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CN120059384A - A UV-curable composition and high-impact adhesive tape prepared therefrom - Google Patents

A UV-curable composition and high-impact adhesive tape prepared therefrom Download PDF

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Publication number
CN120059384A
CN120059384A CN202510377077.9A CN202510377077A CN120059384A CN 120059384 A CN120059384 A CN 120059384A CN 202510377077 A CN202510377077 A CN 202510377077A CN 120059384 A CN120059384 A CN 120059384A
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CN
China
Prior art keywords
parts
epoxy resin
curable composition
methacrylic
impact
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Pending
Application number
CN202510377077.9A
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Chinese (zh)
Inventor
沈潇斌
郑加堃
任彬
顾正青
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Suzhou Shihua New Material Technology Co ltd
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Suzhou Shihua New Material Technology Co ltd
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Priority to CN202510377077.9A priority Critical patent/CN120059384A/en
Publication of CN120059384A publication Critical patent/CN120059384A/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/062—Copolymers with monomers not covered by C08L33/06
    • C08L33/068—Copolymers with monomers not covered by C08L33/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/068—Copolymers with monomers not covered by C09J133/06 containing glycidyl groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21—Paper; Textile fabrics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/05—Polymer mixtures characterised by other features containing polymer components which can react with one another
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2312/00—Crosslinking
    • C08L2312/06—Crosslinking by radiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/26—Presence of textile or fabric
    • C09J2400/263—Presence of textile or fabric in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)

Abstract

本发明涉及结构胶粘剂技术领域，公开了一种可UV固化的组合物及其制备的高抗冲胶带。所述高抗冲胶带包括可UV固化的组合物以及具备微纳孔洞的中间基材；所述可UV固化的组合物包括甲基丙烯酸类聚合物、柔性脂肪链改性的环氧树脂、光产酸剂、光敏剂；所述柔性脂肪链改性的环氧树脂由摩尔比为2∶1的环氧树脂与脂肪族二元酸通过本体熔融反应制得；所述具备微纳孔洞的中间基材为厚度＜150um，孔隙率＞50％的多孔膜材。本发明将可UV固化的组合物与多孔膜材复合，得到了一种高抗冲胶带，该胶带室温制程使用，具备优异的结构强度和抗冲击性能，PC动态剪切强度＞3MPa，PC落槌冲击能量＞0.5J，可替代框胶应用。The present invention relates to the technical field of structural adhesives, and discloses a UV-curable composition and a high-impact tape prepared therefrom. The high-impact tape comprises a UV-curable composition and an intermediate substrate with micro-nano pores; the UV-curable composition comprises a methacrylic polymer, a flexible fatty chain-modified epoxy resin, a photoacid generator, and a photosensitizer; the flexible fatty chain-modified epoxy resin is prepared by a bulk melting reaction of an epoxy resin and an aliphatic dibasic acid in a molar ratio of 2:1; the intermediate substrate with micro-nano pores is a porous membrane material with a thickness of less than 150um and a porosity of more than 50%. The present invention composites the UV-curable composition with a porous membrane material to obtain a high-impact tape, which is used in a room temperature process, has excellent structural strength and impact resistance, PC dynamic shear strength>3MPa, PC drop hammer impact energy>0.5J, and can replace frame glue.

Description

UV-curable composition and high-impact adhesive tape prepared from same
Technical Field
The invention relates to the technical field of structural adhesives, in particular to a UV curable composition and a high-impact adhesive tape prepared from the same.
Background
The back frame bonding of the electronic consumer goods pays attention to the impact resistance of the material, the prior proposal has the advantages that the glue bonding and the foam PSA bonding have excellent impact resistance, but the glue bonding has high final strength, the assembly cannot be quickly fixed due to slow establishment of the early strength, the assembly efficiency of the production line is affected, the foam PSA can be die-cut and easily positioned, the adhesive tape has low modulus and relatively insufficient creep resistance. Therefore, how to have the performance advantages of the two materials, develop a tape which can be processed at room temperature, can be die-cut and positioned easily, has higher modulus, good creep resistance and high impact resistance and high bonding strength, and becomes a new and more important subject in the field of electronic consumer goods in recent years.
The existing adhesive tape with high modulus and high adhesive property comprises two types, namely a1 heat curing adhesive film and a2 UV curing adhesive film. The heat-curable adhesive film is limited by the existing resin system, the processing temperature is generally >90 ℃, and some structural components in the field of electronic consumer products are sensitive to the assembly temperature, so that the application of the heat-curable adhesive film in the field is limited. Thus, a UV curable adhesive film would be a desirable potential application alternative to existing frame adhesive products. Through the performance evaluation of the existing UV curable adhesive film, the UV curable adhesive film cannot be temporarily matched with the frame adhesive for application, and the cured UV adhesive film has general impact resistance due to higher modulus and higher rigidity after curing, so that the impact resistance of the adhesive film needs to be improved through a certain scheme.
