CN113681155A - A method and device for laser-assisted electrochemical treatment of hole quality - Google Patents
A method and device for laser-assisted electrochemical treatment of hole quality Download PDFInfo
- Publication number
- CN113681155A CN113681155A CN202110902619.1A CN202110902619A CN113681155A CN 113681155 A CN113681155 A CN 113681155A CN 202110902619 A CN202110902619 A CN 202110902619A CN 113681155 A CN113681155 A CN 113681155A
- Authority
- CN
- China
- Prior art keywords
- laser
- hole
- workpiece
- electrochemical
- tool electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 32
- 238000012545 processing Methods 0.000 claims abstract description 51
- 239000000463 material Substances 0.000 claims description 37
- 239000003792 electrolyte Substances 0.000 claims description 21
- 238000003754 machining Methods 0.000 claims description 20
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000010432 diamond Substances 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 6
- 238000002848 electrochemical method Methods 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 4
- 239000012780 transparent material Substances 0.000 claims 1
- 238000005553 drilling Methods 0.000 abstract description 9
- 239000002131 composite material Substances 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 14
- 230000000694 effects Effects 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010892 electric spark Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H1/00—Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
- B23H1/04—Electrodes specially adapted therefor or their manufacture
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H1/00—Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
- B23H1/10—Supply or regeneration of working media
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H11/00—Auxiliary apparatus or details, not otherwise provided for
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
Abstract
本发明公开了一种激光辅助电化学处理孔质量的方法及装置，涉及复合特种加工技术领域。包括以下步骤：对通孔进行激光和电化学处理以提高孔质量。本发明方法利用工具电极上形成的气膜产生的“尖端”放电及气膜对激光产生的反射和折射作用来有效改善孔内壁质量以及降低锥度，本发明装置包括工件加工系统和控制系统；所述工件加工系统包括激光加工系统和电化学加工系统；本发明装置结构简单，可实现激光打孔、激光和电化学处理在一套装置上实现。
The invention discloses a method and a device for laser-assisted electrochemical processing of hole quality, and relates to the technical field of composite special processing. The following steps are included: Laser and electrochemical treatment of the vias to improve hole quality. The method of the present invention utilizes the "tip" discharge generated by the gas film formed on the tool electrode and the reflection and refraction of the gas film on the laser to effectively improve the quality of the inner wall of the hole and reduce the taper. The device of the present invention includes a workpiece processing system and a control system; The workpiece processing system includes a laser processing system and an electrochemical processing system; the device of the invention has a simple structure, and can realize laser drilling, laser and electrochemical processing on one set of devices.
Description
Technical Field
The invention relates to the field of micro-machining in a special machining technology, in particular to a method and a device for electrochemically treating hole quality by laser assistance, which are suitable for machining through holes of non-conductive hard and brittle materials.
Background
Laser drilling technology is one of the main application areas of laser machining. Compared with other conventional punching methods such as mechanical drilling, electric spark machining and the like, the method has the advantages of high speed, high efficiency and good economic effect, so that the method is widely applied to the fields of metal materials, semiconductor materials, ceramic materials and the like, and well meets the requirements of related industries such as automobiles, aerospace, medical treatment and the like on material precision.
Taper is an important indicator for measuring via quality. The greater the taper, the poorer the quality of the hole. Due to the uneven distribution of laser energy, the problems of large taper and limited thickness of a processed workpiece are inevitable in single laser processing.
Researchers at home and abroad have already conducted certain research on how to reduce the hole taper. Chinese patent 'a laser drilling device and method for improving hole taper and inner wall quality', proposes a method for performing secondary laser drilling by rotating a workpiece by 180 degrees around the x direction of a hole after primary laser drilling through a rotatable clamp so that the workpiece is just immersed in water without changing the x and y coordinates of the small hole and then using a laser-induced cavitation technology. The method needs to rotate the workpiece by 180 degrees in the punching process, has extremely high requirement on the precision of the device and is not easy to ensure.
