CN1266567C

CN1266567C - computer device

Info

Publication number: CN1266567C
Application number: CN 02127784
Authority: CN
Inventors: 陈永顺
Original assignee: Quanta Computer Inc
Current assignee: Quanta Computer Inc
Priority date: 2002-08-05
Filing date: 2002-08-05
Publication date: 2006-07-26
Anticipated expiration: 2022-08-05
Also published as: CN1474644A

Abstract

A computer device includes: a housing; an electronic component disposed in the housing; the heat dissipation device is arranged in the shell and provided with a shell and a fan, wherein the fan is arranged in the shell, the shell is provided with a first side edge, a second side edge, a first surface and a second surface, the first side edge is adjacent to the second side edge, the first surface is opposite to the second surface, the first side edge and the second side edge are arranged between the first surface and the second surface, the first side edge is provided with a first air outlet, the second side edge is provided with a second air outlet, the first surface is provided with a first opening, the second surface is provided with a second opening, the fan is positioned between the first opening and the second opening so as to suck airflow from the first opening and the second opening and discharge the airflow through the first air outlet and the second air outlet, and the fan is provided with a rotating shaft perpendicular to; the radiating fin is arranged in the shell and is opposite to the first air outlet of the radiating device; and a heat pipe connected between the electronic component and the heat sink. Therefore, the temperature of the central processing unit and other electronic elements can be reduced, and the temperature of the keyboard of the notebook computer can be reduced.

Description

computer device

(1)技术领域(1) Technical field

本发明有关一种电脑装置，特别是有关于一种可使笔记本电脑的键盘及内部电子元件的温度更为降低的电脑装置的散热装置。The present invention relates to a computer device, in particular to a cooling device for a computer device that can further reduce the temperature of a keyboard and internal electronic components of a notebook computer.

(2)背景技术(2) Background technology

在一般笔记本电脑中，常见的皆是使用散热风扇来降低中央处理器(CPU)或其他发热元件的温度。但是由于除了中央处理器外的其他电子元件亦会产生高温，因此习知有时会在笔记本电脑中设置另一风扇，以提高散热效率，降低其他电子元件的温度。In general notebook computers, it is common to use cooling fans to reduce the temperature of the central processing unit (CPU) or other heating elements. However, since other electronic components other than the central processing unit also generate high temperatures, it is known that another fan is sometimes installed in the notebook computer to improve heat dissipation efficiency and reduce the temperature of other electronic components.

然而，在空间有限的笔记本电脑中，设置二个风扇势必会压缩笔记本电脑内部电子元件的使用空间，并导致笔记本电脑整体体积及重量的增加。However, in a notebook computer with limited space, disposing two fans will inevitably reduce the space used by the electronic components inside the notebook computer, and lead to an increase in the overall volume and weight of the notebook computer.

(3)发明内容(3) Contents of the invention

有鉴于此，本发明的目的是提供一种电脑装置，藉由其特殊的气流入口及气流出口结构，在不影响笔记本电脑内部空间的情形下，提高散热装置的散热效率，其不但可降低中央处理器及其他电子元件的温度，还可降低笔记本电脑上键盘的温度。In view of this, the object of the present invention is to provide a kind of computer device, by its special airflow inlet and airflow outlet structure, under the situation that does not affect the internal space of notebook computer, improve the heat dissipation efficiency of heat dissipation device, it can not only reduce central The temperature of the processor and other electronic components can also reduce the temperature of the keyboard on the laptop.

