CN1260772C - Substrate, stage device, method of driving stage, exposure system and exposure method - Google Patents

Abstract

The present invention relates to a stage device which comprises a support part (8) and a reaction force stage (17), wherein the support part (8) can be independently arranged in a vibrating mode correspondingly to a fixed disk (3). The reaction force stage (17) freely moves on the support part (8) along a direction through reaction force generated in company with the drive of a stage body (2). Therefore, because the problems of swing, etc. caused by the reaction force can be avoided, the present invention can realize short adjusting time and increased productivity and can also prevent the residual vibration of the support part from being conveyed to the fixed disk.

Description

Stage device, stage driving method, exposure device, and exposure method

technical field

The present invention relates to a stage device for moving a substrate of an exposure mask pattern such as a glass substrate or a wafer, and a stage body holding the substrate in a plane on a fixed plate, and a driving method thereof, and the use of the stage device Exposure device and exposure method for performing exposure treatment with a mask and substrate held in the center, especially when manufacturing devices such as semiconductor integrated circuits or liquid crystal displays, substrates, stage devices, and stage driving methods suitable for photolithography processes And an exposure device and an exposure method thereof.

Background technique

Conventionally, in the photolithography process, which is one of the manufacturing processes of semiconductor devices, a circuit pattern formed on a mask or original plate (hereinafter referred to as original plate) is copied onto a wafer or glass coated with a resist (photosensitive agent). Various exposure devices on substrates such as plates. For example, as the exposure apparatus used for semiconductor devices, with the high integration of integrated circuits in recent years, in accordance with the miniaturization of the minimum line width (device rule) of the pattern, a reduction projection exposure apparatus is mainly used. The graphics are replicated on the wafer in miniature.

As this reduction projection exposure apparatus, there is known a static exposure type reduction projection exposure apparatus (so-called sequential exposure apparatus) of a step-and-repeat method that sequentially copies the pattern of the original plate on a plurality of imaging areas (exposure areas) on the wafer. , or it has been improved and disclosed in Japanese No. 166043/1996 Patent Publication, etc., the original plate and the wafer are moved synchronously along the one-dimensional direction, and the original plate pattern is copied on the wafer. The step-by-step scanning method of each shooting area Exposure apparatus of scanning exposure type (so-called scanning successive exposure apparatus).

In these reduction projection exposure apparatuses, as the stage apparatus, a base frame as the reference of the apparatus is first set on the ground in many cases, and the original plate stage is loaded and supported on it by an anti-vibration table for isolating the vibration of the ground. , the wafer stage and the body seat of the projection optical system (projection lens). In the current stage device, as the anti-vibration table, actuators such as air brackets and voice coil motors that can control the internal pressure are used, and they are installed on the body seat (main frame), for example, according to 6 accelerations An active anti-vibration table that controls the vibration of the body base by controlling the voice coil motor based on the measured value of the meter.

However, in the above-mentioned sequential exposure apparatus, etc., after exposing a certain shot area on the wafer, since other shot areas are sequentially and repeatedly exposed, the wafer stage (in the case of the sequential exposure apparatus) ), or the reaction force generated by the acceleration and deceleration of the original stage and the wafer stage (in the case of scanning successive exposure devices) becomes the vibration factor of the body seat, and there is a relative position error between the projection optical system and the wafer. bad situation. The above-mentioned relative position error during alignment or exposure eventually reproduces the pattern on the wafer at a position different from the design value, and when the vibration component is included in the position error, it becomes the cause of image blur (increased line width of the pattern) bad condition. Therefore, in order to suppress such a problem, it is necessary to sufficiently attenuate the vibration of the main body base by the above-mentioned active vibration isolator or the like. For example, in the case of a sequential exposure apparatus, it is necessary to wait for sufficient position adjustment to bring the wafer stage to a desired position before starting alignment or exposure. On the other hand, in the case of a scanning sequential exposure apparatus, it is necessary to perform exposure in a state where the synchronous adjustment of the original plate stage and the wafer stage is sufficiently ensured. Therefore, it becomes a factor which deteriorates productivity.

Therefore, as an invention to improve such an uncomfortable situation, as disclosed in Japanese Patent Laid-Open Publication No. 166475/1996, the reaction force generated by the movement of the wafer stage is mechanically escaped to the ground (earth) using a frame member, or For example, as disclosed in Japanese Patent Laid-Open Publication No. 330224/1996, a frame member is used to mechanically avoid the reaction force generated by the movement of the master stage to the ground (earth).

However, the above-mentioned conventional stage device and exposure device have the following problems.

With the enlargement of the original plate or wafer in recent years, both stages are enlarged. Even if the invention disclosed in Japanese Patent Publication No. 166475/1996 or No. 330224/1996 is used, the The reaction force on the ground side causes the frame member itself to vibrate, and the reaction force that escapes to the ground is transmitted to the main body (main body) that holds the projection optical system through the anti-vibration table, causing it to vibrate, and there is a risk of so-called rocking. Therefore, it is difficult to secure a certain degree of productivity and to perform high-precision exposure.

Therefore, for example, the following technology is disclosed in Japanese Patent Laid-Open Publication No. 63231/1996: the stage body and the driving frame are provided with a floating support on the base, and as the stage body moves forward, the reaction force drives the Drive frame backwards. According to this technique, since the law of conservation of momentum acts between the stage body and the drive frame to maintain the position of the center of gravity of the device on the base, it is possible to reduce the influence of the vibration of the frame member. However, even in the case of employing this technique, if the stage is increased in size and speed, the influence of the above-mentioned reaction force cannot be completely eliminated.

In consideration of the above points, an object of the present invention is to provide a stage device, a stage driving method, an exposure apparatus, and an exposure method that can be used even when a large stage or a high-speed stage is used The position control characteristic of the stage is maintained. Another object of the present invention is to provide an exposure apparatus and an exposure method that can ensure a certain degree of productivity and perform high-precision exposure even when a large stage or a high-speed stage is used. . Still another object of the present invention is to provide a substrate in which patterns are exposed with high precision.

Contents of the invention

In order to achieve the above object, the present invention adopts the following structures corresponding to FIGS. 1 to 7 showing the embodiment.