Chinese patent 'a ceramic material laser processing device and method' proposes that two laser heads are respectively arranged on two sides of a plate and positioned, then the motion tracks of the two laser heads are respectively set, and finally the two laser heads are simultaneously started and respectively set to move so as to complete the processing of laser holes. The method has extremely high requirements on the consistency of the spot diameters and the motion tracks of different laser heads in the processing process, and meanwhile, the 180-degree position of the plate must be accurate, so that the accuracy is difficult to ensure.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a method for electrochemically processing the hole quality by laser assistance, which effectively improves the quality of the inner wall of the hole by utilizing 'point' discharge generated by an air film formed on a tool electrode and the reflection and refraction effects of the air film on laser in the process of improving the quality of the hole wall; the invention also provides a device for the method for electrochemically processing the hole quality by laser assistance, and the method can be realized by using the device.
The present invention achieves the above-described object by the following technical means.
A laser-assisted electrochemical method for treating the quality of hole features that the hole is treated by laser and electrochemical method to improve the quality of hole wall.
Further, the electrochemical machining specifically comprises: the gas bubbles around the tool electrode coalesce to form a gas film that isolates the tool electrode from the electrolyte, so that a "tip" discharge occurs, and the energy generated by the "tip" discharge is used to treat the walls of the hole.
Further, the laser is arranged on one side of the processed workpiece, the tool electrode is arranged on the other side of the processed workpiece, and the laser is irradiated on a gas film around the tool electrode, so that the gas film can refract and reflect the laser to erode the hole wall material.
Further, the tool electrode is rotatable about the bore axis to electrochemically treat the bore wall.
Further, the outer side wall of the tool electrode is coated with a diamond coating.
Further, the hole is an inverted tapered hole processed by laser.
An apparatus for a method of laser assisted electrochemical processing of hole quality includes a workpiece processing system and a control system; the workpiece processing system comprises a laser processing system and an electrochemical processing system; the laser processing system comprises a pulse laser, a reflector, a focusing lens and a numerical control platform; the laser beam emitted by the pulse laser is reflected by a reflector and then focused on a workpiece to be processed through a focusing lens; a special working groove is arranged on the numerical control platform; the special working tank is filled with electrolyte; the electrolyte is slightly higher than the processed workpiece; when the through hole is completed, the electrolyte flows into the hole;
the electrochemical machining system comprises an electrochemical power supply, an ammeter, an auxiliary electrode, a tool electrode and a workpiece to be machined; the tool electrode is connected with the negative electrode of an electrochemical power supply, the auxiliary electrode is connected with the positive electrode of the electrochemical power supply, and the ammeter is connected in series in an electrochemical loop; the rotation and the position of the tool electrode are controlled by an X-Y-Z workbench;
the control system comprises a computer, a control cabinet and an X-Y-Z workbench; the computer is connected with the control cabinet through a connecting port; the control cabinet is used for controlling the pulse laser, the numerical control platform and the X-Y-Z workbench.
Further, the processing device also comprises a light-transmitting material, wherein the light-transmitting material is arranged right below the processed workpiece; the laser beam is focused by the focusing lens and then irradiates the processed workpiece through the light-transmitting material.
Furthermore, the tool electrode and the auxiliary electrode are arranged in parallel and are vertical to the processed workpiece.
Further, the workpiece to be processed is a non-conductive hard and brittle material.
Has the advantages that:
1. the invention utilizes the 'point' discharge generated by the gas film formed on the tool electrode and the reflection and refraction effect of the gas film on the laser to effectively improve the quality of the inner wall of the hole.
2. In the process of electrochemical discharge etching materials, the tool electrode rotates around the hole axis, so that the taper can be reduced, the uniformity of material etching can be improved, and the quality of the inner wall of the hole and the roundness of the hole are improved; the laser irradiates the air film to be reflected and refracted, so that the material is further etched, and the taper effect is improved.
3. The outer side wall of the tool electrode is coated with a diamond coating, on the one hand for insulation and on the other hand for increasing the effect of the tip discharge.