The common scheme for improving the shock resistance is to increase the rubber elasticity of the material or the microphase interface of the material, so that when the material is impacted, the energy of the impact is dissipated through energy conversion, and the impact on the material is avoided, so that the main structure is not damaged. However, toughening schemes such as rubber bring opaque components to the system, and are not suitable for UV curing systems.
Therefore, it is of great importance to develop a UV curable back frame adhesive tape with high impact resistance.
Disclosure of Invention
The invention provides a UV-curable composition and a high-impact adhesive tape prepared by the same, wherein the UV-curable composition with a flexible chain segment is compounded with a porous membrane material with micro-nano holes, the impact resistance of the UV curable adhesive film is further improved through the micro-nano structure which is distributed in a dispersing way. The invention provides the following technical scheme:
a UV curable composition comprises methacrylic acid polymer, flexible fatty chain modified epoxy resin, photoacid generator and photosensitizer, wherein the flexible fatty chain modified epoxy resin is prepared by bulk melt reaction of epoxy resin and aliphatic dibasic acid in a molar ratio of 2:1.
The composition comprises, by mass, 100-125 parts of methacrylic polymer, 10-200 parts of flexible fatty chain modified epoxy resin, 0.5-30 parts of photoacid generator and 0.15-15 parts of photosensitizer;
Preferably, the UV curable composition comprises, by mass, 100-125 parts of methacrylic polymer, 10-100 parts of flexible fatty chain modified epoxy resin, 0.5-20 parts of photoacid generator, and 0.15-10 parts of photosensitizer.
Melting the epoxy resin at 100-150 ℃, adding aliphatic dibasic acid with the mass of one half of that of the epoxy resin, adding triphenylphosphine serving as a catalyst, and maintaining the temperature for reaction for 3-5 hours to obtain the flexible fatty chain modified epoxy resin;
Preferably, the epoxy resin is an epoxy resin having an average of 2 or more epoxy groups per molecule, preferably an epoxy resin having an epoxy value of 0.1 to 1.0, more preferably an epoxy resin having an epoxy value of 0.2 to 0.6.
The aliphatic dibasic acid is long carbon chain (C6-C18) dibasic acid or one or more of 1, 2-cyclohexanedicarboxylic acid, 1, 3-cyclohexanedicarboxylic acid and 1, 4-cyclohexanedicarboxylic acid.
The photoacid generator is any one or more of diaryl iodonium salt, triarylsulfonium salt and aryl diazonium salt;
Preferably, the photosensitizer is any one or more of condensed ring quinones, azo compounds, organic sulfides and halides.
The methacrylic polymer has an acid value of 5.6 to 56mgKOH/g, preferably an epoxy value of 0.01 to 0.1.
The methacrylic polymer comprises, by mass, 70-100 parts of nonfunctional methacrylic monomer, 0-15 parts of methacrylic monomer containing polar functional groups, 0.5-5 parts of functional methacrylic monomer, 1.5-10 parts of methacrylic monomer containing epoxy groups, 0.2 parts of initiator and 150 parts of solvent, preferably ethyl acetate.
A preparation method of a UV-curable high-impact adhesive tape is characterized by comprising the following steps:
s1, preparation of flexible fatty chain modified epoxy resin
Melting epoxy resin at 100-150 ℃, adding aliphatic dibasic acid, adding triphenylphosphine serving as a catalyst, and maintaining the temperature for reaction for 3-5 hours to obtain flexible aliphatic chain modified epoxy resin;
s2 preparation of methacrylic Polymer
Mixing a non-functional methacrylic monomer, a methacrylic monomer containing polar functional groups, a functional methacrylic monomer, a methacrylic monomer containing epoxy groups, an initiator and a solvent in a glass bottle, introducing nitrogen for two minutes to remove oxygen and sealing, placing the reaction bottle in polymerization equipment for polymerization at 60-80 ℃ for 8-10h to prepare a methacrylic polymer with the viscosity of 1000-10000cp;
S3 preparation of UV-curable composition
Uniformly mixing methacrylic acid polymer, flexible fatty chain modified epoxy resin, photoacid generator and photosensitizer to obtain a UV curable composition;
s4, preparation of UV-curable high-impact adhesive tape
And coating the UV-curable composition on a release film, drying to obtain a dry adhesive film with a certain thickness, coating the UV-curable composition on another release film, drying to obtain a dry adhesive film with a certain thickness, and respectively and tightly pressing the two parts of dried adhesive films on two sides of a porous film material with micro-nano holes to obtain the adhesive tape with two sides covered with the release film.