The stage device of the present invention comprises a stage device 4, 7 of a stage body 2, 5 driven in at least one direction on a fixed plate 3, 6, and is characterized in that the stage device 4, 7 comprises : supporting parts 8,10 are configured to vibrate independently with respect to the fixed discs 3,6; The supporting parts 8, 10 are free to move along the one direction. The stage driving method of the present invention is used for stage driving, and the stage includes the first stage 2, 5 driven in at least one direction on the fixed disk 3, 6, and it is characterized in that, with the The driving of the first object stage 2, 5 supports the second object stage 17, 37 freely movable in the one direction by the reaction force on the supporting part 8, which vibrates independently relative to the fixed disks 3, 6. 10 on. Therefore, in the stage device and the stage driving method of the present invention, when the stage main bodies 2, 5 of the first stage are driven in one direction on the fixed plates 3, 6, along with the object The driving of stage bodies 2 and 5, through the reaction force, the reaction force stages 17 and 37 of the second stage move in the opposite direction to the stage bodies 2 and 5, so the stage bodies 2, 5 and The law of conservation of momentum between the reaction force stage 17, 37 works. Since the reaction force stage 17, 37 moves on the independently vibrating supports 8, 10 relative to the fixed plates 3, 6, the vibration of the supports 8, 10 is not transmitted to the fixed plates 3, 6, which can prevent damage to the load. The position controllability of platform body 2,5 exerts influence.

The exposure apparatus of the present invention exposes the pattern of the mask R held on the mask stage 2 to the substrate W held on the substrate stage 5, and is characterized in that, in the exposure apparatus 1, as the mask stage At least one of the stage 2 and the base stage 5 uses the stage apparatus 4, 7 according to any one of claims 1 to 9. The exposure method of the present invention is used to expose the pattern of the mask R held on the mask stage 2 to the substrate W held on the substrate stage 5, and is characterized in that, as the mask stage 2 and the As the method for driving at least one of the substrate stages 5, the method for driving the stage according to any one of claims 17 to 20 is used. Therefore, in the exposure apparatus and exposure method of the present invention, since the adjustment time of the stage bodies 2, 5 holding the mask R or the substrate W can be shortened, the productivity can be improved while suppressing the stress on the stage bodies 2, 5. The influence of the vibration and maintain the positional controllability, so high-precision exposure can be performed. By making the mask stage 2, the substrate stage 5, and the projection optical system PL vibrate independently of each other, it is possible to prevent the vibration caused by the driving of the mask stage 2 and the substrate stage 5 from being transmitted to the projection optical system PL, Therefore, the imaging characteristics of the mask R can be improved. Also, on the substrate W exposed according to these exposure methods, the pattern of the mask R can be reproduced with high precision.

The present invention relates to a stage device for moving a substrate of an exposure mask pattern such as a glass substrate or a wafer, and a stage body holding the substrate in a plane on a fixed plate, and a driving method thereof, and the use of the stage device Exposure device and exposure method for performing exposure treatment with a mask and substrate held in the center, especially when manufacturing devices such as semiconductor integrated circuits or liquid crystal displays, substrates, stage devices, and stage driving methods suitable for photolithography processes And an exposure device and an exposure method thereof.

According to the stage device and the method for driving the stage of the present invention, since it includes a support part that is vibrated independently with respect to the fixed plate, and the reaction that moves on the support part through the reaction force generated by the drive of the stage body Therefore, problems such as swinging can be avoided, adjustment time can be shortened, and productivity can be improved. At the same time, it can suppress the residual vibration of the support part from being transmitted to the fixed plate, and can maintain the position control of the stage body. Since the fixed platen supports the support portion by the anti-vibration mechanism, transmission of residual vibration of the support portion to the fixed platen can be suppressed, and the positional controllability of the stage main body can be maintained. Furthermore, since the reaction force stage is at least a part of the drive structure that drives the stage body in one direction, it is not necessary to design a separate mechanism for eliminating the reaction force, and the device can be reduced in size and price. Furthermore, between the reaction force stage and the support part, since the rotating body that moves the reaction force stage that rotates around the axis relative to the support part is inserted, when the reaction force stage moves, the rotating body moves around. A simple operation such as axis rotation can realize the simplification of the device. In addition, since the reaction stage moves without friction by inserting a non-contact bearing between the reaction stage and the support part, vibration of the support part and external disturbance caused by friction can be eliminated. In addition, return means such as urging parts that urge the reaction stage in opposite directions can also provide an effect that the reaction stage can be easily returned to the initial position with a simple mechanism. In addition, since the stage body is freely movable in the approximately vertical direction of movement, and the reaction force stage is provided in each such approximately vertical direction, even in the case where the stage body moves two-dimensionally It can also avoid problems such as swaying caused by reaction force along with the movement, which can further shorten the adjustment time and improve productivity.

Moreover, according to the exposure apparatus and exposure method of the present invention, as at least one stage of the mask stage and the substrate stage, since the stage device described in any one of claims 1 to 9 is used , or the stage driving method described in any one of claim 17 to claim 20, so the adjustment time can be shortened, the productivity and exposure accuracy can be improved, and at the same time, the residual vibration of the support part can be suppressed from being transmitted to the fixed plate, and the The position control of the stage body. By disposing the mask stage, substrate stage, and projection optical system independently of each other in terms of vibration, it is possible to prevent the vibration caused by the drive of the stage from being transmitted to the projection optical system, so that the vibration caused by the vibration of the projection optical system is effectively prevented. The deviation of the graphic reproduction position or the blurring of the image, etc., improve the exposure accuracy. Furthermore, since the mask stage holds a plurality of masks, and the substrate stage holds a plurality of substrates, the exchange and alignment operations are performed in the same manner as the exposure operation, so productivity can be greatly improved. Furthermore, if the stator is shared by a plurality of rotors, the reduction of components, that is, the simplification and cost reduction of the device can be realized.

On the other hand, according to the substrate of the present invention, by performing pattern exposure using the above-mentioned exposure method, it is possible to maintain high precision in pattern overlap and line width, and to exhibit predetermined device characteristics.

Description of drawings

FIG. 1 is a diagram showing a first embodiment of the present invention, and is a schematic configuration diagram of an exposure apparatus in which a master plate stage, a wafer stage, and a projection optical system are vibratingly linked and arranged independently.

Fig. 2 is a perspective view of the appearance of the stage device equipped with the original stage.

Fig. 3 is a view showing a first embodiment of the present invention, and is a side view of a stator with springs connected to both sides.

Fig. 4 is a partially enlarged view of a stage device equipped with a wafer stage.

Fig. 5 is an enlarged view of a main part of a linear motor driving a wafer stage.

6 is a view showing a second embodiment of the present invention, and is a schematic configuration diagram of an exposure apparatus in which a master plate stage, a wafer stage, and a projection optical system are vibrated in association and arranged independently.

Fig. 7 is an external perspective view showing another embodiment of a stage device equipped with the wafer stage.

FIG. 8 is a flowchart showing an example of a manufacturing process of a semiconductor device.

Detailed ways

Hereinafter, embodiments of a substrate, a stage device, a stage driving method, an exposure device and an exposure method thereof according to the present invention will be described with reference to FIGS. 1 to 7 . Here, for example, as an exposure apparatus, an example of using a scanning stage for replicating on a wafer a circuit pattern of a semiconductor device formed on a master plate while moving a master plate and a wafer synchronously will be described. In this exposure apparatus, it is assumed that the stage device of the present invention is used for both the original plate stage and the wafer stage.

