CN113325930A - Server heat dissipation device and method - Google Patents
Server heat dissipation device and method Download PDFInfo
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- CN113325930A CN113325930A CN202110592527.8A CN202110592527A CN113325930A CN 113325930 A CN113325930 A CN 113325930A CN 202110592527 A CN202110592527 A CN 202110592527A CN 113325930 A CN113325930 A CN 113325930A
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Abstract
本发明公开一种服务器散热装置及方法，该装置包括感温开关，感温开关第一端接地；服务器内环境温度低于第一温度阈值时，感温开关第二端与控制器的第一接口电连接；服务器内环境温度高于第一温度阈值时，感温开关第二端与控制器的第二接口电连接。本发明根据感温开关的感温特性感知环境温度，从而调节风扇转速，实现风扇调速的双重依据，避免温度传感器故障时引起高温隐患，有效提高散热可靠性。另外，本发明还通过感温材料调节通风风道的通风量，通过感温材料调节散热片的散热面积和散热空间，进一步优化散热效果。同时，本发明通过感温材料的形变调节和优化散热，无需电路控制，结构简单且成本低，适于大范围推广使用。
The invention discloses a server cooling device and method. The device comprises a temperature sensing switch, wherein a first end of the temperature sensing switch is grounded; when the ambient temperature in the server is lower than a first temperature threshold, the second end of the temperature sensing switch and the first end of the controller are connected to the ground. The interface is electrically connected; when the ambient temperature in the server is higher than the first temperature threshold, the second end of the temperature sensing switch is electrically connected to the second interface of the controller. The invention senses the ambient temperature according to the temperature-sensing characteristics of the temperature-sensing switch, so as to adjust the fan speed, realize the dual basis of fan speed control, avoid the hidden danger of high temperature caused by the failure of the temperature sensor, and effectively improve the reliability of heat dissipation. In addition, the present invention also adjusts the ventilation volume of the ventilation duct through the temperature-sensing material, and adjusts the heat-dissipating area and heat-dissipating space of the heat sink through the temperature-sensing material, so as to further optimize the heat dissipation effect. At the same time, the invention adjusts and optimizes heat dissipation through the deformation of the temperature-sensing material, does not require circuit control, has a simple structure and low cost, and is suitable for widespread use.
Description
Technical Field
The invention relates to the field of server heat dissipation, in particular to a server heat dissipation device and method, and particularly relates to a server heat dissipation device and method based on a temperature sensing material.
Background
The server is one kind of computer, provides services such as calculation, storage, data exchange and the like for internet users, and is an important component node in the internet era. The server has higher operation rate, longer operation time and higher data throughput, and the power consumption and the heat brought by the operation process are larger than those of a household PC. The high temperature is a dead enemy of the integrated circuit, the high temperature can not only cause the instability of the system and shorten the service life, but also cause the circuit to be burnt when the system is serious; heat dissipation is a research and development challenge that must be overcome in the server design process. The good heat dissipation scheme guarantees efficient and stable operation of the server on the one hand, and can greatly reduce the operation cost of the data center on the other hand.
The heat dissipation methods commonly used in the industry at present mainly include three types: 1) radiating by a radiator, 2) radiating by air cooling, and 3) radiating by liquid cooling; the heat dissipation of the radiator is mainly carried out in a heat conduction mode, radiating fins are fixed at parts with serious heat generation, and heat is transferred in the contact process of substances, such as the radiating fins of a CPU (central processing unit); the air cooling heat dissipation is realized by adding a fan, and heat is taken out of the machine in one direction by accelerating air flow; liquid cooling heat dissipation is that heat is absorbed and flows out through liquid cooling liquid.
Among them, the air-cooled heat dissipation scheme is the most common. The air-cooled heat dissipation scheme controller realizes the regulation of the rotating speed of the fan according to the temperature on the reading plate of the temperature sensor, the temperature sensing method is single, the temperature value is read only by the temperature sensor to be used as the regulation basis of the rotating speed of the fan, once the sensitivity of the temperature sensor is reduced or the temperature sensor goes wrong along with the increase of the service time, the rotating speed of the fan cannot be regulated in time, and the hidden danger of overhigh temperature occurs.
Disclosure of Invention
In order to solve the above problems, the present invention provides a server heat dissipation device and method, which adjust the heat dissipation capability of a heat sink based on a temperature sensing material, thereby improving the heat dissipation reliability, and in addition, increase and improve the heat dissipation effect of the heat sink and the overall heat dissipation effect of the server while dissipating heat with a fan.
The technical scheme of the invention is as follows: a server heat dissipation device comprises a controller, a fan and a temperature sensor, wherein the fan and the temperature sensor are respectively electrically connected with the controller; when the ambient temperature in the server is lower than a first temperature threshold value, the second end of the temperature sensing switch is electrically connected with a first interface of the controller; when the ambient temperature in the server is higher than the first temperature threshold value, the second end of the temperature sensing switch is electrically connected with the second interface of the controller.
Further, the first interface of the controller is electrically connected with a supply voltage through a first pull-up resistor, and the second interface of the controller is electrically connected with the supply voltage through a second pull-up resistor.