4. The processed workpiece is made of non-conductive hard and brittle materials, such as ceramics and the like, and the problem of difficulty in punching of the materials is solved.
5. The light-transmitting material is arranged right below the processed workpiece, the laser penetrates through the quartz glass plate to start processing from the lower part of the processed workpiece, and after the through hole is completed, the electrolyte flows into the hole from the upper part and simultaneously washes out impurities in the hole.
6. The invention combines laser processing and electrochemical processing together to solve the taper problem of the hole after laser drilling, so that the laser drilling, the laser post-processing and the electrochemical processing are realized in one device.
Drawings
FIG. 1 is a schematic diagram of an apparatus for laser-assisted electrochemical processing of pore quality according to an embodiment of the present invention;
FIG. 2 is a schematic illustration of a laser machined hole;
FIG. 3 is a schematic illustration of a laser and electrochemical machining process;
fig. 4 is a schematic illustration of laser reflection and refraction during laser and electrochemical machining.
Reference numerals:
1-a computer; 2-a control cabinet; 3-a pulsed laser; 4-a mirror; 5-a focusing lens; 6-a numerical control platform; 7-a light transmissive material; 8-special tool groove; 9-a workpiece to be processed; a 10-X-Y-Z stage; 11-a tool electrode; 12-an auxiliary electrode; 13-an ammeter; 14-an electrochemical power source; 15-electrolyte.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "axial," "radial," "vertical," "horizontal," "inner," "outer," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Examples
A method of laser assisted electrochemical processing of pore quality comprising the steps of: the workpiece 9 to be processed is perforated by laser, and the through hole is subjected to laser and electrochemical machining to improve the hole quality.
Wherein, the electrochemical machining specifically comprises the following steps: adjusting the voltage of an electrochemical power supply 14, wherein the tool electrode 11, the auxiliary electrode 12, the electrolyte 15 and the electrochemical power supply 14 form an electrochemical loop; the gas bubbles coalesce around the tool electrode 11 to form a gas film that isolates the tool electrode 11 from the electrolyte 15, so that a "tip" discharge occurs, with the energy generated by the "tip" discharge working the hole wall.
The laser is arranged on one side of a workpiece 9 to be processed, the tool electrode 11 is arranged on the other side of the workpiece 9 to be processed, and after laser drilling is finished, the laser is irradiated on a gas film around the tool electrode 11, and the gas film can refract and reflect the laser so as to erode hole wall materials.
The tool electrode 11 is rotatable about the bore axis to electrochemically machine the bore wall. The tool electrode rotates around the hole shaft, so that the taper can be reduced, and the uniformity of material erosion can be improved, so that the quality of the inner wall of the hole and the roundness of the hole are improved; the laser irradiates the air film to be reflected and refracted, so that the material is further etched, and the taper effect is improved.
The tool electrode 11 is coated with a diamond coating on its outer side wall. The outer side wall of the tool electrode is coated with a diamond coating, on the one hand for insulation and on the other hand for increasing the effect of the tip discharge.
A method for electrochemically processing hole quality by laser assistance,
the method comprises the following steps: adjusting the positions of the numerical control platform 6 and the X-Y-Z worktable 10 to enable the center of a laser spot to be aligned with the position of the workpiece 9 to be processed;
step two: processing a workpiece 9 to be processed by laser; when the through hole is completed, the electrolyte 15 flows into the hole; at this time, the X-Y-Z table 10 is controlled by the computer 1 so that the tool electrode 11 enters the electrolyte 15 to perform electrochemical machining and laser machining simultaneously on the workpiece 9 to be machined.
Further, the workpiece 9 to be processed is a non-conductive hard and brittle material.