[first embodiment]

First, a first embodiment will be described with reference to FIGS. 1 to 5 . The exposure apparatus 1 shown in FIG. 1 is roughly configured as follows: the rectangular (or arc-shaped) illumination area on the original plate (mask) R is illuminated with uniform illuminance by the illumination light for exposure from a light source (not shown). Illumination optical system IU for illuminating; includes original plate stage (stage main body, first object stage) 2 as a mask stage holding original plate R and original plate fixed plate ( fixed disk) 3; projection optical system PL for projecting illumination light emitted from reticle R onto wafer (substrate) W; a stage body, a first stage) 5, and a stage device 7 holding a fixed wafer plate (fixed plate) 6 of the wafer stage 5; Reaction frame (support part) 8 . Here, let the optical axis direction of projection optical system PL be the Z direction, the synchronous moving direction of master R and wafer W in the direction perpendicular to the Z direction be the Y direction, and the asynchronous moving direction be the X direction. In addition, let the rotation directions of the respective rotation axes be θZ, θY, and θX.

The illumination optical system IU is supported by a support seat 9 fixed on the reaction frame 8 . As the exposure illumination light, for example, ultraviolet light (g-line, i-line) emitted from an ultra-high pressure mercury lamp, far ultraviolet light (DUV light) such as KrF excimer laser (wavelength 248nm), ArF excimer laser ( Vacuum ultraviolet light (VUV) such as wavelength 193nm) and F ₂ laser (wavelength 157nm), etc. The reaction frame 8 is installed on a base frame 10 mounted horizontally on the bottom, and steps 8a and 8b protruding inward are formed on the upper side and the lower side thereof, respectively.

In the stage device 4, the original plate fixed plate 3 is supported approximately horizontally by the anti-vibration unit (vibration-proof mechanism) 11 on the step portion 8a of the reaction frame 8 in each corner (the anti-vibration unit on the back side of the paper is not shown). As shown in the figure), an opening 3a through which the graphic image formed on the original plate R passes is formed in the central part. The anti-vibration unit 11 has a structure in which an air bracket 12 capable of adjusting internal pressure and a voice coil motor 13 are arranged in series on the stepped portion 8a. With these anti-vibration components 11, the micro-vibrations transmitted to the original plate fixing plate 3 are insulated at the micro-G level through the base frame 10 and the reaction frame 8.

On the master plate 3 , the master stage 2 is supported so as to be movable two-dimensionally along the master plate 3 . On the bottom surface of the original plate stage 2, a plurality of air bearings (air pads) 14 as non-contact bearings are fixed, and through these air bearings 14, the original plate stage 2 is moved by several microns on the original plate fixed plate 3. left and right gaps to float the support. In the central part of the original plate stage 2, an opening 2a communicating with the opening 3a of the original plate fixing plate 3 through which the graphic image of the original plate R passes is formed. The original plate stage 2 is driven on the original plate fixed plate 3 within a prescribed stroke range in the Y direction as the scanning direction by two sets of linear motors (drive mechanism) 15 . The original plate stage 2 has an unillustrated original micro-motion stage that absorbs and holds the original plate R and performs micro-drive along the non-scanning direction (X direction) and the θZ direction, and a micro-motion stage connected to the micro-motion stage along the X, Coarse motion stages that are movable in the Y direction, but they are shown here as one stage. Therefore, the original plate stage 2 is configured to be linearly driven with a long stroke in the Y direction, and finely driven in the X direction and θZ direction.

As shown in Figure 2, on the end of the -Y direction of the original plate stage 2, a pair of Y moving mirrors 18a, 18b made up of corner cubes are fixed, and on the +X direction of the original plate stage 2 On the end, an X moving mirror 19 consisting of a plane mirror extending in the Y direction is fixed. And, for these movable mirrors 18a, 18b, 19, three laser interferometers (none of which are shown) that irradiate length-measuring beams measure the distances from the movable mirrors to measure the distance of the original plate stage 2 with high precision. Position in X, Y, θZ (rotation around the Z axis) direction.

As shown in FIG. 1 , rotors 16 with built-in coils and extending in the Y direction are respectively integrally provided at approximately the center positions in the Z direction of both sides of the original plate stage 2 in the X direction. Furthermore, a pair of stators 17 having a U-shaped cross section as a reaction force stage (second stage) are arranged for each of these rotors 16 . The stator 17 is composed of a stator yoke and a plurality of permanent magnets arranged at predetermined intervals along the extending direction of the stator yoke to generate an alternating magnetic field. That is, the moving coil type linear motor 15 is constituted by the rotor 16 and the stator 17 , and the rotor 16 is driven in the Y direction (one direction) by electromagnetic interaction with the stator 17 . The weight ratio of the master stage 2 side including the rotor 16 and the like to the stator 17 side is set to approximately 1:4.

As shown in FIG. 2 , between each stator 17 and the upper surface of the reaction frame 8 , rotating guide rails 20 are respectively inserted. The rotating guide rail 20 has a structure in which a plurality of rollers (rotors) 21 extending in the X direction and each rotating around the axis are arranged at regular intervals in the Y direction, and the stator 17 is rotated by the rollers 21 relative to the reaction frame 8 at Y direction can be freely moved. As shown in FIG. 3 , one end of a pair of springs (urging portions) 22 , 22 constituting return means for returning the stator 17 to the initial position is connected to both sides in the Y direction of each stator 17 . The other ends of these springs 22 are fixed to the reaction frame 8, and respectively urge (for example, stretch) substantially the same force to the stator 17 in directions opposite to each other along the Y direction. Each spring 22 is set with a sufficient amount of bending so that the stator 17 deforms within the elastic range when the stator 17 moves. As can be seen from FIGS. 1 and 2 , the original plate stage 2 becomes a railless stage without guide rail components for the movement of the original plate stage 2 when moving in the X and Y directions.

Returning to Figure 1, as the projection optical system PL, the object plane (original R) side and the imaging plane (wafer W) side are used here to have a circular projection field of view under the telecentricity, and the optical glass material is made of quartz or fluorite Refractive optical elements (lens elements) constitute a refractive optical system with a magnification of 1/4 (or 1/5). Therefore, if the illuminating light is irradiated on the original plate R, in the circuit pattern on the original plate R, the imaging light beam from the illuminated part of the illuminating light is incident on the projection optical system PL, and the partial inverted image of the circuit pattern is limited in the form of a slit. An image is formed in the center of the circular field of view on the imaging plane side of projection optical system PL. As a result, a partial inverted image of the projected circuit pattern is copied in reduced size on the resist layer on the surface of one of the plurality of imaging areas on the wafer W disposed on the imaging surface of the projection optical system PL.