A UV-curable high-impact adhesive tape comprises the UV-curable composition and a porous membrane material with micro-nano holes.
Preferably, the UV curable high impact adhesive tape has a thickness of 100-500um.
Preferably, the porous membrane material with micro-nano holes is a membrane material with the thickness of <150um and the porosity of > 50%;
Preferably, the porous membrane material with micro-nano holes is one of polyester-based, polyamide-based non-woven fabrics and polyamide-based plain woven fabrics.
A method for using a UV-curable high-impact adhesive tape comprises the steps of sticking the adhesive tape to a first object to be stuck, irradiating with 365nm LED ultraviolet light source with irradiation energy of 2J/cm 2-8J/cm2, pressing a second object to be stuck to the other surface of the adhesive tape under the pressing conditions of 0.3-1.0MPa,25-80 ℃ and 5-120s, and standing and curing at room temperature for more than 24H.
The beneficial effects are that:
(1) The invention designs and synthesizes the flexible fatty chain modified epoxy resin which has good compatibility and bonding with the epoxy modified acrylic resin, and the epoxy resin structure is provided with the aliphatic flexible chain segment, so that the flexibility of the UV curing composition after curing can be improved.
(2) The invention provides a UV curable composition, which comprises a methacrylic polymer and a flexible fatty chain modified epoxy resin, wherein the methacrylic polymer contains carboxyl, anhydride groups and epoxy groups, the flexible fatty chain modified epoxy resin contains two epoxy functional groups, when UV cations are activated, the epoxy groups of the methacrylic polymer and the epoxy groups of the flexible fatty chain modified epoxy resin can be activated by the UV cations to generate strong protonic acid, the generated strong protonic acid catalyzes a crosslinking reaction, and acid groups such as carboxyl, anhydride and the like in the system can promote forward progress of the reaction, so that a structural adhesive film has relatively uniform high crosslinking density, relatively high structural strength and relatively good adhesion after the reaction.
(3) The invention provides a UV-curable high-impact adhesive tape, which is prepared by compounding a UV-curable composition with a porous membrane material with micro-nano holes. The UV-curable composition contains a flexible chain segment, so that the flexibility of the material is improved, the material is compounded with the porous membrane material with micro-nano holes, the composite high-performance material with the enhanced micro-nano size is obtained, the adhesive strength of the adhesive tape is enhanced, and meanwhile, the dispersed micro-nano structure improves the dissipation of energy at a micro-nano interface when the material is impacted, and the impact resistance of the adhesive tape is improved. Further, the porous membrane material has good ultraviolet-visible light penetrability, does not influence the UV activation of the adhesive tape, and provides good die cutting performance of the thick adhesive tape.
(4) The invention provides a UV-curable high-impact adhesive tape, which has mild use process conditions and can be processed at room temperature, so that damage of high-temperature conditions to some materials which cannot resist temperature in electronic devices is avoided.
Detailed Description
The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the following examples, the raw materials used are shown in the following table:
Name of the name Description of the invention Manufacturer (S)
ITX Photosensitizer, 2-isopropyl thioxanthone TC1
H2A Adipic acid Microphone forest
CHDA 1, 4-Cyclohexanedicarboxylic acid Microphone forest
EPON 828 Liquid epoxy resin obtained from bisphenol A, average epoxy equivalent weight: 188.5 Hansen
TPP Triphenylphosphine and process for preparing same Microphone forest
MA Non-functional methacrylic monomer methyl acrylate Hua Yi A
BA Non-functional methacrylic monomer butyl acrylate Hua Yi A
2-HEA (Meth) acryl monomer having polar functional group 2-hydroxyethyl acrylate Baves (Bass)
AA Functional (meth) acryl monomer acrylic acid Baves (Bass)
GMA Epoxy group-containing (meth) acryl monomer glycidyl methacrylate Microphone forest
EA Acetic acid ethyl ester Ceramic' s
AIBN Azo diisobutyronitrile initiator TCl
Triaryl hexafluoros Sulfonium antimonate Photoacid generator, triaryl hexafluoroantimonate sulfonium salt Jiangsu Taitel
P50 50Um PET (porosity <50%, visible light transmittance > 80%) Dongzhi wood
P50P 50Um PET porous film (porosity >50%, visible light transmittance > 80%) Homemade
PWF50-200 50Um plain weave cloth (200 mesh) (porosity >50%, visible light transmittance > 80%) Changtai package
PWF50-800 50Um plain weave cloth (porosity <50%, visible light transmittance < 80%) Changtai package
The preparation of the flexible fatty chain modified epoxy resin comprises the following 3 synthetic examples:
synthesis example 12 mol EPON 828 and 1mol H2A were mixed at 100℃and reacted at constant temperature for 5 hours after 0.02mol triphenylphosphine was added to obtain flexible aliphatic chain modified epoxy resin 1.