An apparatus for a method of laser assisted electrochemical processing of hole quality includes a workpiece processing system and a control system; the workpiece processing system comprises a laser processing system and an electrochemical processing system; the laser processing system comprises a pulse laser 3, a reflector 4, a focusing lens 5 and a numerical control platform 6; the laser beam emitted by the pulse laser 3 is reflected by a reflecting mirror 4 and then is focused on a workpiece 9 to be processed through a focusing lens 5; a special working groove 8 is arranged on the numerical control platform 6; the special working tank 8 is filled with electrolyte 15; the electrolyte 15 is slightly higher than the processed workpiece 9;
the electrochemical machining system comprises an electrochemical power supply 14, an ammeter 13, an auxiliary electrode 12, a tool electrode 11 and a workpiece 9 to be machined; the tool electrode 11 is connected with the negative electrode of an electrochemical power supply 14, the auxiliary electrode 12 is connected with the positive electrode of the electrochemical power supply 14, and the ammeter 13 is connected in series in an electrochemical loop; the rotation and position of the tool electrode 11 are controlled by the X-Y-Z worktable 10;
the control system comprises a computer 1, a control cabinet 2 and an X-Y-Z worktable 10; the computer 1 is connected with the control cabinet 2 through a connecting port; the control cabinet 2 is used for controlling the pulse laser 3, the numerical control platform 6 and the X-Y-Z worktable 10.
The machining tool further comprises a light-transmitting material 7, and the light-transmitting material 7 is arranged right below a workpiece 9 to be machined. The laser penetrates through the quartz glass plate to start machining from the lower part of the machined workpiece, and after the through hole is completed, electrolyte flows into the hole from the upper part and simultaneously washes out impurities in the hole.
The laser beam is focused by the focusing lens 5 and then is irradiated on a processed workpiece 9 through the light-transmitting material 7; the tool electrode 11 and the auxiliary electrode 12 are arranged parallel to each other and perpendicular to the workpiece 9 to be machined.
Referring to fig. 1, an apparatus for laser assisted electrochemical methods of hole quality processing includes a workpiece processing system and a control system; the workpiece processing system comprises a laser processing system and an electrochemical processing system; the laser processing system comprises a pulse laser 3, a reflector 4, a focusing lens 5 and a numerical control platform 6; the laser beam emitted by the pulse laser 3 is reflected by a reflector 4, passes through a focusing lens 5 and is focused below a workpiece 9 to be processed through a quartz glass plate; the reflector 4 is arranged in the horizontal direction of the pulse laser 3, and the focusing lens 5 is arranged right above the reflector 4; a special working groove 8 is arranged on the numerical control platform 6. The electrochemical machining system comprises an electrochemical power supply 14, an ammeter 13, an auxiliary electrode 12, a tool electrode 11 and a workpiece 9 to be machined; the tool electrode 11 is connected with the negative electrode of an electrochemical power supply 14, the auxiliary electrode 12 is connected with the positive electrode of the electrochemical power supply 14 and is vertically placed in the electrolyte 15; the ammeter 13 is connected in series in an electrochemical loop;
the control system comprises a computer 1, a control cabinet 2 and an X-Y-Z worktable 10; the computer 1 is connected with the control cabinet 2 through a connecting port; the control cabinet 2 is connected with the pulse laser 3, the numerical control platform 6 and the X-Y-Z worktable 10.
Wherein, the processed workpiece 9 is a non-conductive hard and brittle material (ceramic, etc.); the electrolyte is alkaline solution, the height of the solution is about 1-2 mm higher than the upper surface of the workpiece, and the temperature is 20-40 ℃; the thickness of the quartz glass plate of the used light-transmitting material 7 is 0.4mm at least, and the height of the quartz glass plate and the processed workpiece 9 is kept between 3mm and 5 mm; the outer side wall of the tool electrode 11 is coated with a high-temperature-resistant and corrosion-resistant diamond coating, the rotating speed is more than or equal to 300r/min, the diameter d of the tool electrode 11 can be selected according to the diameter of the micropore, and the size of the formed gas film can be controlled by adjusting the voltage of the electrochemical power supply 14.
First, the pulse laser 3 is turned on to complete via hole machining to form a reverse tapered hole as shown in fig. 2.