In FIG. 4 , the projection optical system PL of the exposure apparatus 1 shows the bottom enlarged. As shown in the figure, a flange 23 integrated with the barrel portion of projection optical system PL is provided on the outer periphery of the barrel portion. Further, the projection optical system PL is inserted from above into the lens barrel 25 made of castings or the like supported substantially horizontally by the vibration-proof unit 24 on the step portion 8b of the reaction frame 8 with the optical axis direction as the Z direction, and the connecting flange 23 . As the material of the flange 23 , a low-expansion material such as Invar (Invar; a low-expansion alloy composed of 36% nickel, 0.25% manganese, and a trace amount of carbon and iron containing other elements) can be used. The flange 23 supports the projection optical system PL to the barrel fixing plate 25 at three points through a point, a surface and a V-groove, forming a so-called kinematic support bracket structure. When such a movable support structure is adopted, the assembly of the lens barrel fixed plate 25 of the projection optical system PL is easy, and it can most effectively reduce the vibration and temperature changes caused by the assembled lens barrel fixed plate 25 and the projection optical system PL. The advantages of stress.

The anti-vibration assembly 24 is arranged on each corner of the lens barrel fixed plate 25 (the anti-vibration assembly on the deep side of the paper surface is not shown), and the air bracket 26 and the voice coil motor 27, which can adjust the internal pressure, are arranged in series on the step portion 8b. on the structure. With these anti-vibration components 24, micro vibration transmitted to the barrel fixing plate 25 (or projection optical system PL) through the base frame 10 and the reaction frame 8 can be insulated at a micro G level.

The stage device 7 is mainly composed of a wafer stage 5 that holds a wafer W, and a wafer holding plate 6 that supports the wafer stage 5 so as to be movable two-dimensionally along the XY plane. As shown in FIG. 4, on the bottom surface of the wafer stage 5, a plurality of air bearings (air pads) 28 as non-contact bearings are fixed, and through these air shafts 28, the wafer stage 5 is moved, for example, by several micrometers. The left and right gaps are supported floatingly on the wafer fixing plate 6 .

The wafer holding plate 6 is supported substantially horizontally above the susceptor frame (support portion) 10 by a vibration-proof unit (vibration-proof mechanism) 29 . The anti-vibration assembly 29 is arranged on each corner of the fixed wafer plate 6 (the anti-vibration assembly on the back side of the paper is not shown), and the air support 30 and the voice coil motor 31 which can adjust the internal pressure are arranged in parallel on the base frame 10 Structure. With these anti-vibration components 29, micro vibration transmitted to the wafer holding plate 6 through the susceptor frame 10 can be insulated at a micro G level.

The wafer stage 5 drives a pair of linear motors 32 of the wafer stage 5 in the X direction (the linear motors on the paper side of the wafer stage 5 are not shown), and drives the wafer stage 5 in the Y direction. A pair of linear motors (drive mechanisms) 33 of the stage 5 are freely movable in the XY two-dimensional directions on the wafer holding plate 6 . The stators of the linear electrodes 32 extend along the X direction and are arranged on both outer sides of the wafer stage 5 in the Y direction. The two ends are connected to each other by a pair of connecting members 34 to form a rectangular frame 35 . The rotors of the linear motor 32 are protrudingly provided on both sides in the Y direction of the wafer stage 5 so as to face the stator.

On the lower end faces of the pair of connection members 34 or the linear motor 32 constituting the frame body 35, rotors 36, 36 composed of armature assemblies are respectively provided as the second stage with magnet assemblies corresponding to these rotors 36, 36. The stators (reaction force stage) 37, 37 extend in the Y direction. As shown in FIG. 5 , between the respective stators 37 and the base frame 10 , rotating guide rails 38 are respectively inserted. The rotating guide rail 38 has an axis extending in the X direction, and a plurality of rollers (rollers) 39 each rotating around the axis are arranged at regular intervals in the Y direction. The frame 10 is free to move in the Y direction.

As shown in FIG. 3 , similarly to the stator 17 , one end of a pair of springs (biasing parts) 40 , 40 constituting return means for returning the stator 37 to the initial position is connected to both sides in the Y direction of each stator 37 . The other ends of these springs 40 are fixed to the base frame 10 so that the stators 37 are biased (for example, stretched) with approximately the same force in directions opposite to each other along the Y direction. Each spring 40 is set to a sufficient amount of bending so that the stator 37 deforms within the elastic range even when the stator 37 moves.

Then, a moving coil type linear motor 33 is constituted by these rotor 36 and stator 37 , and the rotor 36 is driven in the Y direction (one direction) by electromagnetic interaction with the stator 37 . That is, the linear motor 33 drives the wafer stage 5 integrated with the housing 35 in the Y direction. As can be seen from FIG. 4 , the wafer stage 5 is a railless stage that has no rail members for movement in the Y direction. In addition, regarding the movement of the wafer stage 5 in the X direction, a railless stage may be appropriately formed.

On the upper surface of the wafer stage 5 , the wafer W is fixed by vacuum suction or the like through the wafer holder 41 . The position of the X-direction of the wafer stage 5 is based on the reference mirror 42 fixed to the lower end of the lens barrel of the projection optical system PL, and the position is changed by measuring the position of the movable mirror 43 fixed to a part of the wafer stage 5. The laser interferometer 44 of the measurement device performs real-time measurement with a predetermined resolution, for example, a resolution of about 0.5 to 1 nm. The Y-direction position of the wafer stage 5 is measured by a reference mirror, a movable mirror, and an interferometer (not shown) arranged approximately perpendicularly to the reference mirror 42 , the movable mirror 43 , and the interferometer 44 . At least one of these laser interferometers is a multi-axis interferometer with two or more long-measuring axes. Based on the measured values of these laser interferometers, not only the XY position of the wafer stage 5 (or wafer W) but also the amount of rotation θ or in addition to them, the adjustment amount can also be obtained.

On the above-mentioned original version fixed disk 3, wafer fixed disk 6, and lens barrel fixed disk 25, three sensors (such as accelerometers, not shown) and three sensors (such as accelerometers, not shown) for measuring the Z-direction vibration of each fixed disk and measuring the XY plane in-plane direction are installed respectively. Three sensors (such as accelerometers, not shown) of the vibration. Two of the latter vibration sensors measure vibration in the Y direction of each fixed plate, and the remaining vibration sensors measure vibration in the X direction (hereinafter, these vibration sensors are referred to as a vibration sensor group for brevity). Furthermore, based on the measured values of these vibration sensor groups, the vibrations of the six degrees of freedom (X, Y, Z, θX, θY, θZ) of the master platen 3, the wafer platen 6, and the lens barrel platen 25 can be obtained respectively. .