Furthermore, the temperature sensitive switch is a shape memory alloy sheet.
Furthermore, a ventilation air duct is arranged on the server, and a wind shield and a temperature sensing spring are arranged in the ventilation air duct;
one end of the wind shield is connected with the top wall of the ventilation air duct, and the other end of the wind shield is a free end; one end of the temperature sensing spring is connected with the top wall of the ventilation air duct, and the other end of the temperature sensing spring is connected with the wind shield.
Further, the temperature sensing spring is a shape memory alloy spring.
Furthermore, a plurality of radiating fins are arranged in the server, and all the radiating fins are arranged in sequence; a temperature sensing push plate is arranged on one side surface of each radiating fin and is positioned between the two radiating fins.
Further, the temperature sensing push plate is a shape memory alloy push plate.
The technical scheme of the invention also comprises a server heat dissipation method, which comprises the following steps:
grounding a first end of the temperature sensing switch;
when the ambient temperature in the server is lower than a first temperature threshold value, a second end of the temperature sensing switch is electrically connected with a first interface of the controller, and the controller obtains a signal that the ambient temperature meets the threshold value;
when the ambient temperature in the server is higher than the first temperature threshold, the second end of the temperature sensing switch is automatically and electrically connected to the second interface of the controller, and the controller obtains a signal that the ambient temperature exceeds the threshold, so that the fan is controlled to increase the speed.
Further, the method also comprises the following steps:
a wind shield and a temperature sensing spring are arranged in a server ventilation air duct; one end of the wind shield is connected with the top wall of the ventilation air duct, and the other end of the wind shield is a free end; one end of the temperature sensing spring is connected with the top wall of the ventilation air duct, and the other end of the temperature sensing spring is connected with the wind shield;
when the ambient temperature in the ventilation air duct is lower than a second temperature threshold value, the temperature sensing spring is not deformed so that the wind shield is at the initial position, and the ventilation quantity of the ventilation air duct is small;
when the ambient temperature in the ventilation air duct is higher than the second temperature threshold value, the temperature sensing spring deforms to pull up the wind shield, so that the fan of the ventilation air duct is increased.
Further, the method comprises the following steps:
a temperature sensing push plate is arranged on the radiating fins and is positioned between two adjacent radiating fins;
when the environmental temperature of the heat dissipation part is lower than a third temperature threshold value, the temperature sensing push plate is not deformed to enable adjacent heat dissipation fins to approach;
when the environmental temperature of the radiating part is higher than the third temperature threshold value, the temperature sensing push plate deforms to prop the two adjacent radiating fins apart, and the radiating space and the radiating area are increased.
The invention provides a server heat dissipation device and a method, wherein a temperature sensing switch is arranged in a server, the temperature sensing switch is electrically connected with a first interface of a controller under normal conditions, when the temperature is too high, the temperature sensing switch is automatically disconnected with the first interface and then electrically connected with a second interface of the controller, the controller acquires the temperature state according to signals of the first interface and the second interface, and when the temperature is too high, the controller controls a fan to increase the rotating speed, so that the controller not only adjusts the fan by means of a temperature sensor, but also can sense the environmental temperature according to the temperature sensing characteristic of the temperature sensing switch, thereby adjusting the rotating speed of the fan, realizing the dual basis of fan speed regulation, avoiding high-temperature hidden danger caused by the fault of the temperature sensor, and effectively improving the heat dissipation reliability. In addition, the ventilation quantity of the ventilation air channel is adjusted through the temperature sensing material, and the heat dissipation area and the heat dissipation space of the heat dissipation fins are adjusted through the temperature sensing material, so that the heat dissipation effect is further optimized. Meanwhile, the temperature sensing material is adjusted and optimized in heat dissipation through deformation of the temperature sensing material, circuit control is not needed, the structure is simple, the cost is low, and the temperature sensing material is suitable for large-scale popularization and use.
Drawings
For a clearer explanation of the embodiments or technical solutions of the prior art of the present application, the drawings needed for the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic circuit diagram of a prior art air-cooled heat dissipation scheme;
FIG. 2 is a schematic structural diagram of an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a second embodiment of the present invention;
FIG. 4 is a schematic view of a prior art heat sink configuration;
FIG. 5 is a schematic diagram of a third embodiment of the present invention.
In the figure, 1-a controller, 2-a fan, 3-a temperature sensor, 4-a temperature-sensing switch, 5-a ventilation air channel, 6-a wind shield, 7-a temperature-sensing spring, 8-a heat sink, 9-a temperature-sensing push plate, R1-a first pull-up resistor, R2-a second pull-up resistor, TEMP _ L-a first interface and TEMP _ H-a second interface.
Detailed Description
The core of the application is to provide a server heat dissipation device and a server heat dissipation method, the ambient temperature is detected based on the deformation characteristic of a temperature sensing material at different temperatures, a basis is provided for a controller to adjust the rotating speed of a fan, the ventilation effect of a ventilation air channel and the heat dissipation effect of a radiator are improved, and the heat dissipation performance of a server is improved.