为实现上述目的，本发明的电脑装置包括：一外壳；一电子元件，设置于该外壳中；一散热装置，设置于该外壳中，并且具有一壳体以及一风扇，其中，该风扇是设置于该壳体中，该壳体具有一第一侧边、一第二侧边、一第一表面以及一第二表面，该第一侧边是相邻于该第二侧边，该第一表面是相对于该第二表面，该第一侧边及该第二侧边是设置于该第一表面及该第二表面之间，该第一侧边具有一第一出风口，该第二侧边具有一第二出风口，该第一表面具有一第一开口，该第二表面具有一第二开口，该风扇位于该第一开口与该第二开口之间，以从该第一开口与该第二开口吸入空气气流，并经由该第一出风口与该第二出风口排出气流，该风扇具有一旋转轴，该旋转轴垂直于该第一表面与该第二表面；一散热片，设置于该外壳的内部并且相对于该散热装置的该第一出风口；以及一导热管，连接于该电子元件与该散热片之间。To achieve the above object, the computer device of the present invention includes: a casing; an electronic component arranged in the casing; a heat dissipation device arranged in the casing, and has a casing and a fan, wherein the fan is arranged In the housing, the housing has a first side, a second side, a first surface and a second surface, the first side is adjacent to the second side, the first The surface is opposite to the second surface, the first side and the second side are arranged between the first surface and the second surface, the first side has a first air outlet, and the second The side has a second air outlet, the first surface has a first opening, the second surface has a second opening, the fan is located between the first opening and the second opening, so as to and the second opening to inhale the airflow, and discharge the airflow through the first air outlet and the second air outlet, the fan has a rotation axis, the rotation axis is perpendicular to the first surface and the second surface; a heat sink , arranged inside the casing and opposite to the first air outlet of the heat sink; and a heat pipe connected between the electronic component and the heat sink.

为进一步说明本发明的目的、结构特点和效果，以下将结合附图对本发明进行详细的描述。In order to further illustrate the purpose, structural features and effects of the present invention, the present invention will be described in detail below in conjunction with the accompanying drawings.

(4)附图说明(4) Description of drawings

图1A是本发明的散热装置的上视立体示意图；Fig. 1A is a top perspective schematic diagram of a heat dissipation device of the present invention;

图1B是本发明的散热装置的底视立体示意图；以及Figure 1B is a bottom perspective schematic diagram of the heat sink of the present invention; and

图2是显示应用本发明的笔记本电脑的主机示意图。Fig. 2 is a schematic diagram showing a host of a notebook computer applying the present invention.

(5)具体实施方式(5) specific implementation

请参阅图1A及图1B，本实施例的散热装置100主要是由一壳体10及一风扇20所构成。Referring to FIG. 1A and FIG. 1B , the heat dissipation device 100 of this embodiment is mainly composed of a casing 10 and a fan 20 .

壳体10具有一第一侧边11、一第二侧边12、一第一表面13以及一第二表面14。第一侧边11具有一第一出风口(outlet)15，第二侧边12具有一第二出风口16，第一表面13具有一第一开口17，第二表面14具有一第二开口18。上述第一表面13是相对于第二表面14，第一开口17是相对于第二开口18。The casing 10 has a first side 11 , a second side 12 , a first surface 13 and a second surface 14 . The first side 11 has a first air outlet (outlet) 15, the second side 12 has a second air outlet 16, the first surface 13 has a first opening 17, and the second surface 14 has a second opening 18 . The above-mentioned first surface 13 is opposite to the second surface 14 , and the first opening 17 is opposite to the second opening 18 .

风扇20是为一鼓风式风扇(blower)，并且是设置于壳体10中。同时，风扇20是位于第一开口17与第二开口18之间，是用以从第一开口17与第二开口18吸入空气气流，并经由第一出风口15与第二出风口16排出气流。此外，风扇20具有一旋转轴，是垂直于第一表面13与第二表面14。The fan 20 is a blower fan and is disposed in the casing 10 . At the same time, the fan 20 is located between the first opening 17 and the second opening 18, and is used to suck the air flow from the first opening 17 and the second opening 18, and discharge the air flow through the first air outlet 15 and the second air outlet 16. . In addition, the fan 20 has a rotation axis which is perpendicular to the first surface 13 and the second surface 14 .