And, as shown in FIG. 4, on the flange 23 of the projection optical system PL, three laser interferometers 45 as position detection devices are fixed at three different places (wherein, in FIG. One is representatively shown in the meter). Openings 25 a are formed at portions facing the column holder plate 25 of the laser interferometers 45 , and the length measuring beams in the Z direction are irradiated from the laser interferometers 45 to the wafer holder plate 6 through these openings 25 a. Reflecting surfaces are formed on the upper surface of the wafer holding platen 6 at positions where the length-measuring beams face each other. Therefore, by the above-mentioned three laser interferometers 45, the Z positions of three different points of the wafer holding plate 6 are respectively measured with the flange 23 as a reference (wherein, in FIG. 4, the wafer W on the wafer stage 5 The central imaging area of , indicates that it is directly below the optical axis of the projection optical system PL, so the length measuring beam is in a state of being blocked by the wafer stage 5). A reflective surface is formed on the upper surface of wafer stage 5, and an interferometer may be provided to measure the Z-direction positions of three different points on the reflective surface with reference to projection optical system PL or flange 23.

Next, among the stage devices 4 and 7 configured as above, the operation of the stage device 4 will be described first.

When the original stage 2 is driven by the linear motor 15 to move in the scanning direction (for example, +Y direction), the stator 17 is opposite to each other in the opposite direction (-Y direction) on the reaction frame 8 through the rotating guide rail 20 under the reaction force generated by the drive. move. At this time, in the rotary guide rail 20, since the roller 21 rotates, the stator 17 moves smoothly.

Here, under the situation that the friction between the three of the original plate stage 2 and the stator 17 and the original plate fixed disk 3 is zero, the law of conservation of momentum works, and along with the movement of the original plate stage 2, the amount of movement of the stator 17 is as follows: The original plate stage 2 side (including Y movable mirrors 18a, 18b, X movable mirror 19, rotor 16, original plate R, etc.) and the stator 17 side are determined by weight ratio. Specifically, since the weight ratio of the master stage 2 side to the stator 17 side is approximately 1:4, for example a movement of 30 cm in the +Y direction of the master stage 2 moves the stator 17 in the -Y direction by 7.5 cm.

Therefore, the reaction force at the time of acceleration and deceleration in the scanning direction of the original plate stage 2 is absorbed by the movement of the stator 17, and the position of the center of gravity in the stage device 4 is substantially fixed in the Y direction. Since the reaction frame 8 supporting the stator 17 supports the original plate fixing plate 3 via the anti-vibration unit 11, these reaction frames 8 and the original plate fixing plate 3 are independent in terms of vibration. Therefore, when the original plate stage 2 is driven, the vibration of the fixed original plate 3 can be effectively suppressed by the above-mentioned reaction force. When the stator 17 moves in the −Y direction, the balance of the biasing force applied to the stator 17 by the biasing portion 22 shown in FIG. 3 is broken, and the force biasing the stator 17 in the +Y direction increases. Therefore, the stator 17 quickly returns to the above-mentioned position where the applied forces are balanced, that is, the initial position.

Then, based on the measured value of the laser interferometer, the anti-vibration unit 11 feeds forward a force (reaction force) that eliminates the influence of the change of the center of gravity accompanying the movement of the original plate stage 2, and drives the gas holder 12 and the voice coil motor 13. to generate the force. According to the original plate stage 2 and the friction between the three of the stator 17 and the original fixed plate 3 is zero, it is only the reason that the moving direction of the original plate stage 2 and the stator 17 is different, etc., in the original plate fixed plate 3 When minute vibrations in the directions of six degrees of freedom remain, feedback control is also performed on the air mount 12 and the voice coil motor 13 in order to remove the residual vibrations based on the measurement values of the vibration sensor group.

On the other hand, the same operation as that of the stage device 4 occurs also in the stage device 7 .

When the wafer stage 5 is driven by the linear motor 33 to move in the scanning direction (+Y direction), under the reaction force generated by the drive, the stator 37 moves in the opposite direction (-Y direction) on the base frame 10 through the rotating guide rail 38. relatively mobile. At this time, in the rotary guide rail 38, since the roller 39 rotates, the stator 37 moves smoothly. And, under the situation that the friction between the wafer stage 5, the stator 37 and the wafer fixed plate 6 is zero, the law of conservation of momentum works, and along with the movement of the wafer stage 5, the movement amount of the stator 37 is equal to that of the wafer. The weight ratio between the stage 5 side and the stator 37 side is determined. Therefore, the reaction force at the time of acceleration and deceleration in the scanning direction of the wafer stage 5 is absorbed by the movement of the stator 37, and the position of the center of gravity of the stage device 7 is substantially fixed in the Y direction. Since the base frame 10 supported by the stator 37 supports the wafer holder 6 via the vibration-proof unit 29, these base frames 10 and the wafer holder 6 are vibration-independent. Therefore, when the wafer stage 5 is driven, the vibration of the fixed wafer platen 6 can be effectively suppressed by the above-mentioned reaction force. When the stator 37 moves in the −Y direction, the balance of the biasing force applied to the stator 37 by the biasing portion 40 shown in FIG. 3 is broken, and the force biasing the stator 37 in the +Y direction increases. Therefore, the stator 37 quickly returns to the above-mentioned position where the applied forces are balanced, that is, the initial position.

Then, the anti-vibration unit 29 applies a feed-forward reaction force that cancels the influence of the center of gravity change due to the movement of the wafer stage 5 based on the measured value of the laser interferometer 44, etc., and drives the gas holder 30 and the voice coil motor 31. to generate the force. According to the friction between the wafer stage 5 and the stator 37 and the three of the original plate fixed disk 6 is not zero, it is only the reason that the moving direction of the wafer stage 5 and the stator 37 is a little different, etc., in the wafer fixed disk 6 When minute vibrations in the directions of six degrees of freedom remain, feedback control is also performed on the air mount 30 and the voice coil motor 31 in order to remove the residual vibrations based on the measurement values of the vibration sensor group.

In the lens barrel fixed plate 25, the reaction force generated by the movement of the original plate stage 2 and the wafer stage 5 moves the stators 17, 37, even if there is a slight vibration on the reaction frame 8, the reaction frame 8 is inserted between the reaction frames 8. Install anti-vibration assembly 24 to make vibration independent. Even if micro-vibration occurs on the barrel fixing plate 25, the vibration in the directions of six degrees of freedom is obtained from the measured values of the vibration sensor group installed on the barrel fixing plate 25, and the air mount 26 and the voice coil motor 27 are fed back. Controlling to eliminate the micro-vibration can make the lens barrel fixing plate 25 always maintain a stable position. Therefore, the projection optical system PL supported on the lens barrel fixing plate 25 can be maintained at a stable position, effectively preventing pattern reproduction position deviation and image blur due to vibration of the projection optical system PL, and improving exposure accuracy.