Secondly, an electrochemical power supply 14 is connected between the tool electrode 11 (cathode) and the auxiliary electrode 12 (anode), the discharge voltage of the electrochemical power supply 14 is adjusted, hydrogen bubbles are generated on the surface of the tool electrode 11 when electrochemical machining starts, the density of the bubbles is continuously increased along with the continuous progress of reaction and is aggregated into a gas film for isolating the rotary electrode 11 from electrolyte, so that 'point' discharge occurs, electrical breakdown occurs and a large amount of energy is generated, a large amount of discharge energy generates high temperature and high pressure, materials are melted and thrown out by high pressure impact, meanwhile, the rise of the temperature also promotes the chemical corrosion process of alkaline solution to the machined workpiece, and the removal of the materials is realized under the combined action of the two; meanwhile, the laser irradiates the gas film formed around the rotary electrode 11 and then is reflected and refracted, and the material is also etched, so that the effect of reducing the hole taper is achieved. In addition, the tool electrode 11 is kept rotating, so that the erosion uniformity of the material is improved, and the improvement of the quality of the inner wall of the hole and the hole roundness are facilitated.
A method of laser assisted electrochemical processing of pore quality comprising the steps of:
adjusting the numerical control platform 6 and the X-Y-Z worktable 10 to enable the tool electrode 11 to be aligned to the center of the laser spot;
putting a workpiece 9 to be processed into a special working groove 8, and adjusting the laser focus;
connecting a circuit, and pouring an electrolyte 15;
laser processing is carried out, the through hole is completed, and the X-Y-Z working platform 10 is controlled to enable the tool electrode 11 to rotate at a high speed to enter the hole;
according to the requirement of the through hole, the electrochemical power supply 14 is turned on, the electrochemical discharge machining starts to remove the material, the laser irradiates the gas film formed around the tool electrode 11 and then reflects and refracts, the material is further removed, and therefore the effect of reducing the hole taper is achieved. In addition, the tool electrode 11 keeps rotating at a high speed, so that the erosion uniformity of the material is improved, and the improvement of the quality of the inner wall of the hole and the roundness of the hole are facilitated;
in the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made in the above embodiments by those of ordinary skill in the art without departing from the principle and spirit of the present invention.
Claims (10)
1. A method for laser-assisted electrochemical treatment of hole quality is characterized in that laser and electrochemical treatment are carried out on holes to improve the hole wall quality.
2. The laser-assisted electrochemical method of processing pore quality as claimed in claim 1, wherein the electrochemical processing is: the bubbles around the tool electrode (11) coalesce to form a gas film which isolates the tool electrode (11) from the electrolyte (15), so that a 'tip' discharge occurs, and the energy generated by the 'tip' discharge is used to treat the walls of the hole.
3. The laser-assisted electrochemical method for hole quality processing according to claim 1, characterized in that the laser is arranged on one side of the workpiece (9) to be processed, the tool electrode (11) is arranged on the other side of the workpiece (9) to be processed, and the laser is irradiated on a gas film around the tool electrode (11), which refracts and reflects the laser to erode the hole wall material.
4. A method for laser assisted electrochemical treatment of hole quality according to any of claims 2 or 3, characterized in that the tool electrode (11) is rotatable about the hole axis for electrochemical treatment of the hole wall.
5. A method for laser assisted electrochemical treatment of hole quality according to any of claims 2 or 3, characterized in that the tool electrode (11) is coated with a diamond coating on its outer side wall.