In order that those skilled in the art will better understand the disclosure, the following detailed description will be given with reference to the accompanying drawings. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Example one
As shown in fig. 1, in the design for controlling and monitoring the rotation speed of the fan 2 in the server air-cooled heat dissipation scheme of the prior art, a Controller 1 may adjust and monitor the rotation speed of the fan 2, the Controller 1 is generally a BMC (Baseboard Management Controller) or a CPLD (Complex Programmable Logic Device), and the Controller 1 reads the detected temperature of the on-board temperature sensor 3 through an I2C bus, so as to adjust the rotation speed of the fan 2 and prevent the over-high temperature condition. It should be noted that, for some chips with large heat productivity, a heat sink needs to be additionally installed to improve the heat dissipation capability of the chip.
When the temperature rises, the existing heat dissipation scheme only depends on the temperature sensor 3 to read the temperature value as the adjusting basis of the rotating speed of the fan 2, and the method is single and not reliable enough, so that the embodiment provides the server heat dissipation device, and the temperature is detected by the temperature sensor 3 and is used as the basis of adjusting the rotating speed of the fan 2.
As shown in fig. 2, the heat dissipation apparatus of the server of the first embodiment includes a temperature-sensitive switch 4, a first end of the temperature-sensitive switch 4 is grounded, and a second end of the temperature-sensitive switch 4 is movably and electrically connected to the controller 1. Specifically, when the ambient temperature in the server is lower than the first temperature threshold, the second end of the temperature sensitive switch 4 is electrically connected to the first interface TEMP _ L of the controller 1, which is also a normal initial state; when the ambient temperature in the server is higher than the first temperature threshold, the second end of the temperature sensitive switch 4 is electrically connected to the second interface TEMP _ H of the controller 1. The controller 1 judges whether the ambient temperature exceeds a threshold value according to signals of a first interface TEMP _ L and a second interface TEMP _ H, the first interface TEMP _ L is switched on to indicate that the ambient temperature is normal, the fan 2 does not need to adjust the speed, the second interface TEMP _ H is switched on to indicate that the ambient temperature exceeds the threshold value, and the controller 1 controls the fan 2 to increase the speed and improve the heat dissipation effect.
In order to realize temperature detection, when the temperature rises, the temperature sensing switch 4 can be automatically disconnected from the first interface TEMP _ L and electrically connected to the second interface TEMP _ H, the temperature sensing switch 4 of the embodiment adopts a shape memory alloy sheet, the shape memory alloy deforms when the temperature changes, the shape memory metal has a conductive function, when the second end of the shape memory alloy sheet is electrically connected with one interface, the circuit is connected, the interface level is pulled down, the controller 1 can know the interface connection state, and further know whether the environmental temperature exceeds a threshold value.
Under normal conditions, namely when the ambient temperature does not exceed the first temperature threshold, the shape memory metal sheet is not deformed, and in this state, the second end of the shape memory metal sheet is electrically connected with the first interface TEMP _ L of the controller 1 in a contact manner, the circuit is connected, the first interface TEMP _ L is at a low level, and at the moment, the second interface TEMP _ H is suspended at a high level; when the ambient temperature in the server rises and exceeds the first temperature threshold, the shape memory metal sheet deforms, and then is electrically connected with the second interface TEMP _ H from the port of the first interface TEMP _ L, the second interface TEMP _ H is connected, the second interface TEMP _ H is at a low level, and at the moment, the first interface TEMP _ L is suspended at a high level. The controller 1 infers whether the ambient temperature in the server exceeds the temperature threshold according to the high-low level states of the first interface TEMP _ L and the second interface TEMP _ H.
It should be noted that, the shape memory alloy sheet with the appropriate temperature threshold is selected to match the first temperature threshold set by the server, that is, the temperature sensing property of the selected shape memory alloy sheet ensures that the shape memory alloy sheet takes a shape when the temperature sensing property is at the first temperature threshold. Meanwhile, the shape memory alloy sheet is set to have a certain shape so as to be placed in the server and grounded, and can contact the first interface TEMP _ L and the second interface TEMP _ H of the controller 1. The first interface TEMP _ L and the second interface TEMP _ H of the controller 1 are connected with the metal sheet to be electrically connected with the shape memory alloy sheet.
In order to receive signals at high and low levels, the first interface TEMP _ L of the controller 1 is further electrically connected to a supply voltage through a first pull-up resistor R1, and the second interface TEMP _ H of the controller 1 is further electrically connected to the supply voltage through a second pull-up resistor R2.
According to the server heat dissipation device provided by the embodiment, the ambient temperature in the server is specifically monitored based on the temperature sensing deformation of the shape memory alloy sheet, when the ambient temperature in the server exceeds a threshold value, the shape memory alloy sheet deforms to change the connection state of the interface of the controller 1, so that the change of the ambient temperature of the controller 1 is timely notified, and the rotating speed of the fan 2 is timely adjusted to reduce the temperature as soon as possible after the controller 1 learns that the ambient temperature is too high. It should be noted that the controller 1 is still electrically connected to the temperature sensor 3, and the rotation speed of the fan 2 is adjusted according to the detection value of the temperature sensor 3. It can be seen that the device controller 1 not only uses the detection value of the temperature sensor 3 as the basis for adjusting the rotating speed of the fan 2, but also increases the detection signal of the shape memory alloy sheet as the basis for adjusting the rotating speed of the fan 2, and the method is various, and improves the reliability of temperature detection.