Next, the exposure operation in the exposure apparatus 1 configured as described above will be described. Various exposure conditions are set in advance for scanning exposure of an imaging region on the wafer W with an appropriate exposure amount (target exposure amount). Then, preparation operations such as master alignment and baseline measurement are performed using a master microscope (not shown) and an off-axis alignment sensor, etc., and the fine alignment of the wafer W is completed using the alignment sensor (EGA; Enhanced Global Alignment etc.) to find the arrangement coordinates of a plurality of imaging regions on the wafer W.

Then, if the exposure preparation operation for the wafer W ends, the measurement value of the laser interferometer 44 is monitored based on the alignment result, and the linear motors 32, 33 are controlled to move the wafer stage 5 to the position for the wafer W. Exposure scan start position for the 1st shot. Then, start to scan the Y direction of the original plate stage 2 and the wafer stage 5 by the linear motors 15, 33, if the two stage 2, 5 reach their respective target scanning speeds, then the exposure will be controlled by the illumination of the exposure. The graphic area of the original R is illuminated and the scanning exposure begins.

During this scanning exposure, the original plate stage 2 and the wafer stage 5 are synchronously controlled by the linear motors 15, 33, so that the moving speed of the original plate stage 2 in the Y direction and the wafer stage 5 in the Y direction The moving speed of the projection optical system PL is maintained at a speed corresponding to the projection magnification (1/5 times or 1/4 times) of the projection optical system PL. Then, different areas of the pattern area of the master plate R are gradually illuminated with illumination light, and the scanning exposure of the first shot on the wafer W is completed by terminating the illumination of the entire surface of the pattern area. As a result, the pattern of the original plate R is reduced and reproduced in the first imaging area on the wafer W by the projection optical system PL.

Then, when the scanning exposure of the first shooting is completed, the wafer stage 5 is moved stepwise in the X and Y directions by the linear motors 32 and 33 to the scanning start position for the exposure of the second shooting. During the stepwise movement, the position of the wafer stage 5 in the X, Y, and θZ directions is measured in real time based on the measurement value of the laser interferometer 44 for detecting the position of the wafer stage 5 (position of the wafer W). Then, based on the measurement result, the linear motors 32 and 33 are controlled to control the position of the wafer stage 5 so that the displacement of the XY position of the wafer stage 5 becomes a predetermined state. Regarding the displacement in the θZ direction of the wafer stage 5 , the master stage 2 is rotationally controlled based on information on the displacement, so that an error in the rotational displacement on the wafer W side can be corrected. Then, scanning exposure is performed on the second imaging area in the same manner as the above-mentioned first imaging area.

Then, scanning exposure of the shot area on wafer W and stepwise movement for the next shot exposure are repeated, and the pattern of original plate R is sequentially copied over the entire exposure target shot area on wafer W.

In the stage device and the exposure device of the present embodiment, the law of conservation of momentum that the stators 17, 37 move in opposite directions with the reaction force when the original plate stage 2 and the wafer stage 5 are driven works, can prevent These reaction forces are transmitted to the reaction frame 8 or the base frame 10, and then to the ground, so that problems such as swaying can be avoided, so even when the master R or wafer W is enlarged and moved at high speed, the adjustment time can be shortened , Improve productivity and exposure accuracy. The reaction frame 8 supports the original fixed disk 3 through the anti-vibration assembly 11, and the base frame 10 supports the wafer fixed disk 6 through the anti-vibration assembly 29, so the residual vibration of the reaction frame 8 and the base frame 10 can be suppressed from being transmitted to the original fixed disk 3 With the wafer holding plate 6, the positional controllability of each stage 2, 5 can be maintained.

In the present embodiment, since the stators 17, 37 respectively constituting a part of the linear motors 15, 33 for driving the above-mentioned stages 2, 5 move with reaction force as the stages 2, 5 are driven, it is not necessary to In addition, a structure designed to eliminate this reaction force can realize downsizing and lowering the price of the device. Furthermore, when these stators 17, 37 are moved by the above-mentioned reaction force, since the rollers 21, 39 are simply operated to rotate around the axis, the device can be simplified.

Moreover, in the present embodiment, the springs 22, 40 respectively energize the stators 17, 37 in mutually opposite directions, so when the respective stators 17, 37 move with a reaction force, they can also be easily returned to the initial position with a simple mechanism. Location.

In the exposure apparatus of this embodiment, the original plate stage 2, the wafer stage 5, and the projection optical system PL vibrate independently through the anti-vibration components 11, 29, 24, so the original plate stage 2 and the wafer stage 2 can be prevented from vibrating independently. The vibration caused by the driving of 5 is transmitted to the projection optical system PL, which can effectively prevent the deviation of the pattern reproduction position or image blur caused by the vibration of the projection optical system PL, and improve the exposure accuracy.

[Second embodiment]

Fig. 6 is a diagram showing a second embodiment of the stage device and the exposure device of the present invention. In this figure, the same components as those of the first embodiment shown in FIGS. 1 to 5 are given the same reference numerals, and description thereof will be omitted. The difference between the second embodiment and the above-mentioned first embodiment lies in the structure of the stage device 7, so it will be described below.

As shown in the figure, the stage device 7 is mainly composed of a wafer stage 5, a wafer holding plate 6, and a support frame (reaction stage) 46 supporting them from below. Furthermore, the stator 37 is configured to move in the Y direction with respect to the support frames 46 via the rotation rails 38 inserted between the support frames 46 . The wafer platen 6 is also vibrated independently of the support frames 46 by the anti-vibration unit 29 arranged between the support frames 46 . Therefore, the support frame 46 functions as a support portion for the reaction force movement of the stator 37 .

Between the supporting frame 46 and the base frame 10, a rotating guide rail 48 composed of a plurality of rollers (rotating bodies) 47 is inserted. The rollers 47 each rotate around an axis extending in the Y direction, and are arranged at regular intervals in the X direction. Furthermore, the support frame 46 is freely movable in the X direction with respect to the base frame 10 by the rotation of the roller 47 around the axis. Other structures are the same as in the above-mentioned embodiment 1.

In the stage apparatus and exposure apparatus of this embodiment, in addition to obtaining the same action and effect as the above-mentioned first embodiment, when the wafer stage 5 moves in the +X direction, it follows the wafer stage 5. The reaction force of the movement of 5 moves the support frame 46 in the -X direction, so that the law of conservation of momentum also works. Therefore, for scanning exposure, not only when the wafer stage 5 is moved, but also when the wafer stage 5 is moved step by step in order to change the shooting area, it is possible to avoid problems such as swinging caused by the reaction force of the stepwise movement. Adjustment time can be further shortened, and productivity and exposure accuracy can be further improved. In this embodiment, transmission of residual vibration of the base frame 10 or the support frame 46 to the fixed wafer platen 6 can also be suppressed, and the positional controllability of the wafer stage 5 can be maintained.