此外，如图1A及图1B所示，第一出风口15是大于第二出风口16，并且第一出风口15是相邻于第二出风口16。当空气经由第一开口17与/或第二开口18被风扇20吸入壳体10中后，会主要经由第一出风口15而排出，而第二出风口16则具有辅助排气的功用。其中，第一出风口15所吹出的气流是用以冷却散热片，以带出中央处理器等电子元件的热量；而第二出风口16所吹出的气流是用以冷却系统，两者搭配可提供足够的气流以达到最佳的散热效率。In addition, as shown in FIG. 1A and FIG. 1B , the first air outlet 15 is larger than the second air outlet 16 , and the first air outlet 15 is adjacent to the second air outlet 16 . After the air is sucked into the casing 10 by the fan 20 through the first opening 17 and/or the second opening 18 , it will be discharged mainly through the first air outlet 15 , while the second air outlet 16 has the function of auxiliary exhaust. Wherein, the airflow blown by the first air outlet 15 is used to cool the heat sink, so as to take out the heat of electronic components such as the central processing unit; and the airflow blown by the second air outlet 16 is used to cool the system, and the combination of the two can Provide sufficient airflow for optimum cooling efficiency.

请参阅图2，本实施例的散热装置100是应用于一笔记本电脑的主机200中。主机200主要包括有一外壳30、一中央处理器40、芯片组50、一导热管60、散热片70以及一散热装置100。此外，在主机200的上还设置有一键盘(未显示)。Please refer to FIG. 2 , the heat dissipation device 100 of this embodiment is applied in a host computer 200 of a notebook computer. The host 200 mainly includes a shell 30 , a CPU 40 , a chipset 50 , a heat pipe 60 , a heat sink 70 and a heat dissipation device 100 . In addition, a keyboard (not shown) is also provided on the host 200 .

外壳30具有相互邻接的一第三侧边31以及一第四侧边32。第三侧边31具有一第三开口311，第四侧边32具有一第四开口(未显示)，此第四侧边32即是外壳30的底部。其中，散热片70是对应于第三侧边31的第三开口311，第二开口18是对应于第四侧边32的第四开口，并且散热装置100的第二侧边12是对应于中央处理器等电子元件的方向。The shell 30 has a third side 31 and a fourth side 32 adjacent to each other. The third side 31 has a third opening 311 , and the fourth side 32 has a fourth opening (not shown). The fourth side 32 is the bottom of the housing 30 . Wherein, the heat sink 70 is the third opening 311 corresponding to the third side 31, the second opening 18 is the fourth opening corresponding to the fourth side 32, and the second side 12 of the heat sink 100 is corresponding to the central The orientation of electronic components such as processors.

导热管60是连接于中央处理器40、芯片组50与散热片70下的金属导热板(未显示)。因此，中央处理器40、芯片组50或其他电子元件所产生的热量可以传导至散热片70上。The heat pipe 60 is a metal heat conduction plate (not shown) connected to the CPU 40 , the chipset 50 and the heat sink 70 . Therefore, the heat generated by the CPU 40 , the chipset 50 or other electronic components can be conducted to the heat sink 70 .

当主机200运作时，中央处理器40、芯片组50或其他电子元件会产生大量的热量，此时藉由导热管60，可将中央处理器40以及芯片组50或其他电子元件的热量传导至散热片70上，然后经由风扇20的运转，可将空气自散热装置100的壳体10上的第一开口17与/或第二开口18吸入，也就说，空气气流是经由散热装置100的上表面及下表面进入壳体10中，最后再经由第一出风口15将气流吹向散热片70并从第三开口311排出至主机200的外壳30外，同时经由第二出风口16将低温气流吹向中央处理器40以做辅助性的冷却。When the host 200 is in operation, the central processing unit 40, the chipset 50 or other electronic components will generate a large amount of heat. At this time, the heat pipe 60 can conduct the heat of the central processing unit 40, the chipset 50 or other electronic components to the On the heat sink 70, then through the operation of the fan 20, the air can be sucked from the first opening 17 and/or the second opening 18 on the housing 10 of the heat sink 100, that is to say, the air flow is through the heat sink 100. The upper surface and the lower surface enter the casing 10, and finally the airflow is blown to the heat sink 70 through the first air outlet 15 and discharged from the third opening 311 to the outside of the housing 30 of the host 200, while the low temperature is blown out through the second air outlet 16. The airflow blows to the CPU 40 for auxiliary cooling.