Synthesis example 2.2 mol EPON 828 and 1molCHDA were mixed at 130℃and reacted at constant temperature for 4 hours after 0.02mol triphenylphosphine was added to obtain flexible aliphatic chain modified epoxy resin 2.
Synthesis example 32 mol EPON 828 and 1molCHDA were mixed at 150℃and reacted at constant temperature for 3 hours after 0.02mol triphenylphosphine was added to obtain flexible aliphatic chain modified epoxy resin 3.
The preparation of the methacrylic polymer comprises the following 5 synthetic examples in parts by mass:
Synthesis example 1A methacrylic polymer was produced by mixing 40 parts of MA,30 parts of BA,10 parts of GMA,5 parts of AA,15 parts of 2-HEA,0.2 part of AIBN,150 parts of EA in a glass bottle, introducing nitrogen for two minutes to remove oxygen and sealing, and placing the reaction bottle in a polymerization apparatus at 60℃to perform polymerization for 8 hours, wherein the solid content was 40% and the viscosity was 5000cp.
Synthesis example 2A methacrylic polymer having a solids content of 40% and a viscosity of 4900cp was produced by mixing 40 parts of MA,50 parts of BA,1.5 parts of GMA,2.5 parts of AA,6 parts of 2-HEA,0.2 part of AIBN, and 150 parts of EA in a glass bottle, introducing nitrogen for two minutes to remove oxygen and sealing, and placing the reaction bottle in a polymerization apparatus at 80℃to perform polymerization for 10 hours.
Synthesis example 3A methacrylic polymer having a solid content of 40% and a viscosity of 6600cp was produced by mixing 48 parts of MA,50 parts of BA,1.5 parts of GMA,0.5 part of AA,0.2 part of AIBN,150 parts of EA in a glass bottle, introducing nitrogen gas for two minutes to remove oxygen and sealing, and placing the reaction bottle in a polymerization apparatus at 60℃to conduct polymerization for 10 hours.
Synthesis example 4 methacrylic polymer was prepared by mixing 50 parts of MA,30 parts of BA,10 parts of GMA,5 parts of AA,5 parts of 2-HEA,0.2 part of AIBN,150 parts of EA in a glass bottle, introducing nitrogen for two minutes to remove oxygen and sealing, and placing the reaction bottle in a polymerization apparatus at 80℃to perform polymerization for 9 hours, wherein the solid content was 40% and the viscosity was 7700cp.
Synthesis example 5A methacrylic polymer was produced by mixing 47 parts of MA,30 parts of BA,6 parts of GMA,2 parts of AA,15 parts of 2-HEA,0.2 part of AIBN,150 parts of EA in a glass bottle, introducing nitrogen for two minutes to remove oxygen and sealing, and placing the reaction bottle in a polymerization apparatus at 70℃to perform polymerization for 9 hours, wherein the solid content was 40% and the viscosity was 6200cp.
Preparation of UV curable high impact tapes, examples 1-5, comparative examples 1-5, in parts by weight:
Example 1 100 parts of methacrylic polymer of Synthesis example 1 (40% solids content), 10 parts of flexible fatty chain modified epoxy resin 1,0.5 part of triaryl hexafluoroantimonate sulfonium salt, 0.15 part of ITX were mixed uniformly to obtain composition 1;
The composition 1 is coated on a release film with the thickness of 50um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, the composition 1 is coated on the release film with the thickness of 30um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, and the two parts of dried adhesive films are respectively and tightly pressed on two sides of a 50um PET porous film (P50P) to obtain the adhesive film (the total thickness of the release film is about 250 um).
Example 2 100 parts of methacrylic polymer of Synthesis example 2 (40% solids content), 60 parts of flexible fatty chain modified epoxy resin 2,5 parts of triaryl hexafluoroantimonate sulfonium salt, 3 parts of ITX were mixed uniformly to give composition 2;
The composition 2 is coated on a release film with the thickness of 50um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, the composition 2 is coated on the release film with the thickness of 30um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, and the two parts of dried adhesive films are respectively and tightly pressed on two sides of a 50um PET porous film (P50P) to obtain the adhesive film (the total thickness of the release film is about 250 um).
Example 3 100 parts of methacrylic polymer of Synthesis example 3 (40% solids content), 30 parts of flexible fatty chain modified epoxy resin 3,4 parts of triaryl hexafluoroantimonate sulfonium salt, 2 parts of ITX were mixed well to give composition 3;
The composition 3 is coated on a release film with the thickness of 50um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, the composition 3 is coated on the release film with the thickness of 30um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, and the two parts of dried adhesive films are respectively and tightly pressed on two sides of a 200-mesh 50um plain weave cloth (PWF 50-200) to obtain an adhesive film (the total thickness of the release film is about 250 um).