[third embodiment]

Fig. 7 is a diagram showing a third embodiment of the stage device and the exposure device of the present invention. In this figure, the same components as those of the first embodiment shown in FIGS. 1 to 5 are given the same reference numerals, and description thereof will be omitted. The difference between the third embodiment and the above-mentioned first embodiment lies in the structure of the wafer stage 5, so it will be described below.

As shown in the figure, on both sides of the projection optical system PL in the Y direction, off-axis alignment sensors 49a, 49b are arranged at predetermined intervals, and the alignment sensors 49a, 49b are provided with two wafer stages 5 along the alignment direction. , 5. In each wafer stage 5, a magnet assembly (see figure) constituting a rotor of a movable linear motor is incorporated. Moreover, the linear guide rails 50 extending along the X direction of the stator of the wafer stage 5 as an armature assembly can move freely on the wafer fixing plate 6 independently.

At both ends of the linear guide rail 50, the above-mentioned rotor 36 composed of an armature assembly protrudes downward, and the stator 37 corresponding to both the rotors 36, 36 of the two wafer stages 5, 5 is extended along the Y direction. Therefore, each wafer stage 5 has a structure in which the stators 37 move independently in the Y direction while moving in the X direction along the linear guide rail 50 . In FIG. 7 , the illustration of the movable mirror, marking member, etc. provided on the wafer stage 5 is omitted.

In the exposure apparatus of the above-mentioned structure, as shown in FIG. Alignment is performed on the wafer W on top. Specifically, the alignment sensor 49a on the +Y side first measures the index member and the alignment marks (not shown) formed on the wafer W, and pre-aligns the wafer W based on the measurement results. Next, while moving the wafer stage 5 using the fine alignment obtained by EGA, for example, the imaging regions on the wafer W are aligned. Then, the wafer stage 5 whose sequential exposure has been completed moves in the −Y direction, and the wafers are exchanged directly under the alignment sensor 49b, and then the above-mentioned sequential alignment is performed. Wafer stage 5 aligned by alignment sensor 49a also moves in the -Y direction, and sequential exposure is performed right below projection optical system PL.

In this embodiment, except that the same effect as that of the above-mentioned first embodiment can be obtained, since the two wafer stages 5, 5 are moved independently, the wafer exchange and alignment operations are performed on one stage, and the operation is performed on the other. Exposure is performed simultaneously on one stage, so productivity can be greatly improved. Furthermore, since the rotors 36 of the two stages share the stator 37 used when the respective stages move in the Y direction, parts reduction, that is, simplification of the device and low cost can be achieved.

In the above-mentioned embodiment, rollers 21, 39, 47 are provided as moving members of stators 17, 37 in the Y direction, but the present invention is not limited thereto, for example, non-contact bearings such as air bearings may be provided. In this case, in addition to obtaining the same action and effect as when using rollers, since the stators 17, 37 move without friction, the vibration and friction of the reaction frame 8 or the base frame 10 can also be eliminated. Interference, exposure processing with higher precision can be implemented. The above-mentioned rollers or air bearings can be arranged in the stator, and can also be arranged in any one of the reaction frame 8 or the base frame 10 supporting the stator. Although not shown in the figure, the original plate stage 2 may have a structure capable of supporting a plurality of original plates R as in the third embodiment. In this case, the rough movement stage constituting the original plate stage 2 may be shared, and a plurality of fine movement stages holding the original plate R may be independently provided. Thereby, the whole original plate stage 2 can be made into a compact structure.

In the above-mentioned embodiment, the stator 17, 37 is formed to move with the reaction force on both the original plate stage 2 and the wafer stage 5, but needless to say, it is also possible for the stator to move with the reaction force only in one of the stages. . Moreover, in the above-mentioned embodiments, all the anti-vibration components are actively anti-vibration structures, but all these components may also have a structure in which a certain component or any plurality of components among them are passively anti-vibration. The original plate stage 2 is formed into a two-stage structure of a coarse-motion stage and a fine-motion stage, and one or both of them is provided with a structure that moves with a reaction force as the stage moves (such as a stator) also can. In the above-mentioned embodiments, the stage device of the present invention is applied to the exposure device 1. However, it is not limited to this. In addition to the exposure device 1, it can also be applied to a scanning device for copying a mask, and a mask pattern. Precision measuring equipment such as position coordinate measuring devices.

As the substrate of this embodiment, not only a semiconductor wafer W used in a semiconductor device, but also a glass substrate used in a liquid crystal display, a ceramic wafer used in a thin-film magnetic head, or a mask used in an exposure device or a master plate (synthetic quartz) can be used. , silicon wafers), etc. As the exposure device 1, in addition to the step-and-scan type scanning exposure device (scanning sequential exposure device; USP5473410) that moves the original plate R and the wafer W and PW synchronously and performs scanning exposure on the pattern of the original plate R, it is also possible to use A step-and-repeat projection exposure device (sequential moving exposure device) in which the pattern of the original R and the wafer W are exposed while the original R and the wafer W are stationary, and the wafer W and PW are sequentially moved step by step. As the type of exposure device 1, it is not limited to the exposure device used in the manufacture of semiconductor devices that expose semiconductor device patterns on the wafer W, and can also be widely used in the exposure device used in the manufacture of liquid crystal display elements, or used in the manufacture of thin film magnetic heads, imaging devices, etc. Exposure device for element (CCD) or original plate, etc.

As the light source of illumination light for exposure, not only bright lines (g-line (436nm), h-line (404.7nm), i-line (365nm)) generated from ultra-high pressure mercury lamps, KrF excimer laser (248nm), ArF Excimer laser (193nm), F ₂ laser (157nm), and charged particle beams such as X-rays or electron beams can also be used. For example, when an electron beam is used, a thermionic emission type lanthanum boride (LaB ₆ ) or tantalum (Ta) can be used as the electron gun. Furthermore, when an electron wire is used, it is sufficient to form a structure using the original plate R, and when the original plate R is not used, it is also possible to directly form a pattern on the wafer. In addition, a high frequency such as a YAG laser or a semiconductor laser may be used.

The magnification of projection optical system PL may be not only a reduction system but also an equal magnification system and an enlargement system. As the projection optical system, when using an excimer laser or other extreme ultraviolet rays, as a glass material, use a material that transmits extreme ultraviolet rays such as quartz or fluorite, and when using an _F2 laser or X-ray, use a catadioptric system Or the optical system of the refraction system (the original R also uses the reflective type), and in the case of using the electron beam, as the optical system, an electron optical system consisting of an electron lens and a deflector is sufficient. Needless to say, the optical path through the electron wire is in a vacuum state. It is also possible to use a proximity effect exposure apparatus which brings the original plate R and the wafer W into close contact and exposes the pattern of the original plate R without using the projection optical system PL.