It should be noted that the first temperature threshold of the shape memory alloy sheet and the temperature threshold of the temperature sensor 3 may be adjusted according to specific needs, and the control strategy of the fan 2 of the controller 1 may also be adjusted according to specific needs. For example, the first temperature threshold of the shape memory alloy sheet is slightly higher than the temperature threshold of the temperature sensor 3, the controller 1 takes the detection value of the temperature sensor 3 as the primary adjustment basis, when the temperature sensor 3 fails, the temperature sensor 3 cannot detect the accurate temperature, and at this time, the controller 1 takes the detection signal of the walking memory alloy sheet as the adjustment basis, so as to avoid damage to the device due to overhigh temperature in time. For another example, the controller 1 uses the detection value of the temperature sensor 3 and the detection state of the shape memory alloy sheet as the adjustment basis at the same time, when the detection value of the temperature sensor 3 exceeds a certain temperature threshold value, and the ambient temperature in the server exceeds a second temperature threshold value at the same time, so that the shape memory alloy sheet is electrically connected with the second interface TEMP _ H, the controller 1 adjusts the rotating speed of the fan 2, and uses two detection information as the adjustment basis, so as to ensure the detection effectiveness and reliability.
Example two
When the air-cooled heat dissipation scheme is adopted, besides the timely heat dissipation by adjusting the rotating speed of the fan 2, the ventilation quantity of the ventilation duct 5 also influences the heat dissipation efficiency, the ventilation quantity of the ventilation duct 5 of the current server is certain, the ventilation quantity cannot be increased to reduce the temperature as soon as possible when the temperature is higher, and the heat dissipation is only performed by increasing the rotating speed of the fan 2, so that the heat dissipation efficiency is low, and the heat dissipation effect is not ideal.
In view of this, the second embodiment provides a server heat sink, as shown in fig. 3, by the cooperation of the wind shield 6 and the temperature sensing spring 7, the ventilation volume can be increased when the temperature rises while the requirement of the ventilation volume at normal temperature is met.
The second embodiment is described in detail below, and it should be noted that the second embodiment is an improvement on the first embodiment.
As shown in fig. 3, in the second embodiment, the server heat dissipation device is provided with a wind shield 6 and a temperature sensing spring 7 in the ventilation air duct 5, one side of the wind shield 6 is connected with the top wall of the ventilation air duct 5, and the other end is a free end; one end of the temperature sensing spring 7 is connected with the top wall of the ventilation air duct 5, and the other end is connected with the wind shield 6. It should be noted that one side of the wind deflector 6 may also be connected to other side walls of the ventilation duct 5, the corresponding temperature sensing spring 7 is connected to the corresponding side wall, and meanwhile, the inclination direction of the wind deflector 6 is adjusted according to the deformation characteristic of the temperature sensing spring 7, so as to ensure that the ventilation volume of the ventilation duct 5 is increased when the ambient temperature is increased.
In fig. 3, the left side is an air inlet and the right side is an air outlet as shown by arrows, and air blows from the left side to the right side. Under the normal condition, the wind shield 6 is in a state of inclining downwards to the right under the action of the temperature sensing spring 7, the ventilation quantity of the ventilation air duct 5 is small, and the ventilation requirement under the normal condition is met. When the temperature in the server is too high, the temperature of wind correspondingly rises, leads to the ambient temperature in the ventilation air duct 5 to rise, and when the ambient temperature in the ventilation air duct 5 exceeded the second temperature threshold value, temperature sensing spring 7 took place to warp, upwards pulled up deep bead 6 to make ventilation volume increase in ventilation air duct 5, in order to promote the radiating efficiency.
In order to adjust the inclination direction of the wind deflector 6 along with the temperature, so as to adjust the ventilation amount and ensure the ventilation amount to be increased when the temperature rises, the temperature sensing spring 7 of the second embodiment is a spring deformed along with the temperature, and the inclination direction of the wind deflector 6 is adjusted by the deformation of the temperature sensing spring 7. When the temperature sensing device is used specifically, the temperature sensing spring 7 is a shape memory alloy spring which can deform along with the change of temperature to drive the wind shield 6. And selecting a shape memory alloy spring with a proper temperature threshold value to be consistent with a second temperature threshold value set by the server, and when the ambient temperature in the ventilation air duct 5 is higher than the second temperature threshold value, deforming the shape memory alloy spring and pulling the wind shield 6 upwards. It should be noted that the higher the temperature is, the greater the deformation of the shape memory alloy is, so that the greater the degree of pulling up the wind shield 6 is, the greater the ventilation volume of the ventilation air duct 5 increases with the temperature rise, and the heat dissipation speed can be effectively increased.