Example 4 100 parts of methacrylic polymer of Synthesis example 4 (40% solids content), 100 parts of flexible fatty chain modified epoxy resin 1,20 parts of triaryl hexafluoroantimonate sulfonium salt, 10 parts of ITX were mixed well to give composition 4;
The composition 4 is coated on a release film with the thickness of 50um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, the composition 4 is coated on the release film with the thickness of 30um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, and the two parts of dried adhesive films are respectively and tightly pressed on two sides of a 200-mesh 50um plain weave cloth (PWF 50-200) to obtain an adhesive film (the total thickness of the release film is about 250 um).
Example 5 100 parts of methacrylic polymer of Synthesis example 5 (40% solids content), 80 parts of flexible fatty chain modified epoxy resin 2,10 parts of triaryl hexafluoroantimonate sulfonium salt, 5 parts of ITX were mixed uniformly to give composition 5;
The composition 5 is coated on a release film with the thickness of 50um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, the composition 5 is coated on the release film with the thickness of 30um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, and the two parts of dried adhesive films are respectively and tightly pressed on two sides of a 50um PET porous film (P50P) to obtain the adhesive film (the total thickness of the release film is about 250 um).
Comparative example 1100 parts of the methacrylic polymer of Synthesis example 3 (40% solids content), 4 parts of triaryl hexafluoroantimonate sulfonium salt, and 2 parts of ITX were uniformly mixed to obtain composition 6;
The composition 6 is coated on a release film with the thickness of 50um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, the composition 6 is coated on the release film with the thickness of 30um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, and the two parts of dried adhesive films are respectively and tightly pressed on two sides of a 200-mesh 50um plain weave cloth (PWF 50-200) to obtain an adhesive film (the total thickness of the release film is about 250 um).
Comparative example 2 100 parts of the methacrylic polymer of Synthesis example 3 (40% solids content), 30 parts of EPON 828,4 parts of triaryl hexafluoroantimonate sulfonium salt, and 2 parts of ITX were uniformly mixed to obtain composition 7;
The composition 7 is coated on a release film with the thickness of 50um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, the composition 7 is coated on the release film with the thickness of 30um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, and the two parts of dried adhesive films are respectively and tightly pressed on two sides of a 200-mesh 50um plain weave cloth (PWF 50-200) to obtain an adhesive film (the total thickness of the release film is about 250 um).
Comparative example 3 100 parts of methacrylic polymer of Synthesis example 3 (40% solids content), 30 parts of flexible fatty chain modified epoxy resin 3,4 parts of triaryl hexafluoroantimonate sulfonium salt, 2 parts of ITX were mixed uniformly to give composition 8;
The composition 8 is coated on a release film with the thickness of 50um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, the composition 8 is coated on the release film with the thickness of 30um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, and the two parts of dried adhesive films are respectively and tightly pressed on two sides of 50um PET (P50) to obtain the adhesive film (the total thickness of the release film is about 250 um).
Comparative example 4 100 parts of methacrylic polymer of Synthesis example 3 (40% solids content), 30 parts of flexible fatty chain modified epoxy resin 3,2 parts of ITX were mixed uniformly to give composition 9;
The composition 9 is coated on a release film with the thickness of 50um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, the composition 9 is coated on the release film with the thickness of 30um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, and the two parts of dried adhesive films are respectively and tightly pressed on two sides of a 200-mesh 50um plain weave cloth (PWF 50-200) to obtain an adhesive film (the total thickness of the release film is about 250 um).
Comparative example 5 100 parts of methacrylic polymer of Synthesis example 3 (40% solids content), 30 parts of flexible fatty chain modified epoxy resin 3,4 parts of triaryl hexafluoroantimonate sulfonium salt, 2 parts of ITX were mixed uniformly to give composition 10;
The composition 10 is coated on a release film with the thickness of 50um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, the composition 10 is coated on the release film with the thickness of 30um, the release film is dried at 110 ℃ for 8min, the dry film thickness is 115um, and the two parts of dried adhesive films are respectively and tightly pressed on two sides of a 50um plain woven cloth (PWF 50-800) with the mesh of 800 to obtain an adhesive film (the total thickness of the release film is about 250 um).
Test results the tapes prepared in examples 1 to 5, comparative examples 1 to 5 were subjected to performance test, and the data obtained are shown below:
initial dynamic shear properties were tested as follows:
PC boards (5 inches by 1 inch) were rubbed three times with ethanol prior to testing. The film samples with release films on both sides were cut 1 inch by 1 inch, and one side of the release film was removed and attached to a PC board. And removing the release film on the other side, and directly attaching the other PC board to the adhesive surface on the other side. The test specimens were left to stand in a controlled environment chamber (23 ℃ C./50% relative humidity) for 24 hours and then tested.