通常，第三开口311与第四开口较佳的是一栅状开口。Usually, the third opening 311 and the fourth opening are preferably a grid opening.

本实施例的散热装置100尚还具有另一项特点，亦即可使键盘的表面温度降低，以让使用者的操作可更为舒适。如上所述，由于空气气流是经由散热装置100的上表面及下表面进入壳体10中，故位于键盘表面的热空气会被向下吸入至壳体10中，最后再经由第一出风口15而排出至主机200的外壳30外，因此，键盘表面的温度便会降低。The heat dissipation device 100 of this embodiment has another feature, that is, it can reduce the surface temperature of the keyboard, so that the user's operation can be more comfortable. As mentioned above, since the air flow enters the casing 10 through the upper surface and the lower surface of the cooling device 100, the hot air on the surface of the keyboard will be sucked downward into the casing 10, and finally pass through the first air outlet 15. And it is discharged to the outside of the casing 30 of the host 200 , so the temperature of the keyboard surface is reduced.

虽然本发明已以较佳实施例予以揭示，然而其并非用以限定本发明，任何熟悉本技术的人员在不脱离本发明的精神和范围内，当可作些许的更动与替换，因此本发明的保护范围当视后附的权利要求所限定的为准。Although the present invention has been disclosed with preferred embodiments, it is not intended to limit the present invention. Any person familiar with the art may make some changes and substitutions without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection of the invention shall prevail as defined by the appended claims.

Claims

1. A computer device, characterized in that, comprising:

a shell;

An electronic component is arranged in the casing;

A heat dissipation device is arranged in the casing, and has a casing and a fan, wherein the fan is arranged in the casing, and the casing has a first side, a second side, a first surface and a second surface, the first side is adjacent to the second side, the first surface is opposite to the second surface, the first side and the second side are disposed on the first side Between the first surface and the second surface, the first side has a first air outlet, the second side has a second air outlet, the first surface has a first opening, and the second surface has a the second opening, the fan is located between the first opening and the second opening, so as to suck air flow from the first opening and the second opening, and discharge the air flow through the first air outlet and the second air outlet, The fan has a rotating shaft, and the rotating shaft is perpendicular to the first surface and the second surface;

a heat sink disposed inside the housing and opposite to the first air outlet of the heat sink; and

A heat pipe is connected between the electronic component and the heat sink.

2. The computer device as claimed in claim 1, further comprising a metal heat conducting plate disposed under the heat sink.

3 . The computer device according to claim 2 , wherein the heat pipe is connected to the electronic component and the metal heat conduction plate under the heat sink. 4 .

4. The computer device according to claim 1, wherein the first air outlet is larger than the second air outlet, and the first air outlet is adjacent to the second air outlet.

5. The computer device as claimed in claim 1, wherein the fan is a blower fan.

6. The computer device according to claim 1, wherein the first opening and the second opening are circular holes.

7. The computer device according to claim 1, wherein the housing further has a third side and a fourth side adjacent to each other, the third side has a third opening, and the fourth side The side has a fourth opening.

8. The computer device according to claim 7, wherein the cooling fin is arranged on the third side of the housing opposite to the third opening, and the second side of the casing is arranged on the Opposite the electronics.

9. The computer device according to claim 7, wherein the second opening is the fourth opening corresponding to the fourth side.

10 . The computer device according to claim 7 , wherein the third opening and the fourth opening are grid-shaped openings. 11 .