6. The method of claim 1, wherein the hole is an inverted conical hole machined by a laser.
7. The apparatus of claim 6, comprising a workpiece processing system and a control system;
the workpiece processing system comprises a laser processing system and an electrochemical processing system; the laser processing system comprises a pulse laser (3), a reflector (4), a focusing lens (5) and a numerical control platform (6); the laser beam emitted by the pulse laser (3) is reflected by a reflector (4) and then focused on a workpiece (9) to be processed through a focusing lens (5); a special working groove (8) is arranged on the numerical control platform (6); the special working groove (8) is filled with electrolyte (15); the height of the electrolyte (15) is slightly higher than that of the processed workpiece (9), and when the through hole is completed, the electrolyte (15) flows into the through hole;
the electrochemical machining system comprises an electrochemical power supply (14), an ammeter (13), an auxiliary electrode (12), a tool electrode (11) and a workpiece (9) to be machined; the tool electrode (11) is connected with the negative electrode of an electrochemical power supply (14), the auxiliary electrode (12) is connected with the positive electrode of the electrochemical power supply (14), and the ammeter (13) is connected in series in an electrochemical loop; the rotation and position of the tool electrode (11) are controlled by an X-Y-Z worktable (10);
the control system comprises a computer (1), a control cabinet (2) and an X-Y-Z workbench (10); the computer (1) is connected with the control cabinet (2) through a connecting port; the control cabinet (2) is used for controlling the pulse laser (3), the numerical control platform (6) and the X-Y-Z workbench (10).
8. The device for realizing the laser-assisted electrochemical treatment method for hole quality according to claim 7, characterized by further comprising a light-transmissive material (7), wherein the light-transmissive material (7) is arranged right below the workpiece (9) to be processed; the laser beam is focused by the focusing lens (5) and then irradiates the processed workpiece (9) through the transparent material (7).
9. The device for carrying out the laser-assisted electrochemical treatment of hole quality as claimed in claim 7, characterized in that the tool electrode (11) and the auxiliary electrode (12) are arranged parallel to one another and perpendicular to the workpiece (9) to be machined.
10. The device for realizing a laser-assisted electrochemical treatment of hole quality according to claim 7, characterized in that the workpiece (9) to be machined is a non-conductive hard brittle material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110902619.1A CN113681155B (en) | 2021-08-06 | 2021-08-06 | Method and device for electrochemically processing hole quality under assistance of laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110902619.1A CN113681155B (en) | 2021-08-06 | 2021-08-06 | Method and device for electrochemically processing hole quality under assistance of laser |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113681155A true CN113681155A (en) | 2021-11-23 |
| CN113681155B CN113681155B (en) | 2022-08-23 |
Family
ID=78579072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110902619.1A Active CN113681155B (en) | 2021-08-06 | 2021-08-06 | Method and device for electrochemically processing hole quality under assistance of laser |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113681155B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116604333A (en) * | 2023-04-19 | 2023-08-18 | 江苏大学 | Device and method for conducting laser and electrochemical micromachining by rotating and throwing out micro liquid flow |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11197871A (en) * | 1998-01-08 | 1999-07-27 | Toshiba Corp | Visible pulse laser processing method and apparatus |
| JP2000024923A (en) * | 1998-07-09 | 2000-01-25 | Seiko Epson Corp | Micro hole / groove processing method |
| JP2000077824A (en) * | 1998-05-20 | 2000-03-14 | Canon Inc | Method of forming through-hole |
| CN105904105A (en) * | 2016-05-25 | 2016-08-31 | 广东工业大学 | Laser drilling device and method capable of improving hole taper |
| WO2016201761A1 (en) * | 2015-06-17 | 2016-12-22 | 江苏大学 | Device and method for machining materials by combining electrochemical discharging and laser |
| KR101845750B1 (en) * | 2017-08-25 | 2018-04-05 | 에이티아이 주식회사 | Laser processing apparatus and laser processing method |
| CN107971592A (en) * | 2017-11-16 | 2018-05-01 | 中国科学院宁波材料技术与工程研究所 | Laser intervenes electrochemical micromachining method and its device |