Dynamic shear force was tested using an Instron company tensile tester. The speed was 10.0mm/min. Each test was repeated three times and averaged in MPa.
The dynamic shear properties were tested as follows:
PC boards (5 inches by 1 inch) were rubbed three times with ethanol prior to testing. The film samples with release films on both sides were cut 1 inch by 1 inch, and one side of the release film was removed and attached to a PC board. The other side release film was removed and irradiated with UV (365 nm LED lamp, UVA of about 4000mJ/cm 2) and another PC board was attached to the other side adhesive. The test specimens were post-cured in a controlled environment chamber (23 ℃ C./50% relative humidity) for 24 hours and tested. Or the prepared sample is put in an 80 ℃ oven to accelerate curing for 1 hour, taken out of the oven, cooled to room temperature in a controlled environment chamber (23 ℃ per 50% relative humidity) and then measured.
Dynamic shear force was tested using an Instron company tensile tester. The speed was 10.0mm/min. Each test was repeated three times and averaged in MPa.
Impact performance testing was performed as follows:
The PC board was rubbed three times with ethanol before testing. The film sample with release films on both sides was cut into square annular glue samples with an inner side length of 20.5mm and an outer side length of 24.5mm, and one side of the release film was peeled off and attached to a PC board (Frame 40 mm. Times.40 mm, with 20.5 mm. Times.20.5 mm square holes in the inner side). The other side release film was removed and irradiated with UV (365 nm LED lamp, UVA about 4000mJ/cm 2) and another PC board (Window, 24.5 mm. Times.24.5 mm) was attached to the other side adhesive surface. The test specimens were post-cured in a controlled environment chamber (23 ℃ C./50% relative humidity) for 24 hours and tested. Or the prepared sample is put in an 80 ℃ oven to accelerate curing for 1 hour, taken out of the oven, cooled to room temperature in a controlled environment chamber (23 ℃ per 50% relative humidity) and then measured.
The drop hammer impact was tested using an Instron company impact tester. The mass of the hammer is 15.125kg, the falling height is 205mm, the impact energy is 30.4J, and the impact speed is 2.01m/s. Each test was repeated three times and averaged in J.
The detection results are shown in the following table:
Initial shear MPa UV post-dynamic shear MPa Energy J at the end of hammer impact
Example 1 0.26 4.01 0.56
Example 2 0.22 4.62 0.58
Example 3 0.25 3.76 0.71
Example 4 0.11 3.87 0.52
Example 5 0.17 4.76 0.54
Comparative example 1 0.35 0.44 0.29
Comparative example 2 0.23 3.53 0.39
Comparative example 3 0.19 4.23 0.31
Comparative example 4 0.26 0.35 0.19
Comparative example 5 0.19 3.72 0.34
It is concluded from the above data that the epoxy resin is not used in comparative example 1, and thus the adhesive strength and impact resistance of the cured film are poor. In comparative example 2, the epoxy resin modified with a flexible fatty chain was not used, but the adhesive film after curing was strong in adhesive strength, but insufficient in impact resistance. The films used in comparative examples 3 and 5 did not meet the requirement of porosity >50%, and thus the impact resistance of the cured films was poor. In the adhesive film in comparative example 4, no UV initiator was used, so that the adhesive film was not cured by UV activation, and the adhesive property and impact resistance were affected. Examples 1 to 5 prepared according to the method provided by the present invention have good impact resistance and excellent adhesion properties.
The foregoing description is only of the optional embodiments of the present invention, and is not intended to limit the scope of the claims, and all equivalent structures or equivalent processes using the content of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.