In the case of using a linear motor (refer to USP5,623,853 or USP5,528,118) in the wafer stage 5 or master stage 2, an air-floating type using an air bearing and a Lorentz (Lorentz) motor can also be used. Magnetic floating type with force or reactive force. Each stage 2, 5 may be a type that moves along a guide rail, or may be a guide-less type that does not provide a guide rail. As the driving mechanism of each stage 2, 5, it is also possible to use electromagnetic force generated by opposing a magnet assembly (permanent magnet) in which magnets are two-dimensionally arranged and an armature assembly in which coils are two-dimensionally arranged. Planar motors for each stage 2, 5. In this case, either one of the magnet assembly and the armature assembly is connected to the stage 2, 5, and the other of the magnet assembly and the armature assembly is placed on the moving surface side (base) of the stage 2, 5 can.

As described above, the exposure apparatus 1 of this embodiment is manufactured by assembling various subsystems including various structural components listed in the scope of the claims of the present application to ensure predetermined mechanical accuracy, electrical accuracy, and optical accuracy. In order to ensure various precision, before and after the assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are adjusted to achieve electrical accuracy. Adjustments for precision. The process of assembling an exposure apparatus from various subsystems includes mutual mechanical connection of various subsystems, wiring connection of electric circuits, piping connection of pneumatic circuits, and the like. Before the process of assembling the exposure apparatus from various subsystems, it goes without saying that there are individual assembling processes of the respective subsystems. When the process of assembling various subsystems into an exposure device is completed, comprehensive adjustments are performed to ensure various accuracies of the exposure device as a whole. It is preferable to manufacture the exposure apparatus in a clean room that controls temperature, cleanliness, and the like.

As shown in FIG. 8, through the step 201 of designing the function and performance of the device, the step 202 of making a mask (original plate) based on the design step, and the step 203 of manufacturing a wafer from silicon material, the exposure device 1 of the above-mentioned embodiment will The pattern of the original plate is exposed on the wafer in wafer processing step 204, device assembly step (including dicing process, soldering process, packaging process) 205, inspection step 206, etc. to manufacture semiconductor devices.

Claims (24)

1. A stage device, comprising a stage body driven in at least one direction on a fixed plate, characterized in that, the stage device also includes: a support portion configured to vibrate independently with respect to the fixed plate; and The reaction force stage, along with the driving of the stage body, can freely move along the one direction on the support part by the reaction force. 2 . The stage device according to claim 1 , wherein the fixed plate is supported on the support portion through an anti-vibration mechanism. 3. The stage device according to claim 1 or 2, wherein the reaction force stage constitutes at least a part of a driving mechanism for driving the stage body in the one direction. 4. The stage device according to claim 3, wherein the drive mechanism comprises a rotor disposed on the stage body, and the rotor is driven along the rotor through electromagnetic interaction between the rotors. A stator driven in one direction, The reaction force stage has the stator. 5. The object stage device according to claim 1, wherein a rotating body is inserted between the reaction force stage and the support part, and the rotating body rotates along the axis, and makes the The reaction force stage moves in the one direction relative to the support portion. 6. The stage device according to claim 1, wherein a non-contact bearing is interposed between the reaction force stage and the support portion. 7. The stage device according to claim 1, further comprising a return device for returning the reaction force stage to an initial position. 8 . The stage device according to claim 7 , wherein the return device includes a force applying portion that applies force to the reaction force stage in a direction opposite to the one direction. 9. The stage device according to claim 1, wherein the stage body can move freely along directions perpendicular to each other, The reaction force stage is arranged in any one of the mutually perpendicular directions. 10. An exposure device, comprising a mask stage and a substrate stage, for illuminating the pattern of the mask held on the mask stage through an illumination optical system, and exposing the pattern on the substrate stage held on a substrate, characterized in that, At least one of the mask stage and the substrate stage includes: a stage body driven in at least one direction on a fixed plate; a support portion independently vibrated with respect to the fixed plate; The reaction force of the drive of the above-mentioned stage body, the reaction force stage freely moving in the above-mentioned one direction on the above-mentioned support part; the return device for returning the reaction force stage to the initial position. 11. The exposure apparatus according to claim 10, comprising a projection optical system disposed between the mask stage and the substrate stage to project the pattern of the mask onto the on the base. 12. The exposure apparatus according to claim 11, wherein the mask stage, the substrate stage, and the projection optical system are vibrateably arranged independently of each other. 13. The exposure apparatus according to claim 10, wherein the mask stage has a micro-motion stage that holds the mask and is movable in the first direction, and is connected with the micro-motion stage. A rough motion stage connected to the object stage and movable in a second direction different from the first direction. 14. The exposure apparatus according to claim 10, wherein at least one of the mask stage and the substrate stage is a rail stage. 15. The exposure apparatus according to claim 10, wherein the mask stage is capable of holding a plurality of masks. 16. The exposure apparatus of claim 10, wherein the substrate stage is capable of holding a plurality of substrates. 17. A method for driving a stage, the stage comprising a stage body driven in at least one direction on a fixed plate by a linear motor having a stator and a rotor, characterized in that, As the stage body is driven, the reaction force stage movable in the direction opposite to the one direction and having the stator is supported to vibrate independently with respect to the fixed plate by the reaction force. On the support part, and make the above-mentioned reaction force stage return to the initial position. 18. The method for driving a stage according to claim 17, wherein the weight of the reaction force stage is heavier than the weight of the stage body. 19. An exposure method for exposing a pattern of a mask held on a mask stage onto a substrate held on a substrate stage, characterized in that the method adopts the following stage driving method, The stage body of at least one of the mask stage and the substrate stage is driven in at least one direction on the fixed plate by a linear motor having a stator and a rotor, and the reaction force with the above-mentioned stator is loaded. The stage is supported on a support portion that independently vibrates with respect to the fixed plate, and moves in a direction opposite to the stage body by a reaction force generated by driving the stage body. 20. The exposure method according to claim 19, comprising the step of exposing the pattern during the movement of the mask stage and the substrate stage. 21. The exposure method of claim 19, including the step of maintaining a plurality of masks in the mask stage. 22. The exposure method of claim 19, comprising the step of holding a plurality of substrates in the substrate stage. 23. The exposure apparatus according to claim 10, wherein at least one of the stages is a mask stage, and the weight of the reaction force stage is greater than the weight of the stage body. 24. The exposure apparatus according to claim 10, wherein at least one of the stages is a substrate stage, and the weight of the reaction force stage is greater than the weight of the stage body.

Images