| CN109158775A (en) * | 2018-10-11 | 2019-01-08 | 江苏大学 | A kind of laser drilling device and method improving hole taper and hole wall quality |
-
2021
- 2021-08-06 CN CN202110902619.1A patent/CN113681155B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11197871A (en) * | 1998-01-08 | 1999-07-27 | Toshiba Corp | Visible pulse laser processing method and apparatus |
| JP2000077824A (en) * | 1998-05-20 | 2000-03-14 | Canon Inc | Method of forming through-hole |
| JP2000024923A (en) * | 1998-07-09 | 2000-01-25 | Seiko Epson Corp | Micro hole / groove processing method |
| WO2016201761A1 (en) * | 2015-06-17 | 2016-12-22 | 江苏大学 | Device and method for machining materials by combining electrochemical discharging and laser |
| CN105904105A (en) * | 2016-05-25 | 2016-08-31 | 广东工业大学 | Laser drilling device and method capable of improving hole taper |
| KR101845750B1 (en) * | 2017-08-25 | 2018-04-05 | 에이티아이 주식회사 | Laser processing apparatus and laser processing method |
| CN107971592A (en) * | 2017-11-16 | 2018-05-01 | 中国科学院宁波材料技术与工程研究所 | Laser intervenes electrochemical micromachining method and its device |
| CN109158775A (en) * | 2018-10-11 | 2019-01-08 | 江苏大学 | A kind of laser drilling device and method improving hole taper and hole wall quality |
Non-Patent Citations (2)
| Title |
|---|
| 张朝阳等: "脉冲激光电化学复合的定域性研究及三维微细刻蚀加工", 《机械工程学报》 * |
| 王玉峰等: "基于激光束全反射的激光与电解复合小孔加工技术研究", 《电加工与模具》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116604333A (en) * | 2023-04-19 | 2023-08-18 | 江苏大学 | Device and method for conducting laser and electrochemical micromachining by rotating and throwing out micro liquid flow |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113681155B (en) | 2022-08-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204397104U (en) | Orifice electrode scan-type mask electrolytic machining device | |
| CN102019474B (en) | Online preparing system and method for electrochemical grinding micro tool for line electrode | |
| US11992889B2 (en) | Method for preparing a cross-size micro-nano structure array | |
| CN111360345B (en) | Processing method for forming microstructure on surface of workpiece and control system | |
| CN108526627A (en) | A kind of semi-conducting material laser electrochemical copolymerization micro-processing method and device | |
| CN105328285B (en) | A kind of the online of rotating accuracy bulb columnar electrode high prepares trimming device and method | |
| CN101003100A (en) | Electrolytic lathe working method | |
| CN101085483A (en) | Combinational processing method for micro-array axle hole | |
| CN115338533A (en) | Scanning method for accurate and controllable track of femtosecond laser beam | |
| CN111940930A (en) | Micropore laser processing method and equipment | |
| CN110625272B (en) | A device and method for laser processing low-taper micro-holes using chemically corroded ice layers | |
| CN114523165A (en) | Laser-enhanced ultrasonic electrolytic composite processing method and device for preparing array holes in semiconductor material | |
| CN112059406B (en) | Laser Interference Induced Electrochemical Machining Method and Device for Micro-Nano Structures on Friction Surfaces | |
| CN113681155A (en) | A method and device for laser-assisted electrochemical treatment of hole quality | |
| Choungthong et al. | Removal of Recast layer in laser-ablated titanium alloy surface by electrochemical machining process | |
| CN111702337A (en) | A method and device for improving the quality of laser etching assisted by solid electrolyte | |
| CN104551277A (en) | Wire saw winding tool electrode for electrochemical-mechanical combined processing | |
| CN109048088B (en) | Method and device for composite machining of micropores by long-pulse laser and plasma jet | |
| Zhang et al. | Effect of electrochemical dissolving in laser drilling assisted with jet electrochemical machining | |
| Chun et al. | Comparison between wire mesh and plate electrodes during wide-pattern machining on invar fine sheet using through-mask electrochemical micromachining | |
| CN115194271B (en) | Laser and electrochemical composite polishing device for 3D printing metal component | |
| CN115805362A (en) | Method and device for processing metal microstructure by laser-electrolysis in-situ combination | |
| CN114481248A (en) | A processing device and method for localized electrodeposition on silicon surface | |
| CN112975011A (en) | High-localization micro-groove electrolytic machining device and method | |
| CN108746895B (en) | Laser electrolysis's cutting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |