The method according to claim 5, wherein in the step S1, 80mg of Pt is added per kg of the total mass of the silicone resin and the polybutadiene.
7. The method according to claim 5, wherein in the step S2, 50mg of the Kadset catalyst is added per kg of the silicone resin based on the mass of the silicone resin.
8. The preparation method according to claim 5, wherein in the step S1, the temperature of the reaction 1 is 70 to 90 ℃, and the time of the reaction 1 is 4 to 8 hours;
In the step S2, the temperature of the reaction 2 is 90-100 ℃, and the time of the reaction 2 is 6-12 hours.
9. The method according to claim 3, wherein the rotation speed of the stirring 1 is 500-1000 rpm, and the stirring 1 time is 20-40 min;
The rotating speed of the stirring 2 is 300-600 rpm, and the stirring 2 time is 30-60 min;
The rotation speed of the stirring 3 is 500-1000 rpm, and the stirring 3 time is 30-60 min.
10. The method according to claim 3, wherein the heat insulating filler is at least one selected from the group consisting of hollow glass beads, alumina hollow spheres and vitrified micro bubbles.
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