It should be noted that, in the second embodiment, an improvement is made in the first embodiment, in a specific application, the first end of the shape memory alloy sheet is grounded, and the second end is electrically connected to the first interface TEMP _ L or the second interface TEMP _ H of the controller 1 according to a temperature change; meanwhile, the controller 1 is electrically connected with the temperature sensor 3 and the fan 2, and the controller 1 takes two detection signals of the temperature sensor 3 and the shape memory alloy sheet as the regulation basis of the fan 2. Arranging a shape memory alloy spring and a wind shield 6 in a ventilation air duct 5, wherein one end of the wind shield 6 is connected with the top wall of the ventilation air duct 5, and the other end is a free end; one end of the shape memory alloy spring is connected with the top wall of the ventilation air duct 5, the other end of the shape memory alloy spring is connected with a wind shield 6, and the wind shield 6 is in a downward inclined state. When the ambient temperature in the server is lower than the first temperature threshold and the temperature on the board is lower than the temperature threshold of the temperature sensor 3, the shape memory alloy sheet is electrically connected with the first interface TEMP _ L of the controller 1, and meanwhile, the temperature value detected by the temperature sensor 3 is within the normal range, and at this time, the controller 1 controls the fan 2 to normally operate. Meanwhile, the temperature of the air outlet is low, the temperature in the ventilation air duct 5 cannot exceed the second temperature threshold, the shape memory alloy spring does not deform, the wind shield 6 is in the initial inclined position, the ventilation volume of the ventilation air duct 5 is small, and the ventilation volume requirement when the temperature is low is met. When the ambient temperature in the server is higher than the first temperature threshold value and the temperature on the board is higher than the temperature threshold value of the temperature sensor 3, the shape memory alloy sheet is electrically connected with the second interface TEMP _ H of the controller 1, and meanwhile, the temperature value detected by the temperature sensor 3 is higher than a certain temperature threshold value, and at this time, the controller 1 controls the fan 2 to increase the speed. The air outlet temperature rises at this moment, and when the temperature in the ventilation air duct 5 is higher than the second temperature threshold value, the shape memory alloy spring is deformed, the wind shield 6 is pulled upwards, the ventilation volume of the ventilation air duct 5 is increased, the heat dissipation effect can be achieved as soon as possible, and the heat dissipation efficiency is improved.
EXAMPLE III
At present, for some chips with larger heat productivity, besides adopting an air-cooled heat dissipation scheme, a heat radiator, such as an on-board heat radiator, is additionally arranged to improve the heat dissipation capacity. When the temperature rises, the heat dissipation capacity of the server is improved only by increasing the rotating speed of the fan 2, and the method is single.
In view of this, the third embodiment provides a server heat dissipation apparatus, which is improved on the basis of the first embodiment, so as to ensure that the rotation speed of the fan 2 is increased, and at the same time, the heat dissipation capability of the heat sink is improved, and the heat dissipation effect is improved.
As shown in fig. 4, the heat dissipating fins 8 of the conventional heat sink are arranged in sequence, and adjacent heat dissipating fins 8 are close to each other without any gap therebetween, so that the heat dissipating area is constant. The heat radiator of the embodiment can increase the heat radiation area along with the increase of the temperature, thereby improving the heat radiation efficiency.
As shown in fig. 5, in the third embodiment, a temperature sensing push plate 9 is disposed on one side surface of the heat sink 8, and the temperature sensing push plate 9 is located between the two heat sinks 8. When the environmental temperature of the radiating part is normal, namely lower than a third temperature threshold value, the temperature sensing push plate 9 is not deformed, the state of the temperature sensing push plate is close to vertical downward, the gap between the two radiating fins 8 is narrow and close to a closed state, and the radiating requirement in a low-temperature state is met. When the heat dissipation temperature rises and is higher than the third temperature threshold value, the temperature sensing push plate 9 deforms and is upwards supported, so that the two radiating fins 8 are supported, the distance between the two radiating fins 8 is increased, the left side surface and the right side surface of each radiating fin 8 have the heat dissipation effect, and the heat dissipation efficiency is effectively improved.
It should be noted that the heat dissipation portion of the heat sink is provided with a chute for the heat dissipation sheet 8 to move.
In order to realize the adjustment of the distance between the radiating fins 8, the temperature sensing push plate 9 deforms according to the temperature, so that the distance between the radiating fins 8 is increased when the temperature rises, and the radiating effect is improved. The temperature sensing push plate 9 of the third embodiment is a push plate that deforms with temperature, and the heat sink 8 is driven to move by the deformation of the temperature sensing push plate 9. When the temperature sensing push plate is used specifically, the temperature sensing push plate 9 is made of shape memory alloy, and the shape memory alloy push plate can deform along with the change of temperature to push the radiating fins 8. The shape memory alloy push plate with the proper temperature threshold is selected to be in accordance with the third temperature threshold set by the server, and when the ambient temperature of the heat dissipation part is higher than the third temperature threshold, the shape memory alloy push plate deforms and upwards supports, so that the heat dissipation fins 8 are pushed to move, the distance between the two heat dissipation fins 8 is increased, the left side surface and the right side surface of each heat dissipation fin 8 can play a role in heat dissipation, and the overall heat dissipation effect is improved.