Claims (10)

1.一种可UV固化的组合物，其特征在于：所述可UV固化的组合物包括甲基丙烯酸类聚合物、柔性脂肪链改性的环氧树脂、光产酸剂、光敏剂；所述柔性脂肪链改性的环氧树脂由摩尔比为2：1的环氧树脂与脂肪族二元酸通过本体熔融反应制得。1. A UV-curable composition, characterized in that: the UV-curable composition comprises a methacrylic polymer, a flexible fatty chain-modified epoxy resin, a photoacid generator, and a photosensitizer; the flexible fatty chain-modified epoxy resin is prepared by a bulk melt reaction of an epoxy resin and an aliphatic dibasic acid in a molar ratio of 2:1. 2.根据权利要求1所述的一种可UV固化的组合物，其特征在于：所述组合物包括以下组分：按质量份数计，100-125份甲基丙烯酸类聚合物、10-200份柔性脂肪链改性的环氧树脂、0.5-30份光产酸剂、0.15-15份光敏剂；2. A UV-curable composition according to claim 1, characterized in that: the composition comprises the following components: by mass, 100-125 parts of methacrylic polymer, 10-200 parts of flexible fatty chain modified epoxy resin, 0.5-30 parts of photoacid generator, and 0.15-15 parts of photosensitizer; 优选地，所述可UV固化的组合物包括以下组分：按质量份数计，100-125份甲基丙烯酸类聚合物、10-100份柔性脂肪链改性的环氧树脂、0.5-20份光产酸剂、0.15-10份光敏剂。Preferably, the UV-curable composition comprises the following components: by mass, 100-125 parts of methacrylic polymer, 10-100 parts of flexible fatty chain-modified epoxy resin, 0.5-20 parts of photoacid generator, and 0.15-10 parts of photosensitizer. 3.根据权利要求1所述的一种可UV固化的组合物，其特征在于：所述柔性脂肪链改性的环氧树脂按如下方法制备：100℃-150℃下将环氧树脂融化，并加入物质的量为环氧树脂二分之一的脂肪族二元酸，加入催化剂三苯基膦后，维持温度反应3-5h，得到柔性脂肪链改性的环氧树脂；3. A UV-curable composition according to claim 1, characterized in that: the flexible fatty chain-modified epoxy resin is prepared by the following method: melting the epoxy resin at 100°C-150°C, adding an aliphatic dibasic acid in an amount of half that of the epoxy resin, adding a catalyst triphenylphosphine, maintaining the temperature for reaction for 3-5 hours, and obtaining the flexible fatty chain-modified epoxy resin; 优选地，所述环氧树脂为平均每个分子中具有2个以上环氧基的环氧树脂，优选为环氧值为0.1-1.0的环氧树脂，更优选为环氧值为0.2-0.6的环氧树脂。Preferably, the epoxy resin is an epoxy resin having two or more epoxy groups in each molecule on average, preferably an epoxy resin having an epoxy value of 0.1-1.0, and more preferably an epoxy resin having an epoxy value of 0.2-0.6. 所述脂肪族二元酸为长碳链(C6-C18)二元酸或1，2-环己烷二甲酸、1，3-环己烷二甲酸、1，4-环己烷二甲酸中的一种或多种。The aliphatic dicarboxylic acid is a long carbon chain (C6-C18) dicarboxylic acid or one or more of 1,2-cyclohexanedicarboxylic acid, 1,3-cyclohexanedicarboxylic acid, and 1,4-cyclohexanedicarboxylic acid. 4.根据权利要求1所述的一种可UV固化的组合物，其特征在于：所述光产酸剂为二芳基碘鎓盐、三芳基硫鎓盐、芳基重氮盐类中的任意一种或多种；4. A UV-curable composition according to claim 1, characterized in that: the photoacid generator is any one or more of diaryliodonium salts, triarylsulfonium salts, and aryldiazonium salts; 优选地，所述光敏剂为稠环醌类、偶氮化合物、有机硫化物、卤化物中的任意一种或多种。Preferably, the photosensitizer is any one or more of condensed ring quinones, azo compounds, organic sulfides, and halides. 5.根据权利要求1所述的一种可UV固化的组合物，其特征在于：所述甲基丙烯酸类聚合物的酸值为5.6-56mgKOH/g；5. A UV-curable composition according to claim 1, characterized in that: the acid value of the methacrylic polymer is 5.6-56 mgKOH/g; 优选地，所述甲基丙烯酸类聚合物的环氧值为0.01-0.1。Preferably, the epoxy value of the methacrylic polymer is 0.01-0.1. 6.根据权利要求1所述的一种可UV固化的组合物，其特征在于：所述甲基丙烯酸类聚合物包括以下组分：按质量份数计，70-100份非功能性甲基丙烯酸类单体、0-15份含有极性官能团的甲基丙烯酰类单体、0.5-5份功能性甲基丙烯酰类单体、1.5-10份含有环氧基团的甲基丙烯酰类单体、0.2份引发剂、150份溶剂。6. A UV-curable composition according to claim 1, characterized in that: the methacrylic polymer comprises the following components: by mass, 70-100 parts of non-functional methacrylic monomers, 0-15 parts of methacrylic monomers containing polar functional groups, 0.5-5 parts of functional methacrylic monomers, 1.5-10 parts of methacrylic monomers containing epoxy groups, 0.2 parts of initiators, and 150 parts of solvents. 7.