It should be noted that, in the third embodiment, an improvement is made to the first embodiment, and in a specific application, the first end of the shape memory alloy sheet is grounded, and the second end of the shape memory alloy sheet is electrically connected to the first interface TEMP _ L or the second interface TEMP _ H of the controller 1 according to a temperature change; meanwhile, the controller 1 is electrically connected with the temperature sensor 3 and the fan 2, and the controller 1 takes two detection signals of the temperature sensor 3 and the shape memory alloy sheet as the regulation basis of the fan 2. The heat radiating fins 8 are provided with shape memory alloy push plates, and the temperature sensing push plate 9 is positioned between the two heat radiating fins 8. When the ambient temperature in the server is lower than the first temperature threshold and the temperature on the board is lower than the temperature threshold of the temperature sensor 3, the shape memory alloy sheet is electrically connected with the first interface TEMP _ L of the controller 1, and meanwhile, the temperature value detected by the temperature sensor 3 is within the normal range, and at this time, the controller 1 controls the fan 2 to normally operate. Meanwhile, the environment temperature of the heat dissipation part is lower, the temperature cannot exceed the third temperature threshold, the shape memory alloy push plate cannot deform, the shape memory alloy push plate is located at the initial position, and the adjacent two heat dissipation fins 8 are close to the closed state. When the ambient temperature in the server is higher than the first temperature threshold value and the temperature on the board is higher than the temperature threshold value of the temperature sensor 3, the shape memory alloy sheet is electrically connected with the second interface TEMP _ H of the controller 1, and meanwhile, the temperature value detected by the temperature sensor 3 is higher than a certain temperature threshold value, and at this time, the controller 1 controls the fan 2 to increase the speed. The corresponding rising of radiating part position ambient temperature this moment, when radiating part position ambient temperature is higher than the third temperature threshold value, shape memory alloy push pedal warp and upwards prop to promote fin 8, make the distance between two fins 8 draw big, fin 8 left and right sides face all can play the radiating effect, thereby promotes whole radiating effect.
Example four
The fourth embodiment provides a heat sink for a server, which improves the heat dissipation reliability and effect of the server from the following three aspects.
On the first hand, a temperature sensing switch 4 is arranged, and a first end of the temperature sensing switch 4 is grounded; when the ambient temperature in the server is lower than the first temperature threshold, the second end of the temperature-sensing switch 4 is electrically connected with the first interface TEMP _ L of the controller 1; when the ambient temperature in the server is higher than the first temperature threshold, the second end of the temperature sensitive switch 4 is electrically connected to the second interface TEMP _ H of the controller 1. Meanwhile, the controller 1 electrically connects the temperature sensor 3 and the fan 2. The controller 1 takes the detection value of the temperature sensor 3 and the detection state of the shape memory alloy sheet as the adjustment basis at the same time, when the detection value of the temperature sensor 3 exceeds a certain temperature threshold value and the ambient temperature in the server exceeds a second temperature threshold value at the same time, the controller 1 adjusts the rotating speed of the fan 2 when the shape memory alloy sheet is electrically connected with the second interface TEMP _ H, and the two detection information is taken as the adjustment basis, so that the detection effectiveness and the detection reliability are ensured.
In the second aspect, a wind shield 6 and a temperature sensing spring 7 are arranged in the ventilation air duct 5, one side of the wind shield 6 is connected with the top wall of the ventilation air duct 5, and the other end of the wind shield is a free end; one end of the temperature sensing spring 7 is connected with the top wall of the ventilation air duct 5, and the other end is connected with the wind shield 6. Under the normal condition, the wind shield 6 is in a state of inclining downwards to the right under the action of the temperature sensing spring 7, the ventilation quantity of the ventilation air duct 5 is small, and the ventilation requirement under the normal condition is met. When the temperature in the server is too high, the temperature of wind correspondingly rises, leads to the ambient temperature in the ventilation air duct 5 to rise, and when the ambient temperature in the ventilation air duct 5 exceeded the second temperature threshold value, temperature sensing spring 7 took place to warp, upwards pulled up deep bead 6 to make ventilation volume increase in ventilation air duct 5, in order to promote the radiating efficiency.
In the third aspect, a heat sink 8 is arranged in the server, a temperature sensing push plate 9 is arranged on one side surface of the heat sink 8, and the temperature sensing push plate 9 is positioned between the two heat sinks 8. When the environmental temperature of the radiating part is normal, namely lower than a third temperature threshold value, the temperature sensing push plate 9 is not deformed, the state of the temperature sensing push plate is close to vertical downward, the gap between the two radiating fins 8 is narrow and close to a closed state, and the radiating requirement in a low-temperature state is met. When the heat dissipation temperature rises and is higher than the third temperature threshold value, the temperature sensing push plate 9 deforms and is upwards supported, so that the two radiating fins 8 are supported, the distance between the two radiating fins 8 is increased, the left side surface and the right side surface of each radiating fin 8 have the heat dissipation effect, and the heat dissipation efficiency is effectively improved.