一种可UV固化的高抗冲胶带的制备方法，其特征在于：包含以下步骤：7. A method for preparing a UV-curable high-impact tape, characterized in that it comprises the following steps: S1，柔性脂肪链改性的环氧树脂的制备S1, Preparation of flexible fatty chain modified epoxy resin 100℃-150℃下将环氧树脂融化，并加入脂肪族二元酸，加入催化剂三苯基膦后，维持温度反应3-5h，得到柔性脂肪链改性的环氧树脂；Melt the epoxy resin at 100-150°C, add aliphatic dibasic acid, add triphenylphosphine as a catalyst, and maintain the temperature for 3-5 hours to obtain a flexible aliphatic chain modified epoxy resin; S2，甲基丙烯酸类聚合物的制备S2, Preparation of methacrylic acid polymer 将非功能性甲基丙烯酸类单体、含有极性官能团的甲基丙烯酰类单体、功能性甲基丙烯酰类单体、含有环氧基团的甲基丙烯酰类单体、引发剂、溶剂混合于玻璃瓶中，通入氮气两分钟除去氧气并密封，将反应瓶放在聚合设备中60-80℃进行聚合反应8-10h，制备甲基丙烯酸类聚合物，粘度为1000-10000cp；A non-functional methacrylic acid monomer, a methacrylic acid monomer containing a polar functional group, a functional methacrylic acid monomer, a methacrylic acid monomer containing an epoxy group, an initiator, and a solvent are mixed in a glass bottle, nitrogen is introduced for two minutes to remove oxygen, and the bottle is sealed, and the reaction bottle is placed in a polymerization device at 60-80° C. for 8-10 hours to prepare a methacrylic acid polymer with a viscosity of 1000-10000cp; S3，可UV固化的组合物的制备S3. Preparation of UV-curable composition 将甲基丙烯酸类聚合物、柔性脂肪链改性的环氧树脂、光产酸剂、光敏剂混合均匀，得到可UV固化的组合物；The methacrylic acid polymer, the flexible fatty chain modified epoxy resin, the photoacid generator and the photosensitizer are uniformly mixed to obtain a UV curable composition; S4，可UV固化的高抗冲胶带的制备S4, Preparation of UV-curable high impact tape 将可UV固化的组合物涂布于离型膜上，烘干得到一定厚度的干胶膜，将可UV固化的组合物涂布于另一离型膜上，烘干得到一定厚度干胶膜，将以上两部分干燥后的胶膜分别紧密压合在具备微纳孔洞的多孔膜材的两侧，得到两面覆盖离型膜的胶带。The UV-curable composition is coated on a release film and dried to obtain a dry adhesive film of a certain thickness. The UV-curable composition is coated on another release film and dried to obtain a dry adhesive film of a certain thickness. The above two parts of dried adhesive films are tightly pressed on both sides of a porous membrane material with micro-nano pores to obtain a tape with release films covered on both sides. 8.一种可UV固化的高抗冲胶带，其特征在于：包括权利要求1-6任一项所述的可UV固化的组合物以及具备微纳孔洞的多孔膜材。8. A UV-curable high-impact adhesive tape, characterized in that it comprises the UV-curable composition according to any one of claims 1 to 6 and a porous membrane material having micro-nano pores. 9.根据权利要求8所述的一种可UV固化的高抗冲胶带，其特征在于：所述可UV固化的高抗冲胶带的胶厚为100-500um；所述具备微纳孔洞的多孔膜材为厚度＜150um、孔隙率＞50％的膜材；9. The UV-curable high-impact tape according to claim 8, characterized in that: the thickness of the UV-curable high-impact tape is 100-500um; the porous membrane material with micro-nano pores is a membrane material with a thickness of less than 150um and a porosity of more than 50%; 优选地，所述具备微纳孔洞的多孔膜材为聚酯基、聚酰胺基无纺布、聚酰胺基平织布中的一种。Preferably, the porous membrane material with micro-nano pores is one of polyester-based, polyamide-based non-woven fabric and polyamide-based plain woven fabric. 10.根据权利要求8-9任一项所述的一种可UV固化的高抗冲胶带的使用方法，其特征在于：胶带贴到第一被贴物后，利用365nm LED紫外光源照射，照射能量为2J/cm2-8J/cm2，然后将第二被贴物压合到胶带的另一面，压合条件为0.3-1.0MPa，25-80℃，5-120s，室温静置养护24H以上即可。10. A method for using a UV-curable high-impact tape according to any one of claims 8 to 9, characterized in that: after the tape is attached to a first adherend, it is irradiated with a 365nm LED ultraviolet light source with an irradiation energy of 2J/ cm2-8J / cm2 , and then the second adherend is pressed onto the other side of the tape under the pressing conditions of 0.3-1.0MPa, 25-80℃, 5-120s, and then cured at room temperature for more than 24 hours.
CN202510377077.9A 2025-03-27 2025-03-27 A UV-curable composition and high-impact adhesive tape prepared therefrom Pending CN120059384A (en)

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