In the fourth embodiment, the heat dissipation of the server is improved from three aspects, including both an air-cooled heat dissipation scheme and a heat dissipation scheme of a heat sink. For the air-cooled heat dissipation scheme, a temperature sensing switch 4 is arranged in a server, under normal conditions, the temperature sensing switch 4 is electrically connected with a first interface TEMP _ L of a controller 1, when the temperature is too high, the temperature sensing switch 4 is automatically disconnected from the first interface TEMP _ L and then electrically connected to a second interface TEMP _ H of the controller 1, the controller 1 learns the temperature state according to signals of the first interface TEMP _ L and the second interface TEMP _ H, and when the temperature is too high, a fan 2 is controlled to increase the rotating speed, so that the controller 1 not only adjusts the fan 2 by means of a temperature sensor 3, but also senses the environmental temperature according to the temperature sensing characteristic of the temperature sensing switch 4, thereby adjusting the rotating speed of the fan 2, realizing the dual basis of speed regulation of the fan 2, avoiding high-temperature hidden danger caused by the fault of the temperature sensor 3, and effectively improving the heat dissipation reliability. Simultaneously, set up deep bead 6 and temperature sensing spring 7 in ventilation duct 5, when ambient temperature exceeded the third temperature threshold value in ventilation duct 5, temperature sensing spring 7 warp and pulls up deep bead 6, and then increase the air volume, optimize the radiating effect. For the heat dissipation scheme of the radiator, the distance between the adjacent radiating fins 8 is adjusted by arranging the temperature sensing push plate 9 on the radiating fins 8, the effective heat dissipation area of the radiating fins 8 is increased, and the heat dissipation effect is further optimized.
It is thus clear that this scheme utilization temperature sensing material had both increased the foundation of adjusting 2 rotational speeds of fan in the air-cooled heat dissipation scheme, improved temperature and detected the reliability, had improved the radiating effect from two aspects of adjusting air volume and 8 heat radiating area of fin again, and this scheme need not circuit control, and simple structure and with low costs are suitable for using widely on a large scale.
EXAMPLE five
The fifth embodiment provides a server heat dissipation method, which includes the following steps:
s101, grounding a first end of the temperature sensitive switch 4;
s102, when the ambient temperature in the server is lower than a first temperature threshold, a second end of the temperature sensing switch 4 is electrically connected with a first interface TEMP _ L of the controller 1, and the controller 1 obtains an ambient temperature signal meeting the threshold;
and S103, when the ambient temperature in the server is higher than the first temperature threshold, the second end of the temperature-sensitive switch 4 is automatically and electrically connected to the second interface TEMP _ H of the controller 1, and the controller 1 obtains a signal that the ambient temperature exceeds the threshold, so as to control the fan 2 to increase the speed.
The above steps enable the controller 1 to adjust the rotation speed of the fan 2 according to the detection signal of the temperature sensitive switch 4, and it should be noted that, in specific application, the controller 1 simultaneously adjusts the rotation speed of the fan 2 according to the detection value of the temperature sensor 3, that is, the controller 1 uses the detection data of the temperature sensor 3 and the detection signal of the temperature sensitive switch 4, and two detection results are used as the basis for adjusting the rotation speed of the fan 2, thereby effectively improving the validity and reliability of temperature detection.
The temperature sensing switch 4 is a shape memory alloy metal sheet, which meets the power-on requirement, and the shape of the temperature sensing switch changes with the temperature, so that when the ambient temperature of the server exceeds a first temperature threshold, the temperature sensing switch can be disconnected from the first interface TEMP _ L of the controller 1 and connected to the second interface TEMP _ H.
On the basis of ensuring the validity and reliability of temperature detection, the method of the fifth embodiment further comprises the following step of improving the ventilation quantity of the ventilation air duct 5 to improve the heat dissipation efficiency. The method specifically comprises the following steps:
s201, arranging a wind shield 6 and a temperature sensing spring 7 in a server ventilation air duct 5; one end of the wind shield 6 is connected with the top wall of the ventilation air duct 5, and the other end is a free end; one end of a temperature sensing spring 7 is connected with the top wall of the ventilation air duct 5, and the other end is connected with a wind shield 6;
s202, when the ambient temperature in the ventilation air duct 5 is lower than a second temperature threshold value, the temperature-sensitive spring 7 is not deformed, so that the wind shield 6 is at an initial position, and the ventilation quantity of the ventilation air duct 5 is small;
and S203, when the ambient temperature in the ventilation air duct 5 is higher than a second temperature threshold value, the temperature sensing spring 7 deforms to pull up the wind shield 6, so that the fan 2 of the ventilation air duct 5 is enlarged.
According to the method, the position of the wind shield 6 is adjusted through the temperature sensing spring 7, specifically, the inclination angle of the wind shield 6 is adjusted to adjust the ventilation quantity of the ventilation air duct 5, so that when the ambient temperature is increased, the ventilation quantity of the ventilation air duct 5 is correspondingly increased, the heat dissipation is accelerated, and the heat dissipation efficiency is improved.
The temperature sensing spring 7 is a shape memory alloy spring, the shape of which changes with the temperature, and the function of adjusting the position of the wind shield 6 can be realized.
For the chip with larger calorific capacity, still dispose the radiator, each fin 8 of traditional radiator is close together, can not give full play to the radiating effect, and this embodiment fifthly still sets up following step to give full play to the radiating effect of radiator, promote the radiating efficiency, specifically include following step:
s301, arranging a temperature sensing push plate 9 on each radiating fin 8, wherein the temperature sensing push plate 9 is positioned between two adjacent radiating fins 8;
s302, when the environmental temperature of the radiating part is lower than a third temperature threshold value, the temperature sensing push plate 9 is not deformed to enable the adjacent radiating fins 8 to approach;
and S303, when the environmental temperature of the heat dissipation part is higher than a third temperature threshold value, the temperature sensing push plate 9 deforms to prop apart the two adjacent heat dissipation fins 8, so that the heat dissipation space and the heat dissipation area are increased.
The distance between the adjacent radiating fins 8 is adjusted through the temperature sensing push plate 9, when the temperature rises, the temperature sensing push plate 9 deforms to drive the radiating fins 8 to move, so that the distance between the adjacent radiating fins 8 is increased, the left side surface and the right side surface of each radiating fin 8 can radiate heat, the radiating area and the radiating space of the radiator are effectively improved, and the radiating effect is improved.
The temperature sensing push plate 9 is a shape memory alloy push plate, and the shape of the temperature sensing push plate changes with the temperature, so that the function of driving the radiating fin 8 to move can be realized.
The above disclosure is only for the preferred embodiments of the present invention, but the present invention is not limited thereto, and any non-inventive changes that can be made by those skilled in the art and several modifications and amendments made without departing from the principle of the present invention shall fall within the protection scope of the present invention.
Claims (10)
1. A server heat dissipation device comprises a controller, a fan and a temperature sensor, wherein the fan and the temperature sensor are respectively electrically connected with the controller; when the ambient temperature in the server is lower than a first temperature threshold value, the second end of the temperature sensing switch is electrically connected with a first interface of the controller; when the ambient temperature in the server is higher than the first temperature threshold value, the second end of the temperature sensing switch is electrically connected with the second interface of the controller.
2. The server heat sink of claim 1, wherein the first interface of the controller is further electrically connected to a supply voltage through a first pull-up resistor, and wherein the second interface of the controller is further electrically connected to the supply voltage through a second pull-up resistor.
3. The heat sink for server as claimed in claim 2, wherein the temperature sensitive switch is a shape memory alloy sheet.
4. The server heat dissipation device according to claim 1, 2 or 3, wherein a ventilation air duct is provided in the server, and a wind shield and a temperature sensing spring are provided in the ventilation air duct;
one end of the wind shield is connected with the top wall of the ventilation air duct, and the other end of the wind shield is a free end; one end of the temperature sensing spring is connected with the top wall of the ventilation air duct, and the other end of the temperature sensing spring is connected with the wind shield.
5. The heat sink of claim 4, wherein the temperature sensitive spring is a shape memory alloy spring.
6. The server heat sink according to claim 5, wherein a plurality of heat sinks are provided in the server, each heat sink being arranged in sequence; a temperature sensing push plate is arranged on one side surface of each radiating fin and is positioned between the two radiating fins.
7. The heat sink of claim 6, wherein the temperature-sensitive push plate is a shape memory alloy push plate.
8. A server heat dissipation method is characterized by comprising the following steps:
grounding a first end of the temperature sensing switch;
when the ambient temperature in the server is lower than a first temperature threshold value, a second end of the temperature sensing switch is electrically connected with a first interface of the controller, and the controller obtains a signal that the ambient temperature meets the threshold value;
when the ambient temperature in the server is higher than the first temperature threshold, the second end of the temperature sensing switch is automatically and electrically connected to the second interface of the controller, and the controller obtains a signal that the ambient temperature exceeds the threshold, so that the fan is controlled to increase the speed.
9. The server heat dissipation method of claim 8, further comprising:
a wind shield and a temperature sensing spring are arranged in a server ventilation air duct; one end of the wind shield is connected with the top wall of the ventilation air duct, and the other end of the wind shield is a free end; one end of the temperature sensing spring is connected with the top wall of the ventilation air duct, and the other end of the temperature sensing spring is connected with the wind shield;
when the ambient temperature in the ventilation air duct is lower than a second temperature threshold value, the temperature sensing spring is not deformed so that the wind shield is at the initial position, and the ventilation quantity of the ventilation air duct is small;
when the ambient temperature in the ventilation air duct is higher than the second temperature threshold value, the temperature sensing spring deforms to pull up the wind shield, so that the fan of the ventilation air duct is increased.
10. The server heat dissipation method of claim 9, further comprising:
a temperature sensing push plate is arranged on the radiating fins and is positioned between two adjacent radiating fins;
when the environmental temperature of the heat dissipation part is lower than a third temperature threshold value, the temperature sensing push plate is not deformed to enable adjacent heat dissipation fins to approach;
when the environmental temperature of the radiating part is higher than the third temperature threshold value, the temperature sensing push plate deforms to prop the two adjacent radiating fins apart, and the radiating space and the radiating area are increased.
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| CN119602834A (en) * | 2024-12-17 | 2025-03-11 | 江苏麒羽科技有限公司 | An intelligent radio frequency transceiver |
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